CN211702369U - Capacitive microphone chip - Google Patents
Capacitive microphone chip Download PDFInfo
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- CN211702369U CN211702369U CN202020356771.5U CN202020356771U CN211702369U CN 211702369 U CN211702369 U CN 211702369U CN 202020356771 U CN202020356771 U CN 202020356771U CN 211702369 U CN211702369 U CN 211702369U
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- microphone chip
- condenser microphone
- capacitor plate
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Abstract
The utility model relates to an acoustoelectric conversion technology field discloses a condenser microphone chip, which comprises a substrate, substrate top both sides all are equipped with coupling mechanism, coupling mechanism upper portion is connected with the lining lid, lining lid middle part evenly is provided with a plurality of back of the body utmost point, be provided with the vibrating diaphragm on the substrate of back of the body utmost point below, the top both sides of vibrating diaphragm are provided with dust absorption mechanism, dust absorption mechanism's middle part is provided with the dust-binding pad. The utility model discloses a dust absorption mechanism that sets up, positive capacitance plate, negative pole capacitance plate switch on respectively, form the electric field promptly between positive capacitance plate, negative pole capacitance plate, and the electric field can adsorb the dust that runs through the inside charge of mouth to adsorb the dust to on the dust sticking pad on the vibrating diaphragm, both prevented that the dust from making the back of the body utmost point and vibrating diaphragm short circuit, also prevented simultaneously that the dust separation from running through the mouth, influence the microphone and use.
Description
Technical Field
The utility model relates to an acoustoelectric conversion technical field especially relates to a condenser microphone chip.
Background
An MEMS (micro electro mechanical system) microphone is a microphone manufactured based on the MEMS technology, wherein a diaphragm and a back plate are important components in the MEMS microphone, and the diaphragm and the back plate form a capacitor and are integrated on a silicon wafer to realize the sound-electricity conversion, and since the volume of the MEMS microphone chip is very small, the distance between the diaphragm and the back plate is usually about 1 μm; furthermore, in order to improve the sensitivity of the diaphragm, a through hole is usually formed in the back plate to equalize the air pressure between the back plate and the diaphragm. When the microphone with the structure is used, dust enters between the diaphragm and the back plate through the through hole. When the microphone chip is in a humid environment, moisture can gather around dust particles, so that the diaphragm and the back plate are electrically conducted, and the performance of the microphone is affected.
Through retrieval, the chinese patent No. CN206640795U relates to a condenser microphone chip, which includes a substrate having a back cavity, on which a back electrode and a diaphragm are disposed above the back cavity; the back electrode and the vibrating diaphragm are arranged oppositely, and a gap is formed between the back electrode and the vibrating diaphragm to form a capacitor structure; a plurality of through holes are formed in the back electrode; wherein an insulating layer is arranged on the surface of the back electrode opposite to the diaphragm.
The existing condenser microphone chip has the following defects: although two layers of insulating layers are arranged, water vapor dust particles still gather on the through holes when the microphone is used in a humid environment for a long time, so that the through holes are blocked, the microphone is inconvenient to clean, and the microphone is finally influenced in use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a condenser microphone chip, dust absorption mechanism through setting up, anodal capacitor plate, the circular telegram respectively of negative pole capacitor plate, promptly at anodal capacitor plate, form the electric field between the negative pole capacitor plate, the electric field can adsorb the inside charged dust of through-hole, thereby adsorb the dust to the clay dirt pad on the vibrating diaphragm, both prevented that the dust from making the back of the body utmost point and vibrating diaphragm short circuit, the dust separation through-hole has also been prevented simultaneously, influence the advantage that the microphone used, although current condenser microphone chip has been solved and two-layer insulating layer has set up, nevertheless use still to gather steam dust particle on the through-hole for a long time under humid environment, thereby the jam through-hole, and be not convenient for clear up, finally influence the problem of the use of microphone.
According to the utility model discloses capacitanc microphone chip, which comprises a substrate, substrate top both sides all are equipped with coupling mechanism, coupling mechanism upper portion is connected with the lining lid, lining lid middle part evenly is provided with a plurality of back of the body utmost point, be provided with the vibrating diaphragm on the substrate of back of the body utmost point below, the top both sides of vibrating diaphragm are provided with dust absorption mechanism, dust absorption mechanism's middle part is provided with the dust pad.
Furthermore, through openings are formed among the back electrodes, and the lower portions of the through openings face the dust sticking pads.
Further, the dust absorption mechanism comprises a positive electrode capacitor plate and a negative electrode capacitor plate, and the top end of the vibrating diaphragm is respectively provided with a mounting groove matched with the positive electrode capacitor plate and the negative electrode capacitor plate.
Furthermore, terminals are arranged on two sides of the bottom wall of the mounting groove, and wiring grooves matched with the terminals are formed in the bottoms of the positive electrode capacitor plate and the negative electrode capacitor plate.
Furthermore, the both sides of terminal all bulge has the setting element, the outer wall of setting element all is inconsistent with the wiring groove inner wall.
Further, the fixing blocks are arranged on the opposite sides of the positive electrode capacitor plate and the negative electrode capacitor plate, and fixing ports matched with the fixing blocks are formed in one side of the mounting groove.
Further, coupling mechanism includes the stand, the top middle part of stand is provided with the spread groove.
Furthermore, a positioning rod is arranged in the connecting groove, and the upper end of the positioning rod penetrates through the notch of the connecting groove and extends to the outside.
Further, a plurality of cutting ferrule have nestedly on the outer wall of locating lever, the cutting ferrule is with the inner wall interference fit of spread groove.
Furthermore, the upright post is fixed on the substrate, and the upper end of the positioning rod is connected with the lining cover.
Compared with the prior art, the utility model beneficial effect who has is:
1. through the arranged dust collection mechanism, the positive capacitor plate and the negative capacitor plate are respectively electrified, namely, an electric field is formed between the positive capacitor plate and the negative capacitor plate, the electric field can be adsorbed on dust with charges in the through hole, so that the dust is adsorbed on a dust sticking pad on the vibrating diaphragm, the dust is prevented from causing short circuit between the back electrode and the vibrating diaphragm, meanwhile, the dust is prevented from blocking the through hole, the use of a microphone is influenced, the positive capacitor plate and the negative capacitor plate are fixed through the fixing block and the fixing hole, and the capacitor is prevented from being broken by arranging the positioning piece on the binding post, so that the dust collection of the capacitor is ensured to continuously work;
2. through the coupling mechanism who sets up, only need exert oneself when needing to clear up the dust and extract the spread groove with the locating lever and can realize the separation to cutting ferrule and spread groove are interference fit, and fixed effect is good, and dismantles portably, just can clear up and change the dust that the sticky dirt stacks up after the dismantlement, thereby increases the dust removal effect that lasts of sticky dirt pad.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of a capacitive microphone chip according to the present invention;
fig. 2 is a top view of a partial structure of a liner cover in a condenser microphone chip according to the present invention;
fig. 3 is a schematic structural diagram of a connection mechanism in a condenser microphone chip according to the present invention.
In the figure: 1-substrate, 2-lining cover, 3-vibrating diaphragm, 4-back electrode, 5-through hole, 6-anode capacitor plate, 7-cathode capacitor plate, 8-dust-sticking pad, 9-mounting groove, 10-binding post, 11-fixing hole, 12-connecting mechanism, 13-upright post, 14-connecting groove, 15-locating rod, 16-clamping sleeve and 17-locating piece.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following describes the implementation of the present invention in detail with reference to specific embodiments.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be understood that if there are the terms "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and those skilled in the art can understand the specific meanings of the terms according to specific situations.
Referring to fig. 1-3, the preferred embodiment of the present invention is shown.
The utility model provides a condenser microphone chip, including substrate 1, 1 top both sides of substrate all are equipped with coupling mechanism 12, coupling mechanism 12 upper portion is connected with the lining lid 2, lining lid 2 middle part evenly is provided with a plurality of back of the body utmost point 4, be provided with vibrating diaphragm 3 on the substrate 1 of back of the body utmost point 4 below, the top both sides of vibrating diaphragm 3 are provided with dust absorption mechanism, dust absorption mechanism's middle part is provided with the adhesive dust pad 8, dust absorption mechanism adsorbs the dust to the adhesive dust pad 8 on the vibrating diaphragm 3 on, both prevented that the dust from making back of the body utmost point 4 and vibrating diaphragm 3 short circuit, also prevented simultaneously that the dust separation from running through mouthful 5, influence the microphone and use, coupling mechanism 12 is convenient for dismantle lining lid 2 and substrate 1, thereby be convenient for clear up the dust.
In the embodiment, the through holes 5 are arranged between the back electrodes 4, the lower parts of the through holes 5 are opposite to the dust sticking pads 8, the through holes 5 are convenient for the microphone to use, and dust is easy to stick to the through holes 5 in a humid environment.
In this embodiment, the dust suction mechanism includes a positive electrode capacitor plate 6 and a negative electrode capacitor plate 7, the top end of the vibrating diaphragm 3 is respectively provided with a mounting groove 9 matching with the positive electrode capacitor plate 6 and the negative electrode capacitor plate 7, both sides of the bottom wall of the mounting groove 9 are provided with terminals 10, the bottoms of the positive electrode capacitor plate 6 and the negative electrode capacitor plate 7 are respectively provided with a wiring groove matching with the terminals 10, both sides of the terminals 10 are respectively protruded with a positioning member 17, the outer wall of the positioning member 17 is abutted against the inner wall of the wiring groove, one side of the mounting groove 9 opposite to the positive electrode capacitor plate 6 and the negative electrode capacitor plate 7 is provided with a fixing port 11 matching with the fixing block, the positive electrode capacitor plate 6 and the negative electrode capacitor plate 7 are fixed by the fixing block and the fixing port 11, and a positioning piece 17 is arranged on the binding post 10 to prevent the capacitor from being broken, thereby ensuring the dust removal of the capacitor to continuously work.
In this embodiment, coupling mechanism 12 includes stand 13, the top middle part of stand 13 is provided with spread groove 14, be equipped with locating lever 15 in the spread groove 14, the upper end of locating lever 15 runs through the notch of spread groove 14 and extends to the outside, the nested a plurality of cutting ferrule 16 that have on the outer wall of locating lever 15, cutting ferrule 16 and spread groove 14's inner wall interference fit, and stand 13 fixes on substrate 1, locating lever 15's upper end is connected with bushing cover 2, only need extract spread groove 14 with locating lever 15 hard when needing to clear up the dust like this and can realize the separation, and cutting ferrule 16 and spread groove 14 are interference fit, fixed effect is good, and dismantle portably, just can clear up and change the dust on the sticky dirt pad 8 after the dismantlement, thereby increase the lasting dust removal effect of sticky dirt pad.
When the technical scheme is used, firstly, a microphone is electrified for use, and is respectively communicated with a positive electrode capacitance plate 6 and a negative electrode capacitance plate 7 through a binding post 10, a dust absorption mechanism works, namely, an electric field is formed between the positive electrode capacitance plate 6 and the negative electrode capacitance plate 7, the electric field can be adsorbed on dust with electric charges in a through hole 5, so that the dust is adsorbed on a dust sticking pad 8 on a vibrating diaphragm 3, the dust is prevented from short-circuiting a back electrode 4 and the vibrating diaphragm 3, the dust is prevented from blocking the through hole 5 and influencing the use of the microphone, the positive electrode capacitance plate 6 and the negative electrode capacitance plate 7 are fixed through a fixed block and a fixed port 11, a positioning piece 17 is arranged on the binding post 10 to prevent the capacitor from being broken, so that the dust removal continuous work of the capacitor is ensured, when the dust removal effect is reduced, the separation can be realized only by forcibly pulling a positioning rod 15 out of a connecting groove 14 through a connecting mechanism 12, and the cutting ferrule 16 and the connecting groove 14 are in interference fit, so that the fixing effect is good, the disassembly is simple and convenient, and the dust on the sticky mat 8 can be cleaned and replaced after the disassembly, so that the continuous dust removal effect of the sticky mat is improved.
In this embodiment, the whole operation process can be controlled by a computer, and PLC and the like are added to realize automatic operation control, and in each operation link, signal feedback can be performed by setting a sensor to realize sequential execution of steps, which are conventional knowledge of the current automatic control, and are not repeated in this embodiment.
The details of the present invention are well known to those skilled in the art.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A condenser microphone chip is characterized in that: the dust-collecting device comprises a substrate, wherein connecting mechanisms are arranged on two sides of the top end of the substrate, a lining cover is connected to the upper portion of each connecting mechanism, a plurality of back electrodes are uniformly arranged in the middle of the lining cover, a vibrating diaphragm is arranged on the substrate below the back electrodes, dust-collecting mechanisms are arranged on two sides of the top end of the vibrating diaphragm, and a dust-sticking pad is arranged in the middle of each dust-collecting mechanism.
2. A condenser microphone chip according to claim 1, wherein: and through openings are formed among the back electrodes, and the lower parts of the through openings are right opposite to the dust sticking pads.
3. A condenser microphone chip according to claim 2, wherein: the dust collection mechanism comprises a positive electrode capacitor plate and a negative electrode capacitor plate, and mounting grooves matched with the positive electrode capacitor plate and the negative electrode capacitor plate are respectively formed in the top end of the vibrating diaphragm.
4. A condenser microphone chip according to claim 3, wherein: the terminal is arranged on both sides of the bottom wall of the mounting groove, and the wiring grooves matched with the terminals are arranged at the bottoms of the positive electrode capacitor plate and the negative electrode capacitor plate.
5. A condenser microphone chip according to claim 4, wherein: the both sides of terminal all the protrusion have the setting element, the outer wall of setting element all offsets with the wiring groove inner wall.
6. A condenser microphone chip according to claim 5, wherein: and one side of the mounting groove is provided with a fixing port matched with the fixing block.
7. A condenser microphone chip according to any one of claims 1 to 6, wherein: the connecting mechanism comprises an upright post, and a connecting groove is arranged in the middle of the top end of the upright post.
8. A condenser microphone chip according to claim 7, wherein: be equipped with the locating lever in the spread groove, the notch of spread groove is run through and extends to the outside in the upper end of locating lever.
9. A condenser microphone chip according to claim 8, wherein: the outer wall of the positioning rod is nested with a plurality of clamping sleeves, and the clamping sleeves are in interference fit with the inner walls of the connecting grooves.
10. A condenser microphone chip according to claim 9, wherein: the upright post is fixed on the substrate, and the upper end of the positioning rod is connected with the lining cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020356771.5U CN211702369U (en) | 2020-03-19 | 2020-03-19 | Capacitive microphone chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020356771.5U CN211702369U (en) | 2020-03-19 | 2020-03-19 | Capacitive microphone chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211702369U true CN211702369U (en) | 2020-10-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020356771.5U Expired - Fee Related CN211702369U (en) | 2020-03-19 | 2020-03-19 | Capacitive microphone chip |
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| Country | Link |
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| CN (1) | CN211702369U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492487A (en) * | 2020-12-03 | 2021-03-12 | 青岛歌尔智能传感器有限公司 | Microphone chip, MEMS microphone and electronic device |
| WO2023202521A1 (en) * | 2022-04-21 | 2023-10-26 | 维沃移动通信有限公司 | Microphone control method and apparatus, electronic device, and readable storage medium |
-
2020
- 2020-03-19 CN CN202020356771.5U patent/CN211702369U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492487A (en) * | 2020-12-03 | 2021-03-12 | 青岛歌尔智能传感器有限公司 | Microphone chip, MEMS microphone and electronic device |
| WO2023202521A1 (en) * | 2022-04-21 | 2023-10-26 | 维沃移动通信有限公司 | Microphone control method and apparatus, electronic device, and readable storage medium |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201016 |
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| CF01 | Termination of patent right due to non-payment of annual fee |