CN211504184U - Machine state monitoring and diagnosing instrument - Google Patents

Abstract

The utility model relates to a monitoring devices field especially relates to a machine state monitoring diagnostic apparatus. The utility model provides a machine state monitoring and diagnosing instrument, which comprises a shell; a power supply assembly, a mainboard assembly and a sensor are arranged in the shell, and the power supply assembly and the sensor are respectively in power supply connection and communication connection with the mainboard assembly; be provided with leaded light post and data interface on the casing, leaded light post and data interface and mainboard subassembly communication connection. The machine state monitoring and diagnosing instrument can ensure that a user can directly check the working state of the current machine state monitoring and diagnosing instrument through the state of the light guide column by arranging the light guide column on the shell; through set up data interface on the casing, set up the mainboard subassembly in the casing, the user can conveniently gather real-time monitoring data, has guaranteed that the user can know the state of monitoring equipment at present in real time according to corresponding monitoring data, and then has simplified the application method of machine state monitoring diagnostic equipment.

Description

Machine state monitoring and diagnosing instrument

Technical Field

The utility model relates to a monitoring devices field especially relates to a machine state monitoring diagnostic apparatus.

Background

The existing pump machine state monitoring and diagnosing instrument has the functions of equipment abnormality monitoring, fault diagnosis, alarm and the like. The pump machine state monitoring diagnostic instrument is generally cylindrical in shape, has no exposed display lamp, no exposed on-off key and no exposed data instant transmission port, needs to upload data intermittently due to the online monitoring characteristic, has short working time due to small battery capacity and is more frequent in later maintenance due to battery replacement.

Therefore, the user cannot judge the working state of the diagnostic instrument through appearance display, switch off the instrument without opening the cover, and acquire real-time data without opening the cover, the operation is complex, and the problem that the on-site battery replacement cannot be estimated possibly occurs.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a machine state monitoring diagnostic device to solve the inconvenient problem of machine state monitoring diagnostic device among the prior art.

In order to solve the technical problem, the utility model provides a machine state monitoring diagnostic apparatus, which comprises a shell; a power supply assembly, a mainboard assembly and a sensor are arranged in the shell, and the power supply assembly and the sensor are respectively in power supply connection and communication connection with the mainboard assembly; the shell is provided with a light guide column and a data interface, and the light guide column and the data interface are in communication connection with the mainboard assembly.

Further, the casing includes lid and base, the lid detachably connects on the base.

Further, a first sealing ring is arranged between the cover body and the base.

Furthermore, an accommodating space is formed inside the cover body, and the main board assembly is arranged in the accommodating space and fixedly connected in the cover body through a first fastener.

Further, the mainboard assembly comprises a control mainboard and a communication mainboard, the control mainboard is in communication connection with the communication mainboard, and the communication mainboard is fixedly connected in the cover body through the first fastening piece.

Further, the sensor is fixedly connected to the base through a second fastener, and the sensor is in communication connection with the communication main board.

Furthermore, an interface cover plate is arranged on the cover body, the interface cover plate can shield or open the data interface, and a second sealing ring is arranged between the interface cover plate and the cover body.

Further, still be provided with the panel on the lid, leaded light post detachably connects on the lid, be provided with on the panel with the opening that the position of leaded light post corresponds.

Furthermore, a switch button is arranged on the panel.

Furthermore, the communication device also comprises an antenna, wherein the first end of the antenna extends out of the cover body, and the second end of the antenna is inserted into the communication mainboard.

The machine state monitoring and diagnosing instrument provided by the utility model can ensure that the machine state monitoring and diagnosing instrument has better continuous working capacity by arranging the power supply component in the shell; the light guide column is arranged on the shell, so that a user can directly check the working state of the current machine state monitoring diagnostic apparatus through the state of the light guide column; through set up data interface on the casing or set up the mainboard subassembly in the casing, guaranteed that the user conveniently gathers real-time monitoring data or sends monitoring data for the high in the clouds through the mainboard subassembly, and then guaranteed that the user can know the state of monitoring equipment at present in real time according to corresponding monitoring data, and then simplified the application method of machine state monitoring diagnostic equipment.

Drawings

Fig. 1 is a schematic cross-sectional view of a machine condition monitoring and diagnosing apparatus provided in an embodiment of the present invention;

fig. 2 is a schematic side view of a machine condition monitoring and diagnosing apparatus provided in an embodiment of the present invention;

fig. 3 is a schematic front view of a cover and a panel according to an embodiment of the present invention.

The reference numbers illustrate:

100. a power supply component; 102. a sensor; 104. a light guide pillar; 106. a cover body; 108. a base; 110. a first seal ring; 112. a first fastener; 114. a control main board; 116. a communication motherboard; 118. a second fastener; 120. an interface cover plate; 122. a second seal ring; 124. a panel; 126. an opening; 128. switching a key; 130. an antenna; 132. a buffer sponge.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly described below with reference to the accompanying drawings of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the utility model, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the utility model.

In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the embodiments of the present invention can be understood in specific cases by those skilled in the art.

In embodiments of the invention, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

As shown in fig. 1 to 3, the present invention provides a machine state monitoring and diagnosing apparatus, which comprises a housing; a power supply assembly 100, a mainboard assembly and a sensor 102 are arranged in the shell, and the power supply assembly 100 and the sensor 102 are respectively in power supply connection and communication connection with the mainboard assembly; be provided with leaded light post 104 and data interface on the casing, leaded light post 104 and data interface and mainboard subassembly communication connection.

The machine state monitoring and diagnosing instrument provided by the utility model can ensure that the machine state monitoring and diagnosing instrument has better continuous working capacity by arranging the power supply module 100 in the shell; the light guide column 104 is arranged on the shell, so that a user can directly check the working state of the current machine state monitoring diagnostic apparatus through the state of the light guide column 104; through set up data interface on the casing or set up the mainboard subassembly in the casing, guaranteed that the user conveniently gathers real-time monitoring data or sends monitoring data for the high in the clouds through the mainboard subassembly, and then guaranteed that the user can know the state of monitoring equipment at present in real time according to corresponding monitoring data, and then simplified the application method of machine state monitoring diagnostic equipment.

Particularly, the embodiment of the utility model provides a machine condition monitoring diagnostic apparatus can be used to monitor mechanical equipment's vibration condition to reflect according to this vibration condition whether the operation is normal by monitoring equipment.

The embodiment of the utility model provides an in, machine state monitoring diagnostic apparatus is including the casing, and most structural component in this embodiment all sets up inside the casing. Therefore, most structural components can be protected by the shell, and the machine state monitoring and diagnosing instrument is easy to transport and use after being assembled.

Inside the housing are provided a power supply assembly 100, a main board assembly and a sensor 102.

The power supply module 100 serves as a power source of the device condition monitoring and diagnosing apparatus. For example, the power module 100 may be packaged with three 14505 batteries and one capacitor, which provides the power module 100 with advantages of large capacity, low cost, high reliability, etc.

Preferably, a buffer member such as a buffer sponge 132 is attached to both sides of the power module 100 to protect the power module 100.

In addition, the power module 100 is electrically connected to the motherboard module via a connector.

The mainboard assembly is used for realizing the control function and the communication function of the machine state monitoring diagnostic instrument. For example, the mainboard subassembly can realize opening to start of this machine state monitoring diagnostic apparatus and stop control etc. simultaneously, the mainboard subassembly can also realize uploading the effect of high in the clouds in real time with each item monitoring parameter of this machine state monitoring diagnostic apparatus to make the user can look over the operating condition of monitored equipment at present according to each item monitoring parameter.

The sensor 102 is used to monitor the status of the device, and as mentioned above, the sensor 102 may be an actuator used to monitor vibrations; of course, the sensor 102 may be configured as other types of sensors as needed to monitor whether the device is operating properly based on other parameters.

In this embodiment, the sensor 102 is disposed on a plate-shaped structural member and is fixedly attached to the interior of the housing by the second fastener 118. In this way, it is ensured that the sensor 102 and the housing have the same vibration frequency, and vibration errors caused to the sensor 102 by housing vibrations are eliminated. The second fastening member 118 may be a screw or the like.

In addition, the sensor 102 is in communication connection with the motherboard assembly through the plug connector, so that the monitored monitoring parameters are fed back to the motherboard assembly.

The light guide column 104 is arranged on the shell and used for reflecting the current operating state of the machine state monitoring diagnostic apparatus in real time. The light guide 104 may be bonded in the housing by a 3M adhesive.

Wherein, light guide column 104 can choose for use soft silica gel material to make, has just so guaranteed light guide column 104 when having good leaded light nature, still has better waterproof leakproofness. In addition, because the light guide column 104 is made of soft silica gel, the light guide column 104 can be ensured to have better bending resistance.

The data interface arranged on the shell is used for realizing the function that a user can export various monitoring parameters monitored by the sensor 102 at any time through the data interface.

In addition, the data interface is in communication connection with the mainboard assembly, so that a user can export various monitoring parameters in real time through the data interface.

As shown in fig. 1 and 2, the housing further includes a cover 106 and a base 108, and the cover 106 is detachably connected to the base 108. For example, a slot may be disposed at an edge of the base 108, a protrusion corresponding to the slot may be disposed on the cover 106, and the cover 106 and the base 108 may be detachably connected by placing the protrusion in the slot.

In this embodiment, the housing includes two parts, namely a cover 106 and a base 108. In a preferred embodiment, the cover 106 and the base 108 are fastened together to form a rectangular parallelepiped housing. For example, when the cover 106 and the base 108 are fastened together, a rectangular parallelepiped structure with a length of 60 mm, a width of 40 mm, and a height of 60 mm can be formed. Thereby, a large space for installing the corresponding equipment and the equipment to be monitored can be formed inside the housing.

In addition, the cover 106 and the base 108 in this embodiment may be made of aluminum alloy, so as to ensure a certain structural strength of the housing and reduce the overall weight of the housing.

Still further, a first seal ring 110 is disposed between the cover 106 and the base 108.

As shown in fig. 1, the first sealing ring 110 may be made of a rubber material, and the waterproof sealing performance between the cover 106 and the base 108 can be ensured by disposing the first sealing ring 110 between the cover 106 and the base 108. For example, the first seal ring 110 may be disposed in a slot on the base 108. It should be noted that, when the cover 106 and the base 108 are inserted, the first sealing ring 110 is to ensure that the sealing between the two meets the requirement of IP 67.

Further, a receiving space is formed inside the cover 106, and the main board assembly is disposed in the receiving space and fixedly connected to the cover 106 by a first fastener 112.

Referring to fig. 1, the main board assembly may be fixedly connected to the accommodating space formed inside the cover 106 by a connecting member such as a screw, so that the main board assembly is fixedly connected. That is, the first fastener 112 in the present embodiment may be a fastener such as a screw.

In addition, as mentioned above, the housing includes the cover 106 and the base 108, and preferably, the sensor 102 is mounted on the base 108, so as to reduce interference of other components with the measurement accuracy.

Further, the main board assembly includes a control main board 114 and a communication main board 116, the control main board 114 is in communication connection with the communication main board 116, and the communication main board 116 is fixedly connected in the cover 106 through the first fastening member 112.

In other words, the motherboard assembly in this embodiment includes two motherboards, namely, a control motherboard 114 and a communication motherboard 116. The control motherboard 114 is configured to control the machine state monitoring and diagnosing apparatus, and the communication motherboard 116 is configured to send various device parameters monitored by the sensor 102 to the cloud.

As shown in fig. 1, the control motherboard 114 is located below the communication motherboard 116, and the communication motherboard 116 is plugged into the control motherboard 114 through a plug connector to implement communication connection between the two. The communication board 116 is fixedly connected to the accommodating space inside the cover 106 by a connector such as a screw. More importantly, the communication main board 116 is electrically connected with the control main board 114, and then the communication main board 116 is connected with the cover body 106, so that the assembly process in the upper cover body 106 is reduced, and the assembly efficiency of the whole machine is greatly improved.

As shown in fig. 2, in a preferred embodiment, an interface cover plate 120 is disposed on the cover 106, the interface cover plate 120 can cover or uncover the data interface, and the interface cover plate 120 and the cover 106 are disposed with a second sealing ring 122.

In other words, the data interface in this embodiment is not directly exposed, but is shielded by the interface cover 120, and when the data interface needs to be used, the interface cover 120 can be removed. That is, the access panel 120 of the present embodiment may be hingedly attached to the cover 106.

Further, the second seal ring 122 is provided between the interface cover plate 120 and the lid body 106, and the second seal ring 122 can effectively seal the gap between the interface cover plate 120 and the lid body 106. Wherein, the second sealing ring 122 may be made of rubber material; the interface cover plate 120 may be made of an aluminum alloy.

Further, as shown in fig. 3, a panel 124 is further disposed on the cover 106, and an opening 126 corresponding to the position of the light guide bar 104 is disposed on the panel 124.

For example, a groove corresponding to the shape of the panel 124 may be formed on the cover 106, and the panel 124 may be placed in the groove.

The opening 126 corresponding to the position of the light guide column 104 is formed in the panel 124, so that a user can see the state of the light guide column 104 without disassembling the cover 106, and the user can conveniently see the working state of the machine state monitoring and diagnosing instrument at any time.

The opening 126 may be formed by directly forming a through hole on the panel 124, or by forming a window on the panel 124 through which the light guide 104 can be viewed.

In addition, the panel 124 may be made of a PC material.

Further, a switch button 128 is provided on the panel 124. In this embodiment, the switch button 128 may be a membrane button, so that the on/off of the apparatus condition monitoring and diagnosing apparatus can be realized without detaching the cover 106.

As shown in fig. 1, the apparatus for monitoring and diagnosing status of a machine further includes an antenna 130, a first end of the antenna 130 extends out of the cover 106, and a second end of the antenna 130 is plugged into the communication motherboard 116.

The antenna 130 has a mounting kit and a sealing member, the antenna 130 can be connected and sealed with the cover 106 through the mounting kit and the sealing member, a first end of the antenna 130 extends out of the cover 106 to ensure sufficient signal strength, and a second end of the antenna 130 can be connected with the communication motherboard 116 through the IPEX connector.

The following explains the steps of installing the apparatus condition monitoring and diagnosing apparatus:

1. firstly, the light guide column 104 is installed on the cover body 106, and then the panel 124 is installed on the cover body 106;

2. the antenna 130 is fixed on the cover 106 through a self-contained installation kit and is electrically connected with the communication main board 116 through an IPEX plug connector;

3. fixing the control main board 114 to the communication main board 116 through a plug connector to complete electrical connection, and then fixing the communication main board 116 to the cover 106 through a screw;

4. placing the first seal ring 110 into the slot of the base 108;

5. the sensor 102 is fixed on the base 108 through screws, and is electrically connected with the communication mainboard 116 through a plug connector;

6. attaching buffer sponges 132 to both sides of the power supply module 100, and electrically connecting the power supply module 100 with the communication motherboard 116 through plug connectors;

7. after the above assembly is completed, the cover 106 and the base 108 are fixed by screws, and the final assembly is completed.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A machine state monitoring and diagnosing instrument is characterized by comprising a shell;

a power supply assembly, a mainboard assembly and a sensor are arranged in the shell, and the power supply assembly and the sensor are respectively in power supply connection and communication connection with the mainboard assembly;

the shell is provided with a light guide column and a data interface, and the light guide column and the data interface are in communication connection with the mainboard assembly.

2. The machine condition monitoring and diagnostic instrument of claim 1, wherein the housing includes a cover and a base, the cover being removably attached to the base.

3. The machine condition monitoring and diagnosing instrument of claim 2, wherein a first sealing ring is disposed between the cover and the base.

4. The machine condition monitoring and diagnosing instrument of claim 2, wherein a receiving space is formed inside the cover, and the main board assembly is disposed in the receiving space and fixedly connected inside the cover by a first fastening member.

5. The machine condition monitoring and diagnosing instrument as claimed in claim 4, wherein the main board assembly includes a control main board and a communication main board, the control main board is in communication connection with the communication main board, and the communication main board is fixedly connected in the cover body through the first fastening member.

6. The machine condition monitoring and diagnostic instrument of claim 5, wherein the sensor is fixedly attached to the base by a second fastener, the sensor being in communication with the communication motherboard.

7. The machine condition monitoring and diagnosing instrument as claimed in claim 2, wherein the cover body is provided with an interface cover plate, the interface cover plate can cover or uncover the data interface, and the interface cover plate and the cover body are provided with a second sealing ring.

8. The machine condition monitoring and diagnosing instrument as claimed in claim 2, wherein the cover is further provided with a panel, the light guide post is detachably connected to the cover, and the panel is provided with an opening corresponding to the position of the light guide post.

9. The machine condition monitoring and diagnosing instrument as claimed in claim 8, wherein the panel is provided with a switch button.

10. The machine condition monitoring and diagnosing instrument of claim 5, further comprising an antenna, wherein a first end of the antenna extends out of the cover, and a second end of the antenna is plugged into the communication motherboard.

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