CN211090124U

CN211090124U - Embedded radiating fin and mounting structure of radiating fin and circuit board

Info

Publication number: CN211090124U
Application number: CN201922146846.7U
Authority: CN
Inventors: 阮水林; 候国光; 何泳龙
Original assignee: Huizhou Merix Electronic Technology Co ltd
Current assignee: Huizhou Merix Electronic Technology Co ltd
Priority date: 2019-12-04
Filing date: 2019-12-04
Publication date: 2020-07-24
Anticipated expiration: 2029-12-04

Abstract

The utility model discloses a mounting structure of embedded fin and circuit board, embedded fin include fin body and a plurality of protrusion structure, each protrusion structure all sets up on the lateral wall of fin body, and each protrusion structure is located the intermediate position of keeping away from both sides surface on the lateral wall of fin body. The mounting structure of the radiating fin and the circuit board comprises an embedded radiating fin and the circuit board, a mounting cavity is formed in the circuit board and is matched with the embedded radiating fin, the embedded radiating fin is embedded into the mounting cavity, and the protruding structure is meshed with the inner side wall of the mounting cavity. The utility model is used for electronic components's heat radiation structure in the circuit board.

Description

Embedded radiating fin and mounting structure of radiating fin and circuit board

Technical Field

The utility model relates to a circuit board technical field, concretely relates to embedded fin and mounting structure of fin and circuit board.

Background

The circuit board is an integrated circuit module structure, and the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electrical appliance layout. The circuit board is a component mounting carrier and a circuit connection structure in various electrical equipment, and many electronic components need to be mounted and fixed through the circuit board. Some electronic components generate more heat during working and need heat dissipation treatment, otherwise the electronic components can be burnt by self-generated high temperature, and for example, a chip needs heat dissipation treatment.

Embedding a heat sink in a circuit board to dissipate heat of an electronic component is a common heat dissipation method, and the heat sink is embedded in a cavity groove of the circuit board by mechanical pressure. Some of the existing embedded radiating fins are pressed in a cavity groove of a circuit board, and the radiating fins are not firmly installed on the circuit board and are easy to fall off from the circuit board, so that the heat dissipation of electronic components is influenced; some embedded copper heat sinks usually have wave-shaped copper teeth designed on four side walls of the heat sink to achieve the purpose of fastening in order to reinforce the heat sink and prevent the heat sink from falling off, but the wave-shaped copper teeth are extruded out to remain on the surface of the circuit board during mechanical pressure assembly due to the structure, so that the yield of the circuit board is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem to the not enough in the background art, provide the mounting structure of embedded fin and circuit board that can solve.

In order to solve the technical problem, the technical scheme of the utility model is that: an embedded radiating fin comprises a radiating fin body and a plurality of protruding structures, wherein each protruding structure is arranged on the outer side wall of the radiating fin body, and each protruding structure is located in the middle position, far away from the surfaces of the two sides, of the outer side wall of the radiating fin body.

Furthermore, a protruding structure is arranged on each outer side wall of the radiating fin body.

Further, each of the protruding structures is a circular arc protruding structure.

Further, the height of the protruding structure is 30% -50% of the thickness of the radiating fin body.

Furthermore, the corner of the outer side wall of the radiating fin body connected with the surface is of a first chamfer structure.

Further, the joint of the adjacent outer side walls of the radiating fin body is of a fillet structure.

The utility model provides an utilize mounting structure of fin and circuit board of aforementioned embedded fin, includes embedded fin and circuit board, the installation cavity has been seted up on the circuit board, installation cavity and embedded fin looks adaptation, embedded fin is embedded into in the installation cavity, the inner side wall interlock of protrusion structure and installation cavity.

Furthermore, a second chamfer structure is arranged at the joint of the mounting cavity and the outer surface of the circuit board.

The utility model discloses the beneficial effect who realizes mainly has following several: the outer side wall of the radiating fin body is provided with a protruding structure, and when the embedded radiating fin is arranged in the embedded groove of the base body, the protruding structure can be abutted against the inner side wall of the embedded groove, so that the embedded radiating fin is tightly clamped and fixed in the embedded groove of the base body; and the bulge structure is only arranged at the vertical middle position of the side wall of the radiating fin body, and the bulge structure can deform and extend upwards and downwards when being extruded, so that the bulge structure can be prevented from being extruded to form a tumor body to expose the surface of the base body, and the quality of the base body is influenced. The mounting structure of the radiating fin and the circuit board utilizes the embedded radiating fin, so that the surface of the circuit board is prevented from generating a tumor body while the embedded radiating fin is firmly mounted on the circuit board, and the yield of circuit board processing production is improved.

Drawings

Fig. 1 is a schematic perspective view of an embedded heat sink in an embodiment of the present invention;

fig. 2 is a schematic structural view of a circuit board of an installation structure of a heat sink and the circuit board according to a second embodiment of the present invention;

fig. 3 is a schematic structural view of the embedded heat sink and the circuit board according to the second embodiment of the present invention after being mounted.

The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted; the same or similar reference numerals correspond to the same or similar parts; the terms describing positional relationships in the drawings are for illustrative purposes only and are not to be construed as limiting the patent.

Detailed Description

To facilitate understanding for those skilled in the art, the present invention will be described in further detail with reference to the accompanying drawings and examples.

Example one

Referring to fig. 1, an embedded heat sink may be embedded in other substrates to be used as a heat dissipation component, and the embedded heat sink is usually a metal sheet with good heat dissipation, such as a copper sheet. The embedded heat sink 1 includes a heat sink body 11 and a plurality of protruding structures 12, wherein the heat sink body 11 is a main structure of the heat sink, and contacts with an electronic component to be cooled through its good heat dissipation performance, so as to conduct heat from the electronic component to the heat sink body 11, and then dissipate the heat through the heat sink body 11. The shape of the heat sink body 11 is selected according to the needs, for example, if the electronic component to be cooled is circular, the heat sink body 11 may also be configured to be a disk-shaped structure; if the electronic component to be cooled is a quadrilateral, the heat sink body 11 may also be a quadrilateral plate structure, and the heat sink body 11 having a quadrilateral plate structure is described as an example in this embodiment. The protruding structure 12 is a structure fixed to the base body on which the embedded heat sink is mounted, and the embedded heat sink is fixed to the embedded groove of the base body by the protruding structure 12.

Referring to fig. 1, each of the protruding structures 12 is disposed on the outer sidewall 111 of the heat sink body 11, and is generally integrated with the heat sink body 11. For the heat sink body 11 with the quadrilateral sheet structure in this example, the protruding structures 12 may be disposed on two opposite outer sidewalls 111 of the heat sink body 11, or the protruding structures 12 may be disposed on four outer sidewalls 111 of the heat sink body 11, preferably, the latter method is adopted, so that the embedded heat sink 1 is embedded into the base body to be more firmly clamped; for the fin body 11 in a circular sheet shape, it is preferable that a plurality of the convex structures 12 are uniformly provided on the outer side wall of the fin body 11.

Referring to fig. 1, the protruding structure 12 is located at a middle position of the outer side wall 111 of the heat sink body 11 far from the two side surfaces 112, that is, at a middle position of the side wall of the heat sink body 11 in the vertical direction, and both ends of the protruding structure 12 do not reach the two side surfaces 112 of the heat sink body 11. From this, when embedded fin 1 installs in the embedded groove of base member, protrusion structure 12 can offset with the lateral wall of embedded groove to fix embedded fin 1 chucking in the embedded groove of base member, protrusion structure 12 only sets up in the vertical intermediate position of 11 lateral walls of fin body moreover, and protrusion structure 12 can be to space deformation of ascending down when receiving the extrusion, can avoid protrusion structure 12 to receive the extrusion shape to become the surface that the tumor body exposes the base member from this, influences the quality of base member. The protruding structure 12 is disposed on the outer sidewall 111 of the heat sink body 11 at a position far away from the middle of the two side surfaces 112, so that the embedded heat sink 1 can be mounted in the embedded groove of the base body from both the upper and lower sides.

Referring to fig. 1, the shape of the protruding structure 12 may be a common shape, such as a spherical protrusion, a truncated pyramid protrusion, a prismatic protrusion, or an arc-shaped protrusion, and preferably, the spherical protrusion and the arc-shaped protrusion are used, so that the shape of the heat sink body 11 is smoother, and the installation of the embedded heat sink 1 is easier. In the present embodiment, a projection structure 12 having a circular arc-shaped projection structure is shown. In order to allow enough space for the protruding structures 12 to extend and deform up and down, the height of the protruding structures 12 is preferably between 30% and 50% of the thickness of the heat sink body 11.

Referring to fig. 1, the corner of the outer sidewall 111 of the heat sink body 11 connected to the surface 112 is a first chamfer structure 113, which can be set to a 45 ° chamfer structure, and the chamfer structure can ensure the smoothness of the outer wall of the heat sink body 11, and also can guide the embedded heat sink 1 to the embedded groove through the chamfer structure, so that the embedded installation is easier. Similarly, the joint of the adjacent outer sidewalls 111 of the heat sink body 11 is preferably configured as a fillet structure 114, so as to further ensure the smoothness of the outer wall of the heat sink body 11.

Example two

Referring to fig. 1 to 3, a mounting structure of a heat sink and a circuit board using an embedded heat sink in the first embodiment includes an embedded heat sink 1 and a circuit board 2, the circuit board 2 is used as the base, and the embedded heat sink 1 is mounted in the circuit board 2 and used as a heat dissipation structure of an electronic component on the circuit board. The circuit board 2 is provided with a mounting cavity 21 (namely an embedded groove), the mounting cavity 21 is matched with the embedded heat sink 1, and the mounting cavity 21 and the embedded heat sink 1 have the same shape and size, so that the embedded heat sink 1 can be embedded into the mounting cavity 21; when the male structure 12 is inserted into the mounting cavity 21, the male structure 12 is engaged with the inner sidewall 211 of the mounting cavity 21, so as to clamp the male structure 12in the mounting cavity 21. The mounting cavity 21 can be a through groove structure or a blind groove structure, and is selected according to the actual structure of the circuit board; the inner side wall 211 of the mounting cavity 21 may be a substrate structure of a circuit board or a circuit structure.

Referring to fig. 2, as a further preferred scheme, a second chamfer structure 212 is preferably disposed at a connection position of the mounting cavity 21 and the outer surface of the circuit board 2 to cooperate with the first chamfer structure 113, so as to facilitate guiding of the embedded heat sink 1 during embedded mounting to the mounting cavity 21.

The embedded heat sink 1 in this embodiment is made of copper T2/C11000, the length and width of the heat sink body 11 are 0.2 inch by 0.12inch, the thickness of the heat sink body 11 is 0.106inch, the radius of the arc-shaped protruding structure 12 is 0.020inch, the height of the arc-shaped protruding structure 12 is 0.04inch, and the external dimension of the mounting cavity 21 is the same as that of the embedded heat sink 1. The above description provides one specification of the embedded heat sink 1 and the mounting cavity 21, which can be selected as required in practice.

When the mounting structure of the heat sink and the circuit board in this embodiment is used, the electronic component to be cooled is welded on the circuit board 2, and the heating surface of the electronic component is abutted to the surface of the embedded heat sink 1, so that the electronic component can be cooled by the embedded heat sink 1.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations to the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. An embedded heat sink is characterized in that: the radiating fin comprises a radiating fin body (11) and a plurality of protruding structures (12), wherein each protruding structure (12) is arranged on the outer side wall (111) of the radiating fin body (11), and each protruding structure (12) is located in the middle position, far away from the two side surfaces (112), of the outer side wall (111) of the radiating fin body (11).

2. The embedded heat sink as recited in claim 1, wherein: each outer side wall (111) of the radiating fin body (11) is provided with a protruding structure (12).

3. The embedded heat sink as recited in claim 2, wherein: each protruding structure (12) is an arc protruding structure.

4. The embedded heat sink as recited in claim 3, wherein: the height of the protruding structure (12) is 30% -50% of the thickness of the radiating fin body (11).

5. The embedded heat sink as recited in claim 3, wherein: the corner of the outer side wall (111) of the radiating fin body (11) connected with the surface (112) is provided with a first chamfer structure (113).

6. The embedded heat sink as recited in claim 3, wherein: the joint of the adjacent outer side walls (111) of the radiating fin body (11) is a fillet structure (114).

7. A mounting structure of a heat sink and a circuit board using the embedded heat sink of any one of claims 1 to 5, characterized in that: including embedded fin (1) and circuit board (2), installation cavity (21) have been seted up on circuit board (2), installation cavity (21) and embedded fin (1) looks adaptation, embedded fin (1) are embedded into in installation cavity (21), the inside wall (211) interlock mutually of protruding structure (12) and installation cavity (21).

8. The mounting structure of a heat sink and a wiring board according to claim 7, wherein: and a second chamfer structure (212) is arranged at the joint of the outer surface of the mounting cavity (21) and the outer surface of the circuit board (2).