CN210742805U - Server with good heat dissipation performance - Google Patents

Abstract

An embodiment of the utility model provides a good heat dissipation's server, include: the computer case comprises a case, a main board, a fan module, a back board, a power supply module and a barrier piece, wherein the main board, the fan module, the back board, the power supply module and the barrier piece are arranged in the case; the mainboard and the power supply module are arranged at the front end of the case; the fan module is arranged at the rear end of the case; the back plate is arranged between the main plate and the fan module; the blocking piece is arranged outside the power supply module and used for forming an independent cavity with the case shell to accommodate the power supply module, namely, the power supply module is arranged in the independent cavity of the case, the heat dissipation air channel of the power supply module is arranged in the independent cavity and is isolated from the system heat dissipation air channel of the server, and in the process of some embodiments, the mutual interference between the heat dissipation air channel of the power supply module and the system heat dissipation air channel of the server can be avoided, and the heat dissipation performance of the server is improved.

Description

Server with good heat dissipation performance

Technical Field

The embodiment of the utility model provides a but, relate to but not limited to electronic equipment's heat dissipation field, particularly, relate to but not limited to a good heat dissipation's server.

Background

Servers, also known as servers, are devices that provide computing services. To make the performance of the server more powerful, the server usually includes a large number of electronic components that generate a large amount of heat during operation. The existing server has poor heat dissipation effect, so that the temperature of the server is too high, the service life of the server is influenced, and the working stability of the server is seriously influenced. Therefore, how to improve the heat dissipation performance of the server is still an urgent problem to be solved.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a good heat dissipation's server, the main technical problem who solves is the poor problem of current server heat dispersion.

In order to solve the above technical problem, an embodiment of the utility model provides a good heat dissipation's server, include: the method comprises the following steps: the computer case comprises a case, a main board, a fan module, a back board, a power supply module and a barrier piece, wherein the main board, the fan module, the back board, the power supply module and the barrier piece are arranged in the case; the mainboard and the power supply module are arranged at the front end of the case; the fan module is arranged at the rear end of the case; the back plate is arranged between the main plate and the fan module; the blocking piece is arranged outside the power supply module and used for forming an independent cavity with the chassis shell to accommodate the power supply module.

The utility model has the advantages that:

the embodiment of the utility model provides a good heat dissipation's server, include: the computer case comprises a case, a main board, a fan module, a back board, a power supply module and a barrier piece, wherein the main board, the fan module, the back board, the power supply module and the barrier piece are arranged in the case; the mainboard and the power supply module are arranged at the front end of the case; the fan module is arranged at the rear end of the case; the back plate is arranged between the main plate and the fan module; the blocking piece is arranged outside the power supply module and used for forming an independent cavity with the case shell to accommodate the power supply module, namely, the power supply module is arranged in the independent cavity of the case, and the heat dissipation air channel of the power supply module is arranged in the independent cavity and is isolated from the system heat dissipation air channel of the server.

Other features and corresponding advantages of the invention are set forth in the following part of the specification, and it is to be understood that at least some of the advantages become apparent from the description of the invention.

Drawings

Fig. 1 is a top view of a server according to a first embodiment of the present invention;

fig. 2 is another top view of a server according to a first embodiment of the present invention;

fig. 3 is a further top view of a server according to a first embodiment of the present invention;

fig. 4 is a left side view of a server according to a first embodiment of the present invention;

fig. 5 is a perspective view of a server according to a second embodiment of the present invention;

fig. 6 is a schematic structural diagram of a server according to a second embodiment of the present invention;

fig. 7 is a schematic view of a third barrier according to a second embodiment of the present invention;

fig. 8 is a schematic structural diagram of another server according to a second embodiment of the present invention;

fig. 9 is a schematic view of another third blocking member according to the second embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings by way of specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The first embodiment is as follows:

in order to solve the problem of poor heat dissipation performance of the existing server, the present embodiment provides a server with good heat dissipation performance, where the server provided by the present embodiment may be any server, for example, an edge server. For an edge server, the edge server is a main carrier of edge computing, wherein edge computing refers to providing a nearest service nearby by adopting an open platform with integrated network, computing, storage and application core capabilities on one side close to an object or a data source. The server with good heat dissipation performance provided by the embodiment comprises: the computer case comprises a case, and a main board, a fan module, a back board, a power supply module and a blocking piece which are arranged in the case.

Referring to fig. 1, fig. 1 is a top view of the server provided in this embodiment, in which a main board 102 is disposed at a front end of a chassis 101, a fan module 103 is disposed at a rear end of the chassis 101, and a back board 104 is disposed between the main board 102 and the fan module 103. In this embodiment, the fan module 103 adopts an air draft design, and the fan module 103 located at the rear end of the chassis 101 can suck cold air from the front end of the chassis 101 (i.e., the front 1011 of the chassis) and exhaust the cold air from the rear end of the chassis 101 (i.e., the rear 1012 of the chassis) after passing through the main board 102 and the back board 104, that is, in this embodiment, air is fed from the front 1011 of the chassis (i.e., the front end of the chassis) and discharged from the rear 1012 of the chassis (i.e., the rear end of the chassis), so as to form a system heat dissipation air duct which advances and then discharges, and. It should be understood that the back plate 104 is provided with a ventilation opening so that the wind from the front end of the cabinet 101 passes through the back plate 104 and is exhausted from the rear end of the cabinet 101, and the size, shape and the like of the ventilation opening can be flexibly set according to actual needs. In this embodiment, the fan module includes at least one fan, and the number of the specifically included fans may be flexibly set according to actual needs, for example, 3, 5, and the like. The fan module can adopt an axial flow fan and also can adopt a radial flow fan. In order to improve the heat dissipation performance of the server, the aperture of the fan used by the fan module may be greater than or equal to 80mm (millimeter), for example, the aperture of the fan used by the fan module may be 80mm, 90 mm, or 120mm, and specifically, the aperture may be selected according to the heat dissipation requirement of the server.

In this embodiment, the power module is arranged at the front end of the chassis, and because the power module is arranged in front, compared with a server with a rear power module, the depth of the chassis of the server is smaller, and miniaturization can be realized. The power module can be arranged at the upper end or the lower end of the main board, namely the power module can be arranged at the upper part of the front end of the case, and the main board is arranged at the lower part of the front end of the case, or the power module can be arranged at the lower part of the front end of the case, and the main board is arranged at the upper part of the front end of the case. Alternatively, the power module may be disposed on a side of the motherboard, that is, the power module and the motherboard are disposed side by side at a front end of the chassis, for example, as shown in fig. 1, the power module 105 may be disposed on a right side of the motherboard 102, or, as shown in fig. 2, the power module 105 may be disposed on a left side of the motherboard 102.

In this embodiment, the blocking member is disposed outside the power module, and the blocking member is used to form an independent cavity with the chassis housing to accommodate the power module, where the blocking member may be a plate structure, or the blocking member may also be a box structure. For example, referring to fig. 1, assuming that the power module 105 is disposed on the right side of the main board 102, the blocking member 106 includes a sub-blocking member disposed between the power module 105 and the main board 102, and a sub-blocking member disposed at the rear end of the power module 105, so that the blocking member 106 and the top surface (shown in the figure) of the chassis 101, the bottom surface (shown in the figure) of the chassis 101, the front surface 1011 of the chassis, and the right side surface of the chassis 101 may form an independent cavity 107 for accommodating the power module 105. Alternatively, referring to fig. 2, assuming that the power module 105 is disposed on the left side of the main board 102, the blocking member 106 includes a sub-blocking member disposed between the power module 105 and the main board 102, and a sub-blocking member disposed at the rear end of the power module 105, so that the blocking member 106 and the top surface (shown in the figure) of the chassis 101, the bottom surface of the chassis 101, the front surface 1011 of the chassis, and the left side surface of the chassis 101 may form an independent cavity 107 for accommodating the power module 105.

In this embodiment, the power module is disposed in the independent cavity in the chassis, so that the heat dissipation air duct of the power module is disposed in the independent cavity and isolated from the system heat dissipation air duct, thereby avoiding isolation between the heat dissipation air duct of the power module and the system heat dissipation air duct, and improving heat dissipation performance of the server. Because the power module is arranged in the independent cavity at the front end of the case, the front face of the independent cavity is overlapped with the front face of the case, namely, the front face of the case and the barrier piece form the independent cavity for accommodating the power module. It should be understood that the independent cavity is provided with an air inlet and an air outlet for heat dissipation of the power module. The air inlet and the air outlet are arranged on the surface of the independent cavity overlapped with the chassis shell. The air inlet and the air outlet can be arranged on the same surface, for example, both are arranged on the front surface of the independent cavity. In order to improve the heat dissipation efficiency, in the independent cavity, besides the front side, at least one side overlaps with the chassis housing, at this time, the air outlet and the air inlet are respectively arranged on two sides overlapping with the chassis housing, wherein the air inlet may be arranged on the front side of the independent cavity, the air outlet may be arranged on other sides overlapping with the chassis housing, or the air outlet may be arranged on the front side of the independent cavity, and the air inlet may be arranged on other sides overlapping with the chassis housing, for example, it is assumed that the front side of the chassis, the top side of the chassis and the blocking member form an independent cavity, at this time, the front side and the top side of the independent cavity overlap with the front side and the top side of the chassis respectively, the air outlet is arranged on the front side of the chassis. In the prior art, a plurality of servers are usually stacked, and therefore, in order to avoid the mutual influence of the power heat dissipation of the servers when the servers are placed, the front surface of the independent cavity is overlapped with the front surface of the chassis, and at least one side surface (left side surface and/or right side surface) of the independent cavity is overlapped with the side surface of the chassis, so that the air inlet and the air outlet can be respectively arranged on the front surface of the independent cavity and the side surface overlapped with the side surface of the chassis, for example, the air inlet is arranged on the front surface of the independent cavity, and the air outlet is arranged on the side surface overlapped with the side surface of the chassis on the independent cavity, to form a power heat dissipation air duct which is fed in and fed out in front, or, the air outlet is arranged on the front surface of the independent cavity, and the air inlet is arranged on the side surface overlapped with the side surface of the chassis on the independent cavity, to form a, that is, the front 1011 of the chassis, the left side of the chassis 101 and the blocking member 106 form an independent cavity 107, at this time, the air outlet can be arranged on the front of the independent cavity (i.e., the front 1011 of the chassis), and the air inlet can be arranged on the left side of the independent cavity (i.e., the left side of the chassis 101), so as to form a power supply heat dissipation air duct which enters from the left and exits from the front.

In this embodiment, the server may further include a daughter card, and the daughter card may be disposed at any position of the chassis, for example, may be disposed at the top or bottom of the power module, or may be disposed at the top or bottom of the motherboard. When power module sets up in the mainboard side, when the daughter card sets up in power module bottom (or power module top), in order to form the independent cavity that holds power module, the separation piece is including setting up the first separation piece between mainboard and power module, the second separation piece of setting between daughter card and power module, and the third separation piece of setting in the power module rear end, like this, first separation piece, second separation piece, third separation piece and quick-witted case outer wall form an independent cavity and hold power module, it needs to be said, power module rear end here is that power module sets up in the quick-witted case, the part that is close to quick-witted case rear end. The first blocking member may be a box structure or a plate structure, the second blocking member may be a box structure or a plate structure, and the third blocking member may be a box structure or a plate structure. For example, referring to fig. 3 and 4, fig. 3 is a top view of the server, fig. 4 is a left view of the server shown in fig. 3, and it is assumed that the power module 105 is disposed at the left side of the main board 102, the daughter card 108 is disposed at the bottom of the power module 105, the barriers include a first barrier 1061 disposed between the main board 102 and the power module 105, a second barrier 1062 disposed between the daughter card 108 and the power module 105, and a third barrier 1063 disposed at the rear end of the power module 105, thus, the first barrier 1061, the second barrier 1062, the third barrier 1063, the top surface of the chassis 101, the front surface 1011 of the chassis, and the left side surface of the chassis 101 form an independent cavity 107 for accommodating the power module 105, and at this time, an air outlet is arranged on the front surface 1011 of the case corresponding to the power module 105, an air inlet is arranged on the left side surface of the case 101 corresponding to the power module 105, and a power supply heat dissipation air channel which is arranged in front of the left side is formed in the independent cavity.

Through the embodiment of the utility model provides a good heat dissipation's server, in some implementation process, the server includes: the computer case comprises a case, a main board, a fan module, a back board, a power supply module and a barrier piece, wherein the main board, the fan module, the back board, the power supply module and the barrier piece are arranged in the case; the mainboard and the power supply module are arranged at the front end of the case; the fan module is arranged at the rear end of the case; the back plate is arranged between the main plate and the fan module; the blocking piece is arranged outside the power supply module and used for forming an independent cavity with the chassis shell to accommodate the power supply module, namely, the power supply module is arranged in the independent cavity of the chassis, and the heat dissipation air channel of the power supply module is arranged in the independent cavity and isolated from the system heat dissipation air channel of the server

Example two:

in order to solve the problem of poor heat dissipation performance of the existing server, the present embodiment provides a server with good heat dissipation performance, where the server is an edge server, as shown in fig. 5 to 7, fig. 5 is a perspective view of the server provided in the present embodiment, fig. 6 is a schematic view of a heat dissipation air duct of the server provided in the present embodiment, and fig. 7 is a schematic view of a third blocking member provided in the present embodiment, and the server includes: the computer system comprises a chassis 101, a mainboard 102, a fan module 103, a backplane 104, a power module 105, a daughter card 108 and a barrier member, wherein the mainboard 102, the fan module 103, the backplane 104, the power module 105, the daughter card 108 and the barrier member are arranged in the chassis 101.

The main board 102 is disposed on the left side of the front end of the chassis 101, the fan module 103 is disposed on the rear end of the chassis 101, the back board 104 is disposed between the main board 102 and the fan module 103, and the back board 104 is provided with a vent. The power module 105 is disposed on the right side of the front end of the chassis 101 (i.e., the power module 105 is disposed on the right side of the motherboard 102), and since the position control deployed by the edge server is not tight, the depth of the chassis of the server is generally required to be within 450mm to meet the requirement of being disposed in a 600mm cabinet, therefore, the power module is disposed on the front end of the chassis, the depth of the chassis can be controlled to be within 450mm, and the requirement of front routing of the wireless device cabinet can be met.

In this embodiment, the barriers include a first barrier 1061 disposed between the motherboard 102 and the power module 105, a second barrier 1062 disposed between the daughter card 108 and the power module 105, and a third barrier 1063 disposed at the rear end of the power module 105, where the first barrier 1061, the second barrier 1062, the third barrier 1063, the front side of the chassis, the top surface 1013 of the chassis, and the right side surface 1014 of the chassis form an independent cavity for accommodating the power module 105, and isolating the power module 105 from the motherboard 102 and the daughter card 108. The first barrier 1061 and the second barrier 1062 are plate structures (i.e., partition plates), the third barrier 1063 is a box structure, and the third barrier 1063 is a box structure, so that the formed independent cavity is firmer. Of course, in other embodiments, referring to fig. 8 and 9, the third blocking member 1603 may also be a plate-shaped structure.

In this embodiment, an air outlet is disposed on the front surface of the independent cavity (i.e., the front surface of the chassis 101), and an air inlet 1071 is disposed on the right side surface of the independent cavity (i.e., the portion of the right side surface 1014 of the chassis corresponding to the power module), it should be understood that the air inlet and the air outlet disposed here are used for heat dissipation of the power module 105, that is, an independent air duct for heat dissipation of the power module is formed in the independent cavity, which is configured to enter and exit from the right side (the direction of the heat dissipation air of the power module is shown by the black solid arrow in fig. 6), and the fan in the power module 105 can suck air from the air inlet on the right side surface of the chassis. In this embodiment, since the heat dissipation air duct of the power module 105 is a right-in front-out air duct, the power module 105 may adopt the IT-standard CRPS power module 105 designed by air draft, and compared with the existing power dissipation air duct which is a front-in rear-out air duct, the cost of the power module which must be designed by customization can be saved. Wherein, the heat dissipation of power module can adopt the convulsions design.

In this embodiment, fan module 103 adopts the convulsions design, and fan module 103 adopts the bore to be greater than 80 mm's axial fan, and the performance is better, and the radiating effect is better. The specific caliber of the adopted axial flow fan and the number of the fans included in the fan module can be flexibly set according to actual needs. Because the fan module 103 adopts an air draft design, the fan module 103 can suck cold air from the front end of the chassis 101, and the cold air passes through the motherboard 102, the daughter card 108 and the backplane 104 and is exhausted from the rear end of the chassis 101, i.e. a system heat dissipation air duct which advances and then exits is formed (the direction of the system heat dissipation air is shown by black hollow arrows in fig. 6).

Because the system heat dissipation air duct that advances back-out passes through the barrier with the power module heat dissipation air duct that advances forward and back-out on the right side and keeps apart, consequently, the two can not influence each other to can promote the heat dispersion of edge server.

Through the embodiment of the utility model provides a good heat dissipation's server, in some implementation process, the server includes: the computer case comprises a case, a mainboard, a fan module, a back plate, a power module, a daughter card and a barrier piece, wherein the mainboard, the fan module, the back plate, the power module, the daughter card and the barrier piece are arranged in the case; the main board and the power supply module are arranged at the front end of the case, the power supply module is arranged on the right side of the main board, the fan module is arranged at the rear end of the case, the back board is arranged between the main board and the fan module, and the daughter card is arranged at the bottom of the power supply module; the barrier comprises a first barrier arranged between the main board and the power module, a second barrier arranged between the sub-card and the power module, and a third barrier arranged at the rear part of the power module, the barrier and the chassis shell form an independent cavity for accommodating the power module, the right side surface of the independent cavity is provided with an air inlet, and the front surface of the independent cavity is provided with an air outlet, namely, a power module radiating air duct which enters and exits from the right side is formed in the independent cavity and is isolated from a radiating air duct which exits from the front side of the system through the barrier, so that the mutual interference between the radiating air duct of the power module and a system radiating air duct of a server can be avoided, the radiating performance of the server is improved, meanwhile, the power module and the main board are arranged in a front position, the fan module is arranged in a rear; in addition, the power supply module can directly use the CRPS power supply module with the IT standard, thereby saving the cost.

The foregoing is a more detailed description of embodiments of the present invention, and the specific embodiments are not to be considered in a limiting sense. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.

Claims (10)

1. A server with good heat dissipation, comprising: the server comprises a case, a mainboard, a fan module, a back plate and a power module, wherein the mainboard, the fan module, the back plate and the power module are arranged in the case; the mainboard and the power supply module are arranged at the front end of the case; the fan module is arranged at the rear end of the case; the back plate is arranged between the main plate and the fan module; the blocking piece is arranged outside the power supply module and used for forming an independent cavity with the chassis shell to accommodate the power supply module.

2. The heat dissipating server of claim 1, wherein the front face of the independent cavity overlaps the front face of the housing, and at least one side face of the independent cavity overlaps a side face of the housing.

3. The server according to claim 2, wherein the independent cavity has an air outlet on a front surface thereof, and an air inlet on a side surface of the independent cavity overlapping with a side surface of the housing.

4. The server according to claim 1, wherein the power module is provided on a side surface of the main board.

5. The server of claim 4, further comprising: and the daughter card is arranged at the bottom of the power supply module.

6. The server of claim 5, wherein the barriers comprise a first barrier disposed between the motherboard and the power module, a second barrier disposed between the daughter card and the power module, and a third barrier disposed at a rear end of the power module, and the first barrier, the second barrier, the third barrier, and the outer wall of the housing form an independent cavity for accommodating the power module, and form an independent heat dissipation duct for the power module in the independent cavity.

7. The server according to claim 6, wherein the third barrier is a box structure or a plate structure.

8. The server according to claim 1, wherein the fan module is an axial fan.

9. The server according to claim 1, wherein the fan module is a fan having a diameter of 80mm or more.

10. The server of any of claims 1-9, wherein the server is an edge server.

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