CN210575885U - Reforming device and semiconductor processing equipment - Google Patents
Reforming device and semiconductor processing equipment Download PDFInfo
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- CN210575885U CN210575885U CN201921540992.1U CN201921540992U CN210575885U CN 210575885 U CN210575885 U CN 210575885U CN 201921540992 U CN201921540992 U CN 201921540992U CN 210575885 U CN210575885 U CN 210575885U
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Abstract
The utility model provides a reforming device and semiconductor processing equipment, wherein the reforming device comprises a reforming platform, a plurality of reforming components and a main driving component for driving the reforming components; the reforming table comprises a plurality of bearing areas for bearing the substrate to be reformed; each carrying area can accommodate a plurality of righting assemblies; the main driving assembly drives the substrate to be corrected in the bearing area to move towards the vertical direction, the right horizontal direction or the left horizontal direction by taking the bearing area as a datum plane through the correcting assembly so as to correct the substrate to be corrected. The utility model provides a device and semiconductor processing equipment of reforming can shorten the time of reforming, improves the efficiency of reforming.
Description
Technical Field
The utility model relates to a semiconductor equipment technical field specifically, relates to a device and semiconductor processing equipment reform transform.
Background
At present, with the improvement of the living standard of people, the requirements on liquid crystal products and the requirements on the liquid crystal industry are continuously improved, so that the liquid crystal industry is greatly developed. In the production process of the liquid crystal display, in order to improve efficiency and increase yield, two liquid crystal substrates are often subjected to process treatment simultaneously, namely, in production line production, the two liquid crystal substrates need to be treated simultaneously at the same station. However, since the liquid crystal display is manufactured with high precision, two liquid crystal substrates are simultaneously subjected to automated assembly line operation, and the two liquid crystal substrates need to be located at respective preset positions, and no error exists.
In the prior art, two liquid crystal substrates are placed in a righting platform through a manipulator, the two liquid crystal substrates are placed at intervals from left to right, the upper and lower positions of the two liquid crystal substrates are righted through an upper righting device and a lower righting device which are positioned in the upper and lower directions of the two liquid crystal substrates, a left righting device positioned on the left side of the liquid crystal substrate on the left side is adjusted to a preset position, and a right aligning device positioned on the right side of the right liquid crystal substrate is adjusted to a preset position, and finally the left liquid crystal substrate is aligned to the left to the preset position of the left aligning device through the middle aligning device, and then the right liquid crystal substrate is aligned to the right to the preset position of the right aligning device, so that the left liquid crystal substrate is positioned on the left preset position, and the right liquid crystal substrate is positioned on the right preset position, and a preset interval is formed between the left liquid crystal substrate and the right liquid crystal substrate, so that the positions of the two liquid crystal substrates are restored.
However, in the conventional intermediate correcting device, in the process of correcting the positions of the two liquid crystal substrates, the position of one liquid crystal substrate needs to be corrected first, and then the position of the other liquid crystal substrate needs to be corrected, so that the position correcting time of the two liquid crystal substrates is long, and the efficiency is low.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, provide a device and semiconductor processing equipment of reforming, it can shorten the time of reforming, improves the efficiency of reforming.
The utility model provides a substrate reforming device for realizing the purpose of the utility model, which comprises a reforming platform, a plurality of reforming components and a main driving component for driving the reforming components;
the reforming table comprises a plurality of bearing areas for bearing the substrate to be reformed; each bearing area can accommodate a plurality of the righting assemblies;
the main driving assembly drives the substrate to be corrected in the bearing area to move towards the vertical direction, the right horizontal direction or the left horizontal direction by taking the bearing area as a reference surface through the correcting assembly so as to correct the substrate to be corrected.
Preferably, the correcting assembly comprises a vertical correcting assembly, a right horizontal correcting assembly, a left horizontal correcting assembly and a middle correcting assembly;
the reforming assembly is arranged around the periphery of the bearing area where the reforming assembly is arranged.
Preferably, the middle correcting assembly comprises a sub-driving assembly, a correcting push plate and push rods arranged in pairs;
the push rod is connected with the correcting push plate, and the correcting push plate is connected with the sub-driving assembly;
the sub-driving assembly drives the correcting push plate through the push rod, so that the correcting push plate is abutted against the peripheral wall of the substrate to be corrected, which is located in the same bearing area.
Preferably, each of the intermediate correcting assemblies comprises two adjacent and parallel correcting push plates;
the push rods arranged in pairs are separated from the two correcting push plates.
Preferably, every two inner side surfaces of the correcting push plate are provided with bosses in pairs for bearing the push rods, and each boss is provided with one push rod; the positions between the two bosses which are arranged in pairs are staggered.
Preferably, the sub-driving assembly includes a cylinder.
Preferably, the cylinder is an adjustable stroke cylinder.
Preferably, the stroke adjusting range of the stroke adjustable cylinder is 0mm-10 mm.
The utility model also provides a semiconductor processing equipment, include if the utility model provides a base plate reforming device.
The utility model discloses following beneficial effect has:
the utility model provides a device reforms device with the help of a plurality of subassemblies that reform of main drive assembly drive to treat through a plurality of subassemblies that reform in the drive a plurality of bearing areas and reform the base plate and use bearing area as the reference surface, remove to vertical direction, right side horizontal direction or left side horizontal direction simultaneously, so that treat in a plurality of bearing areas and reform the base plate and reform simultaneously, thereby shorten the time of reforming, improve the efficiency of reforming.
The utility model also provides a semiconductor processing equipment, include the utility model provides a return device with the help of the utility model provides a return device can shorten the time of returning, improves the efficiency of returning.
Drawings
Fig. 1 is a schematic structural diagram of a reforming device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an intermediate reforming assembly of a reforming device according to an embodiment of the present invention;
description of reference numerals:
11-a reforming table; 12-a vertical righting assembly; 13-right horizontal centering component; 14-left horizontal centering component; 15-intermediate reforming assembly; 151-correcting push plate; 152-a push rod; 153-boss; 154-a sub-drive assembly; 16-a linear guide rail; 17-a slide block; 18-peripheral cylinders.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following describes the reforming device and the semiconductor processing apparatus provided by the present invention in detail with reference to the attached drawings.
As shown in fig. 1-2, the present embodiment provides a reforming apparatus including a reforming stage 11, a plurality of reforming assemblies, and a main driving assembly for driving the plurality of reforming assemblies; the reforming station 11 includes a plurality of carrying areas for carrying substrates to be reformed; each carrying area can accommodate a plurality of righting assemblies; the main driving assembly drives the substrate to be corrected in the bearing area to move towards the vertical direction, the right horizontal direction or the left horizontal direction by taking the bearing area as a datum plane through the correcting assembly so as to correct the substrate to be corrected.
The utility model provides a device reforms device with the help of a plurality of subassemblies that reform of main drive assembly drive to treat through a plurality of subassemblies that reform in the drive a plurality of bearing areas and reform the base plate and use bearing area as the reference surface, remove to vertical direction, right side horizontal direction or left side horizontal direction simultaneously, so that treat in a plurality of bearing areas and reform the base plate and reform simultaneously, thereby shorten the time of reforming, improve the efficiency of reforming.
In this embodiment, the substrate to be reformed is placed in the carrying area on the reforming table 11 by the grabbing of the robot, and the substrate to be reformed is reformed by the reforming device at the reforming table 11 so as to perform the subsequent processing, but because the error of the mounting position between the robot and the reforming table 11 and the deviation of the position between the substrate to be reformed and the robot due to the shaking of the assembly line during the transfer process of the substrate to be reformed in the assembly line, the position of the substrate to be reformed in the carrying area may deviate after being placed on the reforming table 11 by the robot, and therefore, the substrate to be reformed needs to be reformed by the reforming device. However, the mode of transporting the substrate to be reformed and the manner of transferring the substrate to be reformed onto the reforming stage 11 are not limited thereto.
In this embodiment, in order to improve the processing efficiency, when performing the reforming each time, a plurality of substrates to be reformed are placed on the reforming table 11, and each substrate to be reformed is placed in one bearing area.
As shown in fig. 1, in the present embodiment, the reforming assembly includes a vertical reforming assembly 12, a right horizontal reforming assembly 13, a left horizontal reforming assembly 14, and an intermediate reforming assembly 15; the reforming assembly is disposed around the perimeter of the load bearing area in which it is located.
Specifically, two bearing areas distributed left and right are taken as an example for explanation, but the number of the normalization units is not limited to this. The upper and lower centering assemblies in the vertical direction of the two carrying areas are vertical centering assemblies 12, the right centering assembly in the right side of the carrying area in the right side is a right horizontal centering assembly 13, the left centering assembly in the left side of the carrying area in the left side is a left horizontal centering assembly 14, the left centering assembly in the right side of the carrying area in the left side and the left side of the carrying area in the right side, that is, the centering assembly in the adjacent position of the two carrying areas is a middle centering assembly 15, wherein the vertical centering assembly 12 in the upper side of the carrying area is used for driving the substrate to be centered downward, the vertical centering assembly 12 in the lower side of the carrying area is used for driving the substrate to be centered upward so as to center the substrate to be centered in the vertical direction, the right horizontal centering assembly 13 is used for driving the substrate to be centered in the carrying area in the right side to move leftward, the left horizontal centering assembly 14 is used for driving the substrate to move rightward in the carrying area in the left side, the middle centering assembly 15 is used to simultaneously drive the substrate to be centered in the right carrying area to move to the right and the substrate to be centered in the left carrying area to move to the left. It should be noted that, the above, below, left and right are mentioned only for the convenience of clearly explaining the position of the righting component, and the practical application is not limited thereto.
In this embodiment, when the to-be-reformed substrate is not placed on the angelica reforming table 11, the vertical reforming assembly 12, the right horizontal reforming assembly 13, the left horizontal reforming assembly 14 and the middle reforming assembly 15 are all disposed around the periphery of the carrying area where the to-be-reformed substrate is located, the robot arm places the to-be-reformed substrate between the vertical reforming assembly 12, the right horizontal reforming assembly 13, the left horizontal reforming assembly 14 and the middle reforming assembly 15, and drives the vertical reforming assembly 12, the right horizontal reforming assembly 13, the left horizontal reforming assembly 14 and the middle reforming assembly 15 to move toward the center of the carrying area where the to-be-reformed substrate is located through the main driving assembly, so as to drive the to-be-reformed substrate to be reformed through the vertical reforming assembly 12, the right horizontal reforming assembly 13, the left horizontal reforming assembly 14 and the middle reforming assembly 15. After the substrate to be corrected is moved away from the carrying area, the vertical correcting assembly 12, the right horizontal correcting assembly 13, the left horizontal correcting assembly 14 and the middle correcting assembly 15 are driven by the main driving assembly to move towards the center far away from the carrying area where the vertical correcting assembly 12, the right horizontal correcting assembly 13, the left horizontal correcting assembly 14 and the middle correcting assembly 15 are located, so that the vertical correcting assembly 12, the right horizontal correcting assembly 13, the left horizontal correcting assembly 14 and the middle correcting assembly 15 return to the periphery of the carrying area where the vertical correcting assembly, the right horizontal correcting assembly, the left horizontal correcting assembly 14 and the middle correcting assembly 15 are located, and the next substrate to.
In this embodiment, the vertical centering assembly 12, the right horizontal centering assembly 13, the left horizontal centering assembly 14 and the middle centering assembly 15 are not driven simultaneously, but are illustrated by taking two bearing areas distributed left and right in fig. 1 as an example. When the substrates to be reformed in the two carrying areas are reformed, the vertical reforming assemblies 12 in the two carrying areas are simultaneously driven to reform the substrates to be reformed in the vertical direction, then the right horizontal reforming assembly 13 and the left horizontal reforming assembly 14 are simultaneously driven to reform the left sides of the substrates to be reformed in the carrying areas on the left side and the right sides of the substrates to be reformed in the carrying areas on the right side, and finally the middle reforming assembly 15 is driven to reform the right sides of the substrates to be reformed in the carrying areas on the left side and the left sides of the substrates to be reformed in the carrying areas on the right side, thereby completing the simultaneous reforming of the substrates in the two carrying areas.
However, the driving order of each of the vertical reforming assembly 12, the right horizontal reforming assembly 13, the left horizontal reforming assembly 14, and the middle reforming assembly 15 is not limited thereto, and it is only necessary to satisfy that reforming of a plurality of substrates to be reformed can be simultaneously completed. For example, the vertical centering assembly 12, the right horizontal centering assembly 13, the left horizontal centering assembly 14, and the middle centering assembly 15 may be driven simultaneously.
As shown in fig. 2, in the present embodiment, the intermediate reforming assembly 15 includes a sub-driving assembly 154, a reforming push plate 151, and push rods 152 arranged in pairs; the push rod 152 is connected with the correcting push plate 151, and the correcting push plate 151 is connected with the sub-driving assembly 154; the sub-driving assembly 154 drives the push rod 152 through the aligning push plate 151 so that the push rod 152 abuts against the peripheral wall of the substrate to be aligned in the same carrying area.
Specifically, the sub-driving assembly 154 is used for providing a driving force and is connected with the aligning push plate 151 to drive the aligning push plate 151 to move, in the process that the sub-driving assembly 154 drives the aligning push plate 151 to move, the sub-driving assembly 154 and the aligning push plate 151 are both located below the substrate to be aligned, the aligning push plate 151 drives the push rod 152 arranged thereon to move, so that the push rod 152 abuts against the peripheral wall of the substrate to be aligned, and the substrate to be aligned is pushed by the push rod 152 to move, so that the substrate to be aligned is aligned. In addition, the push rod 152 pushes the substrate to be aligned to move, so that the contact area between the push rod 152 and the substrate to be aligned is small, and the scratch of the substrate to be aligned caused by the push rod 152 can be avoided.
In this embodiment, each intermediate reforming assembly 15 comprises two adjacent and parallel reforming push plates 151; the push rods 152 arranged in pairs are separated on the two aligning push plates 151. As shown in fig. 2, the middle aligning member 15 includes two aligning push plates 151 respectively located on the left side and the right side, the two aligning push plates 151 are arranged in parallel with each other, push rods 152 are respectively arranged on the two aligning push plates 151, the aligning push plate 151 located on the left side is driven by a sub-driving member 154 connected thereto to move leftward so that the push rod 152 thereon abuts against the peripheral wall of the substrate to be aligned located on the left side thereof, and the aligning push plate 151 located on the right side is driven by the sub-driving member 154 connected thereto to move rightward so that the push rod 152 thereon abuts against the peripheral wall of the substrate to be aligned located on the right side thereof, so that the substrates to be aligned located on the left side and the right side of the middle aligning member 15 can be aligned by the middle aligning member 15 at the same time.
In this embodiment, two pairs of bosses 153 for carrying the push rods 152 are provided on the inner side surface of the aligning push plate 151, and each boss 153 is provided with one push rod 152; the positions between the two bosses 153 arranged in pairs are staggered. Through making boss 153 staggered arrangement on the push pedal 151 of reforming, can avoid when two push pedals 151 of reforming are close to each other and remove, push rod 152 on two push pedals 151 of reforming bumps, improves the stability of the device of reforming to can make and to get closer between two adjacent push pedals 151 of reforming, thereby reduce the shared space of middle subassembly 15 of reforming, and then be convenient for the placing of the device of reforming.
In this embodiment, each intermediate restoring assembly 15 further includes a linear guide 16 and a slider 17, wherein the slider 17 is disposed below the restoring push plate 151 and slidably connected to the linear guide 16, when the sub-driving assembly 154 drives the restoring push plate 151 to move, the restoring push plate 151 drives the slider 17 connected thereto to move, the slider 17 can move along the linear guide 16 slidably connected thereto, so that the restoring push plate 151 moves along the linear guide 16, and the linear guide 16 can guide the slider 17 to move along a straight line, so that the restoring push plate 151 moves along a straight line, so as to improve the stability and accuracy of the movement of the restoring push plate 151 and improve the accuracy and stability of the restoring device.
As shown in fig. 2, in the present embodiment, the intermediate aligning member 15 is an integrated structure, and specifically, the sub-driving members 154 and the linear guide 16, which are respectively connected to the two aligning push plates 151, are respectively connected by a connecting member to form an integrated structure.
In the present embodiment, the sub-driving assembly 154 includes a cylinder. The cylinder is a pneumatic actuating element for converting the pressure of compressed gas into mechanical energy, can do linear reciprocating motion, and has the advantages of simple structure, low price and simple control compared with a driving structure of a servo motor and a lead screw, so that the installation difficulty, the cost and the control difficulty of the correcting device are reduced.
In this embodiment, the vertical centering assemblies 12, the right horizontal centering assembly 13 and the left horizontal centering assembly 14 provide the driving force by the peripheral cylinders 18 disposed at the periphery of the bearing area, and the peripheral cylinders 18 in each of the vertical centering assemblies 12, the right horizontal centering assembly 13 and the left horizontal centering assembly 14 have only one, which is different from the two cylinders in the middle centering assembly 15, and the two cylinders are of an integral structure.
In this embodiment, the cylinder is an adjustable stroke cylinder. The air cylinder or other types of driving structures are used for a long time, errors can occur in the stroke of the air cylinder or other types of driving structures due to long-time use, the air cylinder cannot have the original stroke, the substrate to be corrected cannot be corrected, and the stroke of the air cylinder can be restored to the original stroke by adjusting the stroke of the air cylinder when the stroke of the air cylinder is changed, so that the air cylinder can continue to correct the substrate to be corrected, the air cylinder can be used for a long time, and the correction device is convenient to maintain.
In the embodiment, the stroke adjusting range of the stroke-adjustable air cylinder is 0mm-10 mm. However, the method is not limited to this, and may be selected according to actual use.
The embodiment also provides semiconductor processing equipment which comprises the correcting device provided by the embodiment.
The semiconductor processing equipment provided by the embodiment can shorten the reforming time and improve the reforming efficiency by the reforming device provided by the embodiment.
In summary, the reforming device and the semiconductor processing apparatus provided in the embodiment can shorten the reforming time and improve the reforming efficiency.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (9)
1. A substrate reforming device is characterized by comprising a reforming table, a plurality of reforming assemblies and a main driving assembly for driving the reforming assemblies;
the reforming table comprises a plurality of bearing areas for bearing the substrate to be reformed; each bearing area can accommodate a plurality of the righting assemblies;
the main driving assembly drives the substrate to be corrected in the bearing area to move towards the vertical direction, the right horizontal direction or the left horizontal direction by taking the bearing area as a reference surface through the correcting assembly so as to correct the substrate to be corrected.
2. The substrate reforming apparatus according to claim 1, wherein the reforming assembly comprises a vertical reforming assembly, a right horizontal reforming assembly, a left horizontal reforming assembly and a middle reforming assembly;
the reforming assembly is arranged around the periphery of the bearing area where the reforming assembly is arranged.
3. The substrate reforming device according to claim 2, wherein the intermediate reforming assembly comprises a sub-driving assembly, a reforming push plate, and push rods arranged in pairs;
the push rod is connected with the correcting push plate, and the correcting push plate is connected with the sub-driving assembly;
the sub-driving assembly drives the push rod through the correcting push plate, so that the push rod is abutted against the peripheral wall of the substrate to be corrected, which is located in the same bearing area.
4. The substrate reforming device according to claim 3, wherein each of said intermediate reforming assemblies comprises two of said reforming push plates disposed adjacently and in parallel;
the push rods arranged in pairs are separated from the two correcting push plates.
5. The substrate reforming device according to claim 4, wherein the inner side surfaces of the reforming push plates are pairwise provided with bosses for bearing the push rods, and each boss is provided with one push rod; the positions between the two bosses which are arranged in pairs are staggered.
6. The substrate reforming device according to claim 3, wherein the sub-driving unit comprises a cylinder.
7. The substrate reforming device according to claim 6, wherein the cylinder is an adjustable stroke cylinder.
8. The substrate reforming device according to claim 7, wherein the stroke adjustment range of the stroke-adjustable cylinder is 0mm to 10 mm.
9. A semiconductor processing apparatus comprising the substrate reforming device according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921540992.1U CN210575885U (en) | 2019-09-17 | 2019-09-17 | Reforming device and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921540992.1U CN210575885U (en) | 2019-09-17 | 2019-09-17 | Reforming device and semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210575885U true CN210575885U (en) | 2020-05-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921540992.1U Active CN210575885U (en) | 2019-09-17 | 2019-09-17 | Reforming device and semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210575885U (en) |
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2019
- 2019-09-17 CN CN201921540992.1U patent/CN210575885U/en active Active
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