CN210519308U - Data center plate cold type liquid cooling system - Google Patents
Data center plate cold type liquid cooling system Download PDFInfo
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- CN210519308U CN210519308U CN201921274801.1U CN201921274801U CN210519308U CN 210519308 U CN210519308 U CN 210519308U CN 201921274801 U CN201921274801 U CN 201921274801U CN 210519308 U CN210519308 U CN 210519308U
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- 238000001816 cooling Methods 0.000 title claims abstract description 165
- 239000007788 liquid Substances 0.000 title claims abstract description 137
- 230000000712 assembly Effects 0.000 claims abstract description 27
- 238000000429 assembly Methods 0.000 claims abstract description 27
- 238000005057 refrigeration Methods 0.000 claims abstract description 15
- 230000000694 effects Effects 0.000 abstract 1
- 239000000498 cooling water Substances 0.000 description 17
- 239000003507 refrigerant Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 238000005265 energy consumption Methods 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002528 anti-freeze Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010622 cold drawing Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The utility model relates to a refrigeration field discloses a well cold type liquid cooling system in data includes: a cooling system and a server refrigeration system; the cooling system comprises at least one cooling device, a first cold supply pipeline and a first heat return pipeline, wherein a liquid outlet of the cooling device is communicated with the first cold supply pipeline, and a liquid inlet of the cooling device is communicated with the first heat return pipeline; the server refrigeration system comprises at least one first heat exchange device and a plurality of cold plate assemblies which are used for attaching to heat generating components of the server and cooling the server; the first heat exchange device comprises a first liquid outlet, a first liquid return port, a second liquid outlet and a second liquid return port; the first liquid return port is communicated with the first cold supply pipeline, and the first liquid outlet is communicated with the first heat return pipeline; the liquid inlets of the cold plate assemblies are communicated with the second liquid outlet through the second cold supply pipeline, and the liquid outlets of the cold plate assemblies are communicated with the second liquid return port through the second heat return pipeline, so that the cold plate assemblies are arranged in parallel, and the effects of consumption reduction and noise reduction can be achieved.
Description
Technical Field
The utility model relates to the field of refrigeration technology, in particular to well cold type liquid cooling system in data.
Background
In recent years, due to the vigorous development of industries such as artificial intelligence, internet, big data, cloud computing and internet of things, the application requirements on data storage, exchange, computing and the like are continuously increased, and the construction of a data center can provide basic equipment support for large-scale data storage, exchange and application requirements, so that the increase of the data center requirements is promoted. The high energy consumption of data centers is also becoming a focus of increasing business and social attention. The energy consumption of the data center is high, and the refrigeration system accounts for about 40% of the energy consumption, so that the reduction of the energy consumption of the refrigeration system of the data center through technical measures is an important measure for reducing the overall energy consumption of the data center and reducing the PUE.
At present, a cold air cooling mode of a data center is not enough to meet the heat dissipation requirement of a high-power-density server, even the working performance of the server and the fault can be caused, and meanwhile, the noise decibel value of a machine room can be increased due to the increased air volume for meeting the heat dissipation of the server.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a data center plate cold type liquid cooling system adopts the direct thermal mode of taking away by cold medium matter immersion server, both reduces the energy consumption and can reduce the noise of computer lab again.
In order to achieve the above purpose, the utility model provides the following technical scheme:
a data center plate-cooled liquid cooling system, comprising: a cooling system and a server refrigeration system;
the cooling system comprises at least one cooling device, a first cold supply pipeline and a first heat return pipeline, wherein a liquid outlet of the cooling device is communicated with the first cold supply pipeline, and a liquid inlet of the cooling device is communicated with the first heat return pipeline;
the server refrigeration system comprises at least one first heat exchange device and a plurality of cold plate assemblies for attaching to heat generating components of the server and cooling the server; the first heat exchange device comprises a first liquid outlet, a first liquid return port corresponding to the first liquid outlet, a second liquid outlet and a second liquid return port corresponding to the second liquid outlet; the first liquid return port is communicated with the first cold supply pipeline, and the first liquid outlet is communicated with the first heat return pipeline; the liquid inlets of the cold plate assemblies are communicated with the second liquid outlet through second cold supply pipelines, and the liquid outlets of the cold plate assemblies are communicated with the second liquid return port through second heat return pipelines so that the cold plate assemblies are arranged in parallel.
The data center plate-cooled liquid cooling system adopts plate-cooled liquid cooling for cooling, a high-heat-dissipation component of the server is attached to a cold plate, and liquid circulates in the cold plate to take away heat. The components such as the hard disk and the power supply with low heat dissipation capacity in the cabinet still need to be dissipated by the fan. The influence of the plate-cooled liquid-cooled server on the data center architecture is small, the noise is low, and the energy efficiency is high. Specifically, a first refrigerant medium cooled by the cooling tower enters the first heat exchange device through the first cooling supply pipeline to provide a cold source, a second refrigerant medium in the liquid cooling box absorbs heat of the server and then enters the first heat exchange device through the second heat return pipeline to cool, the first refrigerant medium and the second refrigerant medium exchange heat in the first heat exchange device, the first refrigerant medium after absorbing heat enters the cooling tower through the first heat return pipeline to be cooled, the second refrigerant medium after releasing heat enters the cold plate assembly through the second cooling supply pipeline to directly absorb heat of the server, and the operation is repeated in this way.
Therefore, the traditional water chilling unit with high energy consumption and the tail end precision air conditioner are omitted, the cooling tower is used for preparing high-temperature cooling water, and the cooling water directly enters the cold plate assembly of the liquid cooling server after certain heat exchange circulation to take away heat of the server. The heat exchange efficiency of the cooling water is far higher than that of air cooling, and the cooling tower provides high-temperature cooling water to realize natural cooling all the year round. The system can reduce the power consumption of the fan of the server, the power consumption of the refrigerating system, the PUE value, the reliability of the server and the running noise of the server.
Optionally, the cooling system has a plurality of cooling devices, and liquid outlets of the plurality of cooling devices are all communicated with the first cold supply pipeline, and liquid inlets of the plurality of cooling devices are all communicated with the first heat return pipeline;
the first cooling circuit is a loop and the first heat return circuit is a loop.
Optionally, when the first heat exchange device is multiple, the second cooling circuit is a loop, and the second heat recovery circuit is a loop.
Optionally, the liquid inlets of the plurality of cold plate assemblies are all communicated with the second cooling supply pipeline through a third cooling supply pipeline, and the liquid outlets of the plurality of cold plate assemblies are all communicated with the second heat return pipeline through a third heat return pipeline.
Optionally, the cooling apparatus is a closed cooling tower.
Optionally, the cooling device is a dry cooler.
Optionally, the cooling apparatus is an open cooling tower;
the cooling system also comprises at least one second heat exchange device, and the second heat exchange device comprises a third liquid outlet, a third liquid return port corresponding to the third liquid outlet, a fourth liquid outlet and a fourth liquid return port corresponding to the fourth liquid outlet; the third liquid outlet is communicated with a liquid inlet of the open cooling tower through a fourth heat return pipeline, and the third liquid return port is communicated with a liquid outlet of the open cooling tower through a fourth cold supply pipeline; the fourth liquid outlet is communicated with the first cold supply pipeline, and the fourth liquid return port is communicated with the first heat return pipeline.
Optionally, the number of the second heat exchange devices is multiple, the fourth cooling circuit is a loop, and the fourth heat return circuit is a loop.
Optionally, the second heat exchange device is a plate heat exchanger set.
Optionally, the first heat exchange device is a heat exchange unit.
Drawings
Fig. 1 is a first schematic diagram of a data center board-cooled liquid cooling system according to an embodiment of the present invention;
fig. 2 is a second schematic diagram of a data center board cold type liquid cooling system according to an embodiment of the present invention.
In the figure: 100-a cooling system; 200-a server refrigeration system; 110 a-closed cooling tower; 110 b-open cooling tower; 120-a first cooling circuit; 130-a first heat return circuit; 140-second heat exchange means; 150-a fourth cooling circuit; 160-a fourth heat return circuit; 210-first heat exchange means; 220-a cold plate assembly; 230-a second cooling circuit; 240-second loop heat circuit; 250-a third cooling circuit; 260-third heat circuit.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-2, an embodiment of the present invention provides a data center plate-cooled liquid cooling system, including: a cooling system 100 and a server refrigeration system 200;
the cooling system 100 comprises at least one cooling device, a first cooling pipeline 120 and a first heat return pipeline 130, wherein a liquid outlet of the cooling device is communicated with the first cooling pipeline 120, and a liquid inlet of the cooling device is communicated with the first heat return pipeline 130;
the server refrigeration system 200 includes at least one first heat exchange unit 210 and a plurality of cold plate assemblies 220 for attaching to and cooling heat generating components of the server; the first heat exchange device 210 comprises a first liquid outlet, a first liquid return port corresponding to the first liquid outlet, a second liquid outlet, and a second liquid return port corresponding to the second liquid outlet; the first liquid return port is communicated with the first cooling supply pipeline 120, and the first liquid outlet port is communicated with the first heat return pipeline 130; the liquid inlets of the plurality of cold plate assemblies 220 are communicated with the second liquid outlet through a second cooling supply pipeline 230, and the liquid outlets of the plurality of cold plate assemblies 220 are communicated with the second liquid return port through a second heat return pipeline 240, so that the plurality of cold plate assemblies 220 are arranged in parallel.
The data center plate-cooled liquid cooling system adopts plate-cooled liquid cooling for cooling, a high-heat-dissipation component of the server is attached to a cold plate, and liquid circulates in the cold plate to take away heat. The components such as the hard disk and the power supply with low heat dissipation capacity in the cabinet still need to be dissipated by the fan. The influence of the plate-cooled liquid-cooled server on the data center architecture is small, the noise is low, and the energy efficiency is high. Specifically, a first refrigerant medium cooled by the cooling tower enters the first heat exchange device 210 through the first cooling supply pipeline 120 to provide a cold source, a second refrigerant medium in the liquid cooling box absorbs heat of the server and then enters the first heat exchange device 210 through the second heat return pipeline 240 to cool, the first refrigerant medium and the second refrigerant medium exchange heat in the first heat exchange device 210, the heat-absorbed first refrigerant medium enters the cooling tower through the first heat return pipeline 130 to cool, the heat-released second refrigerant medium enters the cold plate assemblies 220 through the second cooling supply pipeline 230 to directly absorb heat of the server, and the circulation is repeated, and the cold plate assemblies 220 are arranged in parallel, so that pipeline redundancy is realized, and online maintenance is facilitated.
Therefore, the traditional water chilling unit with high energy consumption and the tail end precision air conditioner are omitted, the cooling tower is used for preparing high-temperature cooling water, and the cooling water directly enters the cold plate assembly 220 of the liquid cooling server after certain heat exchange circulation to take away heat of the server. The heat exchange efficiency of the cooling water is far higher than that of air cooling, and the cooling tower provides high-temperature cooling water to realize natural cooling all the year round. The system can reduce the power consumption of the fan of the server, the power consumption of the refrigerating system, the PUE value, the reliability of the server and the running noise of the server.
In a specific embodiment, the cooling system 100 has a plurality of cooling devices, and the liquid outlets of the plurality of cooling devices are all communicated with the first cooling supply pipeline 120, and the liquid inlets of the plurality of cooling devices are all communicated with the first heat return pipeline 130;
the first cooling circuit 120 is a loop and the first return circuit 130 is a loop.
The plurality of cooling devices are connected with the first heat exchange device 210 by adopting a loop, so that the redundancy of pipelines is realized, and the online maintenance is facilitated.
In one specific embodiment, when the number of the first heat exchange devices 210 is plural, the second cooling circuit 230 is a loop, and the second heat circuit 240 is a loop.
The plurality of first heat exchange devices 210 are connected with the plurality of cold plate assemblies 220 by adopting a loop, so that the redundancy of pipelines is realized, and the online maintenance is facilitated.
Alternatively, the liquid inlets of the plurality of cold plate assemblies 220 are all communicated with the second cooling pipeline 230 through a third cooling pipeline 250, and the liquid outlets of the plurality of cold plate assemblies 220 are all communicated with the second heat circuit 240 through a third heat circuit 260.
It should be noted that, as shown in fig. 1 and fig. 2, the main circuit between the first heat exchange device 210 and the plurality of cold plate assemblies 220 is a loop, that is, the second cooling circuit 230 and the second heat circuit 240 are loops, and the branch circuit is a double circuit, that is, the third cooling circuit 250 and the third heat circuit 260 are double circuits. The cold plate assemblies 220 are connected in parallel and then communicated with branch pipelines, and the branch pipelines are communicated with the main pipeline, so that pipeline redundancy is realized, and online maintenance is facilitated.
In the data center plate-cooled liquid cooling system described above, the cooling system 100 may be implemented in two ways:
in a first mode, the cooling device is a closed cooling tower 110 a.
In this manner, as shown in fig. 1, the cooling apparatus may be a closed cooling tower 110a, a liquid outlet of the closed cooling tower 110a is communicated with the first cooling supply pipeline 120, and a liquid inlet of the closed cooling tower 110a is communicated with the first heat return pipeline 130. The closed cooling tower 110a can ensure that the water quality is not polluted, well protects the high-efficiency operation of the main equipment and prolongs the service life. The circulating cooling fluid may be, but is not limited to, water or a glycol solution of a concentration that prevents freezing.
And in the second mode, the cooling equipment is a dry cooler.
This approach is based on the same principle as the closed cooling tower 110a and will not be described here.
In the third mode, the cooling equipment is an open cooling tower 110 b;
the cooling system 100 further includes at least one second heat exchange device 140, where the second heat exchange device 140 includes a third liquid outlet, and a third liquid return port corresponding to the third liquid outlet, a fourth liquid outlet, and a fourth liquid return port corresponding to the fourth liquid outlet; the third liquid outlet is communicated with the liquid inlet of the open cooling tower 110b through a fourth heat return pipeline 160, and the third liquid return port is communicated with the liquid outlet of the open cooling tower 110b through a fourth cold supply pipeline 150; the fourth liquid outlet is communicated with the first cooling supply pipeline 120, and the fourth liquid return outlet is communicated with the first heat return pipeline 130.
In this way, as shown in fig. 2, in this embodiment, the cooling water is cooled by the cooling tower and then enters the second heat exchange device 140 for heat exchange, and the heated cooling water circulates to enter the cooling tower for heat dissipation; the cooling water cooled on the other side of the second heat exchange device 140 enters the first heat exchange device 210, and the cooling water heated by the first heat exchange device 210 enters the second heat exchange device 140 for cooling. The open cooling tower 110b is relatively low cost. The open cooling tower 110b has no antifreeze requirement and meets the requirement of environmental protection and emission.
Optionally, there are a plurality of second heat exchange devices 140, the fourth cooling circuit 150 is a loop, and the fourth heat return circuit 160 is a loop.
The plurality of open cooling towers 110b are connected with the second heat exchange device 140 by adopting a loop, so that the pipeline redundancy is realized, and the online maintenance is convenient.
Optionally, second heat exchange apparatus 140 is a plate heat exchanger train.
It should be noted that, the plate heat exchanger unit can be split into a plate heat exchanger, a circulating water pump and other pipeline accessories, and other configurations are unchanged.
Optionally, first heat exchange device 210 is a heat exchange unit.
It should be noted that the heat exchange UNIT is controlled by a CDU (coupling and DISTRIBUTION UNIT). The heat exchange unit can be disassembled into a plate heat exchanger, a circulating water pump and other pipeline accessories, and other configurations are unchanged.
The automatic control method in the data center plate-cooled liquid cooling system comprises the following steps:
a) the temperature and flow of the water supply pipe and the water return pipe on the system pipeline are detected and led to the on-duty control room.
b) Detecting outdoor temperature and humidity: the temperature and humidity measuring points are located outdoors and are set by a self-control professional, and the number of the measuring points is not less than 1.
c) All data in the cooling tower, heat exchanger unit, CDU, cold plate assembly 220 control panel are directed to the control room.
d) The start-stop/operating state of the rotating device and the fault signal are transmitted to the control room.
e) The cooling tower, the heat exchange unit and the CDU are interlocked in a start-stop mode.
And (3) starting sequence: the system controller sends start commands in sequence: and selecting a refrigeration unit, a CDU and a heat exchange unit to be started, and starting the corresponding cooling tower.
Shutdown sequence: the system controller sends shutdown commands in sequence: and (4) selecting a closed refrigeration unit, firstly closing the cooling tower, and closing the corresponding heat exchange unit and the CDU.
The cooling tower adopts a hot standby mode in winter (the temperature is 5 ℃ and below and is adjustable).
f) The frequency of the circulating pump is controlled according to the worst loop pressure difference, and the pressure difference of the supply return water is not more than 0.05MPa (adjustable).
g) The cooling tower controls the requirement of water supply temperature through the frequency conversion of the fan and the opening degree of the electric regulating valve.
h) Detect the water quality in the piping and cold plate assembly 220.
The embodiment of the utility model provides a well cold type liquid cooling system in data has cancelled the higher traditional cooling water set of energy consumption and terminal accurate air conditioner, adopts the cooling tower to prepare high temperature cooling water, and the cooling water directly gets into the cold drawing of liquid cooling server after certain heat transfer circulation, takes away the heat of server. The heat exchange efficiency of the cooling water is far higher than that of air cooling, and the cooling tower provides high-temperature cooling water to realize natural cooling all the year round. The system can reduce the power consumption of the fan of the server, the power consumption of the refrigerating system, the PUE value, the reliability of the server and the running noise of the server.
It will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A data center plate-cooled liquid cooling system, comprising: a cooling system and a server refrigeration system;
the cooling system comprises at least one cooling device, a first cold supply pipeline and a first heat return pipeline, wherein a liquid outlet of the cooling device is communicated with the first cold supply pipeline, and a liquid inlet of the cooling device is communicated with the first heat return pipeline;
the server refrigeration system comprises at least one first heat exchange device and a plurality of cold plate assemblies for attaching to heat generating components of the server and cooling the server; the first heat exchange device comprises a first liquid outlet, a first liquid return port corresponding to the first liquid outlet, a second liquid outlet and a second liquid return port corresponding to the second liquid outlet; the first liquid return port is communicated with the first cold supply pipeline, and the first liquid outlet is communicated with the first heat return pipeline; the liquid inlets of the cold plate assemblies are communicated with the second liquid outlet through second cold supply pipelines, and the liquid outlets of the cold plate assemblies are communicated with the second liquid return port through second heat return pipelines so that the cold plate assemblies are arranged in parallel.
2. The data center plate-cooled liquid cooling system of claim 1, wherein the cooling system has a plurality of cooling devices, and wherein the plurality of cooling devices have liquid outlets that are each in communication with the first cooling supply line and liquid inlets that are each in communication with the first return line;
the first cooling circuit is a loop and the first heat return circuit is a loop.
3. The data center plate-cooled liquid cooling system of claim 2, wherein when the first heat exchange apparatus is plural, the second cooling circuit is a loop and the second return circuit is a loop.
4. The data center plate-cooled liquid cooling system of claim 2, wherein the liquid inlets of the plurality of cold plate assemblies are each in communication with the second cooling supply line via a third cooling supply line, and the liquid outlets of the plurality of cold plate assemblies are each in communication with the second recuperative line via a third recuperative line.
5. The data center plate-cooled liquid cooling system of any one of claims 1-4, wherein the cooling apparatus is a closed cooling tower.
6. The data center plate-cooled liquid cooling system of any one of claims 1-4, wherein the cooling apparatus is a dry cooler.
7. The data center plate-cooled liquid cooling system of any one of claims 1-4, wherein the cooling apparatus is an open cooling tower;
the cooling system also comprises at least one second heat exchange device, and the second heat exchange device comprises a third liquid outlet, a third liquid return port corresponding to the third liquid outlet, a fourth liquid outlet and a fourth liquid return port corresponding to the fourth liquid outlet; the third liquid outlet is communicated with a liquid inlet of the open cooling tower through a fourth heat return pipeline, and the third liquid return port is communicated with a liquid outlet of the open cooling tower through a fourth cold supply pipeline; the fourth liquid outlet is communicated with the first cold supply pipeline, and the fourth liquid return port is communicated with the first heat return pipeline.
8. The data center plate-cooled liquid cooling system of claim 7, wherein the second heat exchange apparatus is a plurality, the fourth cooling circuit is a loop, and the fourth heat return circuit is a loop.
9. The data center plate-cooled liquid cooling system of claim 7, wherein the second heat exchange device is a plate heat exchanger train.
10. The data center plate-cooled liquid cooling system of claim 1, wherein the first heat exchange device is a heat exchange unit.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921274801.1U CN210519308U (en) | 2019-08-07 | 2019-08-07 | Data center plate cold type liquid cooling system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921274801.1U CN210519308U (en) | 2019-08-07 | 2019-08-07 | Data center plate cold type liquid cooling system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111998707A (en) * | 2020-09-03 | 2020-11-27 | 中国电子科技集团公司第十四研究所 | Multi-parallel branch stabilizing device and method for two-phase cooling system |
| CN115696871A (en) * | 2022-11-04 | 2023-02-03 | 中国电子工程设计院有限公司 | Machine learning-based data center water cooling system regulation and control method and device |
-
2019
- 2019-08-07 CN CN201921274801.1U patent/CN210519308U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111998707A (en) * | 2020-09-03 | 2020-11-27 | 中国电子科技集团公司第十四研究所 | Multi-parallel branch stabilizing device and method for two-phase cooling system |
| CN115696871A (en) * | 2022-11-04 | 2023-02-03 | 中国电子工程设计院有限公司 | Machine learning-based data center water cooling system regulation and control method and device |
| CN115696871B (en) * | 2022-11-04 | 2023-06-13 | 中国电子工程设计院有限公司 | Data center water cooling system regulation and control method and device based on machine learning |
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Address after: 100142 Block C, Linglong Tiandi building, 160 Xisihuan North Road, Haidian District, Beijing Patentee after: S.Y. TECHNOLOGY ENGINEERING & CONSTRUCTION Co.,Ltd. Country or region after: China Patentee after: China Electronics Engineering Design Institute Co.,Ltd. Address before: 100142 Block C, Linglong Tiandi building, 160 Xisihuan North Road, Haidian District, Beijing Patentee before: S.Y. TECHNOLOGY ENGINEERING & CONSTRUCTION Co.,Ltd. Country or region before: China Patentee before: CHINA ELECTRONICS ENGINEERING DESIGN INSTITUTE Co.,Ltd. |