CN210130003U

CN210130003U - Port isolation structure

Info

Publication number: CN210130003U
Application number: CN201920921309.2U
Authority: CN
Inventors: 郭泳欣
Original assignee: Shenzhen Guoren Technology Co Ltd
Current assignee: Shenzhen Guoren Technology Co Ltd
Priority date: 2019-06-17
Filing date: 2019-06-17
Publication date: 2020-03-06
Anticipated expiration: 2029-06-17

Abstract

The utility model relates to a port isolation structure, including frock PCB board, set up at the positive subassembly PCB board of frock PCB board and set up the positive dielectric waveguide filter of subassembly PCB board, the front of subassembly PCB board is equipped with a plurality of first metallized via holes, a plurality of second metallized via holes respectively in the peripheral position that corresponds input feed port, output feed port, a plurality of first metallized via holes set up around the periphery of first conductive component, a plurality of second metallized via holes set up around the periphery of second conductive component; the front surface of the assembly PCB is provided with at least one row of first non-metallization through holes at positions between the first conductive assembly and the second conductive assembly, and the arrangement direction of the at least one row of first non-metallization through holes is perpendicular to the extension direction of a connecting line between the center of the first conductive assembly and the center of the second conductive assembly. The utility model discloses the input feed port of improvement dielectric waveguide filter that can be very big, the isolation between the output feed port.

Description

Port isolation structure

[ technical field ] A method for producing a semiconductor device

The utility model belongs to the technical field of the radio frequency communication technique and specifically relates to an isolation structure between input feed port and output feed port of dielectric waveguide filter is related to.

[ background of the invention ]

With the rapid development of communication technology, especially the application of 5G technology, miniaturization of base stations is required. The filter is as the essential key equipment of radio frequency front end, and its size directly determines the volume of basic station, and traditional coaxial cavity filter is because its size is big, and weight is heavy, can't satisfy the requirement of new generation communication technology to the filter yet. The dielectric waveguide filter has the advantages of high Q value, small volume, simple structure, capability of being integrated with a component PCB (printed circuit board), and the like, so that the dielectric waveguide filter becomes the mainstream of the next-generation filter. Driven by new-generation communication technology, the filter has gradually developed towards device formation, is mounted on a tooling PCB, and is integrated with other devices, but due to the undersize of the dielectric waveguide filter, the distance between the radio frequency connectors of the input feed port and the output feed port of the dielectric waveguide filter is too short, which causes crosstalk and coupling of signals between the input feed port and the output feed port, and thus, the performance of the filter is adversely affected.

In the prior art, isolation is mainly realized by electromagnetic shielding, and only limited electromagnetic signal isolation can be realized by mainly arranging a metalized through hole between two ports on a component PCB at the bottom around a feed port of a dielectric waveguide filter. And a part of the assembly PCB between the two ports is cut to form an empty groove area, although the isolation degree is good, the processing technology is relatively complex, the structural strength is low, the assembly PCB is easy to break, and the processing cost is high.

[ Utility model ] content

An object of the utility model is to overcome the not enough of above-mentioned technique, provide a port isolation structure, improvement dielectric waveguide filter's that can be very big input feed port, the isolation between the output feed port, and processing is convenient, with low costs.

The utility model provides a pair of port isolation structure, including frock PCB board, set up at the positive subassembly PCB board of frock PCB board and set up at the positive dielectric waveguide filter of subassembly PCB board, dielectric waveguide filter's being close to the one side of subassembly PCB board is equipped with input feed port and output feed port, subassembly PCB board is equipped with first conductive component and the second conductive component who runs through its front and back, frock PCB board is equipped with input transmission interface and output transmission interface that runs through its front and back, first conductive component's one end with input feed port is connected or is contacted, the other end with input transmission interface contact, second conductive component's one end with output feed port is connected or is contacted, the front of subassembly PCB board is corresponding input feed port, A plurality of first metalized through holes and a plurality of second metalized through holes are respectively arranged at the peripheral positions of the output feed port, the first metalized through holes are arranged around the periphery of the first conductive assembly, and the second metalized through holes are arranged around the periphery of the second conductive assembly; the front of subassembly PCB board is being located position between first conductive component and the second conductive component is equipped with at least one row of first non-metallization through-hole, the array direction of at least one row of first non-metallization through-hole is perpendicular with the extending direction of the line between the center of first conductive component and the center of second conductive component.

Furthermore, a plurality of third metalized through holes and a plurality of fourth metalized through holes are respectively arranged on the front surface of the tooling PCB around the periphery of the input transmission interface and the periphery of the output transmission interface; the front of frock PCB board is lieing in position between input transmission interface and the output transmission interface is equipped with at least one row of non-metallized through-hole of second, at least one row of non-metallized through-hole of second with at least one row of first non-metallized through-hole corresponds.

Furthermore, the input feed port and the output feed port are an input metalized blind hole and an output metalized blind hole respectively; the input metalized blind holes and the output metalized blind holes are arranged side by side along the longitudinal direction of one surface, close to the component PCB, of the dielectric waveguide filter or arranged side by side along the transverse direction of one surface, close to the component PCB, of the dielectric waveguide filter.

Further, first conductive component is including running through the first through-hole that the front and the back of subassembly PCB board set up and wear to establish the first metal pole in the first through-hole, the one end welding of first metal pole is in the input metallization blind hole, the other end with input transmission interface contact, second conductive component is including running through the second through-hole that the front and the back of subassembly PCB board set up and wear to establish the second metal pole in the second through-hole, the one end welding of second metal pole is in the output metallization blind hole, the other end with output transmission interface contact.

Furthermore, the input feed port and the output feed port are an input metal conductive electrode and an output metal conductive electrode respectively, and the input metal conductive electrode and the output metal conductive electrode are arranged side by side along the transverse direction of one surface of the dielectric waveguide filter, which is close to the component PCB board, and are located at one end of the dielectric waveguide filter, which is close to one surface of the component PCB board; the dielectric waveguide filter comprises a first end and a second end which are opposite, and the second end face of the input metal conducting electrode and the second end face of the output metal conducting electrode are flush with the second end face of the dielectric waveguide filter.

Furthermore, the first conductive assembly comprises a first metal through hole penetrating through the front surface and the back surface of the assembly PCB and two first connecting rings arranged on the peripheries of two ends of the first metal through hole, the two first connecting rings are respectively arranged on the front surface and the back surface of the assembly PCB, the first connecting ring on the front surface of the assembly PCB is contacted with the input metal conductive electrode, and the first connecting ring on the back surface of the assembly PCB is contacted with the input transmission interface; the second conductive assembly comprises a second metal through hole penetrating through the front and the back of the assembly PCB and two second connecting rings arranged on the peripheries of two ends of the second metal through hole, the two second connecting rings are respectively arranged on the front and the back of the assembly PCB, the second connecting ring on the front of the assembly PCB is contacted with the output metal conductive electrode, and the second connecting ring on the back of the assembly PCB is contacted with the output transmission interface.

Furthermore, the front side and the back side of the component PCB are respectively provided with a first avoidance area around the two first connecting rings, the first avoidance areas correspond to the input metal conductive electrodes, and the plurality of first metalized through holes are positioned on the outer side of the first avoidance areas; and the front surface and the back surface of the assembly PCB are respectively provided with a second avoidance area around the two second connecting rings, the second avoidance areas correspond to the output metal conductive electrodes, and the plurality of second metalized through holes are positioned at the outer sides of the second avoidance areas.

Furthermore, a first extension part and a second extension part are respectively formed on the second end face of the input metal conducting electrode and the second end face of the output metal conducting electrode, and the first extension part and the second extension part are arranged on the second end face of the dielectric waveguide filter; one surface of the dielectric waveguide filter, which is close to the component PCB, and the second end surface of the dielectric waveguide filter surround the input metal conductive electrode, and the first extension part is provided with a third avoidance area; and a fourth avoidance area is arranged on one surface of the dielectric waveguide filter, which is close to the PCB and the second end surface of the dielectric waveguide filter, around the output metal conductive electrode and the second extension part.

Further, the front and the back of the tooling PCB are respectively provided with a fifth avoidance area around the input transmission interface, the plurality of third metalized through holes are positioned on the outer side of the fifth avoidance area, the front and the back of the tooling PCB are respectively provided with a sixth avoidance area around the output transmission interface, and the plurality of fourth metalized through holes are positioned on the outer side of the sixth avoidance area.

Further, the dielectric waveguide filter is composed of a first dielectric body and a second dielectric body which are laminated together, the first dielectric body is arranged on the front face of the assembly PCB, and the input metalized blind hole and the output metalized blind hole are formed in one face, close to the assembly PCB, of the first dielectric body.

Implement the utility model discloses, the input feed port of improvement dielectric waveguide filter that can be very big, the isolation between the output feed port, and easily processing, with low costs.

[ description of the drawings ]

Fig. 1 is a schematic structural diagram of a port isolation structure according to a first embodiment of the present invention;

FIG. 2 is an exploded schematic view of a front angle of the port isolation structure of FIG. 1;

FIG. 3 is an exploded view of the back angle of the port isolation structure of FIG. 1;

fig. 4 is a schematic structural diagram of a port isolation structure according to a second embodiment of the present invention;

FIG. 5 is an exploded view of the front angle of the port isolation structure of FIG. 4;

FIG. 6 is an exploded view of the back angle of the port isolation structure of FIG. 4;

fig. 7 is a schematic structural diagram of a port isolation structure according to a third embodiment of the present invention;

FIG. 8 is an exploded view of the front angle of the port isolation structure of FIG. 7;

FIG. 9 is an exploded view of the back angle of the port isolation structure of FIG. 7;

fig. 10 is a schematic structural diagram of a port isolation structure according to a fourth embodiment of the present invention;

FIG. 11 is an exploded view of the front angle of the port isolation structure of FIG. 10;

FIG. 12 is an enlarged view of a portion of FIG. 11 at A;

FIG. 13 is an exploded view of the back angle of the port isolation structure of FIG. 10;

FIG. 14 is an enlarged view of a portion of FIG. 13 at B;

fig. 15 is a schematic structural diagram of a component PCB board of a port isolation structure according to a fifth embodiment of the present invention;

FIG. 16 is an exploded view of the front angle of the port isolation structure of FIG. 15;

fig. 17 is an exploded view of the back angle of the port isolation structure of fig. 15.

[ detailed description ] embodiments

The invention is further described with reference to the following figures and examples.

First embodiment

Referring to fig. 1 to 3, the present invention provides a port isolation structure, which includes a fixture PCB 10, a component PCB 20 disposed on the front side of the fixture PCB 10, and a dielectric waveguide filter 30 disposed on the front side of the component PCB 20. The tooling PCB board 10, the assembly PCB board 20, and the dielectric waveguide filter 30 are all rectangular in shape.

A side of the dielectric waveguide filter 30 adjacent to the component PCB board 20 is provided with an input feed port and an output feed port. In this embodiment, the input feeding port and the output feeding port are an input metalized blind via 31 and an output metalized blind via 32, respectively. The input and output metallized

blind vias

31 and 32 are arranged side by side in the longitudinal direction of the side of the dielectric waveguide filter 30 close to the component PCB board 20. The input metallized blind via 31 and the output metallized blind via 32 are located at the center of the side of the dielectric waveguide filter 30 close to the component PCB board 20 and are biased to one side of the dielectric waveguide filter 30.

The component PCB board 20 is provided with first and second conductive components penetrating the front and rear surfaces thereof. The first conductive member and the second conductive member correspond to the input feeding port and the output feeding port, respectively, so that the first conductive member and the second conductive member are arranged side by side in the longitudinal direction of the component PCB panel 20, and the first conductive member and the second conductive member are located at the center position of the component PCB panel 20 and are biased to one side of the component PCB panel 20. In this embodiment, the first conductive component includes a first through hole 21 penetrating through the front and back surfaces of the component PCB board 20 and a first metal rod 22 penetrating through the first through hole 21. One end of the first metal rod 22 is welded in the input metalized blind hole 31, and the other end of the first metal rod is in contact with the input transmission interface 11 of the tooling PCB 10, so that one end of the first conductive component is connected with the input feed port, and the other end of the first conductive component is in contact with the input transmission interface 11 of the tooling PCB 10, so that the input of the signal input from the tooling PCB 10 to the dielectric waveguide filter 30 can be realized. The second conductive assembly includes a second through hole 23 penetrating the front and back surfaces of the assembly PCB board 20 and a second metal rod 24 penetrating the second through hole 23. One end of the second metal rod 24 is welded in the output metalized blind hole 32, and the other end of the second metal rod is in contact with the output transmission interface 12 of the tooling PCB board 10, so that one end of the second conductive component is connected with the output feed port, and the other end of the second conductive component is in contact with the output transmission interface 12 of the tooling PCB board 10, so that the signal output by the dielectric waveguide filter 30 can be input into the tooling PCB board 10 to output the signal.

The front surface of the component PCB board 20 is provided with a plurality of first metalized vias 26 and a plurality of second metalized vias 27 at peripheral positions corresponding to the input feeding port and the output feeding port, respectively. The plurality of first metalized vias 26 are arranged around the periphery of the first conductive assembly, specifically, the plurality of first metalized vias 26 are arranged around the periphery of the first through hole 21 at intervals, the plurality of first metalized vias 26 are arranged in an annular shape, the plurality of second metalized vias 27 are arranged around the periphery of the second conductive assembly, specifically, the plurality of second metalized vias 27 are arranged around the periphery of the second through hole 23 at intervals, and the plurality of second metalized vias 27 are arranged in an annular shape. The arrangement of the first metallized through holes 26 and the second metallized through holes 27 can realize electromagnetic shielding of signals between the input feed port and the output feed port of the dielectric waveguide filter 30, thereby playing a role in signal isolation. In this embodiment, the first conductive component and the second conductive component are the same in size. The first and second metalized

vias

26 and 27 are the same in size and number.

A row of first non-metallized through holes 28 is formed in the front surface of the component PCB board 20 at a position between the first conductive component and the second conductive component, and the arrangement direction of the row of first non-metallized through holes 28 is perpendicular to the extension direction of the connecting line between the center of the first conductive component and the center of the second conductive component. The row of first non-metallized through holes 28 of the present embodiment is arranged in a lateral direction of the front surface of the component PCB panel 20. The arrangement of the row of first non-metallized vias 28 may achieve physical isolation of signals between the input feed port and the output feed port of the dielectric waveguide filter 30, thereby serving as signal isolation. In this embodiment, the radius of the first non-metalized through hole 28 is larger than the radius of the first and second metalized via

holes

26 and 27.

Through the arrangement of the first metalized through holes 26, the second metalized through holes 27 and the row of the first non-metalized through holes 28, the isolation between the input feed port and the output feed port of the dielectric waveguide filter 30 can be greatly improved, the crosstalk and the coupling of signals between the input feed port and the output feed port are reduced, and the arrangement of the first metalized through holes 26, the second metalized through holes 27 and the row of the first non-metalized through holes 28 on the component PCB 20 is more convenient, the processing is easy, the cost is low, and the component PCB 20 is not easy to break.

The tooling PCB board 10 is provided with an input transmission interface 11 and an output transmission interface 12 penetrating through the front and back surfaces thereof. In this embodiment, the input transmission interface 11 and the output transmission interface 12 are an input connection column and an output connection column, respectively. The input transmission interface 11 is used for connecting with an input transmission line to realize signal input, and the output transmission interface 12 is used for connecting with an output transmission line to realize signal output. The input transmission interface 11 and the output transmission interface 12 correspond to the first conductive component and the second conductive component, respectively, so that the input transmission interface 11 and the output transmission interface 12 are arranged side by side along the longitudinal direction of the tooling PCB 10, and the input transmission interface 11 and the output transmission interface 12 are located at the center of the tooling PCB 10 and are biased to one side of the tooling PCB 10.

Further, the front surface of the tooling PCB board 10 is respectively provided with a plurality of third metalized through holes 13 and a plurality of fourth metalized through holes 14 around the periphery of the input transmission interface 11 and the periphery of the output transmission interface 12. The third metalized vias 13 correspond to the first metalized vias 26, i.e. the third metalized vias 13 are arranged in a ring, and the fourth metalized vias 14 correspond to the second metalized vias 27, i.e. the fourth metalized vias 14 are arranged in a ring. The arrangement of the third metallized through holes 13 and the fourth metallized through holes 14 can further achieve electromagnetic shielding of signals between the input feed port and the output feed port of the dielectric waveguide filter 30, thereby further playing a role in signal isolation.

The front surface of the tooling PCB board 10 is provided with a row of second non-metallized through holes 18 at a position between the input transmission interface 11 and the output transmission interface 12, and the row of second non-metallized through holes 18 corresponds to the row of first non-metallized through holes 28. The row of second non-metallized through holes 18 is arranged in a transverse direction of the front surface of the tooling PCB board 10. The arrangement of the row of second non-metallized through holes 18 can further achieve physical isolation of signals between the input feed port and the output feed port of the dielectric waveguide filter 30, thereby further performing the function of signal isolation.

Through the plurality of third metallized through holes 13, the plurality of fourth metallized through holes 14 and the row of second non-metallized through holes 18 that set up, the isolation between input feed port and the output feed port of dielectric waveguide filter 30 can further be improved, the crosstalk and the coupling of signal between input feed port and the output feed port have further been reduced, and it is more convenient to set up a plurality of third metallized through holes 13, a plurality of fourth metallized through holes 14 and a row of second non-metallized through holes 18 on frock PCB board 10, easy to process, and with low costs, frock PCB board 10 is difficult to the fracture.

In this embodiment, there are four first non-metalized through holes 28 and four second non-metalized through holes 18. It is understood that the number of the first non-metallized through holes 28 and the second non-metallized through holes 18 can be set according to the size of the first conductive component and the input transmission interface 11, the second conductive component and the output transmission interface 12. The number of the first, second, third and fourth

metalized vias

26, 27, 13 and 14 may be set according to the size of the first, second, input and output transmission interfaces 11 and 12.

In this embodiment, the tooling PCB board 10 and the assembly PCB board 20 both include a dielectric layer, a front metal layer disposed on the front side of the dielectric layer, and a back metal layer disposed on the back side of the dielectric layer. The dielectric waveguide filter 30 includes a dielectric block and a metal layer covering a surface of the dielectric block. The tooling PCB 10, the assembly PCB 20 and the dielectric waveguide filter 30 are welded to each other.

The front surface and the back surface of the tooling PCB 10 are respectively provided with an annular fifth avoidance area 16 around the input transmission interface 11, the plurality of third metallized via holes 13 are positioned at the outer side of the fifth avoidance area 16, and the arrangement of the fifth avoidance area 16 on the front surface of the tooling PCB 10 can ensure that the first metal rod 22 is not in contact with the front metal layer of the tooling PCB 10, so that the first metal rod 22 can be prevented from being grounded and short-circuited. The front surface and the back surface of the tooling PCB board 10 are respectively provided with an annular sixth relief area 17 around the output transmission interface 12, and the plurality of fourth metallized via holes 14 are located at the outer side of the sixth relief area 17. The sixth avoiding area 17 on the front surface of the tooling PCB 10 is configured to prevent the second metal rod 24 from contacting the front metal layer of the tooling PCB 10, thereby preventing the second metal rod 24 from being short-circuited to ground.

Preferably, the fifth relief area 16 on the front surface of the tooling PCB 10 is formed by digging a portion of the front metal layer on the front surface of the tooling PCB 10 around the input transmission interface 11. The fifth relief area 16 on the back side of the tooling PCB 10 is formed by digging a portion of the back side metal layer around the input transmission interface 11 on the back side of the tooling PCB 10. The sixth relief area 17 on the front side of the tooling PCB board 10 is formed by digging a portion of the front metal layer around the output transmission interface 12 on the front side of the tooling PCB board 10. The sixth relief area 17 on the back side of the tooling PCB board 10 is formed by digging a portion of the back side metal layer around the output transmission interface on the back side of the tooling PCB board 10.

Second embodiment

Referring to fig. 4 to 6, the same parts of this embodiment as those of the first embodiment are not repeated. The present embodiment is different from the first embodiment in that the input metallized blind via 31 and the output metallized blind via 32 are arranged side by side in the lateral direction of the side of the dielectric waveguide filter 30 close to the component PCB board 20. The input metallized blind via 31 and the output metallized blind via 32 are located at the center of the side of the dielectric waveguide filter 30 close to the component PCB board 20 and are biased toward one end of the dielectric waveguide filter 30. The first conductive member and the second conductive member are arranged side by side in a lateral direction of the component PCB panel 20, and the first conductive member and the second conductive member are located at a central position of the component PCB panel 20 and biased toward one end of the component PCB panel 20. The input transmission interface 11 and the output transmission interface 12 are arranged side by side along a transverse direction of the tooling PCB 10, and the input transmission interface 11 and the output transmission interface 12 are located at a central position of the tooling PCB 10 and are biased to one end of the tooling PCB 10.

The row of first non-metallized through holes 28 is arranged in the longitudinal direction of the front surface of the component PCB panel 20. The row of second non-metallized through holes 18 is arranged along the longitudinal direction of the front surface of the tooling PCB board 10. In this embodiment, there are three first non-metalized through holes 28 and three second non-metalized through holes 18.

Third embodiment

Referring to fig. 7 to 9, the same parts of this embodiment as those of the first embodiment are not repeated. The difference between the present embodiment and the first embodiment is that the dielectric waveguide filter 30 is composed of a first dielectric body 30a and a second dielectric body 30b laminated together, the first dielectric body 30a is disposed on the front surface of the component PCB 20, and the surface of the first dielectric body 30a close to the component PCB 20 is provided with the input metalized blind via 31 and the output metalized blind via 32. The first media body 30a and the second media body 30b are the same size. The first dielectric body 30a and the second dielectric body 30b each include a dielectric block and a metal layer covering a surface of the dielectric block. The first dielectric body 30a and the second dielectric body 30b are welded to each other. The first dielectric body 30a and the component PCB board 20 are soldered to each other. The input and output metalized

blind holes

31 and 32 are arranged side by side along the longitudinal direction of the first dielectric body 30a near the surface of the component PCB 20, and are biased to one end of the first dielectric body 30a near the surface of the component PCB 20. The first conductive member and the second conductive member are arranged side by side in the longitudinal direction of the component PCB panel 20 and biased toward one end of the component PCB panel 20. The input transmission interface 11 and the output transmission interface 12 are arranged side by side along the longitudinal direction of the tooling PCB board 10 and are biased to one end of the tooling PCB board 10.

In this embodiment, there are five first non-metalized through holes 28 and five second non-metalized through holes 18.

Fourth embodiment

Referring to fig. 10 to 14, the same parts of this embodiment as those of the first embodiment are not repeated. The present embodiment is different from the first embodiment in that the input feed port and the output feed port are a rectangular input metal conductive electrode 33 and a rectangular output metal conductive electrode 34, respectively. The input metal conductive electrode 33 and the output metal conductive electrode 34 are arranged side by side in the lateral direction of the side of the dielectric waveguide filter 30 close to the component PCB panel 20, and are located at one end of the dielectric waveguide filter 30 close to the side of the component PCB panel 20. The dielectric waveguide filter 30 includes a first end 30c and a second end 30d opposite to each other, the input metal conductive electrode 33 includes a first end 33a and a second end 33b opposite to each other, the output metal conductive electrode 34 includes a first end 34a and a second end 34b opposite to each other, and an end surface of the second end 33b of the input metal conductive electrode 33 and an end surface of the second end 34b of the output metal conductive electrode 34 are flush with an end surface of the second end 30d of the dielectric waveguide filter 30. The first metalized vias 26 are located at two sides of the input metal electrode 33 and the first end 33a, and the second metalized vias 27 are located at two sides of the output metal electrode 34 and the first end 34 a. The first metallized through holes 26 and the second metallized through holes 27 are arranged in an approximate [ "shape.

The first conductive member and the second conductive member are arranged side by side in a lateral direction of the component PCB panel 20 and near one end of the component PCB panel 20. The input transmission interface 11 and the output transmission interface 12 are arranged side by side along the transverse direction of the tooling PCB board 10 and close to one end of the tooling PCB board 10.

In this embodiment, the first conductive member includes a first metal through hole 21 provided through the front and back surfaces of the component PCB board 20 and two first connection rings 22a, 22b provided on the outer peripheries of both ends of the first metal through hole 21. Two first connection rings 22a, 22b are provided on the front and rear surfaces of the assembly PCB board 20, respectively. The first connection ring 22a of the front surface of the module PCB 20 is in contact with the input metal conductive electrode 33, and the first connection ring 22b of the rear surface of the module PCB 20 is in contact with the input transmission interface 11, and more specifically, the inner side of the first connection ring 22b of the rear surface of the module PCB 20 is in contact with the input transmission interface 11. The signal inputted from the input transmission interface 11 is inputted to the input metal conductive electrode 33 through the first connection ring 22b on the back surface of the component PCB 20, the first metal via 21, and the first connection ring 22a on the front surface of the component PCB 20 to realize the input of the signal. The second conductive member includes a second metal through hole 23 provided through the front and rear surfaces of the component PCB board 20 and two second connection rings 24a, 24b provided at the outer peripheries of both ends of the second metal through hole 23. Two second connection rings 24a, 24b are provided on the front and rear surfaces of the assembly PCB board 20, respectively. The second connection ring 24a of the front surface of the assembly PCB 20 is in contact with the output metal conductive electrode 34, and the second connection ring 24b of the rear surface of the assembly PCB 20 is in contact with the output transmission interface 12, and more particularly, the inner side of the second connection ring 24b of the rear surface of the assembly PCB 20 is in contact with the output transmission interface 12. The signal outputted from the output metal conductive electrode 34 is inputted to the output transmission interface 12 through the second connection ring 24a on the front surface of the assembly PCB 20, the second metal through hole 23, and the second connection ring 24b on the back surface of the assembly PCB 20 to realize the output of the signal. The fifth relief area 16 of the front surface of the tooling PCB 10 may make the first connection ring 22b of the back surface of the component PCB 20 not contact with the front surface metal layer of the front surface of the tooling PCB 10 to prevent the first connection ring 22b of the back surface of the component PCB 20 from being shorted to the ground, and the sixth relief area 17 of the front surface of the tooling PCB 10 may make the second connection ring 24b of the back surface of the component PCB 20 not contact with the front surface metal layer of the front surface of the tooling PCB 10 to prevent the second connection ring 24b of the back surface of the component PCB 20 from being shorted to the ground.

Further, the front and back surfaces of the component PCB board 20 are respectively provided with a first avoidance area 25 around the two first connection rings 22a, 22b, the first avoidance area 25 corresponds to the input metal conductive electrode 33, and the plurality of first metalized via holes 26 are located at the outer side of the first avoidance area 25. The first avoiding area 15 on the front surface of the component PCB 20 can prevent the input metal conductive electrode 33 from contacting the front metal layer on the front surface of the component PCB 20, thereby preventing the input metal conductive electrode 33 from being short-circuited to ground. The front and back surfaces of the assembly PCB board 20 are respectively provided with a second avoidance area 29 around the two second connection rings 24a, 24b, the second avoidance area 29 corresponds to the output metal conductive electrode 34, and the plurality of second metalized via holes 27 are located outside the second avoidance area 29. The second relief area 29 on the front surface of the component PCB 20 can prevent the output metal conductive electrode 34 from contacting the front metal layer on the front surface of the component PCB 20, thereby preventing the output metal conductive electrode 34 from being shorted to ground.

In this embodiment, the first relief area 25 of the front surface of the component PCB 20 is formed by digging out a part of the front metal layer of the component PCB 20 around the first connection ring 22a at the front surface of the component PCB 20. The first relief area 25 of the rear surface of the component PCB panel 20 is formed by digging out a portion of the rear metal layer of the component PCB panel 20 around the first connection ring 22b at the rear surface of the component PCB panel 20. The second relief area 29 of the front surface of the assembly PCB panel 20 is formed by digging out a portion of the front metal layer of the assembly PCB panel 20 around the second connection ring 24a at the front surface of the assembly PCB panel 20. The second relief area 29 of the back surface of the assembly PCB panel 20 is formed by digging out a portion of the back metal layer of the assembly PCB panel 20 around the second connection ring 24b at the back surface of the assembly PCB panel 20.

In this embodiment, the end surface of the second end 33b of the input metal conductive electrode 33 and the end surface of the second end 34b of the output metal conductive electrode 34 are respectively formed with a first extension portion (not shown in the figure) and a second extension portion (not shown in the figure), and the first extension portion and the second extension portion are disposed on the end surface of the second end 30d of the dielectric waveguide filter 30. One surface of the dielectric waveguide filter 30 close to the component PCB board 20 and the end surface of the second end 30d of the dielectric waveguide filter 30 surround the input metal conductive electrode 33, and the first extension portion is provided with a third relief area 35, so that the input metal conductive electrode 33 is in contact with the first connection ring 22a on the front surface of the component PCB board 20. A plurality of first metalized vias 26 are correspondingly located in the third relief area 35. One surface of the dielectric waveguide filter 30 close to the assembly PCB board 20 and the end surface of the second end 30d of the dielectric waveguide filter 30 surround the output metal conductive electrode 34, and the second extension portion is provided with a fourth relief area 36, so that the output metal conductive electrode 34 contacts the second connection ring 24a on the front surface of the assembly PCB board 20. A plurality of second metallized vias 27 are correspondingly located in the fourth relief area 36.

In this embodiment, the third avoiding region 35 is formed by digging a part of the metal layer around the input metal conductive electrode 33 and the first extension portion on the side of the dielectric waveguide filter 30 close to the component PCB board 20 and the end surface of the second end 30d of the dielectric waveguide filter 30, and the fourth avoiding region 36 is formed by digging a part of the metal layer around the output metal conductive electrode 34 and the second extension portion on the side of the dielectric waveguide filter 30 close to the component PCB board 20 and the end surface of the second end 30d of the dielectric waveguide filter 30.

The row of first non-metallized through holes 28 is arranged in the longitudinal direction of the front surface of the component PCB panel 10. The row of second non-metallized 18 through holes is arranged along the longitudinal direction of the front surface of the tooling PCB board 10. In this embodiment, there are three first non-metalized through holes 28 and three second non-metalized through holes 18.

Fifth embodiment

Referring to fig. 15 to 17, the same parts of this embodiment as those of the first embodiment will not be described again. The difference between this embodiment and the first embodiment is that the front surface of the component PCB board 20 is provided with three rows of first non-metallized through holes 28 at positions between the first conductive components and the second conductive components, and the arrangement direction of each row of first non-metallized through holes 28 is perpendicular to the extension direction of the connecting line between the centers of the first conductive components and the centers of the second conductive components. The front surface of the tooling PCB board 10 is provided with three rows of second non-metallized through holes 18 at positions between the input transmission interface 11 and the output transmission interface 12, and the three rows of second non-metallized through holes 18 correspond to the three rows of first non-metallized through holes 28. The number of first non-metallized through holes 28 per row is seven and the number of second non-metallized through holes 18 per row is seven.

In other embodiments, two rows, four rows, etc. of first non-metallized through holes 28 may be provided on the front surface of the component PCB 20 between the first conductive component and the second conductive component, and two rows, four rows, etc. of second non-metallized through holes 18 may be provided on the front surface of the tooling PCB 10 between the input transmission interface 11 and the output transmission interface 12, which may be set according to actual situations.

The above examples only represent preferred embodiments of the present invention, which are described in more detail and detail, but are not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, such as combinations of different features in the various embodiments, which are within the scope of the present invention.

Claims

1. The utility model provides a port isolation structure, includes frock PCB board, sets up at the positive subassembly PCB board of frock PCB board and sets up at the positive dielectric waveguide filter of subassembly PCB board, dielectric waveguide filter's being close to one side of subassembly PCB board is equipped with input feed port and output feed port, subassembly PCB board is equipped with first conductive component and the second conductive component who runs through its front and back, frock PCB board is equipped with input transmission interface and the output transmission interface who runs through its front and back, first conductive component's one end with input feed port is connected or is contacted, the other end with input transmission interface contacts, the one end of second conductive component with output feed port is connected or is contacted, the other end with output transmission interface contacts, its characterized in that: the front surface of the component PCB is respectively provided with a plurality of first metalized through holes and a plurality of second metalized through holes at the peripheral positions corresponding to the input feed port and the output feed port, the first metalized through holes are arranged around the periphery of the first conductive component, and the second metalized through holes are arranged around the periphery of the second conductive component; the front of subassembly PCB board is being located position between first conductive component and the second conductive component is equipped with at least one row of first non-metallization through-hole, the array direction of at least one row of first non-metallization through-hole is perpendicular with the extending direction of the line between the center of first conductive component and the center of second conductive component.

2. The port isolation structure of claim 1 wherein: the front surface of the tooling PCB is respectively provided with a plurality of third metalized through holes and a plurality of fourth metalized through holes around the periphery of the input transmission interface and the periphery of the output transmission interface; the front of frock PCB board is lieing in position between input transmission interface and the output transmission interface is equipped with at least one row of non-metallized through-hole of second, at least one row of non-metallized through-hole of second with at least one row of first non-metallized through-hole corresponds.

3. The port isolation structure of claim 2 wherein: the input feed port and the output feed port are an input metalized blind hole and an output metalized blind hole respectively; the input metalized blind holes and the output metalized blind holes are arranged side by side along the longitudinal direction of one surface, close to the component PCB, of the dielectric waveguide filter or arranged side by side along the transverse direction of one surface, close to the component PCB, of the dielectric waveguide filter.

4. The port isolation structure of claim 3 wherein: the first conductive component comprises a first through hole which runs through the front and the back of the component PCB and a first metal rod which is arranged in the first through hole in a penetrating mode, one end of the first metal rod is welded in the input metallization blind hole, the other end of the first metal rod is contacted with the input transmission interface, the second conductive component comprises a second through hole which runs through the front and the back of the component PCB and a second metal rod which is arranged in the second through hole in a penetrating mode, one end of the second metal rod is welded in the output metallization blind hole, and the other end of the second metal rod is contacted with the output transmission interface.

5. The port isolation structure of claim 2 wherein: the input feed port and the output feed port are respectively an input metal conductive electrode and an output metal conductive electrode, and the input metal conductive electrode and the output metal conductive electrode are arranged side by side along the transverse direction of one surface of the dielectric waveguide filter, which is close to the component PCB board, and are positioned at one end of the dielectric waveguide filter, which is close to one surface of the component PCB board; the dielectric waveguide filter comprises a first end and a second end which are opposite, and the second end face of the input metal conducting electrode and the second end face of the output metal conducting electrode are flush with the second end face of the dielectric waveguide filter.

6. The port isolation structure of claim 5 wherein: the first conductive assembly comprises a first metal through hole penetrating through the front surface and the back surface of the assembly PCB and two first connecting rings arranged on the peripheries of two ends of the first metal through hole, the two first connecting rings are respectively arranged on the front surface and the back surface of the assembly PCB, the first connecting ring on the front surface of the assembly PCB is contacted with the input metal conductive electrode, and the first connecting ring on the back surface of the assembly PCB is contacted with the input transmission interface; the second conductive assembly comprises a second metal through hole penetrating through the front and the back of the assembly PCB and two second connecting rings arranged on the peripheries of two ends of the second metal through hole, the two second connecting rings are respectively arranged on the front and the back of the assembly PCB, the second connecting ring on the front of the assembly PCB is contacted with the output metal conductive electrode, and the second connecting ring on the back of the assembly PCB is contacted with the output transmission interface.

7. The port isolation structure of claim 6 wherein: the front side and the back side of the component PCB are respectively provided with a first avoidance area around the two first connecting rings, the first avoidance areas correspond to the input metal conductive electrodes, and the plurality of first metalized through holes are positioned on the outer sides of the first avoidance areas; and the front surface and the back surface of the assembly PCB are respectively provided with a second avoidance area around the two second connecting rings, the second avoidance areas correspond to the output metal conductive electrodes, and the plurality of second metalized through holes are positioned at the outer sides of the second avoidance areas.

8. The port isolation structure of claim 7 wherein: a first extension part and a second extension part are respectively formed on the second end face of the input metal conducting electrode and the second end face of the output metal conducting electrode, and the first extension part and the second extension part are arranged on the second end face of the dielectric waveguide filter; one surface of the dielectric waveguide filter, which is close to the component PCB, and the second end surface of the dielectric waveguide filter surround the input metal conductive electrode, and the first extension part is provided with a third avoidance area; and a fourth avoidance area is arranged on one surface of the dielectric waveguide filter, which is close to the PCB and the second end surface of the dielectric waveguide filter, around the output metal conductive electrode and the second extension part.

9. The port isolation structure of claim 2 wherein: the front and the back of the tooling PCB are surrounded by the input transmission interface and are respectively provided with a fifth avoidance area, the third metalized through holes are located on the outer side of the fifth avoidance area, the front and the back of the tooling PCB are surrounded by the output transmission interface and are respectively provided with a sixth avoidance area, and the fourth metalized through holes are located on the outer side of the sixth avoidance area.

10. The port isolation structure of claim 3 wherein: the dielectric waveguide filter is composed of a first dielectric body and a second dielectric body which are laminated together, the first dielectric body is arranged on the front face of the assembly PCB, and the input metalized blind hole and the output metalized blind hole are formed in one face, close to the assembly PCB, of the first dielectric body.