CN209897343U - Electronic equipment and flexible circuit board - Google Patents
Electronic equipment and flexible circuit board Download PDFInfo
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- CN209897343U CN209897343U CN201920609102.1U CN201920609102U CN209897343U CN 209897343 U CN209897343 U CN 209897343U CN 201920609102 U CN201920609102 U CN 201920609102U CN 209897343 U CN209897343 U CN 209897343U
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- flexible circuit
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Abstract
The utility model discloses an electronic equipment and flexible circuit board. The flexible circuit board includes a reference line and a plurality of signal lines for transmitting signals, the plurality of signal lines being spaced apart in a width direction of the flexible circuit board, and further includes a line layer, an isolation film, and a shielding film. The signal line is arranged in the line layer, the isolating film is wrapped in the line layer, a conductive metal layer is arranged in the shielding film, the reference line is arranged on the conductive metal layer, the shielding film is arranged on the isolating film, and the isolating film is arranged between the line layer and the shielding film. According to the utility model discloses a flexible circuit board utilizes the conductive metal layer on the barrier film for conductive metal layer sets up in the barrier film as the reference line, can reduce the quantity of the circuit that sets up on the circuit layer from this, thereby can reduce flexible circuit board's width, reaches the benefit that reduces flexible circuit board cross sectional area and saving cost.
Description
Technical Field
The utility model belongs to the technical field of the communication equipment technique and specifically relates to an electronic equipment and flexible circuit board are related to.
Background
Electrical components inside electronic equipment (such as a mobile phone) are connected to a main circuit board through flexible circuit boards, and the flexible circuit board is limited by the arrangement of internal circuits, so that the width of the flexible circuit board is wide, the layout of the flexible circuit board is difficult to meet the light-weight design requirement of the electronic equipment, and the cost is increased.
Disclosure of Invention
The application provides a flexible circuit board, flexible circuit board's circuit layout optimization degree is high, advantage with low costs.
The application also provides an electronic device, the electronic device has the advantages of simple structure and low cost.
According to the utility model discloses flexible circuit board, flexible circuit board includes reference line and many and is used for transmitting signal line, many signal line follows flexible circuit board's width direction is spaced apart, flexible circuit board still includes: the signal line is arranged in the line layer; the isolating film wraps the circuit layer; the shielding film, be equipped with conductive metal layer in the shielding film, the reference line is located conductive metal layer, the shielding film is located on the barrier film, just the barrier film is located the circuit layer with between the shielding film.
According to the utility model discloses flexible circuit board utilizes the conductive metal layer on the barrier film for conductive metal layer sets up in the barrier film as the reference line, can reduce the quantity of the circuit that sets up on the circuit layer from this, thereby can reduce flexible circuit board's width, reaches the benefit that reduces flexible circuit board cross sectional area and saving cost.
In some embodiments, the shielding film is an electromagnetic interference shielding film.
In some embodiments, the shielding film includes a carrier film, a conductive metal layer, and a protective layer, which are sequentially stacked.
In some embodiments, the shielding film further comprises: the first conductive adhesive is arranged between the carrier film and the conductive metal layer.
In some embodiments, the shielding film further comprises: and the second conductive adhesive is arranged between the protective layer and the conductive metal layer.
In some embodiments, the conductive metal layer extends along a length of the flexible circuit board, and the conductive metal layer is one.
In some embodiments, the conductive metal layer extends along a length direction of the flexible circuit board, the conductive metal layer is a plurality of conductive metal layers, and the plurality of conductive metal layers are spaced apart along a width direction of the flexible circuit board.
In some embodiments, an insulating layer is disposed between any adjacent two of the conductive metal layers.
In some embodiments, the conductive metal layer is a copper layer.
In some embodiments, the separator film is a PI film.
In some embodiments, the isolation film includes a first isolation portion and a second isolation portion, the first isolation portion is laid on one side surface of the circuit layer, the second isolation portion is laid on the other side surface of the circuit layer, and the first isolation portion is located between the circuit layer and the shielding film.
In some embodiments, a first adhesive layer is between the first isolation portion and the line layer.
In some embodiments, a second adhesive layer is between the second isolation and the line layer.
According to the utility model discloses electronic equipment, include: the flexible circuit board, the flexible circuit board includes the reference line and is used for signal line, the flexible circuit board still includes circuit layer, barrier film and shielding film, signal line locates in the circuit layer, the barrier film wrap up in the circuit layer, be equipped with conductive metal layer in the shielding film, the reference line is located conductive metal layer, the shielding film is located on the barrier film, just the barrier film is located the circuit layer with between the shielding film.
According to the utility model discloses electronic equipment utilizes the conductive metal layer on the barrier film for conductive metal layer sets up in the barrier film as the reference line, can reduce the quantity of the circuit that sets up on the circuit layer from this, thereby can reduce flexible circuit board's width, reaches the benefit that reduces flexible circuit board cross sectional area and saving cost.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic cross-sectional view of a flexible circuit board according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a flexible circuit board according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional view of a shielding film of a flexible circuit board according to an embodiment of the present invention;
fig. 4 is a schematic cross-sectional view of a shielding film of a flexible circuit board according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Reference numerals:
a flexible circuit board 100, a reference line 101, a signal line 102,
the layer of wires 110 is formed of a plurality of layers,
a separation film 120, a first separation part 121, a first adhesive layer 122, a second separation part 123, a second adhesive layer 124,
the electronic device (200) is provided with a display,
a housing 210, a display screen assembly 220, and a camera assembly 230.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
As shown in fig. 1 and 2, the flexible circuit board 100 according to the embodiment of the present invention includes a reference line 101 and a plurality of signal lines 102 for transmitting signals, and the plurality of signal lines 102 are spaced apart in a width direction (a left-right direction shown in fig. 1) of the flexible circuit board 100. Here, the "reference line 101" may be a GND line, and the "signal line 102" may be a line for transmitting a power supply signal or a data signal. Of course, the division of the reference line 101 and the signal line 102 is not limited thereto, and for example, the reference line 101 and the signal line 102 may be divided by the magnitude of the current, for example, the line carrying a large current may be the reference line 101, and the line carrying a small current may be the signal line 102.
As shown in fig. 1, the flexible circuit board 100 may further include a wiring layer 110, an isolation film 120, and a shielding film 130. The signal line 102 is disposed in the line layer 110, the isolation film 120 is wrapped on the line layer 110, the shielding film 130 is disposed on the isolation film 120, the isolation film 120 is disposed between the line layer 110 and the shielding film 130, a conductive metal layer 133 is disposed in the shielding film 130, and the reference line 101 is disposed on the conductive metal layer 133. That is, the conductive metal layer 133 may be disposed within the shielding film 130 as the reference line 101 of the flexible circuit board 100.
It can be understood that, in the related art, the reference lines and the signal lines are both disposed in the line layer, and since the reference lines and the signal lines both have a certain width, and a certain gap should be reserved between any two lines, that is, all the reference lines and all the signal lines are spaced apart along the width direction of the flexible circuit board. Therefore, under the limitation of the number and the arrangement mode of the reference lines and the signal lines, when the flexible circuit board is constructed, the width of the flexible circuit board is too wide, so that the flexible circuit board occupies a larger assembly space when being applied to electronic equipment (such as a mobile phone), and further, the space inside the electronic equipment is difficult to optimize.
And according to the utility model discloses flexible circuit board 100 utilizes the conductive metal layer 133 on shielding film 130 for conductive metal layer 133 sets up in shielding film 130 as reference line 101, can reduce the quantity of the circuit that sets up on circuit layer 110 from this to can reduce flexible circuit board 100's width, reach the benefit of reducing flexible circuit board 100 cross sectional area and saving cost.
The shielding film 130 may be an electromagnetic interference shielding film. The electromagnetic interference shielding film may also be referred to as an EMI shielding film, and the electromagnetic interference refers to an interference phenomenon generated by an electromagnetic wave acting on an electronic component, and includes both conducted interference and radiated interference. Conducted interference refers to coupling (interfering) a signal on one electrical network to another electrical network through a conductive medium. The radiation interference means that an interference source couples (interferes) signals to another electric network through space, and in the design of a high-speed PCB and a system, a high-frequency signal line, pins of an integrated circuit, various connectors and the like can be radiation interference sources with antenna characteristics and can emit electromagnetic waves and influence the normal work of other systems or other subsystems in the system. "interference" may refer to both a reduction in performance of a device subject to interference and an interference source that causes interference to the device. The first layer means that the thunder and lightning makes the radio generate noise, the snowflake appears on the television picture after the motorcycle runs nearby, and the radio sound is heard after the motorcycle is picked up.
Further, as shown in fig. 3 and 4, the shielding film 130 may include a carrier film 131, a conductive metal layer 133, and a protective layer 136, which are sequentially stacked. It can be understood that the shielding film 130 may be used to protect the circuit layer 110 and shield the interference signal, and by providing the carrier film 131 and the protective layer 136, not only the circuit layer 110 may be protected, but also the conductive metal layer 133 may be protected, so as to reduce the probability of interference, and especially when the reference circuit 101 is disposed on the conductive metal layer 133, the reference circuit 101 may be protected, so as to reduce the probability of interference of the reference circuit 101.
As shown in fig. 3 and 4, the shielding film 130 may further include a first conductive paste 132. First conductive paste 132 is disposed between carrier film 131 and conductive metal layer 133. Accordingly, the adhesion of the first conductive adhesive 132 can be used to adhere the carrier film 131 and the conductive metal layer 133, so that the connection stability between the carrier film 131 and the conductive metal layer 133 can be improved.
As shown in fig. 3 and 4, the shielding film 130 may further include a second conductive paste 135. Wherein the second conductive paste 135 may be disposed between the protective layer 136 and the conductive metal layer 133. Therefore, the protective layer 136 and the conductive metal layer 133 can be bonded together by using the adhesion of the second conductive adhesive 135, so that the connection stability between the protective layer 136 and the conductive metal layer 133 can be improved. The first conductive paste 132 and the second conductive paste 135 may be formed of the same paste, so that the kinds of materials used for the flexible circuit board 100 may be reduced, and the kinds of material storage may be reduced, thereby saving the production cost.
As shown in fig. 1 and 3, the number of the conductive metal layers 133 may be one, and the conductive metal layers 133 extend along the length direction of the flexible circuit board 100. It should be noted that the flexible circuit board 100 may be used to connect two components, and the "length direction of the flexible circuit board 100" may be understood as: the flexible circuit board 100 extends from the direction in which the flexible circuit board 100 is connected to one of the components. Here, it should be further noted that, when there is one conductive metal layer 133, the conductive metal layer 133 may be used as the reference line 101 of the flexible circuit board 100, so that the number of lines on the line layer 110 may be reduced, and under the condition that the number and the width of the reference line 101 and the signal line 102 are fixed, the conductive metal layer 133 may be used as the reference line 101, so that the reference line 101 and the other line layers 110 on the flexible circuit board 100 are stacked, so that the width of the line layer 110 may be reduced, and the width of the flexible circuit board 100 may be reduced.
It is understood that the structure of the conductive metal layer 133 is not limited thereto, for example, in some embodiments, as shown in fig. 2 and 4, the conductive metal layer 133 extends along the length direction of the flexible circuit board 100, the conductive metal layer 133 may be multiple, and the multiple conductive metal layers 133 are spaced along the width direction of the flexible circuit board 100 (the left and right direction shown in fig. 2 and 4). Therefore, the plurality of conductive metal layers 133 can be used as the reference line 101, so that the conductive metal layers 133 in the shielding film 130 can carry more lines, and the conductive metal layers 133 and the line layers 110 are arranged in a stacked manner, that is, the lines in the conductive metal layers 133 and the line layers 110 in the line layers 110 are arranged in a stacked manner, thereby reducing the number of lines in the line layers 110, reducing the width of the line layers 110, and further reducing the width of the flexible circuit board 100.
In order to avoid interference between two adjacent conductive metal layers 133, as shown in fig. 2 and 4, an insulating layer 134 is disposed between any two adjacent conductive metal layers 133. The conductive metal layer 133 may be a copper layer. It should be noted that the conductive metal layer 133 made of copper has the advantages of good conductivity and low cost. The isolation film 120 may be a PI film. The PI film may be a resin film, for example, a polyimide film (polyimide film) is an insulating film, and is formed by performing polycondensation and casting of pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a strongly polar solvent, and imidizing.
As shown in fig. 1 and 2, the isolation film 120 may include a first isolation portion 121 and a second isolation portion 123, the first isolation portion 121 is disposed on one side surface of the circuit layer 110, the second isolation portion 123 is disposed on the other side surface of the circuit layer 110, and the first isolation portion 121 is located between the circuit layer 110 and the shielding film 130. In other words, the second isolation portion 123, the line layer 110, the first isolation portion 121, and the shielding film 130 are sequentially stacked. It should be noted that the isolation film 120 may have an insulating and isolating function to protect the circuit layer 110. By interposing the line layer 110 between the first isolation portion 121 and the second isolation portion 123, the line layer 110 can be isolated and insulated by the first isolation portion 121 and the second isolation portion 123.
Further, in order to improve connection stability between the first isolation part 121 and the line layer 110, a first adhesive layer 122 may be disposed between the first isolation part 121 and the line layer 110. Likewise, in order to improve the connection stability between the second isolation portion 123 and the wiring layer 110, a second adhesive layer 124 may be provided between the second isolation portion 123 and the wiring layer 110. It should be noted that the first adhesive layer 122 and the second adhesive layer 124 are glue layers with certain viscosity, which can adhere the corresponding isolation portion and the circuit layer 110 together. In order to reduce the variety of materials for manufacturing the flexible circuit board 100 and save the production cost, the material for manufacturing the first adhesive layer 122 and the material for manufacturing the second adhesive layer 124 may be the same material.
As shown in fig. 5, the electronic device 200 according to the embodiment of the present invention includes the flexible circuit board 100. The electronic device 200 may be a mobile phone, a tablet computer, a notebook computer, or the like.
Specifically, the flexible circuit board 100 includes a reference line 101 and a signal line 102. Here, the "reference line 101" may be a GND line, and the "signal line 102" may be a line for transmitting a power supply signal or a data signal. Of course, the division of the reference line 101 and the signal line 102 is not limited thereto, and for example, the reference line 101 and the signal line 102 may be divided by the magnitude of the current, for example, the line carrying a large current may be the reference line 101, and the line carrying a small current may be the signal line 102.
The flexible circuit board 100 may further include a circuit layer 110, an isolation film 120, and a shielding film 130, wherein the signal line 102 is disposed in the circuit layer 110, the isolation film 120 is wrapped in the circuit layer 110, a conductive metal layer 133 is disposed in the shielding film 130, the reference line 101 is disposed on the conductive metal layer 133, the shielding film 130 is disposed on the isolation film 120, and the isolation film 120 is disposed between the circuit layer 110 and the shielding film 130.
It can be understood that, in the related art, the reference lines and the signal lines are both disposed in the line layer, and since the reference lines and the signal lines both have a certain width, and a certain gap should be reserved between any two lines, that is, all the reference lines and all the signal lines are spaced apart along the width direction of the flexible circuit board. Therefore, under the limitation of the number and the arrangement mode of the reference lines and the signal lines, when the flexible circuit board is constructed, the width of the flexible circuit board is too wide, so that the flexible circuit board occupies a larger assembly space when being applied to electronic equipment (such as a mobile phone), and further, the space inside the electronic equipment is difficult to optimize.
According to the utility model discloses electronic equipment 200 utilizes the conductive metal layer 133 on the barrier film 130 for conductive metal layer 133 sets up in barrier film 130 as reference line 101, can reduce the quantity of the circuit that sets up on line layer 110 from this to can reduce flexible circuit board 100's width, reach the benefit of reducing flexible circuit board 100 cross sectional area and saving cost.
The shielding film 130 may be an electromagnetic interference shielding film 130. The EMI shielding film 130 may also be referred to as an EMI shielding film 130, and the EMI refers to an interference phenomenon generated by an electromagnetic wave acting on an electronic component, and includes both conducted interference and radiated interference. Conducted interference refers to coupling (interfering) a signal on one electrical network to another electrical network through a conductive medium. The radiation interference means that an interference source couples (interferes) signals to another electric network through space, and in the design of a high-speed PCB and a system, a high-frequency signal line, pins of an integrated circuit, various connectors and the like can be radiation interference sources with antenna characteristics and can emit electromagnetic waves and influence the normal work of other systems or other subsystems in the system. "interference" may refer to both a reduction in performance of a device subject to interference and an interference source that causes interference to the device. The first layer means that the thunder and lightning makes the radio generate noise, the snowflake appears on the television picture after the motorcycle runs nearby, and the radio sound is heard after the motorcycle is picked up.
As shown in fig. 5, the electronic device 200 further includes a camera assembly 230, a main circuit board, a housing 210, and a display screen assembly 220, wherein the display screen assembly 220 is embedded in the housing 210, the camera assembly 230 is connected to the housing 210, the main circuit board is disposed in the housing 210, and the flexible circuit board is connected between the camera assembly 230 and the main circuit board.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (14)
1. A flexible circuit board comprising a reference line and a plurality of signal lines for transmitting signals, the plurality of signal lines being spaced apart in a width direction of the flexible circuit board, the flexible circuit board further comprising:
the signal line is arranged in the line layer;
the isolating film wraps the circuit layer;
the shielding film, be equipped with conductive metal layer in the shielding film, the reference line is located conductive metal layer, the shielding film is located on the barrier film, just the barrier film is located the circuit layer with between the shielding film.
2. The flexible circuit board of claim 1, wherein the shielding film is an electromagnetic interference shielding film.
3. The flexible circuit board according to claim 1, wherein the shielding film comprises a carrier film, a conductive metal layer, and a protective layer, which are sequentially stacked.
4. The flexible circuit board of claim 3, wherein the shielding film further comprises:
the first conductive adhesive is arranged between the carrier film and the conductive metal layer.
5. The flexible circuit board of claim 4, wherein the shielding film further comprises:
and the second conductive adhesive is arranged between the protective layer and the conductive metal layer.
6. The flexible circuit board of claim 1, wherein the conductive metal layer extends along a length of the flexible circuit board, and the conductive metal layer is one.
7. The flexible circuit board of claim 1, wherein the conductive metal layer extends along a length direction of the flexible circuit board, and the conductive metal layer is plural and is spaced apart along a width direction of the flexible circuit board.
8. The flexible circuit board of claim 7, wherein an insulating layer is disposed between any two adjacent conductive metal layers.
9. The flexible circuit board of claim 1, wherein the conductive metal layer is a copper layer.
10. The flexible circuit board of claim 1, wherein the isolation film is a PI film.
11. The flexible circuit board according to claim 1, wherein the isolation film includes a first isolation portion and a second isolation portion, the first isolation portion is disposed on one side surface of the circuit layer, the second isolation portion is disposed on the other side surface of the circuit layer, and the first isolation portion is located between the circuit layer and the shielding film.
12. The flexible circuit board of claim 11, wherein a first adhesive layer is disposed between the first spacer and the circuit layer.
13. The flexible circuit board of claim 11, wherein a second adhesive layer is disposed between the second spacer and the circuit layer.
14. An electronic device, comprising:
the flexible circuit board, the flexible circuit board includes the reference line and is used for signal line, the flexible circuit board still includes circuit layer, barrier film and shielding film, signal line locates in the circuit layer, the barrier film wrap up in the circuit layer, be equipped with conductive metal layer in the shielding film, the reference line is located conductive metal layer, the shielding film is located on the barrier film, just the barrier film is located the circuit layer with between the shielding film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920609102.1U CN209897343U (en) | 2019-04-28 | 2019-04-28 | Electronic equipment and flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920609102.1U CN209897343U (en) | 2019-04-28 | 2019-04-28 | Electronic equipment and flexible circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN209897343U true CN209897343U (en) | 2020-01-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920609102.1U Active CN209897343U (en) | 2019-04-28 | 2019-04-28 | Electronic equipment and flexible circuit board |
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| CN (1) | CN209897343U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113674628A (en) * | 2020-12-31 | 2021-11-19 | 友达光电股份有限公司 | Flexible display module |
| WO2023062484A1 (en) * | 2021-10-14 | 2023-04-20 | 3M Innovative Properties Company | Integral electronic stack |
-
2019
- 2019-04-28 CN CN201920609102.1U patent/CN209897343U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113674628A (en) * | 2020-12-31 | 2021-11-19 | 友达光电股份有限公司 | Flexible display module |
| WO2023062484A1 (en) * | 2021-10-14 | 2023-04-20 | 3M Innovative Properties Company | Integral electronic stack |
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