CN209402920U

CN209402920U - The radiator structure and electronic equipment of electronic equipment

Info

Publication number: CN209402920U
Application number: CN201821554474.0U
Authority: CN
Inventors: 王川; 任付元
Original assignee: TELEEPOCH Ltd
Current assignee: TELEEPOCH Ltd
Priority date: 2018-09-21
Filing date: 2018-09-21
Publication date: 2019-09-17
Anticipated expiration: 2028-09-21

Abstract

The utility model discloses the radiator structure of electronic equipment and electronic equipments.The radiator structure of the electronic equipment is for distributing the heat generated in electronic equipment to the external world, the electronic equipment includes shell and mainboard, the mainboard is installed in the shell, heat eliminating medium is equipped between the mainboard and the shell, the heat release hole through the shell is offered on the shell, the outer wall of the shell corresponds to a detachably connected closing block at the heat release hole；Electronic equipment has above-mentioned radiator structure.The radiator structure of electronic equipment described in the utility model can preferably radiate to electronic equipment, prevent because of excessively thermally-induced Caton, crash.

Description

The radiator structure and electronic equipment of electronic equipment

Technical field

The utility model relates to the technical field of heat dissipation of electronic equipment, and in particular to the radiator structure and electronics of electronic equipment Equipment.

Background technique

With the development of modern society, people are higher and higher to the user experience requirement of the electronic equipments such as mobile phone, mobile phone Screen is increasing, and the capacity of internal battery is also increasing, this allows for the heat of electronic equipment internal generation increasingly Height, if electronic equipment does not have good heat sinking function, it will cause to crash and operating system Caton, influence user experience.

Utility model content

Based on this, it is necessary to provide one kind preferably to radiate to electronic equipment for the utility model, prevents because of mistake Thermally-induced Caton, crash electronic equipment radiator structure.

The utility model also provides a kind of electronic equipment.

In order to realize the purpose of this utility model, the utility model uses following technical scheme:

The radiator structure of a kind of electronic equipment, for distributing the heat generated in electronic equipment to the external world, the electronics Equipment includes shell and mainboard, and the mainboard is installed in the shell, and heat dissipation is equipped between the mainboard and the shell and is situated between Matter, the heat release hole through the shell is offered on the shell, and the outer wall of the shell corresponds to removable at the heat release hole Connect a closing block with unloading.

The radiator structure of above-mentioned electronic equipment, is placed in shell using heat eliminating medium, and heat release hole is opened up on shell, is led to The heat release hole in the conductive force and shell of heat eliminating medium is crossed, the intracorporal heat of shell is dispersed into the external world, is avoided because overheating out Existing Caton, crash phenomenon close heat release hole by closing block when not needing heat dissipation, prevent from entering dust, water in shell Point, the normal operation of electronic equipment is not influenced.

In some of embodiments, the heat eliminating medium is installed on the mainboard.

In some of embodiments, the electronic equipment includes that shell includes bottom case and face-piece, and the heat release hole is opened in On the bottom case.

In some of embodiments, the outer wall of the shell offers mounting groove, and the closing block is set to the mounting groove It is interior.

In some of embodiments, the closing block snaps connection the shell.

In some of embodiments, the size of the closing block is equal to the size of the mounting groove.

In some of embodiments, the heat eliminating medium is thermal grease block.

In some of embodiments, the quantity of the thermal grease block be it is multiple, compartment of terrain is installed on the mainboard.

In some of embodiments, the gross area of the heat eliminating medium is greater than the position that the shell opens up the heat release hole Area.

The utility model also provides a kind of electronic equipment comprising the radiator structure.

Detailed description of the invention

Fig. 1 is the structural schematic diagram that electronic equipment described in one preferred embodiment of the utility model removes face-piece；

Fig. 2 is the structural schematic diagram that electronic equipment described in Fig. 1 removes processor；

Fig. 3 is the structural schematic diagram at another visual angle of electronic equipment described in Fig. 1；

Fig. 4 is the structural schematic diagram that electronic equipment described in Fig. 3 removes closing block；

Fig. 5 is the sectional view along A-A of Fig. 3.

Specific embodiment

The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model, It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms in fact It is existing, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes public affairs to the utility model The understanding for opening content is more thorough and comprehensive.

It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to To another element or it may be simultaneously present centering elements.

Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be The purpose of description specific embodiment, it is not intended that in limitation the utility model.

The utility model provides the radiator structure of a kind of electronic equipment, is used for, the heat generated in electronic equipment is distributed To the external world, to radiate to electronic equipment.

The present embodiment also provides a kind of electronic equipment 100, and internal heat accumulation is less, and user experience is good.

Embodiment one

Fig. 1, Fig. 2 and Fig. 5 are please referred to, the present embodiment provides the radiator structures of a kind of electronic equipment, for electronic equipment It radiates, which includes shell 10 and mainboard 20, and mainboard 20 is mounted in shell 10.Referring to figure 2. with Fig. 5, Heat eliminating medium 30 is equipped between mainboard 20 and shell 10.Referring to figure 4. with Fig. 5, offer through the shell 10 on shell 10 Heat release hole 40.Referring to figure 3. with Fig. 5, the outer wall of shell 10 is corresponding to a detachably connected closing block 50 at heat release hole 40.Just In normal situation, closing block 50 is mounted at heat release hole 40, prevents dust, moisture etc. from being entered in shell 10 by heat release hole 40, is influenced Electronic equipment operates normally；When internal heat is larger for example when watching video, charging, the progress of closing block 50 is removed Heat dissipation, installs closing block 50 after heat dissipation.

Please refer to Fig. 1 and Fig. 5, shell 10 includes bottom case 11 and the face-piece (not shown) that connect bottom case 11, bottom case 11 and face Accommodating cavity is formed between shell, mainboard 20 is mounted in the accommodating cavity body, processor (CPU) 60 is also equipped in accommodating cavity body, Heat is mainly generated by processor 60, and processor 60 is close to face-piece, and mainboard 20 is close to bottom case 11.

Referring to figure 2. with Fig. 5, heat eliminating medium 30 choose the more advanced representative thermal grease block of industry circle, than Nearly 1000 times of air good heat dissipation.Certainly, heat eliminating medium 30 can also choose common aluminium radiator, but its effect does not radiate Silica gel block is good.Thermal grease block 30 is installed on mainboard 20, and is arranged close to bottom case 11 so that it is convenient to which thermal grease block 30 is thermally conductive To the external world.

The quantity of thermal grease block 30 be it is multiple, compartment of terrain is installed on mainboard 20.The gross area of heat eliminating medium 30 is greater than Bottom case 11 opens up the area of the position of heat release hole 40.Silica gel block can preferably radiate in this way.

Referring to figure 4. with Fig. 5, heat release hole 40 is opened in the middle position of bottom case 11, and is arranged in array.Heat release hole 40 Shape can be round, rectangular, triangle etc., not influence its heat dissipation effect.

Referring to figure 4., the outer wall of bottom case 11 offers mounting groove 12, and closing block 50 is removably installed in mounting groove 12 It is interior.In the present embodiment, closing block 50 is snapped connection with bottom case 11, and the size of closing block 50 is equal to the size of mounting groove 12, with more Heat release hole 40 is covered in well.

The material of closing block 50 is preferably identical as the material of bottom case 11, so that closing block 50 is installed rear and bottom case 11 It is integrally formed, does not influence the appearance of shell 10.

Embodiment two

Fig. 1, Fig. 2 and Fig. 5 are please referred to, the present embodiment provides a kind of electronic equipment 100, which includes shell 10, mainboard 20 and processor 60, mainboard 20 and processor 60 are mounted in shell 10.Referring to figure 2. with Fig. 5, mainboard 20 with Heat eliminating medium 30 is equipped between shell 10.Referring to figure 4. with Fig. 5, the heat release hole 40 through the shell 10 is offered on shell 10. Referring to figure 3. with Fig. 5, the outer wall of shell 10 is corresponding to a detachably connected closing block 50 at heat release hole 40, under normal circumstances, Closing block 50 is mounted at heat release hole 40, is prevented dust, moisture etc. from being entered in shell 10 by heat release hole 40, is being influenced electronic equipment just Often operation；It for example removes closing block 50 when watching video, charging when internal heat is larger and radiates, radiated Closing block 50 is installed after finishing.

Please refer to Fig. 1 and Fig. 5, shell 10 includes bottom case 11 with the face-piece that connect bottom case 11, shape between bottom case 11 and face-piece At accommodating cavity, mainboard 20 and processor 60 are installed in the accommodating cavity body, and heat is mainly generated by processor 60, processor 60 close to face-piece, and mainboard 20 is close to bottom case 11.

Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed, But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.

Claims

1. the radiator structure of a kind of electronic equipment, for distributing the heat generated in electronic equipment to the external world, the electronics is set Standby includes shell and mainboard, and the mainboard is installed in the shell, which is characterized in that is set between the mainboard and the shell There is heat eliminating medium, the heat release hole through the shell is offered on the shell, the outer wall of the shell corresponds to the heat dissipation A detachably connected closing block at hole.

2. the radiator structure of electronic equipment according to claim 1, which is characterized in that the heat eliminating medium is installed on described On mainboard.

3. the radiator structure of electronic equipment according to claim 1, which is characterized in that the electronic equipment includes shell packet Bottom case and face-piece are included, the heat release hole is opened on the bottom case.

4. the radiator structure of electronic equipment according to claim 1 or 3, which is characterized in that the outer wall of the shell opens up There is mounting groove, the closing block is set in the mounting groove.

5. the radiator structure of electronic equipment according to claim 1, which is characterized in that the closing block snaps connection described Shell.

6. the radiator structure of electronic equipment according to claim 4, which is characterized in that the size of the closing block is equal to institute State the size of mounting groove.

7. the radiator structure of electronic equipment according to claim 1-3, which is characterized in that the heat eliminating medium is Thermal grease block.

8. the radiator structure of electronic equipment according to claim 7, which is characterized in that the quantity of the thermal grease block is Multiple, compartment of terrain is installed on the mainboard.

9. the radiator structure of electronic equipment according to claim 1, which is characterized in that the gross area of the heat eliminating medium is big The area of the position of the heat release hole is opened up in the shell.

10. a kind of electronic equipment, which is characterized in that including the described in any item radiator structures of claim 1-9.