CN209246027U - A kind of heat dissipation structure of LED lamp based on semiconductor cooler - Google Patents
A kind of heat dissipation structure of LED lamp based on semiconductor cooler Download PDFInfo
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- CN209246027U CN209246027U CN201920163685.XU CN201920163685U CN209246027U CN 209246027 U CN209246027 U CN 209246027U CN 201920163685 U CN201920163685 U CN 201920163685U CN 209246027 U CN209246027 U CN 209246027U
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- semiconductor cooler
- semiconductor
- heat
- heat dissipation
- shell
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Abstract
The utility model discloses a kind of heat dissipation structure of LED lamp based on semiconductor cooler, including the radiating subassembly, semiconductor cooler shell (1) and LED light source (2) being fixedly connected sequentially;LED circuit substrate (3) are provided in the LED light source (2);Semiconductor cooler (4) are installed in the semiconductor cooler shell (1).The utility model structure is simple, it is radiated by the heat that semiconductor cooler can generate LED light source, radiating efficiency is high, while humid air can be avoided by hair dryer, suction ventilator and humidity sensor and be easy condensation droplet in the cold end of semiconductor cooler to cause the wiring board damage or the problem of the pole P semiconductor and the semiconductor short circuit of the pole N of LED lamp, the radiating subassembly that semiconductor cooler release end of heat is arranged in can quickly and efficiently distribute the heat of semiconductor cooler generation.
Description
Technical field
The utility model relates to led light technology field, especially a kind of LED lamps cooling knot based on semiconductor cooler
Structure.
Background technique
LED light compares compared with conventional lights has many advantages, such as that small in size, power consumption is low, long service life and high brightness, LED are hairs
The abbreviation of optical diode, its basic structure are one piece of electroluminescent chip of semiconductor material, are arrived with elargol or latex solidified
On bracket, then with silver wire or gold thread connection chip and circuit board, then surrounding is sealed with epoxy resin, plays protection inner core
The effect of line, finally installs shell, so the anti-seismic performance of LED light is good.LED lamp, also referred to as LED lamp, refer to energy
Enough light transmissions, distribution and the utensil for changing LED light source light distribution, light emitting diode have efficiently, energy conservation, safety, longevity, it is small and exquisite,
The technical characterstics such as clear light.
The design of existing LED light the deficiencies of there are poor radiations.Also there is the LED light using labyrinth come radiating and cooling,
But since manufacturing cost is too high, be not suitable for promoting and applying.LED is dropped using semiconductor cooler although having already appeared now
Temperature heat dissipation, but since the usage scenario of LED light is nearly all in outdoor, and in the higher situation of summer air humidity, half
The cold junction temperature of conductor refrigerator is lower, and humid air is easy condensation droplet in the cold end of semiconductor cooler, causes entire LED light
Tool is easy to have an impact the wiring board of LED lamp under moisture conditions, leads to wiring board short circuit or damage, to LED
While lamps and lanterns radiate, it is also contemplated that the clammy device of semiconductor guarantees the normal work of LED circuit board in the case where humidity height.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of LED based on semiconductor cooler
Lamp cooling structure.
The purpose of this utility model is achieved through the following technical solutions:
A kind of heat dissipation structure of LED lamp based on semiconductor cooler, including be fixedly connected sequentially radiating subassembly, partly lead
Chiller shell 1 and LED light source 2;LED circuit substrate 3 is provided in the LED light source 2;
Semiconductor cooler 4 is installed, the semiconductor cooler includes that heat absorption is exhausted in the semiconductor cooler shell 1
The top of semiconductor cooler shell 1 is arranged in edge potsherd 5 and heat release insulating ceramic film 6, the heat release insulating ceramic film 6,
The bottom of semiconductor cooler shell 1 is arranged in the heat absorption insulating ceramic film 5;LED circuit substrate 3 in the LED light source 2
Heat-conducting plate 7 is additionally provided between heat absorption insulating ceramic film 5;It is equipped with and blows on the left side wall of the semiconductor cooler shell 1
Blower 8 is equipped with suction ventilator 9 on the right side wall of semiconductor cooler shell 1;
The radiating subassembly includes that radiator shell 10, radiating fin 11 and heat dissipation orifice plate 12, the radiating fin 11 are set
It sets at the top of radiator shell 10, the heat dissipation orifice plate 12 is arranged in the top of radiator shell 10 and is located at several heat dissipations
At the center of fin 11.
The pole the P semiconductor uniformly to distribute alternately is provided between heat absorption insulating ceramic film 5 and the heat release insulating ceramic film 6
The pole 13 and N semiconductor 14 is cascaded between the pole P semiconductor 13 and the pole N semiconductor 14 by conductive metal block 15, is gone here and there
The pole P semiconductor 13 and the pole N semiconductor 14 after connection, which are powered, to freeze.
Cooling fan, the air outlet face heat dissipation orifice plate of the cooling fan are also equipped in the radiator shell 10
12。
Further include controller, humidity sensor 15, the humidity sensor are additionally provided in the semiconductor cooler shell 1
The output end of device 15 and the input terminal of controller connect.
The output end of the controller respectively with hair dryer and air draught mechatronics.
It is adhesively fixed between the heat absorption insulating ceramic film 5 and heat-conducting plate 7 by thermally conductive pad pasting.
The beneficial effects of the utility model are:
The utility model structure is simple, is radiated, is dissipated by the heat that semiconductor cooler can generate LED light source
The thermal efficiency is high, while can be avoided humid air in the cold end of semiconductor cooler by hair dryer, suction ventilator and humidity sensor
Condensation droplet is easy to cause the wiring board damage or the problem of the pole P semiconductor and the semiconductor short circuit of the pole N of LED lamp, if
The radiating subassembly set in semiconductor cooler release end of heat can quickly and efficiently give out the heat of semiconductor cooler generation
It goes.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model;
Fig. 2 is the structural schematic diagram of radiating subassembly;
In figure, 1- semiconductor cooler shell, 2-LED light source, 3-LED circuit substrate, 4- semiconductor cooler, 5- heat absorption
Insulating ceramic film, 6- heat release insulating ceramic film, 7- heat-conducting plate, 8- hair dryer, 9- suction ventilator, 10- radiator shell, 11- heat dissipation
Fin, 12- heat dissipation orifice plate, the pole 13-P semiconductor, the pole 14-N semiconductor, 15- conductive metal block, 16- humidity sensor.
Specific embodiment
The technical solution of the utility model, but the protection scope of the utility model are described in further detail with reference to the accompanying drawing
It is not limited to as described below.
As shown in Figure 1, it is a kind of based on the heat dissipation structure of LED lamp of semiconductor cooler by semiconductor cooler shell 1,
LED light source 2, LED circuit substrate 3, semiconductor cooler 4, heat absorption insulating ceramic film 5, heat release insulating ceramic film 6, heat-conducting plate 7,
Hair dryer 8, radiator shell 10, radiating fin 11, heat dissipation orifice plate 12, the pole P semiconductor 13, the pole N semiconductor 14, is led at suction ventilator 9
Electric metal block 15 and humidity sensor 16 form.
A kind of connection type of the heat dissipation structure of LED lamp based on semiconductor cooler is as follows:
A kind of heat dissipation structure of LED lamp based on semiconductor cooler, it is characterised in that: dissipated including what is be fixedly connected sequentially
Hot component, semiconductor cooler shell 1 and LED light source 2;LED circuit substrate 3 is provided in the LED light source 2;
Semiconductor cooler 4 is installed, the semiconductor cooler includes that heat absorption is exhausted in the semiconductor cooler shell 1
The top of semiconductor cooler shell 1 is arranged in edge potsherd 5 and heat release insulating ceramic film 6, the heat release insulating ceramic film 6,
The bottom of semiconductor cooler shell 1 is arranged in the heat absorption insulating ceramic film 5;LED circuit substrate 3 in the LED light source 2
Heat-conducting plate 7 is additionally provided between heat absorption insulating ceramic film 5;It is equipped with and blows on the left side wall of the semiconductor cooler shell 1
Blower 8 is equipped with suction ventilator 9 on the right side wall of semiconductor cooler shell 1;
The radiating subassembly includes that radiator shell 10, radiating fin 11 and heat dissipation orifice plate 12, the radiating fin 11 are set
It sets at the top of radiator shell 10, the heat dissipation orifice plate 12 is arranged in the top of radiator shell 10 and is located at several heat dissipations
At the center of fin 11.
The pole the P semiconductor uniformly to distribute alternately is provided between heat absorption insulating ceramic film 5 and the heat release insulating ceramic film 6
The pole 13 and N semiconductor 14 is cascaded between the pole P semiconductor 13 and the pole N semiconductor 14 by conductive metal block 15, is gone here and there
The pole P semiconductor 13 and the pole N semiconductor 14 after connection, which are powered, to freeze.
Cooling fan, the air outlet face heat dissipation orifice plate of the cooling fan are also equipped in the radiator shell 10
12。
Further include controller, humidity sensor 15, the humidity sensor are additionally provided in the semiconductor cooler shell 1
The output end of device 15 and the input terminal of controller connect.
The output end of the controller is electrically connected with hair dryer 8 and suction ventilator 9 respectively.
It is adhesively fixed between the heat absorption insulating ceramic film 5 and heat-conducting plate 7 by thermally conductive pad pasting.
The utility model structure is simple, is radiated, is dissipated by the heat that semiconductor cooler can generate LED light source
The thermal efficiency is high, while can be avoided humid air in the cold end of semiconductor cooler by hair dryer, suction ventilator and humidity sensor
Condensation droplet is easy to cause the wiring board damage or the problem of the pole P semiconductor and the semiconductor short circuit of the pole N of LED lamp, if
The radiating subassembly set in semiconductor cooler release end of heat can quickly and efficiently give out the heat of semiconductor cooler generation
It goes.
Finally it should be noted that above are merely preferred embodiments of the utility model, it is noted that for this technology
For the those of ordinary skill in field, without departing from the principle of this utility model, several improvement and profit can also be made
Decorations, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (6)
1. a kind of heat dissipation structure of LED lamp based on semiconductor cooler, it is characterised in that: including the heat dissipation being fixedly connected sequentially
Component, semiconductor cooler shell (1) and LED light source (2);LED circuit substrate (3) are provided in the LED light source (2);
It is equipped with semiconductor cooler (4) in the semiconductor cooler shell (1), the semiconductor cooler includes that heat absorption is exhausted
Edge potsherd (5) and heat release insulating ceramic film (6), the heat release insulating ceramic film (6) are arranged in semiconductor cooler shell (1)
Top, it is described heat absorption insulating ceramic film (5) setting semiconductor cooler shell (1) bottom;In the LED light source (2)
LED circuit substrate (3) and heat absorption insulating ceramic film (5) between be additionally provided with heat-conducting plate (7);The semiconductor cooler shell
(1) it is equipped on left side wall hair dryer (8), suction ventilator (9) is installed on the right side wall of semiconductor cooler shell (1);
The radiating subassembly includes radiator shell (10), radiating fin (11) and heat dissipation orifice plate (12), the radiating fin
(11) setting is at the top of radiator shell (10), and heat dissipation orifice plate (12) setting is in the top of radiator shell (10) and position
At the center of several radiating fins (11).
2. a kind of heat dissipation structure of LED lamp based on semiconductor cooler according to claim 1, it is characterised in that: institute
State be provided between heat absorption insulating ceramic film (5) and heat release insulating ceramic film (6) pole the P semiconductor (13) uniformly to distribute alternately and
The pole N semiconductor (14) is connected on one by conductive metal block (15) between the pole P semiconductor (13) and the pole N semiconductor (14)
It rises, the pole the P semiconductor (13) and the pole N semiconductor (14) after series connection, which are powered, to freeze.
3. a kind of heat dissipation structure of LED lamp based on semiconductor cooler according to claim 1, it is characterised in that: institute
It states and is also equipped with cooling fan in radiator shell (10), the air outlet face of the cooling fan radiates orifice plate (12).
4. a kind of heat dissipation structure of LED lamp based on semiconductor cooler according to claim 1, it is characterised in that: also
Including controller, it is additionally provided with humidity sensor (16) in the semiconductor cooler shell (1), the humidity sensor (16)
Output end and controller input terminal connect.
5. a kind of heat dissipation structure of LED lamp based on semiconductor cooler according to claim 4, it is characterised in that: institute
The output end for stating controller is electrically connected with hair dryer (8) and suction ventilator (9) respectively.
6. a kind of heat dissipation structure of LED lamp based on semiconductor cooler according to claim 1, it is characterised in that: institute
It states and is adhesively fixed between heat absorption insulating ceramic film (5) and heat-conducting plate (7) by thermally conductive pad pasting.
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CN201920163685.XU CN209246027U (en) | 2019-01-30 | 2019-01-30 | A kind of heat dissipation structure of LED lamp based on semiconductor cooler |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115113463A (en) * | 2022-05-30 | 2022-09-27 | 歌尔光学科技有限公司 | Heat dissipation device for heat source module and electronic equipment |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115113463A (en) * | 2022-05-30 | 2022-09-27 | 歌尔光学科技有限公司 | Heat dissipation device for heat source module and electronic equipment |
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