CN208969594U - A kind of vehicle diagnosis tablet computer - Google Patents
A kind of vehicle diagnosis tablet computer Download PDFInfo
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- CN208969594U CN208969594U CN201821660900.9U CN201821660900U CN208969594U CN 208969594 U CN208969594 U CN 208969594U CN 201821660900 U CN201821660900 U CN 201821660900U CN 208969594 U CN208969594 U CN 208969594U
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- tablet computer
- power module
- conductive bracket
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Abstract
The utility model relates to vehicle diagnosis tablet computer technical field, disclose in a kind of vehicle diagnosis tablet computer, vehicle diagnosis tablet computer includes: shell, including front housing and rear shell, cavity is provided between front housing and rear shell, front housing is provided with installing port, and installing port is connected to cavity；Screen is set in cavity, and screen is opposite with installing port；Mainboard is set in cavity, and mainboard includes circuit board and the power module for being equipped on circuit board；Heat-conductive bracket is set between mainboard and screen, for conducting heat between power module and screen；First equal thermosphere, is set between heat-conductive bracket and screen, and the first equal thermosphere between heat-conductive bracket and screen for conducting heat；The thermal coefficient of first equal thermosphere is greater than the thermal coefficient of heat-conductive bracket, makes the vehicle diagnosis tablet computer small volume, and can realize the heat dissipation to power module.
Description
[technical field]
The utility model relates to vehicle diagnosis tablet computer technical field more particularly to a kind of vehicle diagnosis tablet computers.
[background technique]
Electronic equipment develops to frivolous direction at present, and vehicle diagnosis tablet computer is no exception.
Mainboard for controlling vehicle diagnosis panel computer work is installed, mainboard is working in vehicle diagnosis tablet computer
When, power module such as central processing unit, the power device fever for being equipped on mainboard is serious, and fever causes power module efficiency to drop
It is low, and service life reduction, it is therefore desirable to it radiates to power module.
But inventor is in the process of implementing the utility model, discovery: current vehicle diagnosis tablet computer uses wind
The part such as fan or heat-dissipating pipe radiates to power module, causes vehicle diagnosis tablet computer volume big.Therefore, the prior art
It needs to improve.
[summary of the invention]
In order to solve the above-mentioned technical problem, the utility model embodiment provides a kind of vehicle diagnosis tablet computer, the vapour
Vehicle diagnoses the small in size of tablet computer, and mainboard heat-sinking capability is good.
In order to solve the above-mentioned technical problem, the utility model embodiment the following technical schemes are provided:
There is provided a kind of vehicle diagnosis tablet computer, comprising: shell, including front housing and rear shell, the front housing and the rear shell
Between be provided with cavity, the front housing is provided with installing port, and the installing port is connected to the cavity；Screen is set to the appearance
It is intracavitary, and the screen is directed at the installing port；Mainboard is set in the cavity, and the mainboard includes circuit board and takes
It is loaded in the power module of the circuit board；Heat-conductive bracket is set between the mainboard and the screen, and the heat-conductive bracket is used
In conducting heat between the power module and the screen；First equal thermosphere, is set to the heat-conductive bracket and the screen
Between curtain, the first equal thermosphere is for conducting heat between the heat-conductive bracket and the screen；The first equal thermosphere
Thermal coefficient be greater than the heat-conductive bracket thermal coefficient.
In some embodiments, the area of the described first equal thermosphere and the area of the heat-conductive bracket are all larger than the power
The area of module.
In some embodiments, the described first equal thermosphere is the first graphene film.
In some embodiments, the surface of the heat-conductive bracket towards the power module is provided with lug boss；It is described convex
The portion of rising and the power module face, the heat-conductive bracket conduct the heat that the power module generates by the lug boss.
In some embodiments, the heat-conductive bracket is provided with recessed portion away from the surface of the power module；It is described convex
The portion of rising is between the recessed portion and the power module.
In some embodiments, heat-conducting layer is provided between the power module and the heat-conductive bracket；The heat-conducting layer
A face contact described in power module, the heat-conducting layer away from the power module a face contact described in heat-conductive bracket.
In some embodiments, the heat-conducting layer is made by silica gel material.
In some embodiments, the screen includes touch screen and display screen；
For the display location between the described first equal thermosphere and the touch screen, the touch screen is set to the installation
At mouthful；The first equal thermosphere is attached at the display screen away from the heat-conductive bracket on one side；The display screen and the touching
It touches and is provided with the first gap between screen.
In some embodiments, the rear shell is provided with the second equal thermosphere towards the circuit board on one side；Described second
Equal thermosphere is for conducting heat between the circuit board and the rear shell；The thermal coefficient of the second equal thermosphere is greater than described
The thermal coefficient of circuit board.
In some embodiments, the area of the described second equal thermosphere is greater than the area of the power module.
In some embodiments, the described second equal thermosphere is the second graphene film.
In some embodiments, the second gap is provided between the described second equal thermosphere and the circuit board.
In some embodiments, the rear shell is provided with heat release hole；The heat release hole is connected with the cavity.
Compared with prior art, in a kind of vehicle diagnosis tablet computer of the utility model embodiment, the automobile
Diagnosing tablet computer includes: shell, including front housing and rear shell, cavity is provided between the front housing and the rear shell, before described
Shell is provided with installing port, and the installing port is connected to the cavity；Screen is set in the cavity, and the screen and institute
It is opposite to state installing port；Mainboard is set in the cavity, and the mainboard includes circuit board and the function for being equipped on the circuit board
Rate module；Heat-conductive bracket is set between the mainboard and the screen, the heat-conductive bracket be used for the power module with
Heat is conducted between the screen；First equal thermosphere, is set between the heat-conductive bracket and the screen, first soaking
Layer is for conducting heat between the heat-conductive bracket and the screen；The thermal coefficient of the first equal thermosphere is greater than described lead
The thermal coefficient of hot bracket.By above-mentioned setting, make the vehicle diagnosis tablet computer small volume, and by the power mould
The heat transfer of block can take away the heat of the screen, it can be achieved that described with the air of the screen contact to the screen
The heat dissipation of power module.
[Detailed description of the invention]
One or more embodiments are illustrated by corresponding attached drawing, these exemplary illustrations not structure
The restriction of pairs of embodiment, the element with same reference numbers label is expressed as similar element in attached drawing, unless there are special
It declares, composition does not limit the figure in attached drawing.
Fig. 1 is a kind of structural schematic diagram of the utility model vehicle diagnosis tablet computer that wherein an embodiment provides；
Fig. 2 is the dismantling schematic diagram of vehicle diagnosis tablet computer shown in FIG. 1；
Fig. 3 is the dismantling schematic diagram at another visual angle of vehicle diagnosis tablet computer shown in Fig. 2；
Fig. 4 is the partial cutaway schematic of vehicle diagnosis tablet computer shown in FIG. 1, and arrow is the transmitting side of heat in figure
To.
[specific embodiment]
For the ease of understanding the utility model, with reference to the accompanying drawings and detailed description, the utility model is carried out more
Detailed description.It should be noted that it can be directly in another element when element is expressed " being fixed on " another element
Upper or placed in the middle there may be one or more therebetween elements.When an element is expressed " connection " another element, it can
To be directly to another element or elements placed in the middle there may be one or more therebetween.This specification is used
Term "vertical", "horizontal", "left" and "right", "inner", "outside" and similar statement for illustrative purposes only.
Unless otherwise defined, technical and scientific term all used in this specification and the skill for belonging to the utility model
The normally understood meaning of the technical staff in art field is identical.Term used in the description of the utility model is intended merely to
The purpose for describing specific embodiment is not intended to limitation the utility model.Term "and/or" packet used in this specification
Include any and all combinations of one or more related listed items.
Referring to Fig. 1, wherein an embodiment provides a kind of vehicle diagnosis tablet computer 100, the automobile to the utility model
Diagnose substantially 23 millimeters of thickness of tablet computer 100.
Referring to Figure 2 together, the vehicle diagnosis tablet computer 100 includes shell 10, mainboard 20, heat-conductive bracket 30, leads
Thermosphere 40, the first equal thermosphere 50, the second equal thermosphere 60 and screen 70.Wherein, the shell 10 is provided with installing port 110, institute
State the cavity that installing port 101 is connected to the shell 10, the cavity from the direction in the installing port 101 to the cavity successively
It is provided with the screen 70, the first equal thermosphere 50, the heat-conductive bracket 30, the heat-conducting layer 40, the mainboard 20, described
Second equal thermosphere 60, the screen 70 are directed at the installing port 101.
The shell 10 can be made by engineering plastic alloy (PC+ABS), fire-protection rating UL-94V0, the shell 10
Average wall thickness be 2.5 millimeters.The shell 10 includes front housing 11 and the rear shell 12 for being installed on the front housing 11.
The front housing 11 is provided with the installing port 110.
The rear shell 12 has speaker hole 120 and heat release hole 121.
The speaker hole 120 is connected to the cavity, and loudspeaker (not shown) is additionally provided in the cavity, and the loudspeaker go out
Sound region is opposite with a portion of the speaker hole 120, another part of the speaker hole 120 and 20 phase of mainboard
Right, the part opposite with the mainboard 20 of the speaker hole 120 is for radiating.
The surface of the rear shell 12 towards the mainboard 20 is provided with speaker net 122, and the speaker net 122 covers the loudspeaker
Hole 120, the speaker net 122 are used for the dust filtering at the speaker hole 120.The speaker net 122 can be by stainless steel material system
, the specification of the speaker net 122 are as follows: 0.3 millimeter of aperture, 0.2 millimeter of pitch of holes.
The heat release hole 121 is connected to the cavity, and the heat release hole 121 is for radiating.
The surface of the rear shell 12 towards the mainboard 20 is provided with Air Filter 123, and the Air Filter 123 covers described dissipate
Hot hole 121, the Air Filter 123 are used for the dust filtering at the heat release hole 121.The Air Filter 123 can be by stainless steel material system
, the specification of the Air Filter 123 are as follows: 0.3 millimeter of aperture, 0.2 millimeter of pitch of holes.
The front housing 11 is installed on the rear cover 12, forms the cavity between the front housing 11 and the rear cover 12.
The mainboard 20 includes circuit board 21 and the power module 22 for being equipped on the circuit board 21.
The circuit board 21 is printed circuit board (PCB, Printed Circuit Board), with a thickness of 1.6 millimeters,
The surface of the circuit board 21 towards the installing port 110 is provided with the power module 22.
The power module 22 is the main heat production source of the vehicle diagnosis tablet computer 100 at work, practical at this
It in new embodiment, radiates mainly for the power module 22, due to the thickness of the vehicle diagnosis tablet computer 100
Limitation, cannot carry fan or heat-dissipating pipe biggish radiator in equal volume, and the principle based on raising heat transfer efficiency is to described
Power module 22 radiates.
Specifically, the power module 22 includes power chip component 220 and power device 221.
The power chip component 220 includes power chip 2200 and the shielding case for covering at the power chip 2200
2201。
The power chip 2200 such as central processing unit (CPU, Central Processing Unit), video card
(Video card, Graphics card) etc., in the present embodiment, the power chip 2200 be central processing unit, it is described in
The frequency of central processor is 2G hertz, and the power chip 2200 can generate more heat transfer, the power chip at work
In 2200 heats generated, a part is directly conducted to the circuit board 21, and another part is conducted to the shielding case 2201.
The shielding case 2201 is used to shield interference of the external electrical signal to the power chip 2200, and will be described
The electronic signal partition that power chip 2201 generates, the shielding case 2201 can be made by such as metal materials such as copper, nickel, described
Shielding case 2201 with a thickness of 0.2 millimeter, the heat that the shielding case 2201 is used to generate the power chip 2200 conducts
To the heat-conductive bracket 30.
The power chip 2200 is provided with thermally conductive between the surface and the shielding case 2201 of the circuit board 21
Body 2202.The one side of the heat carrier 2202 is bonded the power chip 2200, and the another side of the heat carrier 2202 is bonded institute
Power chip 2201 is stated, the heat carrier 2202 is used to conduct heat between the power chip 2200 and the shielding case 2201
Amount.The heat carrier 2202 can be made by silica gel material, and the thermal coefficient of the heat carrier 2202 is 5w/ (m.k), it is possible to understand that
, according to the actual situation, the heat carrier 2202 and not only limiting is made by silica gel material, such as the heat carrier 2202 may be used also
Think thermally conductive mica sheet, thermal conductive ceramic plate etc..
Also referring to Fig. 3 and Fig. 4, the power device 221 can be IGBT (Insulated Gate Bipolar
Transistor, insulated-gate bipolar transistor device), high power transistor, bidirectional transistor, thyristor, GTO (Gate
Turn-Off Thyristor, can break thyristor) device, MOSFET
(Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET, OH
Transistor is a kind of field-effect transistor that can be widely used in analog circuit and digital circuit) device etc..The power device
221 can generate more heat transfer at work, and in the heat that the power device 221 generates, a part is directly conducted to the electricity
Road plate 21, another part are conducted to the heat-conductive bracket 30.
The heat-conductive bracket 30 can be made by magnesium alloy, and with a thickness of 1.2 millimeters, the heat-conductive bracket 30 is used for described
First equal thermosphere 40 conducts the heat that the power module 22 generates, and the area of the heat-conductive bracket 30 is much larger than the power mould
The area of block 22, therefore, the heat of power module 22 conduction to the heat-conductive bracket 30 are easy to produce showing for heat concentration
As, generate the reason of heat is concentrated and on the one hand do not conducted in time due to the heat of the heat-conductive bracket 30, on the other hand due to
Heat is not spread to 30 surrounding of heat-conductive bracket in time.
When the heat-conductive bracket 30 generates the phenomenon that heat is concentrated, on the one hand, heat continues to 70 side of screen
Conduction finally generates the hot spot that heat is concentrated on screen 70, has security risk, on the other hand, the power module 22 cannot
Heat dissipation in time causes 22 working efficiency of power module to reduce, and service life declines.
The surface of the heat-conductive bracket 30 towards the power module 22 is provided with lug boss 31.
The lug boss 31 is opposite with the power module 22, and the heat-conductive bracket 30 conducts institute by the lug boss 31
State the heat of the generation of power module 22.
Specifically, the lug boss 31 includes the first lug boss 310 and the second lug boss 311.
First lug boss 310 is opposite with the shielding case 2201, and the heat-conductive bracket 30 passes through first protrusion
Conduct 2201 heat of shielding case in portion 310.
Second lug boss 311 is opposite with the power device 221, and the heat-conductive bracket 30 passes through second protrusion
Conduct the heat that the power device 221 generates in portion 311.
The heat-conductive bracket 30 is provided with recessed portion 32, the recessed portion 32 and institute away from the surface of the power module 22
The position for stating lug boss 31 is opposite, i.e., the described lug boss 31 is between the recessed portion 32 and the power module 22, setting
The lug boss 31 can make to transmit heat towards the side of the screen 70 in the heat-conductive bracket 30 with the recessed portion 32
When, the region that the heat-conductive bracket 30 is provided with the recessed portion 32 is remote at a distance from the screen 70, can make described thermally conductive
The hot concentration effect of bracket 30 influences to reduce on the screen 70.
Wherein, recessed portion can be what metal plate punching lug boss was formed by the way, or be independently formed by other techniques, by
When other techniques independently form, the area of recessed portion can be greater than the area of lug boss, to be further reduced hot concentration effect.It is recessed
The area of concave portion can quickly carry out heat transfer by heat-conductive bracket to can guarantee, and can subtract in particular range
Few influence of the fuel factor to screen, to avoid the loss of screen.
Specifically, the recessed portion 32 includes the first recessed portion 320 and the second recessed portion 321.
First recessed portion 320 is corresponding with the position of first lug boss 310, second recessed portion 321 with
The position of second lug boss 311 is corresponding.
It is understood that according to the actual situation, the lug boss 310 can be omitted, such as the heat-conductive bracket 30
When thickness reaches certain value, the recessed portion 32 can be set in the heat-conductive bracket 30.
The heat-conducting layer 40 is provided between the lug boss 31 and the power module 22.
The heat-conducting layer 40 is described thermally conductive for conducting heat between the power module 22 and the heat-conductive bracket 30
One face contact power module 22 of layer 40, the heat-conducting layer 40 deviate from lug boss described in a face contact of the power module 22
31。
The heat-conducting layer 40 is filled between the power module 22 and the heat-conductive bracket 30, so that the power module
Gap between 22 and the heat-conductive bracket 30 reduces, the heat that the power module 22 is distributed quickly conduct to
Heat-conductive bracket 30.
Specifically, the heat-conducting layer 40 includes the first heat-conducting layer 41 and the second heat-conducting layer 42.
First heat-conducting layer 41 is set between first lug boss 310 and the shielding case 2201, and described first
Heat-conducting layer 41 between first lug boss 310 and the shielding case 2201 for transmitting heat, first heat-conducting layer 41
A face contact described in shielding case 2201, first heat-conducting layer 41 away from the shielding case 2201 a face contact described in first
Lug boss.First heat-conducting layer 41 can be made by silica gel material, first heat-conducting layer 41 with a thickness of 2 millimeters, described
The thermal coefficient of one heat-conducting layer 41 is 5w/ (m.k), it is to be understood that according to the actual situation, first heat-conducting layer 41 is not
It only limits and is made by silica gel material, such as first heat-conducting layer 41 can also be thermally conductive mica sheet, thermal conductive ceramic plate etc..
Second heat-conducting layer 42 is set between second lug boss 311 and the power device, and described second leads
Thermosphere 42 between the heat-conductive bracket 20 and the power device 221 for transmitting heat, and the one of second heat-conducting layer 42
Power device 221 described in face contact, it is second convex described in a face contact of second heat-conducting layer 42 away from the power device 221
Play portion 311.Second heat-conducting layer 42 can be made by silica gel material, second heat-conducting layer 42 with a thickness of 2 millimeters, described
The thermal coefficient of two heat-conducting layers 42 is 5w/ (m.k), it is to be understood that according to the actual situation, second heat-conducting layer 42 is not
It only limits and is made by silica gel material, such as second heat-conducting layer 42 can also be thermally conductive mica sheet, thermal conductive ceramic plate etc..
It is understood that according to the actual situation, the heat-conducting layer 40 can be omitted, in some other embodiments,
The power module 22 is directly contacted with the heat-conductive bracket 30.
The first equal thermosphere 50 is attached at the surface that the heat-conductive bracket 30 deviates from the mainboard 20.First soaking
Layer 50 is for conducting heat between the heat-conductive bracket 30 and the screen 70.
The thermal coefficient of the first equal thermosphere 50 is greater than the thermal coefficient of the heat-conductive bracket 30, so that described first is equal
Thermosphere 50 quickly conducts the heat of the heat-conductive bracket 30 to 70 side of screen, can reduce heat in the thermally conductive branch
The accumulation of frame 30, it is not easy to generate the phenomenon that heat is concentrated in the heat-conductive bracket 30.
Further, the area of the described first equal thermosphere 50 is greater than the area of the power module 22, due to described first
Equal thermosphere 50 and the thickness of the heat-conductive bracket 30 can be ignored, and heat is big in the diffusion velocity of the described first equal thermosphere 50
In heat the heat-conductive bracket 30 diffusion velocity, therefore, the heat at first equal 50 edge of thermosphere and the thermally conductive branch
It will do it heat conduction between the edge of frame 30, so that the first equal thermosphere 50 and the heat of the heat-conductive bracket 30 are opposite equal
It is even, create a further reduction the degree of heat concentration.
The first equal thermosphere 50 is the first graphene film, and with a thickness of 0.1 millimeter, thermal coefficient is 1700w/ (m
k)。
It is understood that according to the actual situation, the first equal thermosphere 50 is not limited to the first graphene film, example
Such as, the described first equal thermosphere 50 is graphite material, carbon fibre materials etc., as long as the thermal coefficient of the first equal thermosphere 50 is big
In the thermal coefficient of the heat-conductive bracket 30.
The second equal thermosphere 60 is attached at the rear shell 12 towards the surface of the circuit board 21, the second equal thermosphere
60 for conducting heat between the circuit board 21 and the rear shell 12.
The thermal coefficient of the second equal thermosphere 60 is greater than the thermal coefficient of the circuit board 21, so that second soaking
Layer 60 quickly conducts the heat of the circuit board 21 to the rear shell 12, can reduce heat in the tired of the circuit board 21
Product, it is not easy to the phenomenon that the 21 heat production heat of circuit board is concentrated.
Further, the area of the described second equal thermosphere 60 is greater than the area of the power module 22, due to described second
Equal thermosphere 60 and the thickness of the circuit board 21 can be ignored, and heat is greater than in the diffusion velocity of the described second equal thermosphere 60
Heat the circuit board 21 diffusion velocity, therefore, the heat at second equal 60 edge of thermosphere and 21 side of circuit board
It will do it heat conduction between edge, so that the heat of the second equal thermosphere 60 and the circuit board 21 can be relatively uniform, into one
Reduce the degree that heat is concentrated between the described second equal thermosphere 60 and the circuit board 21 to step.
The second equal thermosphere 60 is the second graphene film, and with a thickness of 0.1 millimeter, thermal coefficient is 1700w/ (m
k)。
It is understood that according to the actual situation, the second equal thermosphere 60 is not limited to the second graphene film, example
Such as, the described second equal thermosphere 60 is graphite material, carbon fibre materials etc., as long as the thermal coefficient of the second equal thermosphere 60 is big
In the thermal coefficient of the circuit board 21.
It is provided with the second gap 61 between the second equal thermosphere 60 and the circuit board 21, by between setting described second
On the one hand gap 61 can be reduced generates the degree that heat is concentrated in the rear shell 12, on the other hand, improve the circuit board 21 with
Air contact area, the heat of the circuit board 21 can be conducted to the air contacted with the circuit board 21, with heat
Air can leave the cavity by the speaker hole 120 or the heat release hole 121.
The screen 70 includes touch screen 72 and display screen 71.Wherein, the display screen 71 be located at the touch screen 72 with
Between the first equal thermosphere 50.
The display screen 71 is Thin Film Transistor-LCD (tft-lcd, thin film transistor-
Liquid crystal display), specification are as follows: 12.9 inches of size, resolution ratio 2730*2048, mainly by liquid crystal display panel
It is formed with metal framework.The display screen 71 is contacted with the one side that the described first equal thermosphere 50 deviates from the heat-conductive bracket 30, institute
Display screen 71 is stated for conducting heat between the described first equal thermosphere 50 and the touch screen 72.
The touch screen 72 is mainly glass material, with a thickness of 1.8 millimeters.The touch screen 72 and the display screen 71
Between be provided with the first gap 73.On the one hand, the first gap 73 has buffer function, so that the heat of the display screen 71 is not easy
The phenomenon that heat is concentrated is being generated on the touch screen 72.On the other hand, 72 deformation of touch screen and display screen 71 is avoided to bond
Together, cause to show watermark on display screen 71, influence 71 display effect of display screen.
Compared with prior art, described in a kind of vehicle diagnosis tablet computer 100 provided by the embodiment of the utility model
Vehicle diagnosis tablet computer 100 includes: shell 10, including front housing 11 and rear shell 12, between the front housing 11 and the rear shell 12
It is provided with cavity, the front housing 11 is provided with installing port 110, and the installing port 110 is connected to the cavity；Screen 70, is set to
In the cavity, and the screen 70 and the installing port 110 are opposite；Mainboard 20 is set in the cavity, the mainboard
20 include circuit board 21 and the power module 22 for being equipped on the circuit board 21；Heat-conductive bracket 30 is set to the mainboard 20
Between the screen 70, the heat-conductive bracket 30 is for conducting heat between the power module 22 and the screen 70；
First equal thermosphere 50, is set between the heat-conductive bracket 30 and the screen 70, and the first equal thermosphere 50 is used for described
Heat is conducted between heat-conductive bracket 30 and the screen 70；The thermal coefficient of the first equal thermosphere 50 is greater than the heat-conductive bracket
30 thermal coefficient.By above-mentioned setting, make 100 small volume of vehicle diagnosis tablet computer, and by the power mould
For the heat transfer of block 22 to the screen 70, the air contacted with the screen 70 can take away the heat of the screen 70, can be real
Now to the heat dissipation of the power module 22.
Finally, it should be noted that above embodiments are only to illustrate the technical solution of the utility model, rather than its limitations；
Under the thinking of the utility model, it can also be combined between the technical characteristic in above embodiments or different embodiments,
Step can be realized with random order, and there are many other variations of the different aspect of the utility model as described above, be
Simplicity, they do not provide in details；Although the utility model is described in detail with reference to the foregoing embodiments, this
The those of ordinary skill in field it is understood that it is still possible to modify the technical solutions described in the foregoing embodiments,
Or equivalent replacement of some of the technical features；And these are modified or replaceed, and do not make the sheet of corresponding technical solution
Matter departs from the scope of the technical solutions of the embodiments of the present invention.
Claims (13)
1. a kind of vehicle diagnosis tablet computer (100) characterized by comprising
Shell (10), including front housing (11) and rear shell (12), are provided with cavity between the front housing (11) and the rear shell (12),
The front housing (11) is provided with installing port (110), and the installing port (110) is connected to the cavity；
Screen (70), is set in the cavity, and the screen (70) is directed at the installing port (110)；
Mainboard (20), is set in the cavity, and the mainboard (20) includes circuit board (21) and is equipped on the circuit board
(21) power module (22)；
Heat-conductive bracket (30) is set between the mainboard (20) and the screen (70), and the heat-conductive bracket (30) is used for
Heat is conducted between the power module (22) and the screen (70)；
First equal thermosphere (50), is set between the heat-conductive bracket (30) and the screen (70), the first equal thermosphere
(50) for conducting heat between the heat-conductive bracket (30) and the screen (70)；
The thermal coefficient of the first equal thermosphere (50) is greater than the thermal coefficient of the heat-conductive bracket (30).
2. vehicle diagnosis tablet computer (100) according to claim 1, which is characterized in that the first equal thermosphere (50)
Area and the area of the heat-conductive bracket (30) be all larger than the areas of the power module (22).
3. vehicle diagnosis tablet computer (100) according to claim 1, which is characterized in that the first equal thermosphere (50)
For the first graphene film.
4. vehicle diagnosis tablet computer (100) according to claim 1, which is characterized in that heat-conductive bracket (30) court
The surface of the power module (22) is provided with lug boss (31)；
The lug boss (31) and the power module (22) face, the heat-conductive bracket (30) are passed by the lug boss (31)
Lead the heat of the power module (22) generation.
5. vehicle diagnosis tablet computer (100) according to claim 4, which is characterized in that heat-conductive bracket (30) back
Surface from the power module (22) is provided with recessed portion (32)；
The lug boss (31) is between the recessed portion (32) and the power module (22).
6. vehicle diagnosis tablet computer (100) according to claim 1, which is characterized in that the power module (22) with
Heat-conducting layer (40) are provided between the heat-conductive bracket (30)；
Power module (22) described in one face contact of the heat-conducting layer (40), the heat-conducting layer (40) deviate from the power module
(22) heat-conductive bracket (30) described in a face contact.
7. vehicle diagnosis tablet computer (100) according to claim 6, which is characterized in that the heat-conducting layer (40) is by silicon
Glue material matter is made.
8. vehicle diagnosis tablet computer (100) according to any one of claim 1 to 7, which is characterized in that the screen
It (70) include touch screen (72) and display screen (71)；
Between the described first equal thermosphere (50) and the touch screen (72), the touch screen (72) sets the display screen (71)
It is placed at the installing port (110)；
The first equal thermosphere (50) is attached at the display screen (71) away from the heat-conductive bracket (30) on one side；
The first gap (73) are provided between the display screen (71) and the touch screen (72).
9. vehicle diagnosis tablet computer (100) according to any one of claim 1 to 7, which is characterized in that the rear shell
(12) it is provided with the second equal thermosphere (60) on one side towards the circuit board (21)；
The second equal thermosphere (60) is for conducting heat between the circuit board (21) and the rear shell (12)；
The thermal coefficient of the second equal thermosphere (60) is greater than the thermal coefficient of the circuit board (21).
10. vehicle diagnosis tablet computer (100) according to claim 9, which is characterized in that the second equal thermosphere (60)
Area be greater than the power module (22) area.
11. vehicle diagnosis tablet computer (100) according to claim 9, which is characterized in that the second equal thermosphere (60)
For the second graphene film.
12. vehicle diagnosis tablet computer (100) according to claim 9, which is characterized in that the second equal thermosphere (60)
The second gap (61) are provided between the circuit board (21).
13. vehicle diagnosis tablet computer (100) according to any one of claim 1 to 7, which is characterized in that after described
Shell (12) is provided with heat release hole (121)；
The heat release hole (121) is connected with the cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821660900.9U CN208969594U (en) | 2018-10-11 | 2018-10-11 | A kind of vehicle diagnosis tablet computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821660900.9U CN208969594U (en) | 2018-10-11 | 2018-10-11 | A kind of vehicle diagnosis tablet computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208969594U true CN208969594U (en) | 2019-06-11 |
Family
ID=66758502
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108958440A (en) * | 2018-10-11 | 2018-12-07 | 深圳市道通科技股份有限公司 | A kind of vehicle diagnosis tablet computer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108958440A (en) * | 2018-10-11 | 2018-12-07 | 深圳市道通科技股份有限公司 | A kind of vehicle diagnosis tablet computer |
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