CN208672198U - The fixation device and sensor of foil gauge in a kind of multi-dimension force sensor - Google Patents
The fixation device and sensor of foil gauge in a kind of multi-dimension force sensor Download PDFInfo
- Publication number
- CN208672198U CN208672198U CN201821578613.3U CN201821578613U CN208672198U CN 208672198 U CN208672198 U CN 208672198U CN 201821578613 U CN201821578613 U CN 201821578613U CN 208672198 U CN208672198 U CN 208672198U
- Authority
- CN
- China
- Prior art keywords
- foil gauge
- elastomer
- circuit board
- pad
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Abstract
The utility model provides the fixation device and sensor of foil gauge in a kind of multi-dimension force sensor, and the fixed device includes: circuit board and elastomer；The silicon wafer of the foil gauge is pasted onto the strain beam surrounding of elastomer；The circuit board is fixed on elastomer, and multiple linking arms extended are provided on the circuit board；At least a pair of of pad, and setting corresponding with the strain beam of the elastomer are provided on the linking arm；The spun gold of the foil gauge is welded on the pad of circuit board linking arm.It is big that the utility model solves the problems, such as that the previous silicon wafer using the semiconductor gauge without substrate additionally draws copper wire progress welding cost height, patch difficulty, it solves the problems, such as to cause silicon wafer that can not be placed in parallel in dependent variable since lead is too long simultaneously, proposes a kind of low cost, strong operability, strain fixing means easy to assembly.
Description
Technical field
The utility model relates to strain in e-machine design field more particularly to a kind of multi-dimension force sensor
The fixation device and sensor of piece.
Background technique
Currently, traditional one-dimensional force snesor mostly uses greatly the foil gauge of substrate, but exist as multi-dimension force sensor
Need to be placed with foil gauge much without substrate during production on different strain beams.
Having the semiconductor gauge of substrate under normal circumstances, producer can be semiconductor gauge both ends during production
Spun gold be pre-welded to the metal pins that use for extraneous welding (the usually enameled wire of stretch-proof bending, length appointed
Meaning customization).
As shown in Figure 1, traditional way of sensor lead is that the silicon wafer 4 of semiconductor gauge is pasted strain beam
On, the welding of spun gold 3 of foil gauge and copper wire 5 are welded together, and then copper wire 5 is by certain bending operation (copper wire switching
11) place extends to the circuit board of signal acquisition, be finally welded on the pad of circuit board, completes lead operation.But for nothing
For the foil gauge of substrate, due to producing process problem, the spun gold 3 at the both ends of foil gauge can not accomplish long enough, and
And spun gold is easy to be easy to fracture, and not can be carried out and bends over long distances.
The maximum bottleneck of the current volume production of multi-dimension force sensor is how to carry out correct patch and correct gage system.
Wherein now traditional way is manufacturer when making foil gauge, and the spun gold of enameled wire and semiconductor gauge is welded
It is connected to together, then foil gauge is placed on above strain beam when welt, then apply adhesive curing.The shortcomings of doing so mainly has
Two:
1. semiconductor gauge is very small silicon wafer, cause its quality very light, if using band enameled wire (quality phase
Be not easy bending to larger, and for opposite spun gold) foil gauge carry out patch, first under practical condition, according to one
During fixed coiling rule carries out bending to enameled wire, non-allow is easy to cause enameled wire to break semiconductor gauge both ends
Spun gold.
2. the semiconductor gauge with enameled wire is pasted above strain beam, because the copper wire for lead is very
Long, will lead to wafer sections can not be labelled to correct position (the quality very little of silicon wafer, size are also very small), be easy to appear lengthening
The case where silicon wafer of lead terminal tilts, if this occurs, will lead to uniaxial precision, the axis of the sensor produced
Between crosstalk and temperature drift characteristic volume production coherence request is not achieved.And either lead dispensing is fixed either using complicated at this time
Fixture fix, great workload and complexity can be all brought to volume production, and it is difficult to ensure that different operators posts
The position precision of foil gauge guarantee consistent, the technical level requirement of operator can not be reduced.
Therefore, the existing technology needs further improvement.
Utility model content
In view of the above shortcomings in the prior art, the purpose of this utility model is to provide a kind of multi-dimension force sensors
The fixation device and sensor of middle foil gauge, overcome in foil gauge in the prior art that spun gold is shorter, and needing could be real by copper wire
Cash silk is connect with pad, and since copper wire is too long, and silicon wafer can not be attached to the defect of correct position.
Disclosed by the utility model first is embodied as a kind of fixation device of foil gauge in multi-dimension force sensor, the strain
Piece includes: silicon wafer and the spun gold that the silicon wafer both ends are arranged in, wherein the fixed device includes: circuit board and elastomer；
The silicon wafer of the foil gauge is pasted onto the strain beam surrounding of elastomer；
The circuit board is fixed on elastomer, and multiple linking arms extended are provided on the circuit board；It is described
At least a pair of of pad, and setting corresponding with the strain beam of the elastomer are provided on linking arm；
The spun gold of the foil gauge is welded on the pad of circuit board linking arm.
Optionally, the contact pin for spun gold to be electrically connected with pad is additionally provided on the circuit board；
The contact pin passes through pad and the place face of its connector and the place face of the pad are opposite.
Optionally, the linking arm is correspondingly arranged two-by-two, and the position of notch and the elastomer between each pair of linking arm
Strain beam present position is corresponding.
Optionally, the shape of the linking arm is cuboid, and the pad is evenly distributed on the upper table of the linking arm
Face.
Optionally, the number that the linking arm is correspondingly arranged two-by-two is identical as the number of elastomer strain beam.
Disclosed by the utility model second is embodied as a kind of multi-dimension force sensor, wherein includes: the fixation of the foil gauge
Device.
Beneficial effect, the utility model provide the fixation device and sensor of foil gauge in a kind of multi-dimension force sensor,
The foil gauge includes: silicon wafer and the spun gold that the silicon wafer both ends are arranged in, and the fixed device includes: circuit board and elasticity
Body；The silicon wafer of the foil gauge is pasted onto the strain beam surrounding of elastomer；The circuit board is fixed on elastomer, and the electricity
Multiple linking arms extended are provided on the plate of road；Be provided at least a pair of of pad on the linking arm, and with the elastomer
The corresponding setting of strain beam；The spun gold of the foil gauge is welded on the pad of circuit board linking arm.The utility model solves
The previous silicon wafer using the semiconductor gauge without substrate additionally draws copper wire and carries out that welding cost is high, patch difficulty is big asks
Topic, while solving the problems, such as that silicon wafer causes silicon wafer that can not be placed in parallel in dependent variable since the lead of rear end is too long, it mentions
A kind of low cost, strong operability, solution easy to assembly, improving mass consistency are gone out.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the fixation device of foil gauge in the prior art；
Fig. 2 is the structural representation of the fixation device of foil gauge in the multi-dimension force sensor provided by the utility model
Figure；
Fig. 3 is the exploded view of strain beam and circuit board in the fixed device provided by the utility model；
Fig. 4 is the combination diagram of strain beam and circuit board in the fixed device provided by the utility model.
Specific embodiment
To keep the purpose of this utility model, technical solution and advantage clearer, clear, develop simultaneously implementation referring to the drawings
The utility model is further described in example.It should be appreciated that specific embodiment described herein is used only for explaining this reality
With novel, it is not used to limit the utility model.
Embodiment 1
Disclosed by the utility model first is embodied as a kind of fixation device of foil gauge in multi-dimension force sensor, such as Fig. 2 institute
Show, the foil gauge includes: silicon wafer 4 and the spun gold 3 that the silicon wafer both ends are arranged in, wherein the fixed device includes: circuit
Plate 7 and elastomer 1；
The silicon wafer 4 of the foil gauge is pasted onto 9 surrounding of strain beam of elastomer 1；
The circuit board 7 is fixed on elastomer, and multiple linking arms 12 extended are provided on the circuit board 7；
At least a pair of of pad 2, and setting corresponding with the strain beam 9 of the elastomer 1 are provided on the linking arm 12；
The spun gold 3 of the foil gauge is welded on the pad 2 of the linking arm 12 of circuit board 7.
Traditional circuit board is rectangle or circle, in the utility model, in order to reduce to the greatest extent between spun gold and pad
Distance, spun gold is directly electrically connected with pad, circuit board as described in Figure 2 is devised, that is to say and set its pad
It sets on the linking arm of circuit board, and the linking arm is corresponding with the strain beam size shape of elastomer, connects between realization
The minimal path of line.
Further, in fixed device, the silicon wafer of foil gauge is pasted to the surrounding of strain beam, the strain beam first
For cylinder body shape, silicon wafer is sticked with glue in adjacent four sides.Then circuit board is fixed to the top of elastomer, specifically
, as shown in connection with fig. 3, the center of circuit board and elastomer is provided with fixing threaded hole, may be implemented using screw will be electric
Road plate is fixedly connected with elastomer.After being fixedly connected between circuit board and elastomer, it is welded to by the spun gold at silicon wafer both ends
On pad.
Preferably, the spun gold remote from pad pitch is connected with pad in order to realize, it is additionally provided on the circuit board
Contact pin 6 for spun gold to be electrically connected with pad；
The contact pin 6 passes through pad 2 and the place face of its connector is opposite with the place face of the pad 2.
If the spun gold 3 of foil gauge farther out, cannot be connected directly on the pad 2 of circuit board apart from pad, then can connect
It is connected on contact pin 6, such as shown in Fig. 4 relative to from the preferable spun gold of pad pitch, the spun gold 3 in the face opposite with face where it
Farther out apart from pad, spun gold and pad are directly connected to if cannot achieve, spun gold 3 can be welded on contact pin 6, realize gold
Silk access pad.It that is to say in the present invention, the spun gold close apart from pad can be welded direct on pad, apart from pad
Remote spun gold can be realized and being electrically connected between pad by being welded on contact pin 6.
Specifically, the linking arm is correspondingly arranged two-by-two, Mei Duilian in order to shorten distance between pad and spun gold as far as possible
It is corresponding with elastomer strain beam present position to connect the position of notch between arm, and the shape of the linking arm is rectangular
Body, and the pad is evenly distributed on the upper surface of the linking arm.Two column pad, and each weldering side by side on each linking arm
The contact pin of break-through is provided on disk.
Shape size by above-mentioned circuit board linking arm is similar to strain beam, and position also corresponds to each other, therefore to the greatest extent
Possible to reduce pad and the direct distance of spun gold, realizing can also be connected spun gold with pad without using copper wire.Gram
It has taken when spun gold to be welded on pad, has used copper wire to be not allowed as the contraposition of position of silicon wafer caused by lead, spun gold frangibility,
And the defects of at high cost.
Preferably, the number of the linking arm pair is identical as the number of elastomer strain beam.Due to the number of linking arm pair
Be arranged it is identical as the number of strain beam, specifically, the number be 3.
In conjunction with Fig. 3 and Fig. 4, it is provided centrally with fixing threaded hole in circuit board and elastomer, inserts screws into the circuit
In plate and the fixing threaded hole at elastomer center, realizes and circuit board is fixed on elastomer.
Specifically, the surrounding of the strain beam 9 first in elastomer 1 is pasted without substrate during pasting foil gauge
Semiconductor gauge；
The circuit board of tandem signal is placed on designated position again after the completion of gluing steps circuit board is screwed by screw and consolidated
Determine that circuit board is fixed on elastomer in screw hole 10.
The spun gold 3 at foil gauge both ends is guided to above the board pads 2 of circuit board 7 by tweezers, due to circuit board
The spun gold 3 of the foil gauge of opposite one side is too far with a distance from circuit board 7, and corresponding spun gold 3 can be guided to across board pads 2
Contact pin 6 above, spun gold 3 and board pads 2 are welded together finally by scolding tin, i.e., completion lead operation,
After the completion of above-mentioned steps, the analog signal of all above foil gauge of strain beam 9 can pass through the company on circuit board 7
Joint chair 8 and outer signals acquisition device are attached, and are completed to convert chip by digital-to-analogue and measure foil gauge voltage output value
Measuring task.
Embodiment 2
Disclosed by the utility model second is embodied as a kind of multi-dimension force sensor, wherein includes: the fixation of the foil gauge
Device.
It is envisioned that above-mentioned fixed device can be applied to the production of multi-dimension force sensor, the multidimensional produced
Not only spun gold is not easily broken force snesor, and the position of silicon wafer patch is accurate, therefore the multi-dimension force sensor performance is good, precision
It is high.
Since the material of the spun gold of conventional semiconductors foil gauge is the very high gold of purity, this programme can be in not bending spun gold
Spun gold is welded direct on analogue signal acquisition circuit plate in the case where (starting lead again after the completion of foil gauge solidification), greatly
Saved time cost and complexity.The utility model can make the silicon wafer of foil gauge during cured hardly by outer
The influence of boundary's power (weight of both ends spun gold can be ignored), it is cured during silicon wafer be less prone to overturning, situations such as distortion, energy
Enough guarantee the position precision that silicon wafer is pasted.
The utility model provides the fixation device and sensor of foil gauge in a kind of multi-dimension force sensor, the foil gauge
It include: silicon wafer and the spun gold that the silicon wafer both ends are set, wherein the fixed device includes: circuit board and elastomer；It is described
The silicon wafer of foil gauge is pasted onto the strain beam surrounding of elastomer；The circuit board is fixed on elastomer, and on the circuit board
It is provided with multiple linking arms extended；At least a pair of of pad, and the strain with the elastomer are provided on the linking arm
The corresponding setting of beam；The spun gold of the foil gauge is welded on the pad of circuit board linking arm.The utility model solves in the past
Copper wire is additionally drawn using the silicon wafer of the semiconductor gauge of no substrate and carries out the problem that welding cost is high, patch difficulty is big, simultaneously
It solves the problems, such as that silicon wafer causes silicon wafer that can not be placed in parallel in dependent variable since the lead of rear end is too long, proposes one kind
Low cost, strong operability, solution easy to assembly, improving mass consistency.
Above-mentioned specific embodiment is only the specific case of the utility model, and the scope of patent protection of the utility model includes
But it is not limited to above-mentioned specific embodiment, it is claims of any the method for meeting the utility model and any affiliated
The appropriate change or replacement that the those of ordinary skill of technical field does it should all fall into the patent protection model of the utility model
It encloses.
Claims (6)
1. the fixation device of foil gauge in a kind of multi-dimension force sensor, the foil gauge includes: silicon wafer and is arranged in the silicon wafer
The spun gold at both ends, which is characterized in that the fixed device includes: circuit board and elastomer；
The silicon wafer of the foil gauge is pasted onto the strain beam surrounding of elastomer；
The circuit board is fixed on elastomer, and multiple linking arms extended are provided on the circuit board；The connection
At least a pair of of pad, and setting corresponding with the strain beam of the elastomer are provided on arm；
The spun gold of the foil gauge is welded on the pad of circuit board linking arm.
2. the fixation device of foil gauge in multi-dimension force sensor according to claim 1, which is characterized in that the circuit board
On be additionally provided with contact pin for spun gold to be electrically connected with pad；
The contact pin passes through pad and the place face of its connector and the place face of the pad are opposite.
3. the fixation device of foil gauge in multi-dimension force sensor according to claim 1, which is characterized in that the linking arm
It is correspondingly arranged two-by-two, and the position of notch is corresponding with elastomer strain beam present position between each pair of linking arm.
4. the fixation device of foil gauge in multi-dimension force sensor according to claim 1, which is characterized in that the linking arm
Shape be cuboid, and the pad is evenly distributed on the upper surface of the linking arm.
5. the fixation device of foil gauge in multi-dimension force sensor according to claim 3, which is characterized in that the linking arm
The number being correspondingly arranged two-by-two is identical as the number of elastomer strain beam.
6. a kind of multi-dimension force sensor characterized by comprising the fixed dress of foil gauge as described in claim any one of 1-5
It sets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821578613.3U CN208672198U (en) | 2018-09-27 | 2018-09-27 | The fixation device and sensor of foil gauge in a kind of multi-dimension force sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821578613.3U CN208672198U (en) | 2018-09-27 | 2018-09-27 | The fixation device and sensor of foil gauge in a kind of multi-dimension force sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208672198U true CN208672198U (en) | 2019-03-29 |
Family
ID=65842415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821578613.3U Withdrawn - After Issue CN208672198U (en) | 2018-09-27 | 2018-09-27 | The fixation device and sensor of foil gauge in a kind of multi-dimension force sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208672198U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109084916A (en) * | 2018-09-27 | 2018-12-25 | 海伯森技术（深圳）有限公司 | Fixation device, method and the sensor of foil gauge in a kind of multi-dimension force sensor |
-
2018
- 2018-09-27 CN CN201821578613.3U patent/CN208672198U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109084916A (en) * | 2018-09-27 | 2018-12-25 | 海伯森技术（深圳）有限公司 | Fixation device, method and the sensor of foil gauge in a kind of multi-dimension force sensor |
| CN109084916B (en) * | 2018-09-27 | 2023-08-22 | 海伯森技术（深圳）有限公司 | Device and method for fixing strain gauge in multidimensional force sensor and sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109084916A (en) | Fixation device, method and the sensor of foil gauge in a kind of multi-dimension force sensor | |
| WO2020052651A1 (en) | Gluing device for battery production | |
| USRE43607E1 (en) | Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects | |
| CN208672198U (en) | The fixation device and sensor of foil gauge in a kind of multi-dimension force sensor | |
| CN212031537U (en) | Chip test pin switching mechanism and chip test device | |
| CN205450046U (en) | Many probe test subassembly | |
| CN114200279B (en) | Film probe card and probe head thereof | |
| CN114167094A (en) | Film probe card and probe head thereof | |
| CN114200278A (en) | Film probe card and probe head thereof | |
| CN107481944B (en) | A kind of semiconductor devices hybrid package method | |
| CN102288791B (en) | Wire frame and gold finger structure for Kelvin testing and sorting | |
| CN102507338B (en) | Battery anti-contact pressure test equipment | |
| CN101646311B (en) | Method and device for realizing connection of optical transceiver and main printed circuit board | |
| CN104914273A (en) | Sensor for detecting three-dimensional directional acceleration speed | |
| CN208223689U (en) | Multifunctional demountable pressure sensor apparatus | |
| CN104617002A (en) | Semiconductor packaging method and structure | |
| CN104880573A (en) | MEMS sensing chip | |
| CN108020356A (en) | A kind of MEMS pressure sensor and its method for packing | |
| CN109387762A (en) | A kind of adopting surface mounted LED row survey device | |
| CN102295268B (en) | Heating imposing electric device of long glass column anodic bonding | |
| JP3570271B2 (en) | Semiconductor sensor and manufacturing method thereof | |
| TW516199B (en) | Chip scale package structure and the fabrication method thereof | |
| CN112269119B (en) | High-density measuring point switching test fixture and switching method | |
| CN107564889A (en) | A kind of chip-packaging structure and method for packing | |
| CN213521900U (en) | Radio frequency calibration and antenna packaging compatible structure and radio frequency device comprising same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20190329 Effective date of abandoning: 20230822 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20190329 Effective date of abandoning: 20230822 |