CN208142221U - A kind of COB light source cellular construction - Google Patents
A kind of COB light source cellular construction Download PDFInfo
- Publication number
- CN208142221U CN208142221U CN201820711049.1U CN201820711049U CN208142221U CN 208142221 U CN208142221 U CN 208142221U CN 201820711049 U CN201820711049 U CN 201820711049U CN 208142221 U CN208142221 U CN 208142221U
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- China
- Prior art keywords
- metal base
- aluminum substrate
- light source
- cob light
- heat
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Abstract
The utility model discloses a kind of COB light source cellular constructions, including aluminum substrate, metal base and chip, aluminum substrate is equipped with insulated circuit layer, chip is set in the cavity of metal base, metal base is set on aluminum substrate and the bottom surface of metal base is contacted with the top surface of aluminum substrate, the bottom of metal base is equipped at least one notch, and a part of insulated circuit layer is entered in the cavity of metal base by notch and is electrically connected with chip;The top of metal base is equipped with stepped groove, thermally conductive fluorescent component is equipped in stepped groove, thermally conductive fluorescent component is located at the top of chip, thermally conductive fluorescent component includes the first sapphire wafer stacked gradually, phosphor laminate and the second sapphire wafer, and the periphery of phosphor laminate is bonded with the internal perisporium of stepped groove.Phosphor laminate is contacted with thermally conductive metal base, the bottom surface of metal base is directly contacted with aluminum substrate, is formed a complete heat-conducting system, is improved the heat dissipation performance of COB light source unit.
Description
Technical field
The utility model relates to LED encapsulation field more particularly to a kind of COB light source cellular constructions.
Background technique
Existing COB light source unit includes aluminum substrate, and aluminum substrate is equipped with insulated circuit layer, and insulated circuit layer is equipped with tool
There is the pedestal of cavity, chip is equipped in the cavity of pedestal, the chip is doped with the silica gel material cladding of fluorescent powder.
During existing COB light source unit uses (or aging), the fluorescent powder calorific value adulterated in silica gel material is very big,
And the thermal conductivity of silica gel material is very low, therefore, heat can be gathered in silica gel material i.e. fluorescent powder, can not be conducted into aluminium in time
Substrate also can not just be dispersed heat by external heat sink.In addition, the heat resistance of silica gel material is limited, high power thus
COB light source unit often will appear that decaying is big, silica gel cracking is so that phenomena such as dead lamp after aging.
Utility model content
Technical problem to be solved in the utility model is:A kind of good COB light source cellular construction of heat dissipation performance is provided.
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is:A kind of COB light source cellular construction,
Including aluminum substrate, metal base and chip, aluminum substrate is equipped with insulated circuit layer, and chip is set to the cavity of the metal base
Interior, metal base is set on aluminum substrate and the bottom surface of metal base is contacted with the top surface of aluminum substrate, and the bottom of metal base is equipped with
At least one notch, a part of the insulated circuit layer entered in the cavity of the metal base by the notch and with institute
State chip electrical connection;The top of the metal base is equipped with stepped groove, and thermally conductive fluorescent component is equipped in the stepped groove, described to lead
Hot fluorescent component is located at the top of the chip, and the thermally conductive fluorescent component includes the first sapphire wafer stacked gradually, glimmering
Light arogel film and the second sapphire wafer, the periphery of the phosphor laminate are bonded with the internal perisporium of the stepped groove.
Further, the depth of the stepped groove is greater than or equal to the thickness of the thermally conductive fluorescent component.
Further, the bottom surface of the metal base is equipped with the extending column extended towards aluminum substrate direction, the aluminum substrate
It is equipped with accommodating hole, the outer diameter of the extending column is identical as the diameter of the accommodating hole.
It further, further include heat-conducting cream, the heat-conducting cream is located in the accommodating hole, the heat-conducting cream and extending column
End face contact.
Further, the heat-conducting cream is heat-conducting silicone grease.
The beneficial effects of the utility model are:The doping fluorescent powder in silica gel material is different from the prior art, this is practical
Novel phosphor laminate is arranged in sapphire wafer and directly with thermally conductive metal base contacts, and metal base is big
Portion bottom surface is directly contacted with aluminum substrate, so as to form a complete heat-conducting system, substantially improves COB light source unit
Heat dissipation performance.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the COB light source cellular construction of the utility model embodiment one;
Fig. 2 is heat conduction path schematic diagram in the COB light source cellular construction of the utility model embodiment one.
Label declaration:
1, aluminum substrate;
2, metal base;
3, insulated circuit layer;
4, chip;
5, stepped groove;
6, the first sapphire wafer;
7, phosphor laminate;
8, the second sapphire wafer;
9, extending column;
10, heat-conducting cream.
Specific embodiment
For technology contents, the objects and the effects that the utility model is described in detail, below in conjunction with embodiment and match
Attached drawing is closed to be explained.
The design of the utility model most critical is:Fluorescent powder is set in sapphire wafer and directly connects with metal base
Touching, the bottom surface of metal base are directly contacted with aluminum substrate, to form a complete heat-conducting system.
Referring to Fig.1 and 2, a kind of COB light source cellular construction, including aluminum substrate 1, metal base 2 and chip 4, aluminium base
Plate 1 be equipped with insulated circuit layer 3, chip 4 be set to the metal base 2 cavity in, metal base 2 be set to aluminum substrate 1 on and
The bottom surface of metal base 2 is contacted with the top surface of aluminum substrate 1, and the bottom of metal base 2 is equipped at least one notch, the insulated wire
A part of road floor 3 is entered in the cavity of the metal base 2 by the notch and is electrically connected with the chip 4;The gold
The top for belonging to pedestal 2 is equipped with stepped groove 5, is equipped with thermally conductive fluorescent component in the stepped groove 5, the thermally conductive fluorescent component is located at institute
The top of chip 4 is stated, the thermally conductive fluorescent component includes the first sapphire wafer 6 stacked gradually, phosphor laminate 7 and second
Sapphire wafer 8, the periphery of the phosphor laminate 7 are bonded with the internal perisporium of the stepped groove 5.
As can be seen from the above description, the beneficial effects of the utility model are:It is different from the prior art and is mixed in silica gel material
Miscellaneous fluorescent powder, phosphor laminate is arranged in sapphire wafer and directly with thermally conductive metal base the utility model contacts,
And most of bottom surface of metal base is directly contacted with aluminum substrate, so as to form a complete heat-conducting system, is changed significantly
It has been apt to the heat dissipation performance of COB light source unit.
Further, the depth of the stepped groove 5 is greater than or equal to the thickness of the thermally conductive fluorescent component.
Further, the bottom surface of the metal base 2 is equipped with the extending column 9 extended towards 1 direction of aluminum substrate, the aluminium base
Plate 1 is equipped with accommodating hole, and the outer diameter of the extending column 9 is identical as the diameter of the accommodating hole.
Seen from the above description, the inner wall face contact of the outside wall surface of extending column and accommodating hole, expands metal base and aluminium
The contact area of substrate further improves the heat dissipation performance of COB light source unit.
Further, further include heat-conducting cream 10, the heat-conducting cream 10 is located in the accommodating hole, the heat-conducting cream 10 with prolong
Stretch the end face contact of column 9.
Further, the heat-conducting cream 10 is heat-conducting silicone grease.
Seen from the above description, the gap filling heat-conducting cream between extending column and accommodating hole can be further improved COB light
The heat dissipation effect (avoiding between extending column and accommodating hole through air transmitted heat) of source unit.
Embodiment one
Referring to Fig.1 and 2, the embodiments of the present invention one are:A kind of COB light source cellular construction, including aluminum substrate
1, metal base 2 and chip 4, aluminum substrate 1 are equipped with insulated circuit layer 3, and chip 4 is set in the cavity of the metal base 2, gold
Belong to pedestal 2 on aluminum substrate 1 and the bottom surface of metal base 2 is contacted with the top surface of aluminum substrate 1, the bottom of metal base 2 is equipped with
At least one notch (not shown), a part of the insulated circuit layer 3 enter the sky of the metal base 2 by the notch
It is intracavitary and be electrically connected with the chip 4;The top of the metal base 2 is equipped with stepped groove 5, is equipped in the stepped groove 5 thermally conductive
Fluorescent component, the thermally conductive fluorescent component are located at the top of the chip 4, and the thermally conductive fluorescent component includes stacked gradually
One sapphire wafer 6, phosphor laminate 7 and the second sapphire wafer 8, the periphery of the phosphor laminate 7 and the stepped groove 5
Internal perisporium fitting.Sapphire wafer high temperature resistant, therefore COB light source unit will not crack because temperature is excessively high, and the
It being maintained a certain distance between one sapphire wafer 6 and chip 4, heat is not transferred on chip 4, therefore, the utility model
COB light source unit it is durable.
The depth of the stepped groove 5 is greater than or equal to the thickness of the thermally conductive fluorescent component, in the present embodiment, stepped groove 5
Depth be equal to the thermally conductive fluorescent component thickness.
Optionally, the bottom surface of the metal base 2 is equipped with the extending column 9 extended towards 1 direction of aluminum substrate, the aluminum substrate
1 is equipped with accommodating hole, and the outer diameter of the extending column 9 is identical as the diameter of the accommodating hole.In addition, extending column 9 can also play
The effect of positioning metal pedestal 2 and aluminum substrate 1.
It further include heat-conducting cream 10, the heat-conducting cream 10 is located in the accommodating hole, the end of the heat-conducting cream 10 and extending column 9
Face contact.In the present embodiment, the heat-conducting cream 10 is heat-conducting silicone grease.
In conclusion COB light source cellular construction provided by the utility model, is different from the prior art and mixes in silica gel material
Miscellaneous fluorescent powder, phosphor laminate is arranged in sapphire wafer and directly with thermally conductive metal base the utility model contacts,
And most of bottom surface of metal base is directly contacted with aluminum substrate, so as to form a complete heat-conducting system, is changed significantly
It has been apt to the heat dissipation performance of COB light source unit;Extending column is set and increases the contact area of metal base and aluminum substrate, is improved
The heat dissipation performance of COB light source unit;Heat-conducting cream is set, avoids between extending column and accommodating hole that there are air.
The above description is only the embodiments of the present invention, and therefore it does not limit the scope of the patent of the utility model, all
Equivalents made based on the specification and figures of the utility model are applied directly or indirectly in relevant technology neck
Domain is also included in the patent protection scope of the utility model.
Claims (5)
1. a kind of COB light source cellular construction, including aluminum substrate, metal base and chip, aluminum substrate is equipped with insulated circuit layer, brilliant
Piece is set in the cavity of the metal base, it is characterised in that:Metal base be set to aluminum substrate on and the bottom surface of metal base with
The top surface of aluminum substrate contacts, and the bottom of metal base is equipped at least one notch, and a part of the insulated circuit layer passes through institute
The cavity for stating notch into the metal base is interior and is electrically connected with the chip;The top of the metal base is equipped with ladder
Slot, the stepped groove is interior to be equipped with thermally conductive fluorescent component, and the thermally conductive fluorescent component is located at the top of the chip, described thermally conductive glimmering
Optical assembly includes the first sapphire wafer stacked gradually, phosphor laminate and the second sapphire wafer, the phosphor laminate
Periphery be bonded with the internal perisporium of the stepped groove.
2. COB light source cellular construction according to claim 1, it is characterised in that:The depth of the stepped groove is greater than or waits
In the thickness of the thermally conductive fluorescent component.
3. COB light source cellular construction according to claim 1, it is characterised in that:The bottom surface of the metal base is equipped with court
The extending column extended to aluminum substrate direction, the aluminum substrate are equipped with accommodating hole, the outer diameter of the extending column and the accommodating hole
Diameter it is identical.
4. COB light source cellular construction according to claim 3, it is characterised in that:It further include heat-conducting cream, the heat-conducting cream position
In in the accommodating hole, the heat-conducting cream is contacted with the end face of extending column.
5. COB light source cellular construction according to claim 4, it is characterised in that:The heat-conducting cream is heat-conducting silicone grease.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820711049.1U CN208142221U (en) | 2018-05-14 | 2018-05-14 | A kind of COB light source cellular construction |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820711049.1U CN208142221U (en) | 2018-05-14 | 2018-05-14 | A kind of COB light source cellular construction |
Publications (1)
Publication Number | Publication Date |
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CN208142221U true CN208142221U (en) | 2018-11-23 |
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CN201820711049.1U Expired - Fee Related CN208142221U (en) | 2018-05-14 | 2018-05-14 | A kind of COB light source cellular construction |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114464608A (en) * | 2022-02-16 | 2022-05-10 | 深圳市旋彩电子有限公司 | COB (chip on board) double-color light source of photographic lamp and packaging method thereof |
-
2018
- 2018-05-14 CN CN201820711049.1U patent/CN208142221U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114464608A (en) * | 2022-02-16 | 2022-05-10 | 深圳市旋彩电子有限公司 | COB (chip on board) double-color light source of photographic lamp and packaging method thereof |
CN114464608B (en) * | 2022-02-16 | 2022-11-15 | 深圳市旋彩电子有限公司 | COB (chip on board) double-color light source of photographic lamp and packaging method thereof |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181123 Termination date: 20190514 |