CN207993846U - A kind of encapsulating structure of stent-type electronic tag - Google Patents
A kind of encapsulating structure of stent-type electronic tag Download PDFInfo
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- CN207993846U CN207993846U CN201820048481.7U CN201820048481U CN207993846U CN 207993846 U CN207993846 U CN 207993846U CN 201820048481 U CN201820048481 U CN 201820048481U CN 207993846 U CN207993846 U CN 207993846U
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- electronic tag
- integrated circuit
- encapsulating structure
- stent
- core material
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Abstract
The utility model belongs to radio frequency identification tag package technical field, specifically discloses a kind of encapsulating structure of stent-type electronic tag.The encapsulating structure includes integrated circuit, antenna core material and encapsulating material, the integrated circuit includes holder, chip and packaging plastic material, the bonding wafer is in the bracket, and it is electrically connected with holder by bonding line, the integrated circuit and antenna core material carry out encapsulation for the first time and form label core material finished product, and label core material finished product and encapsulating material, which are finally carried out secondary encapsulation, is made electronic tag.The encapsulating structure so that the reliability of electronic tag significantly improves, cost is substantially reduced, and to make the extensive use of electronic tag become possible, packaging method technical process is simple, equipment investment is few, can effectively reduce the cost of manufacture of integrated circuit.
Description
Technical field
The utility model belongs to radio frequency identification tag package technical field, more particularly to a kind of encapsulation knot of stent-type electronic tag
Structure.
Background technology
Radio Frequency Identification Technology (RFID, Radio Frequency Identification) is a kind of communication technology, it is logical
It crosses radiofrequency signal automatic identification target object and obtains relevant data information, non-contact two-way is carried out using radio frequency method
Letter, reaches identifying purpose and exchanges data, and identification work is without manual intervention, and with recognition speed, fast, dynamic realtime is communicated, worn
Permeability and without barrier reading, better safety, storage data capacity it is big, service life is long the advantages that, be widely used in logistics,
The application fields such as retail, manufacture, anti-fake, asset management, identification, traffic.
The groundwork process of RFID technique is：After RFID tag enters magnetic field, the radiofrequency signal that reader is sent out relies on
The energy that induced current is obtained sends out product information stored in the chip (Passive Tag, passive label or passive mark
Label), or the signal (Active Tag, active label or active tag) of a certain frequency is actively sent by RFID tag, reading
After device reads information and decodes, send to Central Information System and carry out related data processing.
In general, no matter passive label or active label all electronic circuits with integrated circuit or silicon chip form, electricity
Sub-circuit stores and transmits identification data to reader.Wherein active label merges the energy from label itself and leads to reader
The antenna of news；And passive label, antenna are used as that the converter of electric energy will be converted into from the RF energy of reader, chip obtains
It is excited after obtaining energy, and executes the communication function with reader.
The integrated circuit (IC) used in conventional RFID tag is flip-chip, and the stud bump making work in flip-chip
Skill is complicated, production equipment is expensive, and there are when flip-chip is connected with wiring board low production efficiency, poor reliability etc. ask
Topic.So although industry generally to the promise well of RFID technique, the cost of manufacture height of electronic tag, low production efficiency, can
The commercialization process of RFID technique in practical applications is seriously constrained the problems such as poor by property.
Therefore, a kind of low manufacture cost is researched and developed, the encapsulating structure of good, good reliability the electronic tag of production efficiency is compeled in eyebrow
Eyelash.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, disclose a kind of encapsulation knot of stent-type electronic tag
Structure, the encapsulating structure so that the reliability of electronic tag significantly improves, cost is substantially reduced, to make answering extensively for electronic tag
With becoming possible.
In order to reach above-mentioned technical purpose, the utility model is realized by following technical scheme：
A kind of encapsulating structure of stent-type electronic tag described in the utility model, including integrated circuit, antenna core material and
Encapsulating material, the integrated circuit include holder, chip and packaging plastic material, and the bonding wafer in the bracket, and passes through key
Zygonema is electrically connected with holder, and the integrated circuit and antenna core material carry out encapsulation for the first time and form label core material finished product, most then
Label core material finished product and encapsulating material are subjected to secondary encapsulation, electronic tag is made.
As being further improved for above-mentioned technology, the chip is grinding wafer, wafer cutting gained chip.
As the further improvement of above-mentioned technology, the holder is a kind of printed circuit board (Printed Circuit
Board).Wherein, the printed circuit board (Printed Circuit Board), dielectric layer is BT resins
(Bismaleimide Triazine) or phenolic resin (Phonetic) or epoxy resin (Epoxy) or Polyimide tree
(Polyamide) or one kind in the resins such as polytetrafluoroethylene (PTFE) (Polytetrafluorethylene)；The printed circuit board
(Printed Circuit Board), dielectric layer surface are covered with the metal foil made needed for circuit, such as copper foil, aluminium foil.
In the present invention, the packaging plastic is the liquid glue for liquid under the room temperature that can carry out plastic packaging (Molding)
Or solid epoxy glue.
The packaging method of the encapsulating structure of stent-type electronic tag described in the utility model, comprises the concrete steps that：
(1) preparation of integrated circuit：By in bonding wafer to holder, die pads and holder pin are realized by bonding line
Electrical connection, then the processes such as plastic packaging (Molding), solidification, cutting, test integrated circuit (IC) is made；
(2) prepared by label core material finished product：Printing and patch assembly technique by integrated circuit (IC) and antenna core material at
Product are once encapsulated, and label core material finished product is formed；
(3) prepared by electronic tag：Label core material finished product and encapsulating material are subjected to secondary encapsulation, pass sequentially through compound, mould
It cuts, test technology is finally made electronic tag.
In the present invention, the preparation process of above-mentioned steps (1) integrated circuit is as follows：
First, printed circuit board (Printed Circuit Board) is passed through into blanking, drilling, the thin metal of chemical plating (such as
Copper), brush board, exposure, etching, cleaning, silk-screen, the processes such as detection are made for encapsulating the holder needed for integrated circuit；
Secondly, wafer, holder, crystal-bonding adhesive that cutting is completed are put into die bond equipment, carry out chip die bond, baking, completes
Holder after die bond is put into the bonding line that bonding apparatus bonding wafer pad is connect with metal foil (pin)；
Finally, the holder for completing bonding is packed into plastic packaging (Molding) mold and carries out plastic packaging (Molding), then passed through
Integrated circuit finished product is made in the processes such as solidification, cutting, test.
In above-mentioned steps (2), the making step of label core material finished product is as follows：
(1) first, it is pressed together on antenna circuit jigsaw with steel mesh corresponding with antenna circuit typesetting, is printed tin cream with scraper plate
It brushes on the corresponding pad of antenna circuit jigsaw, the antenna circuit jigsaw for completing print solder paste is packed into patch device, is integrated
The surface mount of circuit；
(2) then, the antenna circuit board jigsaw of integrated circuit attachment will be completed, solder reflow device is sent into, tin cream is made to melt,
The electrical connection for completing integrated circuit and antenna is to complete the first time encapsulation of electronic tag, and label core material finished product has been made.
In the present invention, in the production process of the integrated circuit finished product, condition of cure is solidification temperature range
For：100 degree to 250 degree, hardening time is 1 minute to 180 minutes.
In the present invention, the material of the antenna core material be copper, aluminium, silver, electrically conductive ink etc. meet antenna performance and
One kind in the material that practical application needs.And to be paper, plastic film etc. have insulation performance and full to the base material for carrying antenna
One kind in the material being actually needed enough.
In the present invention, the encapsulating material is the satisfactions such as paper, plastics, glass, ceramics, metal encapsulation requirement and reality
One or more of the Material texture that border needs.
Compared with prior art, the utility model has the beneficial effects that：
(1) encapsulating structure of electronic tag described in the utility model the reliability of electronic tag is significantly improved, at
Originally it is substantially reduced, to make the extensive use of electronic tag become possible.
(2) packaging method of electronic tag described in the utility model is cut obtained by grinding wafer, wafer
Integrated circuit is made in the bracket, by techniques such as bonding line, plastic packaging (Molding), solidification, cutting, tests in chip die bond
(IC), compared with the flip-chip of plantation salient point, the simple for process of making integrated circuit (IC), equipment investment are few, Neng Gouyou
The cost of manufacture of the reduction integrated circuit (IC) of effect.
(3) packaging method of electronic tag described in the utility model is adopted with integrated circuit prepared by such encapsulation technology
With techniques such as printing, surface mounts, production efficiency, reliability, the maintenanceability of product are further improved, to save energy
Source reduces production cost so that the extensive use of electronic tag becomes possible.
Description of the drawings
The utility model is described in detail in the following with reference to the drawings and specific embodiments：
Fig. 1 is stent-type Electronic Tag Structure schematic diagram described in the utility model；
Fig. 2 is integrated circuit sectional view in the utility model；
Fig. 3 is the composing structure schematic diagram of antenna circuit in the utility model；
Fig. 4 is steel net structure schematic diagram in the utility model (corresponding with antenna circuit consistent).
Specific implementation mode
As shown in Figure 1, a kind of encapsulating structure of stent-type electronic tag described in the utility model, including integrated circuit 1,
Antenna core material finished product 2 and encapsulating material 3, the integrated circuit 1 include holder 11, chip 12 and packaging plastic 13, the chip 12
It is bonded in holder 11, and is electrically connected with holder 11 by bonding line 14, the integrated circuit 1 and antenna core material 2 carry out first
Secondary encapsulation forms label core material finished product, and label core material finished product and encapsulating material 3, which are finally carried out secondary encapsulation, is made electronic tag.
In the present invention, the material of the antenna core material 2 be copper, aluminium, silver, electrically conductive ink etc. meet antenna performance and
One kind in the material that practical application needs, and to be paper, plastic film etc. have insulation performance and full to the base material for carrying antenna
One kind in the material being actually needed enough；The encapsulating material 3 is that the encapsulation of the satisfactions such as paper, plastics, glass, ceramics, metal requires
One or more of with the Material texture of actual needs；The chip 12 is grinding wafer, wafer cutting gained chip.
The holder 11 includes metal foil 111 and dielectric layer 112, wherein the metal foil 111 is 112 surface of dielectric layer
What is be covered with makes the metal foil needed for circuit, such as copper foil, aluminium foil；The dielectric layer 112 is BT resins (Bismaleimide
) or phenolic resin (Phonetic) or epoxy resin (Epoxy) or Polyimide tree (Polyamide) or polytetrafluoro Triazine
One kind in the resins such as ethylene (Polytetrafluorethylene)；
The packaging plastic 13 be can carry out plastic packaging (Molding) room temperature under be the liquid glue of liquid or solid epoxy
Glue.
The invention also discloses the packaging method of the encapsulating structure of above-mentioned stent-type electronic tag, specific steps
It is：
(1) preparation of integrated circuit：Chip 12 is adhered in holder 11, the pad of chip 12 is realized by bonding line 14
With the electrical connection of 11 pin of holder, integrated circuit 1 then is made by processes such as plastic packaging (Molding), solidification, cutting, tests；
(2) prepared by label core material finished product：By printing and patch assembly technique by integrated circuit (IC) and antenna core
Material finished product 2 is once encapsulated, and label core material finished product is formed；
(3) prepared by electronic tag：Label core material finished product and encapsulating material 3 are subjected to secondary encapsulation, pass sequentially through compound, mould
It the techniques such as cuts, test and being finally made electronic tag.
In the present invention, the preparation process of above-mentioned steps (1) integrated circuit is as follows：
First, as shown in Fig. 2, metal foil 111 (copper foil) and dielectric layer 112 (BT resin base materials) are combined 0.15mm
Thick printed circuit board (Printed Circuit Board), by blanking, drilling, the thin metal of chemical plating (such as copper), brush board,
The processes such as exposure, etching, cleaning, silk-screen, detection are made for encapsulating the holder 11 needed for integrated circuit；
Then, wafer, holder, crystal-bonding adhesive that cutting is completed are put into die bond equipment, carry out 12 die bond of chip, complete die bond
Holder 11 afterwards is put into bonding apparatus, the bonding line 14 that 12 pad of bonding wafer is connect with metal foil 111 (copper foil)；
Finally, the holder for completing bonding is packed into plastic packaging (Molding) mold and carries out plastic packaging (Molding), then passed through
The processes such as solidification, cutting, test are made integrated circuit finished product, condition of cure be solidification temperature ranging from：100 degree to 250 degree,
Hardening time is 1 minute to 180 minutes.
The making step of label core material finished product is following (as shown in Figure 3, Figure 4) in the present invention：
(1) first, it is pressed together on antenna circuit jigsaw 4 with 4 corresponding steel mesh 5 of antenna circuit jigsaw, with scraper plate by tin
Cream is printed onto in the trepanning 61 of 4 corresponding pad 6 of antenna circuit jigsaw, and the antenna circuit jigsaw 4 for completing print solder paste is packed into patch
Piece equipment, into the surface mount of line integrated circuit；
(2) then, the antenna circuit jigsaw 4 of integrated circuit attachment will be completed, solder reflow device is sent into, tin cream is made to melt,
The electrical connection for completing integrated circuit and antenna is to complete the first time encapsulation of electronic tag, and label core material finished product has been made.
The utility model is not limited to the above embodiment, and every various changes or modifications to the utility model do not take off
Spirit and scope from the utility model, if these modification and variations belong to the claims and equivalents of the utility model
Within the scope of, then the utility model is also implied that comprising these modification and variations.
Claims (6)
1. a kind of encapsulating structure of stent-type electronic tag, it is characterised in that：Including integrated circuit, antenna core material and package material
Material, the integrated circuit include holder, chip and packaging plastic material, the bonding wafer in the bracket, and by bonding line with
Holder is electrically connected, and the integrated circuit and antenna core material carry out encapsulation for the first time and form label core material finished product, finally by label core
Expect that finished product and encapsulating material carry out secondary encapsulation and electronic tag are made.
2. the encapsulating structure of stent-type electronic tag according to claim 1, it is characterised in that：The chip grinds for wafer
Mill, wafer cutting gained chip.
3. the encapsulating structure of stent-type electronic tag according to claim 1, it is characterised in that：The holder is a kind of print
Circuit board processed.
4. the encapsulating structure of stent-type electronic tag according to claim 3, it is characterised in that：The printed circuit board,
Its dielectric layer is one kind in BT resins or phenolic resin or epoxy resin or Polyimide tree or polytetrafluoroethylene (PTFE).
5. the encapsulating structure of stent-type electronic tag according to claim 3, it is characterised in that：The printed circuit board,
Its dielectric layer surface is covered with the metal foil made needed for circuit, and the metal foil can not only make circuit-line but also can make pin.
6. the encapsulating structure of stent-type electronic tag according to claim 1, it is characterised in that：The packaging plastic is can be into
It is the liquid glue of liquid or solid epoxy glue under the room temperature of row plastic packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820048481.7U CN207993846U (en) | 2018-01-09 | 2018-01-09 | A kind of encapsulating structure of stent-type electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820048481.7U CN207993846U (en) | 2018-01-09 | 2018-01-09 | A kind of encapsulating structure of stent-type electronic tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207993846U true CN207993846U (en) | 2018-10-19 |
Family
ID=63820201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820048481.7U Active CN207993846U (en) | 2018-01-09 | 2018-01-09 | A kind of encapsulating structure of stent-type electronic tag |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172552A (en) * | 2018-01-09 | 2018-06-15 | 木林森股份有限公司 | A kind of encapsulating structure and its packaging method of stent-type electronic tag |
-
2018
- 2018-01-09 CN CN201820048481.7U patent/CN207993846U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172552A (en) * | 2018-01-09 | 2018-06-15 | 木林森股份有限公司 | A kind of encapsulating structure and its packaging method of stent-type electronic tag |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210726 Address after: 528400 1st floor, building 6, No.1 MuLinSen Avenue, Xiaolan Town, Zhongshan City, Guangdong Province Patentee after: Zhongshan MuLinSen Microelectronics Co.,Ltd. Address before: 528415 No. 1, MuLinSen, Xiaolan Town, Zhongshan City, Guangdong Province Patentee before: MLS Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 528400 1st floor, building 6, No.1 MuLinSen Avenue, Xiaolan Town, Zhongshan City, Guangdong Province Patentee after: Zhongshan Zhuoman Microelectronics Co.,Ltd. Address before: 528400 1st floor, building 6, No.1 MuLinSen Avenue, Xiaolan Town, Zhongshan City, Guangdong Province Patentee before: Zhongshan MuLinSen Microelectronics Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |