Utility model content
Based on this, it is necessary to the problem of for how to make fingerprint identification technology be applied to flexible screen electronic equipment, there is provided
A kind of electronic equipment.
A kind of electronic equipment, including flexible display screen;The flexible display screen being capable of conduct ultrasound;It is also, described soft
Property display screen bottom be provided with ultrasonic fingerprint identification module;The ultrasonic fingerprint identification module includes ultrasonic sensor;
The top surface of the ultrasonic sensor is towards the flexible display screen, and the ultrasonic sensor can launch ultrasonic wave and connect
The ultrasonic wave of reflection is received, and the ultrasonic wave of reflection is converted into electric signal.When user's finger touch after on flexible display screen, by
The ultrasonic wave of ultrasonic sensor transmitting can produce reflection after passing through flexible display screen, and ultrasonic fingerprint identification module can root
Fingerprint recognition is carried out according to the ultrasonic wave of reflection, so as to which fingerprint identification technology is applied in flexible screen electronic equipment.This
Outside, it is not required that ultrasonic fingerprint identification module is arranged in the frame of electronic equipment, can so as to increase electronic equipment
The area of vision area.
In one of the embodiments, the ultrasonic fingerprint identification module fits in the Flexible Displays by adhesive
The bottom of screen.Due to that in the presence of adhesive, can cause ultrasonic fingerprint identifies will not between module and flexible display screen
There is gap, so as to avoid air from decaying to caused by ultrasonic wave, improve the effect of ultrasonic wave conduction.
In one of the embodiments, the cure shrinkage of the adhesive can avoid solidifying less than setting shrinkage factor
The damage to caused by flexible display screen due to contraction afterwards.
In one of the embodiments, the ultrasonic sensor includes TFT substrate, electrode layer and piezoelectric layer;The TFT
Substrate is located at the bottom of the flexible display screen;The electrode layer and the piezoelectric layer are respectively positioned on below the TFT substrate.It is based on
The characteristic of the respective material of TFT substrate, electrode layer, piezoelectric layer, compared with electrode layer, piezoelectric layer, by the way that TFT substrate and flexibility are shown
Display screen is bonded so that whole ultrasonic sensor fits in the bottom of flexible display screen, can both improve the stabilization of fitting
Property, it is convenient for being bonded again.
In one of the embodiments, the piezoelectric layer is between the TFT substrate and the electrode layer.Piezoelectric layer produces
Raw ultrasonic wave, without going past electrode layer, so as to reduce the loss of ultrasonic wave, enters one in the path propagated to contact object
Step can improve the accuracy of fingerprint recognition.
In one of the embodiments, the material of the electrode layer is silver paste.
In one of the embodiments, the ultrasonic fingerprint identification module also includes protection structure;The protection structure
Located at the bottom of the electrode layer, and for carrying out EMI protection.By setting protection structure, outer signals can be avoided to influence
Ultrasonic fingerprint identifies the fingerprint recognition accuracy of module.
In one of the embodiments, the protection structure is protection ink.
In one of the embodiments, the ultrasonic fingerprint identification module also includes circuit board;The circuit board is with surpassing
Sonic sensor electrically connects.
In one of the embodiments, the flexible display screen is flexible OLED display.
In above-mentioned electronic equipment, ultrasonic fingerprint identification module, and flexible display screen energy are provided with flexible display screen bottom
Ultrasonic wave is enough penetrated, when user's finger is touched after on flexible display screen, the ultrasonic wave launched by ultrasonic sensor passes through soft
Property display screen after can produce reflection, ultrasonic fingerprint identification module can carry out fingerprint recognition according to the ultrasonic wave of reflection, from
And fingerprint identification technology can be applied in flexible screen electronic equipment.
Embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings
State.Preferred embodiment of the present utility model is given in accompanying drawing.But the utility model can come in fact in many different forms
It is existing, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to public affairs of the present utility model
Open the understanding more thorough and comprehensive of content.
Unless otherwise defined, technical field of all of technologies and scientific terms used here by the article with belonging to utility model
The implication that is generally understood that of technical staff it is identical.It is intended merely to retouch in the term used in the description of utility model herein
State the purpose of specific embodiment, it is not intended that limitation the utility model.Term as used herein "and/or" include one or
The arbitrary and all combination of multiple related Listed Items.
One embodiment provides a kind of electronic equipment, and the electronic equipment is, for example, tablet personal computer, personal digital assistant, hand
Machine etc..In addition, the electronic equipment includes flexible display screen, and flexible display screen being capable of conduct ultrasound.Flexible display screen be by
Soft material is made, the flexible display device of changeable type.Flexible display screen is, for example, flexible OLED (Organic Light-
Emitting Diode, Organic Light Emitting Diode) display screen.Therefore, the electronic equipment that present embodiment provides is flexible screen
Electronic equipment.
Fig. 1 is refer to, the bottom of flexible display screen is provided with ultrasonic fingerprint identification module 200.In the embodiment party shown in Fig. 1
In formula, the bottom of flexible display screen is the lower surface of flexible display screen.Ultrasonic fingerprint identification module 200 is installed on electronic equipment
It is interior, and below flexible display screen.Specifically, during the electronic equipment is manufactured, ultrasonic fingerprint can first be manufactured
Module 200 is identified, after the completion of to be manufactured, ultrasonic fingerprint identification module 200 is directly attached at flexible display screen bottom.
Specifically, the bottom of flexible display screen is the bottom (for example, film of substrate 110, i.e. film) of substrate 110, and super
Sound wave fingerprint recognition module 200 is installed on the bottom of substrate 110.By taking flexible OLED display as an example, the top of substrate 110 is for example
Stack gradually provided with anode layer, hole transmission layer, organic luminous layer, electron transfer layer, cathode layer (not shown).
Ultrasonic fingerprint identification module 200 can utilize the fingerprint of ultrasonic scanning user, and fingerprint is identified.It is super
Sound wave fingerprint recognition module 200 includes ultrasonic sensor 210.The top surface of ultrasonic sensor 210 towards flexible display screen, and
Ultrasonic sensor 210 can launch ultrasonic wave and receive the ultrasonic wave of reflection, and the ultrasonic wave of reflection is converted into electric signal.
Wherein, the top surface of ultrasonic sensor 210 is the upper surface of ultrasonic sensor 210 in Fig. 1.Because flexible display screen can
Conduct ultrasound, therefore, when user touches position relative with ultrasonic fingerprint identification module 200 on flexible display screen outer surface
Postpone, the finger that the ultrasonic wave that ultrasonic sensor 210 is launched is conducted to user by flexible display screen can produce reflection
Ultrasonic wave, ultrasonic sensor 210 receives the ultrasonic wave of reflection afterwards, and is converted to electric signal, ultrasonic fingerprint identification module
200 can carry out fingerprint recognition according to these electric signals.
In summary, in above-mentioned electronic equipment, when user's finger touch after on flexible display screen, by supersonic sensing
The ultrasonic wave that device 210 is launched can produce reflection after passing through flexible display screen, and ultrasonic fingerprint identification module 200 can be according to anti-
The ultrasonic wave penetrated carries out fingerprint recognition, so as to which fingerprint identification technology is applied in flexible screen electronic equipment.In addition,
Ultrasonic fingerprint need not be identified that module 200 is arranged in the frame of electronic equipment, so as to increase the visual of electronic equipment
The area in area.
In one of the embodiments, pasted please continue to refer to Fig. 1, ultrasonic fingerprint identification module 200 by adhesive 300
Together in the bottom of flexible display screen.Specifically, ultrasonic fingerprint identification module 200 fits in substrate 110 by adhesive 300
Bottom.
Due to that in the presence of adhesive 300, can cause between ultrasonic fingerprint identification module 200 and flexible display screen
Be not in gap, so as to avoid air from decaying to caused by ultrasonic wave, improve the effect of ultrasonic wave conduction.
Specifically, the acoustic impedance of adhesive 300 is less than setting acoustic impedance values.In other words, the acoustic impedance of adhesive 300 compared with
It is small, so as to conduct ultrasound well, to reduce the decay to caused by ultrasonic wave.
Further, the cure shrinkage of adhesive 300 is less than setting shrinkage factor.Wherein, cure shrinkage, can reflect
The diminution degree of size after adhesive solidification, i.e. cure shrinkage is bigger, and the size after adhesive 300 solidifies is smaller.Therefore, glue
The cure shrinkage of stick 300 is less than setting shrinkage factor, and the cure shrinkage equivalent to adhesive 300 is smaller, so as to keep away
Damaged after exempting from solidification due to contraction to caused by flexible display screen.
Further, the adhesion strength of adhesive 300 is greater than setting value, so as to improve ultrasonic fingerprint identification module 200
The stability of bonding between flexible display screen.
Further, the solidification temperature of adhesive 300 is less than set temperature value, is, for example, less than 80 DEG C, so as to avoid right
High temperature identifies damage caused by module 200 to ultrasonic fingerprint during adhesive 300 is solidified.
In one of the embodiments, ultrasonic fingerprint identification module also includes what is electrically connected with ultrasonic sensor 210
Circuit board 230.It should be noted that this technical characteristic of circuit board 230 can apply in other each embodiments.Specifically,
Circuit board 230 is positioned over ultrasonic wave and conducted to outside the paths traversed of flexible display screen outer surface, i.e., ultrasonic wave is to contact
Without going past circuit board 230 during object conduction, so as to avoid conduction of the circuit board 230 to ultrasonic wave from causing shadow
Ring.
In addition, circuit board 230 is provided with driving chip, driving chip is, for example, ASIC (Application Specific
Integrated Circuit) chip.Driving chip to ultrasonic sensor 210 provide control signal (such as to ultrasonic wave pass
Sensor 210 sends high frequency electrical signal), to cause ultrasonic sensor 210 to launch ultrasonic wave.Also, driving chip also receives super
The electric signal that the ultrasonic wave of reflection is converted to by sonic sensor 210, so that fingerprint to be identified.
It is understood that the set-up mode on driving chip is not limited to the above situation, such as driving chip can also
It is directly installed in ultrasonic sensor 210.
In one of the embodiments, TFT substrate 211, electrode layer are included please continue to refer to Fig. 1, ultrasonic sensor 210
212 and piezoelectric layer 213.Wherein, TFT substrate 211 is located at the bottom of flexible display screen.Specifically, TFT substrate 211 is by gluing
Agent 300 fits in the bottom of flexible display screen.Wherein, the bottom of flexible display screen is, for example, the bottom of substrate 110.Electrode layer
212 and piezoelectric layer 213 located at the lower section of TFT substrate 211.
Wherein, TFT substrate 211 includes substrate and some thin film transistor (TFT)s arranged according to array way on substrate
And the circuit for being used to connect each thin film transistor (TFT) on substrate.Also, TFT substrate 211 can be amplified to electric signal
Deng processing.Specifically, TFT substrate 211 can select film as substrate, so as to meet the flexible demand of whole electronic equipment.
Piezoelectric layer 213 is made up of piezoelectric.Piezoelectric is, for example, ferroelectricity high molecular polymer P (VDF-TrFE).Electrode layer 212 by
Conductive material is formed, and conductive material is, for example, silver paste.
Therefore, based on TFT substrate 211, electrode layer 212,213 respective material of piezoelectric layer characteristic, with electrode layer 212, pressure
Electric layer 213 is compared, and is bonded by the way that TFT substrate 211 is bonded with flexible display screen with whole ultrasonic sensor 210
In the bottom of flexible display screen, the stability of fitting can be both improved, is convenient for being bonded again.
In addition, TFT substrate 211 and electrode layer 212 electrically connect with above-mentioned driving chip.Circuit board is located at driving chip
Exemplified by 23, the installation site of circuit board 230 can not at least be in the top of piezoelectric layer 213.Such as shown in figure 1, circuit board
230 can be positioned over the side of electrode layer 212 and piezoelectric layer 213, and be electrically connected respectively with TFT substrate 211, electrode layer 212.
The operation principle of above-mentioned ultrasonic sensor 210 is:Driving chip applies corresponding high frequency telecommunications to electrode layer 212
Number.After electrode layer 212 has been applied in high frequency electrical signal, high frequency electrical signal is conducted to piezoelectric layer 213, so that piezoelectric layer
213 transmitting ultrasonic waves.Ultrasonic wave upwardly propagates until the outer surface for reaching flexible display screen is carried out instead after contacting the finger of user
Penetrate, piezoelectric layer 213 receives the ultrasonic wave of reflection and is converted to electric signal afterwards, and the electric signal is again through TFT substrate 211 by corresponding
Processing (such as amplification) after be sent in driving chip and be converted to image, so that fingerprint to be identified.
Specifically, piezoelectric layer 213 is between TFT substrate 211 and electrode layer 212.In this way, surpass caused by piezoelectric layer 213
Sound wave, without going past electrode layer 212, so as to reduce the loss of ultrasonic wave, further may be used in the path propagated to contact object
To improve the accuracy of fingerprint recognition.
Further, the above-mentioned concrete structure based on ultrasonic sensor 210, if conductive material is silver paste, silver paste
Solidification temperature be less than Second Threshold.In other words, conductive material selects the relatively low silver paste of solidification temperature, such as from low-temperature setting
Silver paste (it is the thick film conductor paste using superfine flake silver powder as conductive phase).Due to when manufacturing ultrasonic fingerprint module 200,
Need first to form piezoelectric layer 213 in the bottom of TFT substrate 211, form electrode layer 212 in the bottom of piezoelectric layer 213 afterwards.And press
The non-refractory of electric layer 213, therefore conductive material can be reduced in manufacture electrode layer 212 from the relatively low silver paste of solidification temperature
Process high temperature is on influence caused by piezoelectric layer 213, so as to improve the reliability of ultrasonic fingerprint identification module 200.
Further, Fig. 2 is refer to, ultrasonic fingerprint identification module 200 also includes protection structure 220.Protection structure 200
Located at the bottom of electrode layer 212, and for carrying out EMI (Electromagnetic Interference, electromagnetic interference) protection.
Specifically, protection structure 220 is, for example, to protect ink.Therefore, by setting protection structure 220, outer signals shadow can be avoided
Ring the fingerprint recognition accuracy of ultrasonic fingerprint identification module 200.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.