CN206773132U - A kind of GIS device internal connection overheating fault simulation test device - Google Patents
A kind of GIS device internal connection overheating fault simulation test device Download PDFInfo
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- CN206773132U CN206773132U CN201720443863.5U CN201720443863U CN206773132U CN 206773132 U CN206773132 U CN 206773132U CN 201720443863 U CN201720443863 U CN 201720443863U CN 206773132 U CN206773132 U CN 206773132U
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Abstract
The utility model discloses a kind of GIS device internal connection overheating fault simulation test device, it is related to technical field of electric equipment, solve needs in the event of a loss of power in the prior art, joint overheating fault whether occurs to GIS device inside to assess, cause also run using the part of the GIS device in power system, the operational efficiency of power system is reduced, is unfavorable for the technical problem of the economical operation of power system.The GIS device internal connection overheating fault simulation test device includes：GIS device body, GIS device body include the fault simulation section being sequentially connected and normal analog section, and failure conductor is overheated in galvanization corresponding to fault simulation section, and normal conductor corresponding to normal analog section is connected by joint with the failure conductor；The outer surface of the housing of the outer surface of failure conductor, the outer surface of normal conductor and GIS device is provided with temperature sensor.The utility model is applied to simulated test GIS device internal connection overheating fault.
Description
Technical field
It the utility model is related to technical field of electric equipment, more particularly to a kind of GIS device internal connection overheating fault mould
Intend experimental rig.
Background technology
Cubicle Gas-Insulated Switchgear is (referred to as：GIS device, Gas Instulated Switchgear) be with
Fully closed combined electric unit equipment of sulfur hexafluoride (SF6) gas as dielectric, because it has, connecting-disconnecting function is strong, fault rate
Low, the advantages that maintenance cost is few, floor space is small, therefore, obtained a wide range of applications in the transformer station of power system.
However, during Operation of Electric Systems, the first-class part of enclosed busbar, disconnecting switch, cable inside GIS device
The phenomenon of insulation ag(e)ing or loose contact occurs, this allow for inside GIS device by enclosed busbar, disconnecting switch, electricity
When the temperature of joint between the temperature and conductor of the conductor of the parts such as cable end connection occurs abnormal, so as to GIS be caused to set
Standby insulation ag(e)ing, even results in that GIS device housing is breakdown, and then triggers the major accident of Operation of Electric Systems, causes weight
Big economic loss.
At present, the surface color or periodic measurement generally by manually observing the joint between GIS device inner conductor
GIS device home loop resistance, to differentiate to the hot stall of the joint between GIS device inner conductor.But artificial sight
The surface color and periodic measurement GIS device home loop resistance for examining the joint between GIS device inner conductor are required for this
GIS device has a power failure, and to be overhauled to GIS device, this is resulted in power system and can not also transported using the part of the GIS device
OK, the operational efficiency of power system is reduced, is unfavorable for the economical operation of power system.
Utility model content
The purpose of this utility model is to provide a kind of GIS device internal connection overheating fault simulation test device and side
Method, for being simulated to GIS device internal connection overheating fault, with the case where not having a power failure, according to analog result to GIS
Whether device interior, which occurs joint overheating fault, is assessed, and improves the operational efficiency of the power system using the GIS device.
To reach above-mentioned purpose, the utility model provides a kind of GIS device internal connection overheating fault simulation test device,
Adopt the following technical scheme that：
The GIS device internal connection overheating fault simulation test device includes：GIS device body, the GIS device body
Including the fault simulation section being sequentially connected and normal analog section, failure conductor mistake in galvanization corresponding to the fault simulation section
Heat, normal conductor corresponding to the normal analog section are connected by joint with the failure conductor；
The outer surface of the housing of the outer surface of the failure conductor, the outer surface of the normal conductor and the GIS device
It is provided with temperature sensor.
Compared with prior art, GIS device internal connection overheating fault simulation test device tool provided by the utility model
There is following beneficial effect：
In GIS device internal connection overheating fault simulation test device provided by the utility model, GIS device body is not
Only include fault simulation section, in addition to coupled normal analog section, failure conductor is logical wherein corresponding to fault simulation section
Overheated during electric current, and normal conductor corresponding to normal analog section is to be connected by joint with failure conductor, this allows for exception
Heat can be transmitted to the joint being in contact with it by the failure conductor of heating by heat transfer, cause joint to overheat, so as to simulate reality
GIS device internal connection that border uses overheat and cause the situation of GIS device failure, and in the outer surface of failure conductor, normal
The outer surface of conductor and the outer surface of the housing of GIS device are provided with temperature sensor, and this is allowed for fault simulation
Section is passed through after electric current, it is possible to obtain the temperature value of the outer surface of failure conductor, normal conductor outer surface temperature value, with
And the temperature value of housing outer surface, so as to the temperature value of the outer surface according to failure conductor, the temperature of the outer surface of normal conductor
Angle value, and the temperature value of housing outer surface, with reference to the loop resistance value of GIS device body, the failure of acquisition GIS device body
The comparing result of the running status of the running status of analog section and normal analog section so that among the practical application of GIS device,
Staff can judge whether GIS device the failure of internal connection overheat occurs according to the comparing result, in the feelings not having a power failure
Joint overheating fault whether occurs to GIS device inside under condition assess, ensure that the power system using the GIS device
Safe operation, the operational efficiency of power system is improved, be advantageous to the economical operation of power system.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
The required accompanying drawing used is briefly described in description, it should be apparent that, drawings in the following description are only that this practicality is new
Some embodiments of type, for those of ordinary skill in the art, on the premise of not paying creative work, can be with root
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structure for the GIS device internal connection overheating fault simulation test device that the utility model embodiment provides
Schematic diagram；
Fig. 2 is failure in the GIS device internal connection overheating fault simulation test device that the utility model embodiment provides
The connection diagram of conductor and normal conductor；
Fig. 3 is interior solid in the GIS device internal connection overheating fault simulation test device that the utility model embodiment provides
The structural representation of fixed board；
Fig. 4 is failure in the GIS device internal connection overheating fault simulation test device that the utility model embodiment provides
The position view of the temperature measuring point set on conductor and the first normal conductor；
Fig. 5 is first in the GIS device internal connection overheating fault simulation test device that the utility model embodiment provides
The position view of the temperature measuring point set on normal conductor and the second normal conductor；
Fig. 6 is failure in the GIS device internal connection overheating fault simulation test device that the utility model embodiment provides
The position view of the temperature measuring point set corresponding to analog section and corresponding to the first normal analog section on non-faulting phase conductor；
Fig. 7 is first in the GIS device internal connection overheating fault simulation test device that the utility model embodiment provides
The position view of the temperature measuring point set corresponding to normal analog section and corresponding to the second normal analog section on non-faulting phase conductor；
Fig. 8 is that GIS is set in the GIS device internal connection overheating fault simulation test device that the utility model embodiment provides
The position view of the temperature measuring point set on the outer surface of the shell of standby body；
Fig. 9 is that GIS is set in the GIS device internal connection overheating fault simulation test device that the utility model embodiment provides
The position view of the temperature measuring point set on the outer surface of the shell of standby body and the intrinsic internal fixation plate of GIS device；
Figure 10 is the flow for the GIS device internal connection overheating fault simulation experiment method that the utility model embodiment provides
Figure.
Description of reference numerals：
1-fault simulation section, 2-normal analog section,
11-failure conductor, 21-normal conductor,
3-joint, 4-disc insulator,
111-our department, 112-through-flow portion,
5-internal fixation plate, the normal conductors of 21a-first,
The normal conductors of 21b-second.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that described embodiment is the utility model part of the embodiment, rather than whole implementation
Example.Based on the embodiment in the utility model, those of ordinary skill in the art are obtained under the premise of creative work is not made
The every other embodiment obtained, belong to the scope of the utility model protection.
The utility model embodiment provides a kind of GIS device internal connection overheating fault simulation test device, such as Fig. 1 and figure
Shown in 2, the GIS device internal connection overheating fault simulation test device includes：GIS device body, GIS device body include according to
Secondary connected fault simulation section 1 and normal analog section 2, failure conductor 11 overheats in galvanization corresponding to fault simulation section 1, just
Normal conductor 21 corresponding to normal analog section 2 is connected by joint 3 with failure conductor 11, and the outer surface of failure conductor 11,
The outer surface of normal conductor 21 and the outer surface of the housing of GIS device are provided with temperature sensor.Exemplarily, such as Fig. 1 institutes
Show, can be separated above-mentioned fault simulation section 1 and normal analog section 2 by disc insulator 4.
During using the experiment of above-mentioned GIS device internal connection overheating fault simulation test device, can first it obtain above-mentioned
The experiment front loop resistance value of GIS device, then by the input phase of the output end of strong current generator and fault simulation section 1
Even, after the output end of normal analog section 2 is connected with the input of strong current generator, by strong current generator, to event
Barrier analog section 1 is passed through electric current, then respectively by being arranged on the outer surface of failure conductor 11, the outer surface of normal conductor 21 and GIS
The temperature sensor of the outer surface of the housing of apparatus body, obtain and record the temperature value, normal of the outer surface of failure conductor 11
The temperature value of the outer surface of the temperature value of the outer surface of conductor 21 and the housing of GIS device body, passing through predetermined test period
Afterwards, you can disconnect strong current generator and the connection of fault simulation section 1 and normal analog section 2, obtain the examination of GIS device body
Rear loop resistance value is tested, finally according to the experiment front loop resistance value of GIS device body, the temperature of the outer surface of failure conductor 11
Value, the temperature value of outer surface of normal conductor 21, the temperature value of outer surface of housing of GIS device body, GIS device body
Loop resistance value after experiment, you can obtain the preliminary right of the running status of fault simulation section 1 and the running status of normal analog section 2
Compare result.
In the GIS device internal connection overheating fault simulation test device that the present embodiment provides, GIS device body is not only
Including fault simulation section 1, in addition to coupled normal analog section 2, wherein failure conductor 11 exists corresponding to fault simulation section 1
Overheated during galvanization, and normal conductor 21 corresponding to normal analog section 2 is to be connected by joint with failure conductor 11, this just makes
Heat can be transmitted to by heat transfer the joint 3 being in contact with it by obtaining the failure conductor 11 of abnormal heating, cause joint 3 to overheat, from
And the GIS device internal connection overheat of actual use can be simulated and cause the situation of GIS device failure, and in failure conductor 11
The outer surface of the housing of outer surface, the outer surface of normal conductor 21 and GIS device is provided with temperature sensor, and this just makes
Obtain and be passed through to fault simulation section 1 after electric current, it is possible to obtain temperature value, the normal conductor 21 of the outer surface of failure conductor 11
Outer surface temperature value, and the temperature value of housing outer surface, so as to the temperature value of the outer surface according to failure conductor 11,
The temperature value of the outer surface of normal conductor 21, and the temperature value of housing outer surface, with reference to the loop resistance of GIS device body
Value, the comparing result of the running status of the fault simulation section 1 of GIS device body and the running status of normal analog section 2 is obtained, is made
Obtain among the practical application of GIS device, staff can judge whether GIS device inside occurs according to the comparing result
The failure of joint overheat, in the case where not having a power failure joint overheating fault whether occurs to GIS device inside assesses, and ensures
Using the safe operation of the power system of the GIS device, the operational efficiency of power system is improved, be advantageous to power system
Economical operation.
Exemplarily, above-mentioned normal analog section may include multiple normal simulation subsegments, wherein, two neighboring normal analog submodule
Normal conductor corresponding to section is connected by joint, by setting multiple normal simulation subsegments, can will be close to fault simulation section
Normal simulation subsegment is used as transition analog section, so as to avoid the hot-spot of fault simulation section from having an impact normal mode plan section,
And then avoid having an impact the result of the test obtained using GIS device internal connection overheating fault simulation test device so that
The result of the test obtained using GIS device internal connection overheating fault simulation test device is more accurate.
Specifically, as shown in Fig. 2 the area of the passage section of failure conductor 11 can be made to be less than through-flow section of normal conductor 21
The area in face, so that the through-current capability deficiency of failure conductor 11, causes hot-spot.
Optionally, as shown in Fig. 2 failure conductor 11 may include our department 111 and through-flow portion 112, our department 111 and through-flow portion
112 outer surface is provided with temperature sensor, and because the resistivity of iron is more than the resistivity of aluminium, therefore can be by through-flow portion
112 are arranged to the through-flow portion of irony, and our department 111 is arranged to aluminum our department, and normal conductor is arranged to aluminum normal conductor, so as to
The through-current capability in through-flow portion 112 is further reduced, causes hot-spot.
In addition, as shown in figure 3, at least one internal fixation plate 5, internal fixation plate 5 can be provided with the housing of GIS device body
The housing of diameter and GIS device body match, internal fixation plate 5 offers what is passed through for failure conductor and/or normal conductor
Through hole, internal fixation plate are provided with temperature sensor, are set so as to obtain GIS using the upper temperature sensor installed in internal fixation plate
The temperature of the sulfur hexafluoride gas at any point in standby body, so as to the sulfur hexafluoride in the housing according to GIS device body
Running status preliminary comparison's result of the temperature value of gas, the running status of combination failure analog section and normal analog section, obtain
The optimization comparing result of the running status of the running status of fault simulation section and normal analog section, to cause the reality in GIS device
Among the application of border, staff more accurately can judge whether GIS device inside occurs and connect according to the optimization comparing result
The failure of head overheat.
Exemplarily, because phenolic resin has certain mechanical strength, high temperature resistant (- 250~150 DEG C), and phenolic aldehyde
The thermal conductivity factor of resin approaches with sulfur hexafluoride gas, and therefore, preferred internal fixation plate is phenolic aldehyde tree in the utility model embodiment
Fat network structure, it is enable to reduce influence of the internal fixation plate to Temperature Distribution in the case of GIS hot-spots, ensures GIS
Device interior joint overheating fault simulation test device and the uniformity of actual card GIS device.
In addition, by the way that fixed plate is arranged into the circulation that network structure also helps the sulfur hexafluoride gas in GIS device,
The situation of the sulfur hexafluoride gas hot-spot caused by internal fixation plate is avoided to occur, so as to further reduce internal fixation plate pair
The influence of Temperature Distribution in the case of GIS hot-spots, it is further ensured that GIS device internal connection overheating fault simulation test device
With the uniformity of actual card GIS device.
Exemplarily, said temperature sensor can be platinum resistance temperature sensor or copper resistance temperature sensor, ability
Field technique personnel can select according to actual conditions, and the utility model embodiment is without limiting.
In addition, temperature rise tester of the said temperature sensor with the temperature signal for receiving temperature sensor collection
Connection, so that staff can directly read temperature value from temperature rise tester.
You need to add is that above-mentioned GIS device internal connection overheating fault simulation test device may also include for testing
The infrared thermography of the temperature of the housing of GIS device body, so as to the GIS device sheet obtained according to the infrared thermography
The Infrared Thermogram of the housing of body, the Temperature Distribution value of the housing of GIS device body is intuitively understood on the whole, in order to work
Make personnel setting test period, grasp macroscopical experiment progress etc..
Optionally, above-mentioned GIS device internal connection overheating fault simulation test device may also include for test environment temperature
The environment temperature sensor of degree, specifically, the environment temperature sensor may be disposed at is more than or equal to 2m apart from GIS device body
Opening position, so as to avoid the environment temperature sensor from being influenceed by GIS device body, obtain accurate environment temperature
Value, with obtain fault simulation section running status and normal analog section running status preliminary comparison's result when, for work people
Member's reference, exclude the disturbing factor of environment temperature.
In addition, be better understood from and implement for the ease of those skilled in the art, below the utility model embodiment provide
The specific example of the set location of temperature sensor in a kind of above-mentioned GIS device internal connection overheating fault simulation test device：
Exemplarily, in the GIS device internal connection overheating fault simulation test device, including fault simulation section and normal
Analog section, wherein, normal analog section may include two normal simulation subsegments, and fault simulation section passes through with the first normal simulation subsegment
Disc insulator is connected, and the first normal simulation subsegment is connected with the second normal simulation subsegment also by disc insulator, GIS device
Including three-phase conductor, 16 temperature measuring points, tool can be set as failure phase conductor in optional any one phase conductor on the failure phase conductor
Body, respectively A, B, C, D, E, F 6 temperature measuring points are being provided with corresponding to fault simulation section on failure conductor 11, first
Be provided with corresponding to normal simulation subsegment on the first normal conductor 21a respectively G, H, I, J, K, L, M, N, 8 temperature measuring points,
Respectively O, P 2 temperature measuring points, above-mentioned 16 surveys are provided with corresponding to second normal simulation subsegment on second normal conductor 21b
In warm spot, the position of each temperature measuring point as shown in Figure 4 and Figure 5, wherein, six surveys of A, B, C, D, E, F on failure conductor 11
The position of warm spot and the position of six temperature measuring points of G, H, I, J, K, L on the first normal conductor 21a are relative to disc insulator 4
Symmetrically；And on two other non-faulting phase conductor, 8 temperature measuring points can be set respectively, corresponding to fault simulation section on conductor
Two temperature measuring points of Q, R are provided with, tetra- temperature measuring points of S, T, U, V are being provided with conductor corresponding to the first normal simulation subsegment,
Corresponding to second normal simulation subsegment two temperature measuring points of W, X, particular location such as Fig. 6 and figure of each temperature measuring point are provided with conductor
Shown in 7；32 temperature measuring points can be set in the outer surface of the shell of GIS device body, specifically, B in Fig. 4 on failure phase conductor,
C, 4 thermometrics are provided with corresponding to each temperature measuring point in D, E, H, I, J, K on the outer surface of the shell of GIS device body
Point, this 4 temperature measuring points the outer surface of the shell of GIS device body particular location as shown in figure 8, in figure black round dot represent
Temperature measuring point；128 temperature measuring points can be set on the intrinsic internal fixation plate of outer surface of outer cover and GIS device of GIS device body,
Specifically, GIS device body corresponding to each temperature measuring point in A, F, G, L, M, N, O, P in Fig. 4 and Fig. 5 on failure phase conductor
Shell outer surface and the intrinsic internal fixation plate of GIS device on be provided with 16 temperature measuring points, this 4 temperature measuring points
Particular location on the intrinsic internal fixation plate of outer surface of outer cover and GIS device of GIS device body is as shown in figure 9, in figure
Black round dot represents temperature measuring point；The disc insulator outer surface being arranged between fault simulation section and normal analog section may also set up
8 temperature measuring points；The temperature sensor of 3 determination of the environment temperature can be set in distance test (DT) device 2m opening position.
The utility model embodiment provides a kind of GIS device internal connection overheating fault simulation experiment method, and use is above-mentioned
GIS device internal connection overheating fault simulation test device is tested, and specifically, as shown in Figure 10, is connect inside the GIS device
Head overheating fault simulation experiment method includes：
Step S1, the experiment front loop resistance value of GIS device body is obtained.
Step S2, the output end of strong current generator is connected with the input of fault simulation section, by normal analog section
Output end is connected with the input of strong current generator, and sets the output valve of strong current generator, adjusts GIS device body
Air pressure is to nominal pressure.
It should be noted that in above-mentioned steps 2, also can be by the input of the output end of strong current generator and normal analog section
End is connected, and the output end of fault simulation section is connected with the input of strong current generator, those skilled in the art can be according to reality
Border situation is configured, and the utility model embodiment is not limited to this.
Step S3, by strong current generator, electric current is passed through to fault simulation section.
Step S4, by the temperature sensor for the outer surface for being arranged on failure conductor, obtain and record the outer of failure conductor
The temperature value on surface.
Step S5, by the temperature sensor for the outer surface for being arranged on normal conductor, obtain and record the outer of normal conductor
The temperature value on surface.
Step S6, by the temperature sensor of the outer surface of the housing that is arranged on GIS device body, obtain and record GIS
The temperature value of the outer surface of the housing of apparatus body.
It should be noted that for above-mentioned steps S4, step S5 steps S6 specific sequencing, the utility model is implemented
Example is not limited, and specifically, step S4, step S5 and step S6 can be carried out simultaneously.
Step S7, by predetermined test period, strong current generator is each turned off with fault simulation section and normally simulating
The connection of section.
Step S8, loop resistance value after the experiment of acquisition GIS device body.
Step S9, according to the experiment front loop resistance value of GIS device body, the temperature value of the outer surface of failure conductor, just
The temperature value of the outer surface of normal conductor, the housing of GIS device body outer surface temperature value, GIS device body experiment after
Loop resistance value, obtain preliminary comparison's result of the running status of fault simulation section and the running status of normal analog section.
The beneficial effect for the GIS device internal connection overheating fault simulation experiment method that the present embodiment provides can refer to above-mentioned
The beneficial effect of GIS device internal connection overheating fault simulation test device, is no longer repeated herein.
Exemplarily, it is above-mentioned after being passed through electric current to fault simulation section in above-mentioned steps S3 by strong current generator
GIS device internal connection overheating fault simulation experiment method may also include：
By the temperature sensor on the internal fixation plate in the housing of GIS device body, obtain and record GIS is set
The temperature value of sulfur hexafluoride gas in the housing of standby body；
According to the operation shape of the temperature value of the sulfur hexafluoride gas in the housing of GIS device body, and fault simulation section
Running status preliminary comparison's result of state and normal analog section, obtain the running status of fault simulation section and the fortune of normal analog section
The optimization comparing result of row state.
Staff just more accurately can judge whether GIS device inside occurs according to above-mentioned optimization comparing result
The failure of joint overheat, further ensures the safe operation of the power system using the GIS device.
It is described above, only specific embodiment of the present utility model, but the scope of protection of the utility model is not limited to
In this, any one skilled in the art can readily occur in change in the technical scope that the utility model discloses
Or replace, it should all cover within the scope of protection of the utility model.Therefore, the scope of protection of the utility model should be with the power
The protection domain that profit requires is defined.
Claims (10)
- A kind of 1. GIS device internal connection overheating fault simulation test device, it is characterised in that including：GIS device body, institute GIS device body is stated to lead including the fault simulation section being sequentially connected and normal analog section, failure corresponding to the fault simulation section Body is overheated in galvanization, and normal conductor corresponding to the normal analog section is connected by joint with the failure conductor；The outer surface of the housing of the outer surface of the failure conductor, the outer surface of the normal conductor and the GIS device is all provided with It is equipped with temperature sensor.
- 2. GIS device internal connection overheating fault simulation test device according to claim 1, it is characterised in that described Normal analog section includes multiple normal simulation subsegments, and the normal conductor corresponding to the two neighboring normal simulation subsegment passes through The joint connection.
- 3. GIS device internal connection overheating fault simulation test device according to claim 1, it is characterised in that described The area of the passage section of failure conductor is less than the area of the passage section of the normal conductor.
- 4. GIS device internal connection overheating fault simulation test device according to claim 3, it is characterised in that described Failure conductor includes our department and through-flow portion, and the outer surface in described our department and the through-flow portion is provided with the temperature sensor；The through-flow portion is the through-flow portion of irony, and described our department is aluminum our department, and the normal conductor is aluminum normal conductor.
- 5. GIS device internal connection overheating fault simulation test device according to claim 1, it is characterised in that described At least one internal fixation plate is provided with the housing of GIS device body；The housing of the diameter of the internal fixation plate and the GIS device body matches, and the internal fixation plate is offered described in confession The through hole that failure conductor and/or the normal conductor pass through, the internal fixation plate are provided with temperature sensor.
- 6. GIS device internal connection overheating fault simulation test device according to claim 5, it is characterised in that described Internal fixation plate is phenolic resin network structure.
- 7. the GIS device internal connection overheating fault simulation test device according to any one of claim 1~6, its feature It is, the temperature sensor is platinum resistance temperature sensor or copper resistance temperature sensor.
- 8. the GIS device internal connection overheating fault simulation test device according to any one of claim 1~6, its feature It is, the temperature sensor is connected with the temperature rise tester of the temperature signal for receiving the temperature sensor collection.
- 9. GIS device internal connection overheating fault simulation test device according to claim 1, it is characterised in that described GIS device internal connection overheating fault simulation test device also includes the temperature for being used to test the housing of the GIS device body Infrared thermography.
- 10. GIS device internal connection overheating fault simulation test device according to claim 1, it is characterised in that described GIS device internal connection overheating fault simulation test device also includes the environment temperature sensor for test environment temperature.
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| CN201720443863.5U CN206773132U (en) | 2017-04-25 | 2017-04-25 | A kind of GIS device internal connection overheating fault simulation test device |
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| CN201720443863.5U CN206773132U (en) | 2017-04-25 | 2017-04-25 | A kind of GIS device internal connection overheating fault simulation test device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106950478A (en) * | 2017-04-25 | 2017-07-14 | 南方电网科学研究院有限责任公司 | A kind of GIS device internal connection overheating fault simulation test device and method |
| CN110426613A (en) * | 2019-08-22 | 2019-11-08 | 南方电网科学研究院有限责任公司 | A kind of GIS device over-heat inside fault judgment method and device |
-
2017
- 2017-04-25 CN CN201720443863.5U patent/CN206773132U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106950478A (en) * | 2017-04-25 | 2017-07-14 | 南方电网科学研究院有限责任公司 | A kind of GIS device internal connection overheating fault simulation test device and method |
| CN106950478B (en) * | 2017-04-25 | 2023-12-22 | 南方电网科学研究院有限责任公司 | GIS equipment internal joint overheat fault simulation test device and method |
| CN110426613A (en) * | 2019-08-22 | 2019-11-08 | 南方电网科学研究院有限责任公司 | A kind of GIS device over-heat inside fault judgment method and device |
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