CN206542065U - Semiconductor laser temperature control component and the semicondcutor laser unit comprising the component - Google Patents
Semiconductor laser temperature control component and the semicondcutor laser unit comprising the component Download PDFInfo
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- CN206542065U CN206542065U CN201720236030.1U CN201720236030U CN206542065U CN 206542065 U CN206542065 U CN 206542065U CN 201720236030 U CN201720236030 U CN 201720236030U CN 206542065 U CN206542065 U CN 206542065U
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- semiconductor laser
- temperature control
- control component
- laser temperature
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Abstract
The utility model is related to a kind of semiconductor laser temperature control component and the semicondcutor laser unit comprising the component, and semiconductor laser temperature control component includes cooling piece；Rebound, the one side of the rebound opens up fluted to house the cooling piece, and another side of the rebound away from the cooling piece offers resistance fixing groove；And thermistor, it is contained in the resistance fixing groove.The heat of semiconductor laser is transmitted scattered by the semiconductor laser temperature control component by rebound via cooling piece, realize the temperature control control and regulation of noise spectra of semiconductor lasers, and sensitivity is high, fast response time, temperature control effect is good, its output wavelength and power is more stablized, it is ensured that the stability of laser output, and change and be convenient to when different semiconductor lasers are installed.
Description
Technical field
The utility model is related to laser technology field, more particularly to a kind of semiconductor laser temperature control component and includes the group
The semicondcutor laser unit of part.
Background technology
Semiconductor laser is the device worked material with certain semi-conducting material and produce laser, with technology
Development, the effect of semiconductor laser is more and more wider, in laser communication, optical storage, optical circulator, laser printing, ranging and thunder
Obtained a wide range of applications in terms of reaching.Semiconductor laser is as pumping source, in solid state laser and optical fiber laser etc.
All it is particularly significant and crucial device in product, because final laser output is related to the power and wavelength of pumping source, because
And the stability of the wavelength and power to pumping source has certain requirement.
But semiconductor laser heating is larger, its output wavelength and power can drift about with temperature, cause laser defeated
Go out unstable, absorption of the gain media in solid state laser or optical fiber laser to pump light in addition has wavelength sensitive
Property, therefore the drift of output wavelength also can further influence the output stability of overall laser aid.
Utility model content
Based on this, it is necessary to generated heat for above-mentioned semiconductor laser larger, output wavelength and power float with temperature
Move, the problem of causing laser output unstable swashs there is provided the good semiconductor of a kind of sensitivity height, fast response time, temperature control effect
Light temperature control component.
Specific technical scheme is as follows：
A kind of semiconductor laser temperature control component, including：
Cooling piece；
Rebound, the one side of the rebound opens up fluted to house the cooling piece, and the rebound is away from described
The another side of cooling piece offers resistance fixing groove；And
Thermistor, is contained in the resistance fixing groove.
Above-mentioned semiconductor laser temperature control component only need to be by semiconductor laser installing on rebound and covering electricity when using
Fixing groove is hindered, cooling piece and thermistor are then accessed into temperature control circuit system, the heat of semiconductor laser can pass through mistake
Cab apron carries out transmission radiating via cooling piece, and the capacity of heat transmission of cooling piece can be adjusted by thermistor, realizes to semiconductor
Temperature control control and the regulation of laser.The component responds speed is fast, and temperature control effect is good, can make the output wavelength of semiconductor laser
Keep stable with power, ensure that the stability of laser output, the groove that rebound one side is opened up is easy to the receipts of cooling piece
Hold and fix, improve stability, and change and be convenient to when different semiconductor lasers are installed.
In one of the embodiments, Heat Conduction Material is filled with the resistance fixing groove, the thermistor passes through institute
Heat Conduction Material is stated to be fixed in the resistance fixing groove.
In one of the embodiments, the semiconductor laser temperature control component also includes bottom plate, and the bottom plate fits in institute
State one side of the cooling piece away from the rebound.
In one of the embodiments, the semiconductor laser temperature control component also includes connector, and the connector is successively
It is connected through the rebound with the bottom plate so that the rebound and the bottom plate are affixed.
In one of the embodiments, adiabatic insulation spacer is provided between the connector and the rebound to isolate
Connector and the rebound are stated, so that adiabatic insulation between the connector and the rebound.
In one of the embodiments, the cooling piece is contacted with the rebound surface and/or connect with the bottom plate
Tactile surface is provided with thermal conductive silicon lipid layer.
In one of the embodiments, the resistance fixing groove is located at the center of the rebound, and the resistance is fixed
Groove extends to the edge of the rebound to form wire lead slot to either side.
In one of the embodiments, the rebound is made up of red copper.
In one of the embodiments, the surface of the rebound is coated with nickel dam.
Another object of the present utility model is to provide a kind of semicondcutor laser unit, including above-mentioned semiconductor laser temperature control
Component and semiconductor laser, the semiconductor laser fit in one side of the rebound away from the cooling piece and at least
Part covers the resistance fixing groove.
Brief description of the drawings
Fig. 1 is the structural representation of the semiconductor laser temperature control component of an embodiment.
Embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings
State.Preferred embodiment of the present utility model is given in accompanying drawing.But, the utility model can come real in many different forms
It is existing, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to public affairs of the present utility model
The understanding for opening content is more thorough comprehensive.
It should be noted that when element is referred to as " being installed on " another element, it can be directly on another element
Or can also have element placed in the middle.When an element is considered as " connection " another element, it can be direct connection
To another element or it may be simultaneously present centering elements.When an element is considered as " connection " another element, it can
To be directly to another element or may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is herein to be in term used in the description of the present utility model
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein "and/or" includes
The arbitrary and all combination of one or more related Listed Items.
As shown in figure 1, a kind of semiconductor laser temperature control component 100 of this preferred embodiment, including cooling piece 10, rebound
20 and thermistor 30.The one side of rebound 20 opens up fluted to house cooling piece 10, and rebound 20 is away from cooling piece 10
Another side offers resistance fixing groove 21, and thermistor 30 is contained in resistance fixing groove 21.
Semiconductor laser 200 need to be only installed on transition by the semiconductor laser temperature control component 100 of the present embodiment when using
On plate 20 and resistance fixing groove 21 is covered, cooling piece 10 and thermistor 30 are then accessed into temperature control circuit system, semiconductor swashs
The heat of light device 200 can be by rebound 20 via the progress transmission radiating of cooling piece 10, and can be adjusted by thermistor 30
The capacity of heat transmission of cooling piece 10, realizes the temperature control control and regulation of noise spectra of semiconductor lasers 200.The component responds speed is fast, temperature
Control effect is good, and the output wavelength and power of semiconductor laser 200 can be made to keep stable, the stabilization of laser output is ensured that
Property, the groove that the one side of rebound 20 is opened up is easy to the collecting of cooling piece 10 to fix, improves stability, and it is different to change installation
Semiconductor laser 200 when be convenient to.
Preferably, thermistor 30 is flushed with one side of the rebound 20 away from cooling piece 10, in this way, thermistor 30 can
The temperature of semiconductor laser 200 is more rapidly more accurately detected, and then more delicately carries out monitoring temperature and regulation.
Specifically, thermistor 30 is negative tempperature coefficient thermistor, and resistance value can reduce with the increase of temperature.Cause
This, after cooling piece 10 and thermistor 30 are accessed into temperature control circuit system, the rise of the temperature of semiconductor laser 200 makes temperature-sensitive
The resistance value of resistance 30 reduces, and electric current increase, the heat conduction rate of cooling piece 10 is improved；The temperature of semiconductor laser 200 is reduced, and is made
The resistance value increase of thermistor 30, electric current reduces, the heat conduction rate reduction of cooling piece 10, so as to adjust semiconductor for greater flexibility
The temperature of laser 200.
Preferably, Heat Conduction Material, such as epoxide-resin glue high-heat-conductivity glue water, thermistor are filled with resistance fixing groove 21
30 are fixed in resistance fixing groove 21 by Heat Conduction Material, and bonding is firmly and thermal conductivity factor is high, so as in long-time more
Monitor real time temperature stability and high efficiency.
In the present embodiment, cooling piece 10 is semiconductor chilling plate, and semiconductor laser temperature control component 100 also includes bottom plate
40, bottom plate 40 fits in one side of the semiconductor chilling plate away from rebound 20.In this way, semiconductor chilling plate is connected into temperature control circuit
During system, adjustment both positive and negative polarity connection, it is hot face to make the one side that semiconductor chilling plate is fitted with bottom plate 40, is contacted with rebound 20
Another side is huyashi-chuuka (cold chinese-style noodles), so that the heat of rebound 20 can be transferred to hot face through the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate and further pass to
Bottom plate 40, so as to strengthen radiating effect, improves temperature control capacity.It is appreciated that in other embodiments, cooling piece 10 is alternatively it
Its refrigerating plant.
Specifically, semiconductor laser temperature control component 100 also include connector 50, connector 50 sequentially pass through rebound 20 with
Bottom plate 40 is connected so that rebound 20 and bottom plate 40 are affixed.Further, provided with adiabatic exhausted between connector 50 and rebound 20
Edge pad 22 is to isolate connector 50 and rebound 20, so that adiabatic insulation between connector 50 and rebound 20.In this way, can
Effectively prevent rebound 20 and bottom plate 40 by connector 50 carry out direct heat exchange and cause the waste of temperature control with it is unstable
It is fixed, while rebound 20 can be made to be insulated with bottom plate 40, it is to avoid the shell of semiconductor laser 200 is conducted with bottom plate 40, is more had
Beneficial to the electricity control of semiconductor laser 200.In the present embodiment, connector 50 is screw.It is appreciated that connector 50
Structure not limited to this, can be arranged as required to.
In the present embodiment, resistance fixing groove 21 is located at the center of rebound 20, and resistance fixing groove 21 is prolonged to either side
The edge of rebound 20 is extended to form wire lead slot 23, in this way, at the bottom of when being easy to the semiconductor laser 200 to be installed on rebound 20
The center covering resistance fixing groove 21 in face, makes thermistor 30 be more defined for the temperature detection of semiconductor laser 200
Really, the electrode wires of thermistor 30 then easily can draw to be connected with temperature control circuit system from wire lead slot 23.
Preferably, cooling piece 10 is contacted with rebound 20 surface and/or the surface contacted with bottom plate 40 are provided with thermal conductive silicon
Lipid layer, so as to avoid the surface being in contact with bottom plate 40 and/or rebound 20 from producing small spaces, makes the conduction of heat more
It is smooth rapid.
Preferably, rebound 20 is made up of red copper, with very high thermal conductivity factor, accelerates the conduction of velocity of heat, has
Cooling piece 10 is quickly transmitted to beneficial to the heat of semiconductor laser 200, the purpose of accurately and fast temperature control is reached.Further,
The surface of rebound 20 is coated with nickel dam, can effectively prevent rebound 20 from getting rusty.
The semiconductor laser temperature control component 100 of the present embodiment can be by rebound 20 by the heat of semiconductor laser 200
Bottom plate 40 is transferred to via cooling piece 10 to be disperseed, and the capacity of heat transmission of cooling piece 10 can be adjusted by thermistor 30, it is real
Show the temperature control control and regulation of noise spectra of semiconductor lasers 200, and sensitivity is high, fast response time, temperature control effect is good, makes partly to lead
The output wavelength and power of body laser 200 are more stablized, and ensure that the stability of laser output, and change installation not
With semiconductor laser 200 when be convenient to.
As shown in figure 1, a kind of semicondcutor laser unit of this preferred embodiment, including above-mentioned semiconductor laser temperature control component
100 and semiconductor laser 200, semiconductor laser 200 fits in one side of the rebound 20 away from cooling piece 10 and at least portion
Divide covering resistance fixing groove 21.
Preferably, thermal conductive silicon lipid layer is provided between semiconductor laser 200 and rebound 20, so as to avoid the two from connecting
Tactile surface produces space, makes the conduction of heat more smooth rapid.
The semicondcutor laser unit of the present embodiment passes through semiconductor laser temperature control 100 pairs of semiconductors as pumping source of component
Laser 200 carries out sensitive accurately temperature control, the output wavelength and power of semiconductor laser 200 is more stablized, enters
And ensure that the stability of laser output.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and it describes more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that for the common skill of this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
Protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of semiconductor laser temperature control component, it is characterised in that including：
Cooling piece；
Rebound, the one side of the rebound opens up fluted to house the cooling piece, and the rebound is away from the refrigeration
The another side of piece offers resistance fixing groove；And
Thermistor, is contained in the resistance fixing groove.
2. semiconductor laser temperature control component according to claim 1, it is characterised in that be filled with the resistance fixing groove
Heat Conduction Material, the thermistor is fixed in the resistance fixing groove by the Heat Conduction Material.
3. semiconductor laser temperature control component according to claim 1, it is characterised in that the semiconductor laser temperature control component
Also include bottom plate, the bottom plate fits in one side of the cooling piece away from the rebound.
4. semiconductor laser temperature control component according to claim 3, it is characterised in that the semiconductor laser temperature control component
Also include connector, the connector sequentially passes through the rebound and is connected with the bottom plate so that the rebound and the bottom
Plate is affixed.
5. semiconductor laser temperature control component according to claim 4, it is characterised in that the connector and the rebound
Between provided with adiabatic insulation spacer to isolate the connector and the rebound so that the connector and the rebound
Between adiabatic insulation.
6. semiconductor laser temperature control component according to claim 3, it is characterised in that the cooling piece and the rebound
The surface of contact and/or it is provided with thermal conductive silicon lipid layer with the surface of the contacts baseplate.
7. semiconductor laser temperature control component according to claim 1, it is characterised in that the resistance fixing groove is located at described
The center of rebound, and the resistance fixing groove extends to the edge of the rebound to form wire lead slot to either side.
8. semiconductor laser temperature control component according to claim 1, it is characterised in that the rebound is made up of red copper.
9. semiconductor laser temperature control component according to claim 8, it is characterised in that the surface of the rebound is coated with nickel
Layer.
10. a kind of semicondcutor laser unit, it is characterised in that including the semiconductor laser temperature described in claim any one of 1-9
Control component and semiconductor laser, the semiconductor laser fits in one side of the rebound away from the cooling piece and extremely
Small part covers the resistance fixing groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720236030.1U CN206542065U (en) | 2017-03-09 | 2017-03-09 | Semiconductor laser temperature control component and the semicondcutor laser unit comprising the component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720236030.1U CN206542065U (en) | 2017-03-09 | 2017-03-09 | Semiconductor laser temperature control component and the semicondcutor laser unit comprising the component |
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| Publication Number | Publication Date |
|---|---|
| CN206542065U true CN206542065U (en) | 2017-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201720236030.1U Active CN206542065U (en) | 2017-03-09 | 2017-03-09 | Semiconductor laser temperature control component and the semicondcutor laser unit comprising the component |
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| CN (1) | CN206542065U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108400521A (en) * | 2018-03-28 | 2018-08-14 | 上海融军实业有限公司 | Miniaturization laser driven module in laser radar |
-
2017
- 2017-03-09 CN CN201720236030.1U patent/CN206542065U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108400521A (en) * | 2018-03-28 | 2018-08-14 | 上海融军实业有限公司 | Miniaturization laser driven module in laser radar |
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