CN206532278U - Touch panel - Google Patents

Abstract

The utility model provides excellent impact resistance and need not set ornamental portion and operate the excellent touch panel of the design of surface side.On the operating surface (11b) of substrate (11), in the way of avoiding the wiring lead region (E2) in wiring lead portion (18) of first electrode (13) and second electrode (14), cap assembly (19) is configured with the position than wiring lead region (E2) in the inner part, untill the step part between substrate (11) produced because configuring the cap assembly (19), so that the surface of cap assembly (19) and the surface (3a) of housing section (3) turn into conplane mode, the peripheral end portion of substrate (11) is clipped above and below, by molding resin material.

Description

Touch panel

Technical field

The utility model relates to carry out the touch panel of the projection type electrostatic capacitance mode of the multiple spot detection of finger tip.

Background technology

In recent years, in portable phone, smart machine (such as panel type terminal or E-book reader), auto navigation system In the electronic equipments such as system, as a kind of mode at interface, display device (the band touch panel with touch panel function is equipped with Display device：Touch panel equipment), the advantage of touch panel function is being capable of intuitive operation, excellent in te pins of durability.

Touch panel is the touch that detection is carried out by the indication body such as finger or stylus and determines the coordinate of the touch location Location input device.The detection mode is roughly divided into the resistive film being made up of analog resistance film method and resistance matrix film mode Mode, the electrostatic capacitance mode being made up of surface type electrostatic capacitance mode and projection type electrostatic capacitance mode, by noctovisor scan Optical mode that mode and retroreflecting mode are constituted, the ultrasonic wave mode being made up of surface acoustic wave mode and Lamb wave mode, And the detection mode of various modes is practical.

Wherein, in recent years, in above-mentioned detection mode, the particularly demand of the touch panel of projection type electrostatic capacitance mode Expand.The touch panel of projection type electrostatic capacitance mode is by the electricity near finger tip when finger tip is close by two electrodes series in length and breadth The change of the electrostatic capacitance of pole detects the touch panel as the position coordinates on touch panel.

Fig. 5 is the partial sectional view of one of the touch panel for representing this projection type electrostatic capacitance mode.Fig. 5 projection The touch panel 51 of type electrostatic capacitance mode is manufactured using following structure as basic structure：In one with translucency The one side (back side relative with the surface as operation surface side) of substrate 52 forms sensor portion 54 and is bonded via two-sided band etc. Sensor portion 54 is embedded into the engaging recessed part 55a of housing section 55 by part 56, wherein, the sensor portion 54 have be laminated by The first electrode (for example, X electrode) of the multiple row of the nesa coating composition extended in the first direction (for example, laterally), Yi Jiyou Along the second electrode (example of the multiple row of the nesa coating composition of second direction (for example, longitudinal direction) extension intersected with first electrode Such as, Y electrode) electrode portion 53.

In addition, in substrate 52, being formed with via decorative layer 58 from the respective of electrode portion (first electrode, second electrode) 53 The wiring lead portion 57 that end is drawn.In addition, the overall side of electrode portion 53 and wiring lead portion 57 to cover sensor portion 54 Formula, is formed with the protective layer 59 being made up of transparent insulating film.And then, on the position relative with the sensor portion 54 of substrate 52, For example, being adhesively fixed with display device 60 such as liquid crystal display via the adhering parts such as transparent adhesive band 61.In addition, making For the touch panel of such projection type electrostatic capacitance mode, for example, as it is known that there is touch panel disclosed in following patent documents 1.

Prior art literature

Patent document

Patent document 1：Japanese Unexamined Patent Publication 2011-90443 publications

【Utility model content】

【The utility model problem to be solved】

However, region (periphery) of the touch panel disclosed in patent document 1 beyond operating area is equipped and is arranged on base The wiring lead portion 57 of electrode portion 53 on the back side of plate 52, and provided with the eyes of user from the operation surface side of touch panel The decorative layer 58 that the mode that can't see is hidden.

But, in order to without prejudice to carry touch panel electronic equipment design, it is necessary to according to the tone of housing section 55 come The operation of tone between the color of collocation decorative layer 58, but the different part of collocation material is extremely difficult.Further, since Decorative layer 58, the process number increase of touch panel are set, thus also there is the problem of manufacturing cost improves such.

In addition, the touch panel of patent document 1 turns into is embedded in housing section 55 and via adhering part 61 by sensor portion 54 The construction being adhesively fixed, thus there are when fallen etc. thump when sensor portion 54 from housing section depart from such Problem.

In addition, the electrode portion (first electrode, second electrode) 53 of the sensor portion 54 of touch panel 51 from end via drawing Go out wiring part 57 to be connected with control IC (not shown), but when wiring lead portion 57 is exposed to outside and is exposed to air, hold Corrosion is also easy to produce, there is broken string, therefore, as its countermeasure, in the past to cover the entire surface in wiring lead portion 57 Mode forms the protective layer 59 being made up of transparent insulating film.

But, to being formed with the protective layer 59 of transparent insulating film under conditions of hot and humid (such as 85 DEG C, 85%) When touch panel 51 attempts benchmark test, learn there is following possibility：According to the specification of protective layer, pass through over time Cross, passing through the protective layer 59 with penetrability from outside moisture reaches wiring lead portion 57, and wiring lead portion 57 is corroded. Therefore, for being only the structure that wiring lead portion 57 is simply covered using protective layer 59, it is desirable to further improve wiring lead The corrosion resistance in portion 57.

The utility model is made in view of the above problems, and its object is to there is provided excellent impact resistance and need not set Decorative layer is put from the excellent touch panel of the design from the point of view of operation surface side.

【Means for solving the problems】

In order to reach above-mentioned purpose, first method of the present utility model is a kind of touch surface of projection type electrostatic capacity Plate, it is characterised in that possess：Sensor portion, its be on the face relative with the operating surface of the substrate with translucency respectively by Formed by the first electrode and second electrode that multiple electrodes row are constituted are intersected with state of insulation；And housing section, it is pressed from both sides The sensor portion, wherein, using the operating surface of the sensor portion as face side, avoid the first electrode and described second The wiring lead portion of electrode, to cover at least a portion of the operating area formed by the first electrode and the second electrode Mode, the surface of the substrate be provided with cap assembly,

The housing section by resin material so that between the cap assembly and the substrate be not present step and with the cover Part, which turns into same plane and the mode of outer edge of the substrate is clipped in table, to be molded.

2nd mode of the present utility model is characterised by, in the touch panel of the 1st mode, and the housing section is with least The mode for covering the surface in the wiring lead portion is molded.

The touch panel of 3rd mode of the present utility model is characterised by, in the touch panel of the 1st mode or the 2nd mode In, the cap assembly is glass material.

The touch panel of 4th mode of the present utility model is characterised by, in the touch panel of the 1st mode or the 2nd mode In, the cap assembly is transparent resin material.

The touch panel of 5th mode of the present utility model is characterised by, in the touch panel of the 4th mode, described The abutment portion abutted with the housing section of cap assembly is formed with projection.

【The effect of utility model】

According to the utility model, it is not necessary to set and covered in the way of being unable to visuognosis wiring lead portion from outside Decorative layer can just cover wiring lead portion, therefore so that manufacturing cost decline.In addition, for substrate, being carried out to housing section Insert injection molding, it is thus possible to provide without worrying cause that substrate departs from from housing section because of the thump such as fall, reliability High touch panel.If in addition, the shape of cap assembly is designed as into the arbitrary shapes such as circular or polygon, only by making The shape of cap assembly is only changed in the state of sensor portion commonization, it becomes possible to arbitrarily change appearance design.

If in addition, carrying out insert injection moulding to housing section in the way of the region in wiring lead portion at least to cover each electrode It is molded, then wiring lead portion is integrally covered by resin, therefore, it is possible to make to not easily pass through from outside moisture, to wiring lead The corrosion in portion plays sufficient effect.

Brief description of the drawings

Fig. 1 (a) is the top view of the sensor portion of touch panel of the present utility model from rear side, Fig. 1 (b) It is Fig. 1 (a) line A-A cutaway view Amplified image.

Fig. 2 (a) is the figure of one of the plane for showing touch panel of the present utility model, and Fig. 2 (b) is Fig. 2 (a) line B-B broken section enlarged drawing.

Fig. 3 is the figure of embodiment when showing to be provided with the projection of anti-dropout on cap assembly.

Fig. 4 is to show the figure in the formation example of the notch part of substrate formation.

Fig. 5 is the broken section enlarged drawing of one of the mounting structure for showing conventional touch panel.

Embodiment

Hereinafter, referring to the drawings, to being described in detail for implementing mode of the present utility model.The utility model is not limited to The embodiment, based on which, those skilled in the art wait based on the embodiment it is conceivable that enforceable other realities Mode, embodiment and application technology etc. is applied to be all contained in scope of the present utility model.

In addition, in this manual, in the following description carried out with reference to each accompanying drawing, in order to represent direction to position and In the case of term using upper and lower, left and right, these terms and user observe as illustrated in the case of each figure it is upper, Under, it is left and right consistent.

The touch panel 1 of present embodiment is employed the electricity near finger tip when finger tip is close by two electrodes series in length and breadth The throwing that the change detection of the electrostatic capacitance of pole is detected as multiple spot position coordinates, can carrying out finger tip on touch panel 1 Shadow type electrostatic capacitance mode.

First, 1~Fig. 3 of reference picture, the structure to touch panel 1 of the present utility model is illustrated.In addition, this embodiment party Shape when overlooking is illustrated as rectangle to illustrate by the touch panel 1 of formula, but its shape not limited to this, for example, can also be just The shape such as square, circular, oval, polygon.

As shown in any one in Fig. 1,2, the touch panel 1 of present embodiment is generally constructed to the He of sensor portion 2 Housing section 3, sensor portion 2 be configuration electrode portion 12 and constitute, wherein, electrode portion 12 by the substrate 11 with translucency the back of the body The first electrode 13 and second electrode 14 formed on face (face relative with the surface as operating surface) is constituted, housing section 3 be Above-below direction (direction in the table of substrate 11) clips insert injection molding in the state of sensor portion 2.

As shown in Fig. 1 (a), sensor portion 2 is base portion with the substrate 11 of rectangular plate-like.Substrate 11 is by with translucency Ins. ulative material formed, for example, using glass type or membrane type.As the substrate 11 of glass type, for example, using alkali-free glass, Soda-lime glass, alumina silicate glass etc..In addition, as membrane type substrate 11, for example, using the resins such as poly terephthalic acid (PET) The film of system.

In the back side (face of the opposite side relative with the face operated by finger tip of substrate 11：Hereinafter referred to as operate opposite face) 11a is formed with first electrode 13 and second electrode 14 as electrode portion 12.For first electrode 13, for example, utilize photoetching technique Deng after being patterned to resist to ITO (Indium Tin Oxide：Tin indium oxide) etc. nesa coating be etched Processing, the multiple row electrodes arranged along Fig. 1 longitudinal direction (X-direction) are used as example, being formed.

Second electrode 14 is same with first electrode 13, e.g. carries out patterning to resist using photoetching technique etc. Afterwards to ITO (Indium Tin Oxide：Tin indium oxide) etc. nesa coating be etched, for example, being formed as along Fig. 1 Transverse direction (Y-direction) be arranged with multiple row electrodes.

Further the forming method to electrode portion 12 is illustrated, first, is formed on the operation opposite face 11a of substrate 11 Transverse direction (the Y side of the multiple first electrodes 13 extended along the longitudinal direction (X-direction) of Fig. 1 (a) and (a) with the state of segmentation along Fig. 1 To) configuration multiple electrodes film 14a.Next, in first electrode 13 and the first electrode 13 of the cross part 15 of second electrode 14 Upper formation insulating barrier 16.Insulating barrier 16 is the layer for making to be electrically insulated between first electrode 13 and second electrode 14, for example, by acrylic acid The insulating materials such as resin are constituted.Next, as shown in Fig. 1 (b), across transverse direction (Y-direction) of the first electrode 13 along Fig. 1 (a) Using the connection multiple electrodes film 14a of distribution (bridging distribution) 17 is bridged, second electrode 14 is formed.Now, the second electricity is connected and composed Bridge joint distribution 17 between electrode film 14a, 14a of pole 14 by way of the top of insulating barrier 16 to carry out distribution.And then, at this In example, the rectangle part of the inner side of the Fig. 2 for the electrode portion 12 being made up of first electrode 13 and second electrode 14 (a) will be formed with It is used as the operating area E1 of sensor portion 2.

In addition, in the forming method of above-mentioned electrode portion 12, bridge joint distribution 17 has been used in second electrode 14, but also may be used To be configured to make first electrode 13 and second electrode 14 reverse, bridge joint distribution 17 is used in first electrode 13.In addition, the first electricity As long as pole 13 and second electrode 14 at least cross part 15 insulate, accordingly it is also possible to be configured in an electrode (the first electricity Pole 13 or second electrode 14) entire surface on formed insulating barrier 16, another electrode (second electrode 14 is formed on the insulating barrier 16 Or first electrode 13).

The first electrode 13 and second electrode 14 formed on the substrate 11 by above-mentioned forming method such as Fig. 1 (a) is shown, Respective end is drawn out to the end of substrate 11 by wiring lead portion 18, and is carried out with control IC (control circuit) (not shown) Distribution is connected.

As shown in Fig. 2 (a), wiring lead portion 18 is that the extraction in the "U" shape part in operating area E1 outside is matched somebody with somebody The distribution drawn in line region E2 (mesh-like area in figure) from the respective end of first electrode 13 and second electrode 14, example Such as, by sputtering method formation MAM (Mo/Al/Mo), the metal film such as APC (AgPdCu etc.), by etching method by defined figure Case formation is until the end of substrate 11.

So, in sensor portion 2, in order to ensure the precision as position sensor, be made up of linear electrode One electrode 13 and second electrode 14 are configured to the rectangular of XY on the substrate 11 with the state of electric insulation, are not which electrode utilized On which side, but separately detect is which X-direction electrode and which Y-direction electrode, and can be according to X-direction electricity Pole calculates position with the intersection point of the Y-direction electrode.

In addition, when carrying out insert injection molding to housing section 3, at least to cover the substrate relative with wiring lead portion 18 The mode of 11 operating surface 11b sides, in the face side (the operating surface 11b sides of substrate 11) of substrate 11 to avoid wiring lead portion 18 Wiring lead region E2 mode, cap assembly 19 is configured in the position than wiring lead region E2 in the inner part via adhesive linkage 20 Put.

When carrying out insert injection molding to housing section 3, cap assembly 19 is configured to avoid being disposed in operation opposite face 11a sides Wiring lead region E2 as shape.By configuring cap assembly 19, the behaviour with substrate 11 on the operating surface 11b of substrate 11 Make to produce step part between the 11b of face, when carrying out insert injection molding, housing can be made in the way of burying the step part The resin material in portion 3 enters.Thus, when as touch panel 1, wiring lead region E2 can be covered using housing section 3, Therefore, when as touch panel 1, it is not necessary to which the processing of substrate 11 itself sets decorative layer, can be same with conventional product Ground is from exterior shield wiring lead portion 18.

In the case of using glass material formation cap assembly 19, because transparency is high, glass texture (hardness, contact When cold degree) obtain feeling of high class aspect, resistance to chemical reagents, weatherability, wear resistance etc. and cope with terms of various use environments It is excellent.

In addition, utilizing transparent resin material (for example, makrolon, Triafol T, acrylic resin etc.) formation In the case of cap assembly 19, compared with glass material, it is difficult in the fragment by generations such as whereabouts breakages in terms of splashing, easily in portion Part surface forms various coatings, and (as one, AR codings (anti-reflection coating), AG codings (anti-dazzle coating), AFP codings are (anti-to refer to Line coating) etc.) aspect, due to housing section 3 be resin material thus the mutual compatibility of resin it is good in terms of on it is excellent.

In addition, in the case where having used transparent resin material to cap assembly 19, as shown in figure 3, being supported with housing section 3 Socket part point, easily can be formed the projection 19a as the fitting portion function chimeric with housing section 3 by ester moulding For arbitrary shape.So, by setting projection 19a, engaging zones (contact area) increase engaged with housing section 3, thus When touch panel 1 falls, it can prevent cap assembly 19 from being come off from housing section 3.In addition, the shape of projection 19a shown in Fig. 3 or Number is an example, as long as shape, size, number with the effect that is chimeric and playing anti-dropout of housing section 3, then without spy Do not limit.

But,, can basis in order to prevent touch panel 1 itself blocked up when cap assembly 19 is configured on substrate 11 The thickness of touch panel 1 suitably adjusts the thickness of substrate 11 and the thickness of cap assembly 19.As one, existing substrate 11 is being set Thickness be 1.1mm in the case of, if it is 0.6mm for example to set the thickness of substrate 11 as 0.5mm, cap assembly 19 thickness, Aggregate thickness is 1.1mm, and the thickness with usually used substrate 11 is equal.In addition, cap assembly 19 is not limited to 1, it can also divide Overlapped into multiple (if for example, target thickness being set as 0.6mm, using 3 0.2mm thickness).

So, in the operating surface 11b sides of substrate 11, in the way of at least avoiding wiring lead region E2, by cap assembly 19 Configuration is in the position than wiring lead region E2 in the inner part, thus, when carrying out insert injection molding to housing section 3, in the cover The step part produced between part 19 and substrate 11 is covered by resin material, it is therefore not necessary to set use as conventional device Decorative layer in shielding wiring lead portion 18, the effect that can play and set decorative layer equal.Further, since resin can be made It is seamless therefore, it is possible to the surface and housing section 3 that make cap assembly 19 untill material enters to the step part produced by cap assembly 19 Turn to same plane.

In addition, on cap assembly 19, being processed into as long as being configured in insert injection molding on the operating surface 11b of substrate 11 It is the cap assembly that at least wiring lead region E2 is covered such shape by the resin material of housing section 3, but for example such as Fig. 4 It is shown, it can also configure and be processed into the cap assembly that the resin material of housing section 3 reaches such shape in operating area E1.

Because the dielectric constant of the resin material used housing section 3 is high, even therefore from arrival operating area E1 Housing section 3 surface 3a, also can by electrode portion 12 detect finger tip position.Therefore, cap assembly 19 is configured as shown in Figure 4 When, an operating area E1 part is covered by the resin material of housing section 3, on the part for covering operating area E1, for example The mark as operation button 3b shown in Fig. 4 is printed, electrode portion 12 is set in the way of making each button function, thus, Without shaping pressing button in addition in housing section 3, operating function can be easily added.

In addition, the shape of cap assembly 19 can be designed as the arbitrary shapes such as circular or polygon, therefore, only by making biography The shape of cap assembly 19 is only changed in the state of commonization of sensor portion 2, it becomes possible to arbitrarily change appearance design.

Housing section 3 is constituted such as the thermoplastic synthetic resin by general-purpose plastics, engineering plastics.Housing section 3 be by as The operating area E1 (region of finger tip operation) of sensor portion 2 operating surface 11b sides are as surface, to cover by configuring in substrate The mode for the step part that cap assembly 19 on 11 operating surface 11b is produced, clips the outer edge of substrate 11 above and below (in table) Portion, to make the surface 3a of housing section 3 turn to conplane mode with the seamless surface of cap assembly 19, is noted by resin material inserts It is moulded into type.

In addition, housing section 3 is at least to cover the electrode portion 12 (first to be formed on the operation opposite face 11a sides of substrate 11 Electrode 13, second electrode 14) wiring lead portion 18 wiring lead region E2 mode, insert injection molding.Thus, draw Wiring part 18 is directly covered by housing section 3, therefore, under rigor condition as benchmark test, also ensure that The reliability of product.

And then, in the touch panel 1 constituted as described above, such as shown in Fig. 2 (b), such as via transparent adhesive band Deng adhesive linkage 21, the operation opposite face 11a (face for being formed with sensor portion 2) of substrate 11 is bonded and fixed to display device (example Such as various display devices of liquid crystal display, EL display) 22.

Thus, by the way that a mode of touch panel 1 as input equipment is equipped on into display device 22, display can be made Device 22 is used as display device (touch panel equipment) function with touch panel.

As described above, the touch panel 1 of present embodiment is manufactured as follows：In the behaviour of substrate 11 Make on the 11b of face, cover with the wiring lead region E2 in the wiring lead portion 18 for avoiding first electrode 13 and second electrode 14 and at least The mode of a lid operating area E1 part configures cap assembly 19, with until produce because configuring the cap assembly 19 and substrate The surface of cap assembly 19 is set to turn into conplane mode with the surface 3a of housing section 3 untill step part between 11, by setting Fat material carries out insert injection molding, and the peripheral end portion of substrate 11 is clipped above and below.

Thus, without setting the decorative layer covered in the way of being unable to visual identity wiring lead portion 18 from outside just Wiring lead portion 18 can be covered, it is thus possible to provide following touch panel：Decline manufacturing cost, without worrying as conventional Device is such, the embedded structure based on adhesive linkage is such, and substrate 11 departs from because of thumps such as whereabouts from housing section 3, reliably Property it is high.

If in addition, the shape of cap assembly 19 is designed as into the arbitrary shapes such as circular or polygon, only by making biography The shape of cap assembly 19 is only changed in the state of commonization of sensor portion 2 just can arbitrarily change appearance design.

In addition, housing section 3 is at least to cover the wiring lead portion 18 of each electrode of first electrode 13 and second electrode 14 The mode in region carries out insert injection molding, and wiring lead portion 18 is overall to be covered by resin, therefore, it is possible to make from the wet of outside Gas is not easily passed through, and the corrosion to wiring lead portion 18 plays sufficient effect.

In addition, it is necessary to set decoration in the way of being unable to visuognosis wiring lead portion 18 from outside in conventional structure Portion, and make cap assembly 19 it is outer be formed as expanding to the position of ornamental portion untill shape, but in the utility model, with by The mode of this part of the covering wiring lead of housing section 3 portion 18 clips cap assembly 19 and manufactured, therefore, it is possible to reduce cap assembly 19 Size.

Particularly, in the case where cap assembly 19 is glass material, obtain multiple from a glass plate, but cover can be reduced Part 19 itself, therefore, it is possible to increase the number of acquirement, manufacturing cost declines.

In addition, in the case where having used transparent resin material to cap assembly 19, easily can be abutted with housing section 3 Abutment portion the projection 19a of the fitting portion function as housing section 3 is formed as by arbitrary shape by resin forming, because This, due to projection 19a, the engaging zones engaged with housing section 3 (contact area) increase, can when touch panel 1 falls Prevent cap assembly 19 from being come off from housing section 3.

The explanation of reference

1 ... touch panel

2 ... sensor portions

3 ... housing sections

3a ... surfaces

3b ... operation buttons

11 ... substrates

11a ... the back sides (operation opposite face)

11b ... surfaces (operating surface)

12 ... electrode portions

13 ... first electrodes

14 ... second electrodes

14a ... electrode films

15 ... cross parts

16 ... insulating barriers

17 ... bridge joint distributions

18 ... wiring lead portions

19 ... cap assemblies (19a ... projections)

20 ... adhesive linkages

E1 ... operating areas

E2 ... wiring leads region

Claims (5)

1. a kind of touch panel, it is characterised in that possess：

Sensor portion, it is made up of respectively multiple electrodes row on the face relative with the operating surface of the substrate with translucency Formed by first electrode and second electrode are intersected with state of insulation；And housing section, it clips the sensor portion, its In,

Using the operating surface of the sensor portion as face side, the wiring lead of the first electrode and the second electrode is avoided Portion, to cover at least one of mode of the operating area formed by the first electrode and the second electrode, described The surface of substrate is provided with cap assembly,

The housing section by resin material so that between the cap assembly and the substrate be not present step and with the cap assembly The mode that the outer edge of the substrate is clipped as same plane and in table is molded.

2. touch panel according to claim 1, it is characterised in that

The housing section in the way of at least covering the surface in the wiring lead portion to be molded.

3. touch panel according to claim 1 or 2, it is characterised in that：

The cap assembly is glass material.

4. touch panel according to claim 1 or 2, it is characterised in that：

The cap assembly is transparent resin material.

5. touch panel according to claim 4, it is characterised in that：

Projection is formed with the abutment portion abutted with the housing section of the cap assembly.