CN206423050U - A kind of plug-in element suitable for Reflow Soldering - Google Patents

A kind of plug-in element suitable for Reflow Soldering Download PDF

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Publication number
CN206423050U
CN206423050U CN201621441131.4U CN201621441131U CN206423050U CN 206423050 U CN206423050 U CN 206423050U CN 201621441131 U CN201621441131 U CN 201621441131U CN 206423050 U CN206423050 U CN 206423050U
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CN
China
Prior art keywords
pin
plug
bending
reflow soldering
horizontal part
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Active
Application number
CN201621441131.4U
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Chinese (zh)
Inventor
汪璧苍
杨冠属
林广丁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen Topstar Lighting Co Ltd
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Xiamen Topstar Lighting Co Ltd
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Publication date
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Priority to CN201621441131.4U priority Critical patent/CN206423050U/en
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Abstract

The utility model discloses a kind of plug-in element suitable for Reflow Soldering, including component body and two pins, the pin is fixed on the lower end of the component body, the pin is one horizontal part of bending formation at 2mm 10mm in the height of distancing element body, and the pin of the horizontal part is formed down a vertical portion in horizontal length for bending at 1mm 5mm.The plug-in element is logical to form pin horizontal part and pin vertical portion to pin progress bending, simple in construction so as to realize the reflow soldering process that is applicable to as surface mount elements, and board automated production is realized on the premise of cost is not increased.

Description

A kind of plug-in element suitable for Reflow Soldering
Technical field
The utility model is related to field of electrical components, relates particularly to a kind of plug-in element suitable for Reflow Soldering.
Background technology
It is general to be welded component on circuit boards using wave-soldering or reflow soldering process in electronic product production.Mesh Preceding wave-soldering is mainly welding plug-in element, and the welding sequence of plug-in element is:First in back of circuit board dispensing, paster, baking It is dry, then manually insert plug-in element in circuit board front, cross wave-soldering, artificial repair welding, manual testing;Reflow Soldering is welding patch Piece element, the welding sequence of surface mount elements is:Brush tin cream, patch surface mount elements, paster, Reflow Soldering, board excessively are tested automatically.Thus It can be seen that, the complex procedures of solder wave process, recruitment cost are high, efficiency is low, board input resource is more, are unfavorable for realizing whole-process automatic Change;And reflow soldering process precision height, efficiency high, full-automation.But, surface mount elements are expensive, improve cost.
Utility model content
In view of this, in view of the shortcomings of the prior art, the utility model is intended to provide a kind of simple in construction, cost low Suitable for the plug-in element of Reflow Soldering.
To achieve the above object, the utility model is adopted the following technical scheme that:
A kind of plug-in element suitable for Reflow Soldering, including component body and two pins, the pin are fixed on the member The lower end of part body, the pin is one horizontal part of bending formation, the water at 2mm-10mm in the height of distancing element body The pin in flat portion is that bending is formed down a vertical portion at 1mm-5mm in horizontal length.The program passes through drawing plug-in element Pin for 2mm-10mm place's bendings forms horizontal part in the height of distancing element body, and the pin of horizontal part is 1mm- in horizontal length Bending is formed down vertical portion at 5mm, so that on circuit boards after brush tin cream, the vertical portion of the plug-in element can pass through machine Platform is automatically inserted into the jack of circuit board, and the horizontal part lower surface of pin is then in close contact with the pad on circuit board, is together led to Cross Reflow Soldering board so that plug-in element pin is closely coupled with pad, reach the effect as surface mount elements.Pin away from Height from component body is bending at 2mm-10mm, can be avoided when height is less than 2mm, pin, can be right in reforming process Component body causes mechanical damage;When height is more than 10mm, in process of production, crank is easily welded element Bad situation.The pin of horizontal part is that 1mm-5mm goes out bending in horizontal length, can be avoided when horizontal length is less than 1mm, tin The contact area of cream and pin is too small, and not prison welding is solid;When horizontal length is more than 5mm, element in process of production, can also go out The phenomenon of existing crank.
Preferably, the two pins are towards the opposite inside bending in direction, and the pin after pin bending is smaller than pin Conventional pin spacing.
Preferably, the two pins outside bending in the opposite direction, the pin spacing after pin bending is more than pin Conventional pin spacing.
As shown from the above technical solution, the beneficial effects of the utility model are:
A kind of plug-in element suitable for Reflow Soldering of the present utility model, pin level is formed by carrying out bending to pin Portion and pin vertical portion so that the plug-in element can realize the reflow soldering process that is applicable to as surface mount elements, structure Simply, board automated production is realized on the premise of cost is not increased.
Brief description of the drawings
Fig. 1 is the structural representation of the plug-in element of the utility model embodiment 1;
Fig. 2 is the structural representation of the plug-in element of the utility model embodiment 2.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the technical solution of the utility model is described further:
Embodiment 1:
One embodiment of the present utility model refer to Fig. 1, a kind of plug-in element suitable for Reflow Soldering, including element sheet Body 1 and pin 2, pin 2 are fixed on the lower end of component body 1, and two pins 2 are court at 2mm in the height H of distancing element body 1 The inside bending in opposite direction forms horizontal part 21, and the pin 2 of horizontal part 21 is the downward shape of bending at 1.5mm in horizontal length L Into vertical portion 22, the pin spacing B1 after the bending of pin 2 is less than the conventional pin spacing B of pin.
The pin 2 of the plug-in element is bending formation horizontal part at 2mm in the height H of distancing element body by board 21, the pin 2 of horizontal part 21 is formed down vertical portion 22 in horizontal length L for bending at 1.5mm, so that in circuit board 3 After upper brush tin cream, the vertical portion 22 of the plug-in element can be automatically inserted into the jack of circuit board by board, the horizontal part of pin 2 21 lower surfaces are then in close contact with the pad on circuit board 3, together pass through Reflow Soldering board so that plug-in element pin 2 and weldering Disk is closely coupled, reaches the effect as surface mount elements.
Embodiment 2:
One embodiment of the present utility model refer to Fig. 2, a kind of plug-in element suitable for Reflow Soldering, including element sheet Body 1 and pin 2, pin 2 are fixed on the lower end of component body 1, and two pins 2 are court at 2mm in the height H of distancing element body 1 The outside bending in opposite direction forms horizontal part 21 ', and the pin 2 of horizontal part 21 ' is downward for bending at 1.5mm in horizontal length L Vertical portion 22 ' is formed, the pin spacing B2 after the bending of pin 2 is more than the conventional pin spacing B of pin.
The pin 2 of plug-in element is bending formation horizontal part 21 ' at 2mm in the height H of distancing element body by board, The pin 2 of horizontal part 21 ' is that bending is formed down vertical portion 22 ' at 1.5mm in horizontal length L, so that on circuit board 3 After brush tin cream, the vertical portion 22 ' of the plug-in element can be automatically inserted into the jack of circuit board by board, the horizontal part of pin 2 21 ' lower surfaces are then in close contact with the pad on circuit board 3, together pass through Reflow Soldering board so that plug-in element pin 2 and weldering Disk is closely coupled, reaches the effect as surface mount elements.
It is described above, only the utility model preferably embodiment, but protection domain of the present utility model is not This is confined to, for those skilled in the art, technical scheme that can be as described above and design make other each It is kind corresponding to change and deform, and all these change and deformation should all belong to the guarantor of the utility model claim Within the scope of shield.

Claims (3)

1. a kind of plug-in element suitable for Reflow Soldering, including component body and two pins, the pin are fixed on the element The lower end of body, it is characterised in that:The pin is one level of bending formation at 2mm-10mm in the height of distancing element body Portion, the pin of the horizontal part is formed down a vertical portion in horizontal length for bending at 1mm-5mm.
2. it is applied to the plug-in element of Reflow Soldering as claimed in claim 1, it is characterised in that:The two pins are towards opposite side To inside bending, the pin after pin bending is smaller than the conventional pin spacing of pin.
3. it is applied to the plug-in element of Reflow Soldering as claimed in claim 1, it is characterised in that:The two pins are towards opposite side To outside bending, the pin spacing after pin bending is more than the conventional pin spacing of pin.
CN201621441131.4U 2016-12-27 2016-12-27 A kind of plug-in element suitable for Reflow Soldering Active CN206423050U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621441131.4U CN206423050U (en) 2016-12-27 2016-12-27 A kind of plug-in element suitable for Reflow Soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621441131.4U CN206423050U (en) 2016-12-27 2016-12-27 A kind of plug-in element suitable for Reflow Soldering

Publications (1)

Publication Number Publication Date
CN206423050U true CN206423050U (en) 2017-08-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621441131.4U Active CN206423050U (en) 2016-12-27 2016-12-27 A kind of plug-in element suitable for Reflow Soldering

Country Status (1)

Country Link
CN (1) CN206423050U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107592751A (en) * 2017-09-18 2018-01-16 广东欧珀移动通信有限公司 A kind of circuit board assemblies and preparation method thereof, contact pin component, mobile terminal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107592751A (en) * 2017-09-18 2018-01-16 广东欧珀移动通信有限公司 A kind of circuit board assemblies and preparation method thereof, contact pin component, mobile terminal
CN107592751B (en) * 2017-09-18 2019-05-28 Oppo广东移动通信有限公司 A kind of circuit board assemblies and preparation method thereof, contact pin component, mobile terminal

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