CN206370995U - The multi-layer combined circuit board of heat dissipation type high - Google Patents
The multi-layer combined circuit board of heat dissipation type high Download PDFInfo
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- CN206370995U CN206370995U CN201621320451.4U CN201621320451U CN206370995U CN 206370995 U CN206370995 U CN 206370995U CN 201621320451 U CN201621320451 U CN 201621320451U CN 206370995 U CN206370995 U CN 206370995U
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Abstract
The utility model discloses a kind of multi-layer combined circuit board of heat dissipation type high, including circuit substrate layer, thermal grease layer, radiate layers of copper, screen layer and antistatic backing, the circuit substrate layer includes upper circuit layer, lower circuit layer and the rigid insulation layer being located between upper and lower circuit layer, rigid insulation layer inner hollow, copper post is provided with rigid insulation layer, a plurality of be used for the heat emission hole of heat discharge in rigid insulation layer is respectively equipped with rigid insulation layer two ends, the thermal grease layer is on upper circuit layer upper surface and lower circuit layer lower surface, the radiating layers of copper is on thermal grease layer outer surface, the screen layer is on radiating layers of copper outer surface, the antistatic backing is on screen layer outer surface.Thereby, by the way that circuit substrate layer, thermal grease layer, radiating layers of copper, screen layer and antistatic backing are integrated to form into circuit board, heat emission hole is opened up in circuit substrate layer both sides, thermal grease layer and radiating layers of copper are set in circuit substrate layer upper and lower surface, circuit board temperature is quickly reduced.
Description
Technical field
The utility model is related to field of circuit boards technology, refers in particular to a kind of multi-layer combined circuit board of heat dissipation type high.
Background technology
Harsher thermal environment stress produces serious influence to the normal work of most of electronic products, causes electronics member
Device accelerates failure, so as to cause the failure of whole product, in recent years, with extensive, super large-scale integration and surface
The application of mounting technology, electronic product develops to miniaturization, high density, high reliability direction, especially in aerospace field, high
Spend integration, pinpoint accuracy, high complexity and extremely narrow space the features such as so that electronic system thermal design is wanted
Also more and more higher is sought, heat is as one of key factor for influenceing its Performance And Reliability.However, available circuit plate general lack of
Autonomous radiator structure, causes circuit board operationally, temperature is higher, has influence on the normal of electronic component and uses, shortens electricity
The service life of sub- component.Therefore, reply available circuit plate is improved, to solve the above problems.
Utility model content
In view of this, in view of the existing deficiencies of the prior art, its main purpose is to provide a kind of high radiating to the utility model
The multi-layer combined circuit board of type, by the way that circuit substrate layer, thermal grease layer, radiating layers of copper, screen layer and antistatic backing is integrated
Circuit board is formed, heat emission hole is opened up in circuit substrate layer both sides, thermal grease layer is set in circuit substrate layer upper and lower surface and dissipated
Hot layers of copper, quickly reduces circuit board temperature.
To achieve the above object, the utility model is using following technical scheme：
A kind of multi-layer combined circuit board of heat dissipation type high, includes circuit substrate layer, thermal grease layer, radiating layers of copper, screen
Layer and antistatic backing are covered, the circuit substrate layer includes circuit layer, lower circuit layer and is located in circuit layer and lower circuit layer
Between rigid insulation layer, the rigid insulation layer inner hollow, in rigid insulation layer on be provided with for by upper circuit layer and under
The copper post of circuit layer conducting, and it is respectively arranged with a plurality of be used for heat discharge in rigid insulation layer in rigid insulation layer two ends
Heat emission hole, the thermal grease layer is arranged on circuit layer upper surface and lower circuit layer lower surface, and the radiating layers of copper is arranged at
On thermal grease layer outer surface, the screen layer is arranged on radiating layers of copper outer surface, and the antistatic backing is arranged at screen layer appearance
On face.
It is used as a kind of preferred scheme：The copper post is vertically through rigid insulation layer, and copper post upper end is connected with upper circuit layer, under
End is connected with lower circuit layer.
It is used as a kind of preferred scheme：Between the upper circuit layer and rigid insulation layer and lower circuit layer and rigid insulation layer
Between be respectively arranged with adhesive linkage.
It is used as a kind of preferred scheme：Plurality of grooves is respectively arranged with the rigid insulation layer upper and lower surface, it is multiple in this
The thermal grease for being used for absorbing circuit layer and lower circuit layer heat is filled with several grooves.
The utility model has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technology
Scheme is understood, by the way that circuit substrate layer, thermal grease layer, radiating layers of copper, screen layer and antistatic backing are integrated to form into circuit board,
The circuit substrate layer is divided into upper and lower circuit layer, sets heat emission hole between upper and lower circuit layer, can accelerate the sky at circuit board center
Flow of air, takes away the heat produced by it, and combines thermal grease layer and radiating layers of copper, enables circuit board surface temperature fast
Prompt drop is low, so that, circuit board is integrally cooled, improve the job stability of circuit board, extend the use of circuit board
Life-span.
More clearly to illustrate architectural feature of the present utility model and effect, come below in conjunction with the accompanying drawings with specific embodiment pair
It is described in detail.
Brief description of the drawings
Fig. 1 is the circuit board layer structure schematic cross-sectional view of the utility model；
Fig. 2 is the rigid insulation layer schematic perspective view of the utility model.
Accompanying drawing identifier declaration：
10th, circuit substrate layer 11, upper circuit layer
12nd, lower circuit layer 13, rigid insulation layer
131st, heat emission hole 132, groove
14th, copper post 15, adhesive linkage
20th, thermal grease layer 30, radiating layers of copper
40th, screen layer 50, antistatic backing.
Embodiment
As depicted in figs. 1 and 2, a kind of multi-layer combined circuit board of heat dissipation type high includes circuit substrate to the utility model
Layer 10, thermal grease layer 20, radiating layers of copper 30, screen layer 40 and antistatic backing 50, wherein：
The circuit substrate layer 10 includes circuit layer 11, lower circuit layer 12 and is located in circuit layer 11 and lower circuit layer
Rigid insulation layer 13 between 12, the rigid insulation 13 inner hollow of layer, is used for upper electricity in being provided with rigid insulation layer 13
Road floor 11 and the copper post 14 of lower circuit layer 12 conducting, the copper post 14 is vertically through rigid insulation layer 13, the upper end of copper post 14 and upper electricity
Road floor 11 is connected, and lower end is connected with lower circuit layer 12；A plurality of be used for hard is respectively arranged with 13 two ends of rigid insulation layer
In insulating barrier 13 heat discharge heat emission hole 131, in rigid insulation layer 13 upper and lower surface on be respectively arranged with plurality of grooves
132, the thermal grease for being used for absorbing upper circuit layer 11 and the lower heat of circuit layer 12 is filled with the plurality of grooves 132, should
Thermal grease can be such that circuit layer 11 and the lower heat of circuit layer 12 is transferred to faster on rigid insulation layer 13；And in upper circuit layer
Adhesive linkage 15 is respectively arranged between 11 and rigid insulation layer 13 and between lower circuit layer 12 and rigid insulation layer 13, by three
Person is fixed to one another.
The thermal grease layer 20 is arranged on the upper surface of circuit layer 11 and the lower lower surface of circuit layer 12；The radiating layers of copper 30
It is arranged on the outer surface of thermal grease layer 20, radiating layers of copper 30 distributes the heat that thermal grease layer 20 absorbs；The screen layer 40
It is arranged on radiating layers of copper 30 outer surface, to improve the shielding properties of circuit board, reduces its outside electromagnetic interference being subject to；This is prevented
Electrostatic layer 50 is arranged on the outer surface of screen layer 40, for eliminating circuit board surface electrostatic, improves its job stability.
Design focal point of the present utility model is, by by circuit substrate layer, thermal grease layer, radiating layers of copper, screen layer
Circuit board is integrated to form with antistatic backing, the circuit substrate layer is divided into upper and lower circuit layer, radiating is set between upper and lower circuit layer
Hole, can accelerate the air flow at circuit board center, take away the heat produced by it, and combine thermal grease layer and radiating copper
Layer, enables circuit board surface temperature to be reduced rapidly, so that, circuit board is integrally cooled, improve the work of circuit board
Make stability, extend the service life of circuit board.
It is described above, only it is preferred embodiment of the present utility model, not technical scope of the present utility model is made
Any limitation, thus it is every according to technical spirit of the present utility model to any trickle amendment made for any of the above embodiments, equivalent become
Change with modification, in the range of still falling within technical solutions of the utility model.
Claims (4)
1. a kind of multi-layer combined circuit board of heat dissipation type high, it is characterised in that：Include circuit substrate layer, thermal grease layer, dissipate
Hot layers of copper, screen layer and antistatic backing, the circuit substrate layer include circuit layer, lower circuit layer and be located in circuit layer and
Rigid insulation layer between lower circuit layer, rigid insulation layer inner hollow, is used for upper electricity in being provided with rigid insulation layer
Road floor and the copper post of lower circuit layer conducting, and it is respectively arranged with a plurality of be used in rigid insulation layer in rigid insulation layer two ends
The heat emission hole of heat discharge, the thermal grease layer is arranged on circuit layer upper surface and lower circuit layer lower surface, the radiating copper
Layer is arranged on thermal grease layer outer surface, and the screen layer is arranged on radiating layers of copper outer surface, and the antistatic backing is arranged at screen
Cover on layer outer surface.
2. the multi-layer combined circuit board of heat dissipation type high according to claim 1, it is characterised in that：The copper post is vertically passed through
Rigid insulation layer, copper post upper end is connected with upper circuit layer, and lower end is connected with lower circuit layer.
3. the multi-layer combined circuit board of heat dissipation type high according to claim 1, it is characterised in that：The upper circuit layer and hard
Adhesive linkage is respectively arranged between matter insulating barrier and between lower circuit layer and rigid insulation layer.
4. the multi-layer combined circuit board of heat dissipation type high according to claim 1, it is characterised in that：On the rigid insulation layer
Plurality of grooves is respectively arranged with lower surface, being filled with the plurality of grooves is used to absorb upper circuit layer and lower circuit layer
The thermal grease of heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621320451.4U CN206370995U (en) | 2016-12-05 | 2016-12-05 | The multi-layer combined circuit board of heat dissipation type high |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621320451.4U CN206370995U (en) | 2016-12-05 | 2016-12-05 | The multi-layer combined circuit board of heat dissipation type high |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206370995U true CN206370995U (en) | 2017-08-01 |
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ID=59392112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621320451.4U Active CN206370995U (en) | 2016-12-05 | 2016-12-05 | The multi-layer combined circuit board of heat dissipation type high |
Country Status (1)
| Country | Link |
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| CN (1) | CN206370995U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108174505A (en) * | 2017-11-29 | 2018-06-15 | 苏州诺纳可电子科技有限公司 | A kind of MULTILAYER COMPOSITE circuit board |
| CN110176258A (en) * | 2019-07-06 | 2019-08-27 | 温州科技职业学院 | A kind of mobile electronic information-storing device |
| CN111683461A (en) * | 2020-05-29 | 2020-09-18 | 珠海新业电子科技有限公司 | Manufacturing method of circuit board |
-
2016
- 2016-12-05 CN CN201621320451.4U patent/CN206370995U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108174505A (en) * | 2017-11-29 | 2018-06-15 | 苏州诺纳可电子科技有限公司 | A kind of MULTILAYER COMPOSITE circuit board |
| CN110176258A (en) * | 2019-07-06 | 2019-08-27 | 温州科技职业学院 | A kind of mobile electronic information-storing device |
| CN111683461A (en) * | 2020-05-29 | 2020-09-18 | 珠海新业电子科技有限公司 | Manufacturing method of circuit board |
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