CN206324777U - EIT electrod-arrays, multi-electrode body surface bio-electrical impedance sensor and intelligent watch - Google Patents
EIT electrod-arrays, multi-electrode body surface bio-electrical impedance sensor and intelligent watch Download PDFInfo
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- CN206324777U CN206324777U CN201620918144.XU CN201620918144U CN206324777U CN 206324777 U CN206324777 U CN 206324777U CN 201620918144 U CN201620918144 U CN 201620918144U CN 206324777 U CN206324777 U CN 206324777U
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Abstract
The utility model is related to EIT imaging detection technologies field, specifically related to a kind of EIT electrod-arrays, multi-electrode body surface bio-electrical impedance sensor and intelligent watch, the spheric electrode that wherein electrod-array is made up of some metal materials is arranged in a combination according to composite figure outward appearance, spheric electrode is directly welded at PCB surface by solder, forms the measuring electrode that organism skin is contacted in measurement;The manufacture method of the electrod-array is by the way of " tin cream "+" copper ball ", by electrode welding to PCB surface.Electrod-array in the utility model, traditional lead electrode approach is prevented, has reduced noise, interference and introduce, prevented influence of the capacitive load to signal of long cable on circuit, it can realize that product is minimized, it is easy to use on small type mobile devices, wearable product, simultaneously as spheric electrode is cambered surface form with the contact of skin, when applying on intelligent watch, contact area is not only increased, and is not stabbed again or shouting pain skin, test experience effect is good.
Description
Technical field
The utility model is related to EIT imaging detection technologies field, and in particular to a kind of EIT electrod-arrays, multi-electrode body surface
Bio-electrical impedance sensor and intelligent watch.
Background technology
Traditional biomedicine signals sensor is generally provided with the electrode slice of one or more electrode, or electrode holder
Son, these electrodes are connected to signal processing unit by respective lead or wiring, and being each connected to the electrode of human body has
The clip that lead connects up terminals, socket are connected to, or is welded on binding post.
But there is Railway Project in this method:
One is that such attachment structure can be produced by between clip and the terminals of lead wiring when people's movement of inspection
Friction caused by extraordinary noise.The extraordinary noise can reduce the accuracy of the detection of biomedicine signals, also, be connected to electricity
The lead of pole can limit the movement of people, and hinder first aid process during the situation of particularly urgent.
Two allow for the skin conditions of the high-impedance behavior of human body skin and different people, often will on traditional electrode
Gel rubber material is applied to promote stable electrode base.But, these materials can cause the uncomfortable sensation of human body, and sometimes
Time causes fash on sensitive skin.
Three be that single electrode volume is excessive, and array is even more to increase area occupied, is unfavorable for realizing that multiple electrode array is measured
And miniaturization.In today's society, health monitoring and monitoring become more and more important, and the application scenarios of portable set are more and more, so
Miniaturization is also more and more important.
Utility model content
In view of the shortcomings of the prior art, the utility model provides a kind of EIT electrod-arrays, multi-electrode body surface biologic resistance
Anti- sensor and intelligent watch, can not only complete that multi-electrode is integrated, electrical uniformity is good, and solve single in the prior art
Individual electrode volume is excessive, the problems such as electrod-array area occupied is big, can realize that product is minimized, be easy to small type mobile devices
Use.
To realize object above, the utility model is achieved by the following technical programs:
A kind of EIT electrod-arrays, it is characterised in that:The spheric electrode that electrod-array is made up of some metal materials is according to group
Close graphical appearance to be arranged in a combination, spheric electrode is directly welded on PCB surface by solder, form the contact life in measurement
The measuring electrode of object skin.
Preferably, the spheric electrode is spherical or elliposoidal.
Preferably, the spheric electrode is copper ball.
Preferably, the combination image outward appearance is rectangle, square, circle, ellipse, rhombus, trapezoidal or sector.
Preferably, the electrode array designs are the electrod-array of de-centralized, the electrod-array of the de-centralized with
Multiple independent, separation irregular form arrangements.
A kind of manufacture method of EIT electrod-arrays, it is characterised in that:Comprise the following steps:
a)First, spacing is determined between the composite figure outward appearance of EIT electrod-arrays arrangement to be designed, electrode and single
Electrode shape;
B) secondly, prepare to plant ball instrument, plant ball seat, clean metal ball, solder, solder printing frame, scraping blade, plant ball steel
Net, pad and PCB, clean and dry wherein planting ball seat alcohol, had some setbacks in order to avoid metal ball is rolled;
C) PCB carries out positioning;
D) solder naturally to thaw and stir, be uniformly coated onto on scraping blade;
E) toward solder printing frame printing solder on the PCB local sleeves having good positioning, angle, dynamics when control hand scrapes solder and
Pull speed, after the completion of gently disengage solder printing frame;
F) confirm that each pad on PCB is uniformly printed on after solder, then plant ball steel mesh is put positioning, be then placed in gold
Belong to ball, shake and plant ball seat, allow metal ball to roll into mesh, confirm that each mesh has after a metal ball, pack up metal ball simultaneously
De- plate;
G) it is last, the reverse PCB for planting good shot is carried out Reflow Soldering or BGA maintenance platform hot air weldings.
Preferably, state in step b, metal ball is copper ball, solder is tin cream, and solder printing frame is paste solder printing frame.
Preferably, state in step b, PCB material is FR4 or metal substrate or ceramic substrate.
A kind of multi-electrode body surface bio-electrical impedance sensor, it is characterised in that:Including EIT electrod-arrays.
A kind of intelligent watch, including watchband and watch rear cover, it is characterised in that:The watch rear cover is internally provided with foregoing
Multi-electrode body surface bio-electrical impedance sensor, and EOT photoelectric sensors, NTC temperature sensors and EIT public electrodes.
The beneficial effects of the utility model:
1. in the manufacture method of EIT electrod-arrays, ball bonding pad is planted not at the IC back side, but above PCB, apply flexibly
IC plants ball, the problem of solving in practice;
2. the distance between each ball electrode, the standard requirement of spread geometry no standard, it is only necessary to according to the spherical of selection
Depending on the concrete condition of electrode, using flexibly extensively, it is only necessary to which customizing corresponding plant ball steel mesh just can be with;
3. completion multi-electrode is integrated, queueing discipline, electrical uniformity is good, on material, can be using above copper ball in
It is gold-plated, nickel plating, or using a variety of extended methods such as the skin compatible materials such as silver-colored tungsten material, so in increase solderability, it is corrosion-resistant and
On the basis of oxidative resistance, and good electric property can be kept;
4. realizing that product is minimized, it is easy to realize multielectrode sensor mode on small type mobile devices, wearable product;
5. preventing traditional lead electrode approach, reduce noise, interference and introduce, prevented the capacitive of long cable on circuit
Load the influence to signal;
6. spheric electrode is cambered surface form with skin contact, when being applied to wearable device, enlarged contact areas, and is not stabbed
Or shouting pain skin, test experience effect good.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the accompanying drawing to be used needed for description of the prior art is briefly described, it should be apparent that, for ordinary skill people
For member, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the side view of electrode assembling in the utility model electrod-array;
Fig. 2 is single electrode assembling partial enlarged drawing in Fig. 1;
Fig. 3 is the utility model electrod-array composite figure schematic appearance;
Fig. 4 is the utility model electrod-array composite figure schematic appearance;
Fig. 5 is the utility model electrod-array composite figure schematic appearance;
Fig. 6 is the stereogram of the utility model intelligent watch;
Fig. 7 is the utility model intelligent watch back position structural representation;
Fig. 8 is X5128 IC, EIT electrod-array, the reality of EOT photoelectric sensors combination in the utility model intelligent watch
Application schematic diagram;
Wherein, 1. copper ball;2. pad;3.PCB substrates;10. watchband;11. watch back cover;12.NTC temperature sensors;
13.EOT photoelectric sensors;14. electrod-array;15.EIT public electrodes;16. human body skin is illustrated;17.X 5128 BGA IC.
Embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Accompanying drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described.Based on this practicality
Embodiment in new, the every other reality that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example is applied, the scope of the utility model protection is belonged to.
In the prior art, traditional biomedicine signals sensor is generally provided with the electrode of one or more electrode
Piece, or electrode clamp, these electrodes are connected to signal processing unit by respective lead or wiring, are each connected to people
The electrode of body, which has, is connected to the clip that lead connects up terminals, socket, or is welded on binding post, as the people of inspection
When mobile, such attachment structure can produce the extraordinary noise as caused by the friction between clip and the terminals of lead wiring.
The extraordinary noise can reduce the accuracy of the detection of biomedicine signals, also, be connected to the lead of electrode and can limit the shifting of people
It is dynamic, and hinder first aid process during the situation of particularly urgent.Secondly, single electrode volume is excessive, and array is even more to increase
Area occupied, is unfavorable for realizing multiple electrode array measurement and minimizes.
Based on this, a kind of EIT electrod-arrays of multi-electrode body surface bio-electrical impedance sensor, the electricity are applicant provided
The spheric electrode that pole array is made up of some metal materials is arranged in a combination according to composite figure outward appearance, and spheric electrode passes through weldering
Material is directly welded on PCB surface, forms the measuring electrode that organism skin is contacted in measurement.
Further, spheric electrode is spherical or elliposoidal.
Further, spheric electrode is copper ball.
Further, its encapsulation is designed as surface mount packages form.
Further, the face shaping after electrod-array arrangement can be according to specific product design, technological esthetics
Design and measurement need and arranged, and can be rectangle, square, circle, ellipse, rhombus, trapezoidal, sector, or other
Meaning polygon, as shown in Fig. 3, Fig. 4, Fig. 5.Can also be as needed, the electrod-array of de-centralized is designed as, with multiple lists
Solely, the irregular form of separation is arranged.
As shown in Figure 1 and Figure 2.In the utility model, the manufacture method of EIT electrod-arrays is used anti-on PCB
To the mode for planting ball.Using the reflow soldering process of standard, by electrode welding to PCB surface, its process and method when welding
Similar BGA plant ball technique, but in the utility model, be to be carried out on PCB surface, be " tin cream "+" copper by the way of
The mode of ball ", plants ball in this case, and glossiness is good, and molten tin process is not in the existing picture of jumping ball, is relatively easy to control and grasps.Tool
Body, first on the pad 2 with the substrate 3 on paste solder printing to PCB(Similar BGA substrate), then with plant ball steel mesh above
Plus a certain size copper ball 1, at this moment tin cream role is exactly to cling copper ball, and allows when heating the contact surface of copper ball
It is bigger, the heated of copper ball faster more comprehensively such copper ball, is melted after tin with BGA pad solder more preferably by tin cream, reduce
The possibility of rosin joint.
Comprise the following steps that:
First, spacing and single electricity between the composite figure outward appearance of EIT electrod-arrays arrangement to be designed, electrode are determined
Pole shape;
Secondly, get out plant the instrument of ball, including plant ball seat, clean copper ball, tin cream, paste solder printing frame, scraping blade, plant
Ball steel mesh, pad and PCB etc., wherein, plant ball seat alcohol and clean and dry, had some setbacks in order to avoid copper ball is rolled;Copper ball is simultaneously
It is clean;
Then, PCB carries out positioning;Tin cream naturally to thaw and stir, and be uniformly coated onto on scraping blade;Toward what is had good positioning
Paste solder printing frame print solder paste on PCB local sleeves, the control good hand that to try one's best scrapes the speed of angle during cream, dynamics and pulling, complete
Tin cream frame is gently disengaged after;
Then, then confirm that each pad on PCB is uniformly printed on after tin cream, then plant ball steel mesh is put positioning, thereafter
Copper ball is put into, shakes and plants ball seat, allows copper ball to roll into mesh, confirms that each mesh can keep copper ball well simultaneously after having a copper ball
De- plate;
Finally, the reverse PCB for planting good shot is carried out Reflow Soldering or BGA maintenance platform hot air weldings, while noting grasping
Welding temperature.
Further, the material of foregoing ball is not limited to copper ball, can select other metal materials, or use plated surface
Gold, nickel plating etc..
Further, the diameter of ball can be adjusted according to actual conditions, but in the utility model, be not suitable for electrode mistake
Big application scenario, such as ball are more than 2 millimeters, it is necessary to consider other electrode methods.
Further, PCB material(Substrate), it is not limited to Rigid substrate materials, such as FR4, metal substrate, ceramic substrate
Deng or flexible substrate material, such as FPC(Can be with local strengthening).
It is mainly to have at following 2 points that the utility model plants ball difference with conventional BGA:
1. planting ball bonding pad not at the IC back side, but above PCB, apply flexibly IC and planted ball, solve asking in practice
Topic, simultaneously as what is used is not tin ball, but copper ball, it you must use tin cream;
2. the distance between each ball electrode, the standard requirement of spread geometry no standard, it is only necessary to according to the spherical of selection
, just can be with using flexibly extensively, need to only customize corresponding plant ball steel mesh depending on the concrete condition of electrode.Simultaneously, it is necessary to according to reality
The situation on border selects suitable welding temperature and Reflow Soldering curve, mainly with PCB material, thickness, tin cream situation and copper ball
Diameter it is relevant with material.
In the utility model, the electrod-array and its manufacture method have the following advantages:
1. completion multi-electrode is integrated, queueing discipline, electrical uniformity is good;
2., can be using gold-plated, nickel plating above copper ball on material, or use skin compatible materials such as silver-colored tungsten material etc.
A variety of extended methods, so on the basis of increase solderability, corrosion-resistant and oxidative resistance, and can keep good electrical resistance
Energy;
3. can realize that product is minimized, it is easy to realize multielectrode sensor on small type mobile devices, wearable product
Mode;
4. preventing traditional lead electrode approach, reduce noise, interference and introduce, prevented the capacitive of long cable on circuit
Load the influence to signal;
5. spheric electrode is cambered surface form with skin contact, enlarged contact areas, and not stabbing or shouting pain skin is tested
Experience effect is good.
Specific embodiment:
According to the above, a kind of multi-electrode body surface bio-electrical impedance sensor, including above-mentioned electrode are applicant provided
The electrod-array 14 that the manufacture method of array is obtained.
As shown in Figure 6, Figure 7.Based on the multi-electrode body surface bio-electrical impedance sensor, applicant provide a kind of intelligence and wear
Wear equipment, i.e., a kind of intelligent watch, it includes watchband 10 and watch rear cover 11, and the watch rear cover is internally provided with including more electric
Polar body table bio-electrical impedance sensor, EOT photoelectric sensors 13, NTC temperature sensors 12 and EIT public electrodes 15.Specifically,
The Application No. 201510895091.4 that applicant applies, patent entitled " biological harmonious degree detection means and detection side can be combined
The patent of method " is understood.
Wherein, the public electrode 15 of an EIT measurement is assembled using spring electrode approach in the region of watchband 10, using bullet
Spring mode, it is ensured that be in close contact after wearing with wrist inside skin.
Secondly, above the dial plate around cover full EIT 128 " probes " composition electrod-array 14, it is middle to surround
Sensor is NTC resistance body temperature trans 12 and EOT photoelectric sensors 13.
It should be noted that the method that EIT electrod-arrays 14 plant ball using the copper ball of mistake described previously herein is realized.Exist
Due to using copper ball as electrode, therefore it is the EIT electrod-arrays of 128 copper ball compositions in the application.While the plant ball
Substrate is same with the X5128 of Xin Fu companies IC substrates 17, and X5128 IC are assembled in TOP faces, and various kinds of sensors is assembled in
BOTTOM faces, which greatly reduce the wire length of signal.It is cambered surface form with skin contact further, since being spheric electrode,
Therefore contact area is increased, and do not stabbed or shouting pain skin, test experience effect is good.
Fig. 8 gives the practical application schematic diagram that X5128 IC, EIT electrod-array, EOT photoelectric sensors are combined.
It should be noted that:
Can be arbitrary shape 1. the structure of dial plate is not limited to round rectangle;
2. the arrangement of electrode is also not necessarily limited to be arranged as regular shape, can according to wrist-watch outward appearance, look after body mechanics, pendant
Band comfortableness design, the position of EOT photoelectric sensors is also that can be adjusted according to reflected light path, structure, Product Definition.
Above example is only to illustrate the technical solution of the utility model, rather than its limitations;Although with reference to foregoing reality
Example is applied the utility model is described in detail, it will be understood by those within the art that:It still can be to preceding
State the technical scheme described in each embodiment to modify, or equivalent is carried out to which part technical characteristic;And these
Modification is replaced, and the essence of appropriate technical solution is departed from the spirit and model of each embodiment technical scheme of the utility model
Enclose.
Claims (7)
1. a kind of EIT electrod-arrays, it is characterised in that:The spheric electrode that the electrod-array is made up of some metal materials according to
Composite figure outward appearance is arranged in a combination, and the spheric electrode is directly welded on PCB surface by solder, is formed in measurement
Contact the measuring electrode of organism skin.
2. a kind of EIT electrod-arrays according to claim 1, it is characterised in that:The spheric electrode is spherical or ellipsoid
Shape.
3. a kind of EIT electrod-arrays according to claim 2, it is characterised in that:The spheric electrode is copper ball.
4. a kind of EIT electrod-arrays according to claim 1, it is characterised in that:The combination image outward appearance is rectangle, just
Square, circular, ellipse, rhombus, trapezoidal or sector.
5. a kind of EIT electrod-arrays according to claim 1, it is characterised in that:The electrode array designs are non-pooled
The electrod-array of formula, the electrod-array of the de-centralized is arranged with multiple independent, separation irregular forms.
6. a kind of multi-electrode body surface bio-electrical impedance sensor, it is characterised in that:Including EIT electrodes as claimed in claim 1
Array.
7. a kind of intelligent watch, including watchband and watch rear cover, it is characterised in that:The watch rear cover is internally provided with such as right
It is required that the multi-electrode body surface bio-electrical impedance sensor described in 6, and EOT photoelectric sensors, NTC temperature sensors and EIT are public
Common electrode.
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106236092A (en) * | 2016-08-22 | 2016-12-21 | 合肥芯福传感器技术有限公司 | EIT electrod-array and manufacture method thereof and device based on this electrod-array |
CN109431503A (en) * | 2018-10-11 | 2019-03-08 | 南京邮电大学 | A kind of miniature EIT device of wireless transmission |
CN111024772A (en) * | 2019-12-03 | 2020-04-17 | 西安科技大学 | Laser cladding molten pool micro-resistance distribution imaging method and device |
US11166104B2 (en) | 2014-02-11 | 2021-11-02 | Apple Inc. | Detecting use of a wearable device |
US11281262B2 (en) | 2014-02-11 | 2022-03-22 | Apple Inc. | Detecting a gesture made by a person wearing a wearable electronic device |
US11432766B2 (en) | 2017-09-05 | 2022-09-06 | Apple Inc. | Wearable electronic device with electrodes for sensing biological parameters |
US11504057B2 (en) | 2017-09-26 | 2022-11-22 | Apple Inc. | Optical sensor subsystem adjacent a cover of an electronic device housing |
-
2016
- 2016-08-22 CN CN201620918144.XU patent/CN206324777U/en active Active
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11166104B2 (en) | 2014-02-11 | 2021-11-02 | Apple Inc. | Detecting use of a wearable device |
US11281262B2 (en) | 2014-02-11 | 2022-03-22 | Apple Inc. | Detecting a gesture made by a person wearing a wearable electronic device |
CN106236092A (en) * | 2016-08-22 | 2016-12-21 | 合肥芯福传感器技术有限公司 | EIT electrod-array and manufacture method thereof and device based on this electrod-array |
US11432766B2 (en) | 2017-09-05 | 2022-09-06 | Apple Inc. | Wearable electronic device with electrodes for sensing biological parameters |
US11504057B2 (en) | 2017-09-26 | 2022-11-22 | Apple Inc. | Optical sensor subsystem adjacent a cover of an electronic device housing |
CN109431503A (en) * | 2018-10-11 | 2019-03-08 | 南京邮电大学 | A kind of miniature EIT device of wireless transmission |
CN111024772A (en) * | 2019-12-03 | 2020-04-17 | 西安科技大学 | Laser cladding molten pool micro-resistance distribution imaging method and device |
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