CN205754850U - A kind of mike, the integrating device of environmental sensor - Google Patents
A kind of mike, the integrating device of environmental sensor Download PDFInfo
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- CN205754850U CN205754850U CN201620456944.4U CN201620456944U CN205754850U CN 205754850 U CN205754850 U CN 205754850U CN 201620456944 U CN201620456944 U CN 201620456944U CN 205754850 U CN205754850 U CN 205754850U
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- pcb board
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- environmental sensor
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- 230000007613 environmental effect Effects 0.000 title claims abstract description 45
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 4
- 241000196324 Embryophyta Species 0.000 description 1
- 241000209140 Triticum Species 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
This utility model relates to the integrating device of a kind of mike, environmental sensor, is provided with microphone chip, asic chip in described first cavity volume；It is provided with environmental sensor chip in described second cavity volume；Wherein, also include connecting microphone chip, environmental sensor chip and extraneous passage.Integrating device of the present utility model, microphone chip, environmental sensor chip are separately positioned on and are positioned in the first cavity volume of the first pcb board both sides, the second cavity volume, this reduces the size of whole integrating device, such that it is able to save microphone chip, the taking up room of environmental sensor chip, make that product can do is less, to meet the miniaturization of modern electronic product.Microphone chip, environmental sensor chip are arranged in two cavity volumes, and are isolated by the first pcb board, thus can avoid the interference problem between two chips.
Description
Technical field
This utility model relates to the integrating device of sensor, more specifically, this utility model relates to one
Mike and the integrating device of environmental sensor.
Background technology
In recent years, along with the development of science and technology, the volume of the electronic product such as mobile phone, notebook computer
Constantly reducing, and people are more and more higher to the performance requirement of these portable electronic products, this is just
The volume requiring matched electronic component also must reduce therewith.
Sensor, as measuring device, has been commonly utilized in the electronic product such as mobile phone, notebook computer
On.In existing process structure, owing to the principle of detection is different, MEMS microphone and MEMS ring
Border sensor chip is usually discrete；Assembling when, system manufacturer is by MEMS microphone chip
Being mounted on respectively on same mainboard with MEMS environmental sensor chip, this makes the mainboard that chip takies
Area is relatively big, is unfavorable for the miniaturization of modern electronic product.And tradition by microphone chip with
Other integrated chip together when, microphone chip is easily subject to the electromagnetic interference of other chip.
Utility model content
A purpose of the present utility model there is provided the integrating device of a kind of mike, environmental sensor.
According to an aspect of the present utility model, it is provided that a kind of mike, the integrated dress of environmental sensor
Put, including the first pcb board, and surround the housing of the first cavity volume with the first pcb board wherein side,
It is provided with microphone chip, asic chip in described first cavity volume；Also include being positioned at the first pcb board
Second pcb board of opposite side, described second pcb board surrounds second by side of sidewall portion and the first pcb board
Cavity volume, is provided with environmental sensor chip in described second cavity volume；Wherein, also include connecting Mike
Wind chip, environmental sensor chip and extraneous passage.
Optionally, described microphone chip, asic chip are arranged on the first pcb board.
Optionally, described passage includes the first through hole being arranged on the first pcb board, and arranges
The second through hole on the second pcb board.
Optionally, described microphone chip is arranged on the position being positioned at the first through hole on the first pcb board.
Optionally, described microphone chip is arranged on the position deviateing the first through hole on the first pcb board,
So that the second cavity volume and the first cavity volume are connected together by the first through hole.
Optionally, described passage includes the first through hole being arranged on the first pcb board, and arranges
The second through hole on housing.
Optionally, described microphone chip is arranged on the position deviateing the first through hole on the first pcb board,
So that the second cavity volume and the first cavity volume are connected together by the first through hole.
Optionally, described first through hole is arranged on the first pcb board near environmental sensor chip
One end.
Optionally, described environmental sensor chip is welded on the second pcb board (2) in the way of planting stannum ball
On.
Optionally, described environmental sensor chip is that pressure, temperature, humidity, gas or optics pass
Sensor chip.
Integrating device of the present utility model, is separately positioned on microphone chip, environmental sensor chip
It is positioned in the first cavity volume of the first pcb board both sides, the second cavity volume, this reduces whole integrating device
Size, such that it is able to save microphone chip, the taking up room of environmental sensor chip so that produce
It is less that product can do, to meet the miniaturization of modern electronic product.By microphone chip, ring
Border sensor chip is arranged in two cavity volumes, and is isolated by the first pcb board, thus can avoid two
Interference problem between individual chip.
By detailed description to exemplary embodiment of the present utility model referring to the drawings, this practicality
Novel further feature and advantage thereof will be made apparent from.
Accompanying drawing explanation
The accompanying drawing of the part constituting description describes embodiment of the present utility model, and together with saying
Bright book is used for explaining principle of the present utility model together.
Fig. 1 is the structural representation of this utility model integrating device.
Fig. 2 is the structural representation of this utility model another embodiment of integrating device.
Detailed description of the invention
Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should be noted that
Arrive: unless specifically stated otherwise, the relative cloth of the parts illustrated the most in these embodiments and step
Put, numerical expression and numerical value are not intended to scope of the present utility model.
Description only actually at least one exemplary embodiment is illustrative below, never makees
For to this utility model and application thereof or any restriction of use.
May be not discussed in detail for technology and equipment known to person of ordinary skill in the relevant, but
In the appropriate case, described technology and equipment should be considered a part for description.
Shown here with in all examples discussed, any occurrence should be construed as merely example
Property rather than as limit.Therefore, other example of exemplary embodiment can have different
Value.
It should also be noted that similar label and letter represent similar terms, therefore, one in following accompanying drawing
A certain Xiang Yi the accompanying drawing of denier is defined, then need not it is carried out further in accompanying drawing subsequently
Discuss.
With reference to Fig. 1, this utility model provides the integrating device of a kind of mike, environmental sensor,
Can be by microphone chip together with environmental sensor integrated chip.It includes the first pcb board 1, with
And surround the housing 7 of the first cavity volume 4 with the first pcb board 1 wherein side.Housing 7 preferably employs gold
Belong to housing, such as, by the way of bonding or ultra-sonic welded, housing 7 can be connected to the first pcb board
1 wherein side so that this first pcb board 1 defines the first airtight cavity volume 4 with housing 7.Institute
Microphone chip 6 and asic chip 5 it is provided with in stating the first cavity volume 4.Wherein, described mike
Chip 6, asic chip 5 can be arranged on the first pcb board 1, such as, can use this area skill
Microphone chip 6 and asic chip 5 are mounted on the first pcb board 1 by the mode known to art personnel
On, by the way of routing, the pin of microphone chip 6 and asic chip 5 is connected electrically in first
In the circuit of pcb board 1.It is of course also possible to use plant the mode of stannum ball by microphone chip 6 and
Asic chip 5 is directly welded in the respective pad of the first pcb board 1.
Above-mentioned housing 7 is arranged on the wherein side of the first pcb board 1, at described first pcb board 1
Opposite side is additionally provided with the second pcb board 2, and described second pcb board 2 is by side of sidewall portion 11 and a PCB
Plate 1 defines the second cavity volume 3.With reference to Fig. 1, it is supported by the side of sidewall portion 11 of an annular, from
And the second pcb board 2 is fixed on the first pcb board 1 so that the second pcb board 2, side of sidewall portion 11,
First pcb board 1 defines the second airtight cavity volume 3.Wherein, described side of sidewall portion 11 and the 2nd PCB
Plate 2 can be one.It is provided with environmental sensor chip 8, this ring in described second cavity volume 3
Border sensor chip 8 is such as directly welded at the respective pad of the second pcb board 2 in the way of planting stannum ball
On, not only achieve environmental sensor chip 8 and the mechanical connection of the second pcb board 2, also environment
The signal of telecommunication of sensor chip 8 is incorporated in the circuit of the second pcb board 2.
Environmental sensor chip 8 of the present utility model, can be pressure, temperature, humidity, gas or
Optical pickocff, it is also possible to be other sensor measuring ambient parameter.According to environmental sensor not
With, select corresponding sensor chip；It is such as pressure sensing when environmental sensor of the present utility model
During device, then its chip is selected pressure-sensitive chip, this belong to those skilled in the art known often
Know, no longer illustrate at this.
Integrating device of the present utility model, also includes connecting microphone chip 6, environmental sensor chip
8 with extraneous passage.Extraneous sound is in described passage can be applied to microphone chip 6
On vibrating diaphragm, microphone chip 6 thus can be made to send the corresponding signal of telecommunication；The change of external environment is passed through
Described channeling, in the sensitive membrane of environmental sensor chip 8, thus can make environmental sensor chip
8 send the corresponding signal of telecommunication.Microphone chip 6 such as can select MEMS microphone chip, its with
The structure of environmental sensor chip and operation principle belong to the common knowledge of those skilled in the art,
No longer illustrate at this.
Passage of the present utility model can be the through hole arranged, such as, can arrange on the first pcb board 1
Through hole so that the external world connects with the microphone chip 6 in the first cavity volume, extraneous sound leads to through this
Hole can act on microphone chip 6.Such as through hole can be set on the second pcb board 2 so that outer
Boundary connects with the environmental sensor chip 8 in the second cavity volume, and the change of external environment can act on environment
On sensor chip 8.
This utility model one preferred embodiment in, described passage includes being arranged on a PCB
The first through hole 9 on plate 1, and the second through hole 10 being arranged on the second pcb board 2, with reference to figure
1.By being respectively provided with first through hole the 9, second through hole 10 at first pcb board the 1, second pcb board 2,
The sound making the external world can act on wheat through second through hole the 10, second cavity volume the 3, first through hole 9
On gram wind chip 6；The change of external environment can act directly on environmental sensor through the second through hole 10
On chip 3.
It should be noted that described microphone chip 6 to may be installed on the first pcb board 1 to be positioned at this
The position of the first through hole 9, so that the second cavity volume 3 is directly communicated on the vibrating diaphragm of microphone chip 6.
Now, extraneous sound acts directly on through second through hole the 10, second cavity volume the 3, first through hole 9
On the vibrating diaphragm of microphone chip 6, without entering into the inside of the first cavity volume 4.Another preferably,
Described microphone chip 6 is arranged on the position deviateing the first through hole 9 on the first pcb board 1, so that the
Two cavity volumes 3 are connected together by the first through hole 9 with the first cavity volume 4.Now, extraneous sound warp
Cross second through hole the 10, second cavity volume the 3, first through hole 9 to enter in the first cavity volume 4, and act on
On the vibrating diaphragm of microphone chip 6.
This utility model another preferred embodiment in, described passage includes being arranged on first
The first through hole 9 on pcb board 1, and the second through hole 10 being arranged on housing 7, with reference to Fig. 2.
By being respectively provided with first through hole the 9, second through hole 10 at the first pcb board 1, housing 7 so that outer
The sound on boundary can act on microphone chip 6 through second through hole the 10, first cavity volume 4；Extraneous
The change of environment can be through second through hole the 10, first cavity volume the 4, first through hole the 9, second cavity volume 3,
Act on eventually on environmental sensor chip 3.
It should be noted that to make first cavity volume the 4, second cavity volume 3 be connected together at this, institute
State microphone chip 6 and be arranged on the position deviateing the first through hole 9 on the first pcb board 1.The most excellent
Choosing, described first through hole 9 is arranged on the first pcb board 1 near environmental sensor chip 8
One end, this just shortens environmental sensor chip 8 to extraneous distance so that this environmental sensor core
The precision of sheet 8 is higher.
Integrating device of the present utility model, is separately positioned on microphone chip, environmental sensor chip
It is positioned in the first cavity volume of the first pcb board both sides, the second cavity volume, this reduces whole integrating device
Size, such that it is able to save microphone chip, the taking up room of environmental sensor chip so that produce
It is less that product can do, to meet the miniaturization of modern electronic product.By microphone chip, ring
Border sensor chip is arranged in two cavity volumes, and is isolated by the first pcb board, thus can avoid two
Interference problem between individual chip.This utility model passage is preferable to provide mode so that mike core
Sheet, environmental sensor chip are in communication with the outside by being positioned at the through hole of integrating device the same side, and this is significantly
Simplify integrating device installation on exterior terminal.
Although specific embodiments more of the present utility model being described in detail by example,
But it should be appreciated by those skilled in the art, above example is merely to illustrate rather than be
Restriction scope of the present utility model.It should be appreciated by those skilled in the art, can be without departing from this reality
In the case of novel scope and spirit, above example is modified.Model of the present utility model
Enclose and be defined by the following claims.
Claims (10)
1. a mike, the integrating device of environmental sensor, it is characterised in that: include a PCB
Plate (1), and surround the housing (7) of the first cavity volume (4) with the first pcb board (1) wherein side,
Microphone chip (6), asic chip (5) it is provided with in described first cavity volume (4)；Also wrap
Include the second pcb board (2) being positioned at the first pcb board (1) opposite side, described second pcb board (2)
Surround the second cavity volume (3) by side of sidewall portion (11) and the first pcb board (1), hold described second
Environmental sensor chip (8) it is provided with in chamber (3)；Wherein, also include connect microphone chip (6),
Environmental sensor chip (8) and extraneous passage.
Integrating device the most according to claim 1, it is characterised in that: described microphone chip
(6), asic chip (5) is arranged on the first pcb board (1).
Integrating device the most according to claim 2, it is characterised in that: described passage includes setting
Put the first through hole (9) on the first pcb board (1), and be arranged on the second pcb board (2)
The second through hole (10).
Integrating device the most according to claim 3, it is characterised in that: described microphone chip
(6) position being positioned at the first through hole (9) on the first pcb board (1) it is arranged on.
Integrating device the most according to claim 3, it is characterised in that: described microphone chip
(6) position of the first pcb board (1) upper deviation the first through hole (9) it is arranged on, so that the second cavity volume
(3) it is connected together by the first through hole (9) with the first cavity volume (4).
Integrating device the most according to claim 2, it is characterised in that: described passage includes setting
Put the first through hole (9) on the first pcb board (1), and be arranged on second on housing (7)
Through hole (10).
Integrating device the most according to claim 6, it is characterised in that: described microphone chip
(6) position of the first pcb board (1) upper deviation the first through hole (9) it is arranged on, so that the second cavity volume
(3) it is connected together by the first through hole (9) with the first cavity volume (4).
Integrating device the most according to claim 6, it is characterised in that: described first through hole (9)
It is arranged on the upper one end near environmental sensor chip (8) of the first pcb board (1).
Integrating device the most according to claim 1, it is characterised in that: described environmental sensor
Chip (8) is welded on the second pcb board (2) in the way of planting stannum ball.
Integrating device the most according to claim 1, it is characterised in that: described environmental sensor
Chip (8) is pressure, temperature, humidity, gas or optical sensor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620456944.4U CN205754850U (en) | 2016-05-17 | 2016-05-17 | A kind of mike, the integrating device of environmental sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620456944.4U CN205754850U (en) | 2016-05-17 | 2016-05-17 | A kind of mike, the integrating device of environmental sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205754850U true CN205754850U (en) | 2016-11-30 |
Family
ID=57364131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620456944.4U Active CN205754850U (en) | 2016-05-17 | 2016-05-17 | A kind of mike, the integrating device of environmental sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205754850U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109238325A (en) * | 2017-07-10 | 2019-01-18 | 研能科技股份有限公司 | Actuation sensor module |
| CN109238328A (en) * | 2017-07-10 | 2019-01-18 | 研能科技股份有限公司 | Has the electronic device of actuation sensor module |
| CN109348389A (en) * | 2018-12-07 | 2019-02-15 | 歌尔股份有限公司 | Combination sensor and electronic equipment |
| CN109362013A (en) * | 2018-12-07 | 2019-02-19 | 歌尔股份有限公司 | Combination sensor |
| CN110470700A (en) * | 2019-07-11 | 2019-11-19 | 维沃移动通信有限公司 | Sensor module, sensor and terminal device |
| CN111384461A (en) * | 2018-12-29 | 2020-07-07 | 中信国安盟固利动力科技有限公司 | Multi-parameter integrated device of ion battery and preparation method thereof |
| CN112788481A (en) * | 2020-12-10 | 2021-05-11 | 美律电子(深圳)有限公司 | Microphone module |
| CN113299319A (en) * | 2021-05-25 | 2021-08-24 | 华晨鑫源重庆汽车有限公司 | Voice recognition module and recognition method based on edge AI chip |
| US11255322B2 (en) | 2017-07-10 | 2022-02-22 | Microjet Technology Co., Ltd. | Electronic device with actuating and sensing module |
| CN109348389B (en) * | 2018-12-07 | 2024-05-24 | 歌尔微电子股份有限公司 | Combined sensor and electronic device |
-
2016
- 2016-05-17 CN CN201620456944.4U patent/CN205754850U/en active Active
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109238325B (en) * | 2017-07-10 | 2023-10-03 | 研能科技股份有限公司 | Actuation sensing module |
| CN109238328A (en) * | 2017-07-10 | 2019-01-18 | 研能科技股份有限公司 | Has the electronic device of actuation sensor module |
| CN109238325A (en) * | 2017-07-10 | 2019-01-18 | 研能科技股份有限公司 | Actuation sensor module |
| US11255322B2 (en) | 2017-07-10 | 2022-02-22 | Microjet Technology Co., Ltd. | Electronic device with actuating and sensing module |
| CN109348389A (en) * | 2018-12-07 | 2019-02-15 | 歌尔股份有限公司 | Combination sensor and electronic equipment |
| CN109362013A (en) * | 2018-12-07 | 2019-02-19 | 歌尔股份有限公司 | Combination sensor |
| CN109348389B (en) * | 2018-12-07 | 2024-05-24 | 歌尔微电子股份有限公司 | Combined sensor and electronic device |
| CN109362013B (en) * | 2018-12-07 | 2023-11-14 | 潍坊歌尔微电子有限公司 | Combined sensor |
| CN111384461A (en) * | 2018-12-29 | 2020-07-07 | 中信国安盟固利动力科技有限公司 | Multi-parameter integrated device of ion battery and preparation method thereof |
| CN110470700A (en) * | 2019-07-11 | 2019-11-19 | 维沃移动通信有限公司 | Sensor module, sensor and terminal device |
| CN112788481A (en) * | 2020-12-10 | 2021-05-11 | 美律电子(深圳)有限公司 | Microphone module |
| CN112788481B (en) * | 2020-12-10 | 2023-09-26 | 美律电子(深圳)有限公司 | Microphone module |
| TWI756976B (en) * | 2020-12-10 | 2022-03-01 | 美律實業股份有限公司 | Microphone module |
| CN113299319B (en) * | 2021-05-25 | 2023-01-24 | 华晨鑫源重庆汽车有限公司 | Voice recognition module and recognition method based on edge AI chip |
| CN113299319A (en) * | 2021-05-25 | 2021-08-24 | 华晨鑫源重庆汽车有限公司 | Voice recognition module and recognition method based on edge AI chip |
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Legal Events
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200610 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |