CN205621722U - Fingerprint sensing module - Google Patents
Fingerprint sensing module Download PDFInfo
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- CN205621722U CN205621722U CN201620130522.8U CN201620130522U CN205621722U CN 205621722 U CN205621722 U CN 205621722U CN 201620130522 U CN201620130522 U CN 201620130522U CN 205621722 U CN205621722 U CN 205621722U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/20—Structure, shape, material or disposition of high density interconnect preforms
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/24145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73259—Bump and HDI connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
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Abstract
The utility model provides a fingerprint sensing module, contains base plate, control wafer, fingerprint response wafer, mould seal and fan -out layer. The base plate has a plurality of electrical property wirings and a plurality of electrical pillar of leading, leads electrical pillar electric connection and lays wire to the electrical property. The control wafer sets up on the base plate, and the bottom surface of just controlling the wafer has the recess. Fingerprint response wafer has sensing contact face, a plurality of spliced pole and a plurality of response electrode. Sensing contact face divides induction zone and circuit region into, and the spliced pole lies in the circuit region and responds to the electrode and lies in the induction zone. Fingerprint response wafer is located the recess. The mould seal covers in base plate, control wafer, fingerprint response wafer and on leading electrical pillar. The fan -out layer covers on the mould seal and has a wiring of a plurality of fan -outs, these fan -outs wirings be located on the mould seal and respectively the electric connection spliced pole with lead electrical pillar.
Description
Technical field
A kind of fingerprint sensing module, particularly relates to one and has the fingerprint sensing module controlling wafer.
Background technology
Along with the development of science and technology, mobile phone, individual's notebook computer or flat board isoelectronic series system have had become as the instrument of indispensability in life, and the such as day such as address list, the photograph different increase of the information of these electronic system internal reservoir, there is the most personalized feature already.Therefore, for the situation such as avoid important information to be lost or to usurp, fingeprint distinguisher is carried in electronic system the most luxuriant for trend.
The electronic installation of the most common tool finger print identification function needs the most additionally to arrange capacitance type fingerprint sensing module, and therefore processing procedure operation is considerably complicated.Capacitance type fingerprint sensing module is generally the fingerprint carrying out sensing finger through induction electrode.It is said that in general, finger is the biggest with the contact area of capacitance type fingerprint sensing module, then fingerprint sensing area is the biggest, and the fingerprint information that fingerprint sensing wafer can obtain is the most complete.If it is to say, complete finger print need to be sensed, then the area of required silicon substrate is relatively big, and the most higher at the cost of silicon substrate making IC processing procedure.
It addition, active electric capacity fingerprint sensing module is that driving becket is installed in module, so that fingerprint sensing wafer exports driving signal to reach the function of identification of fingerprint through exterior driving becket.But, in preparation section, need to additionally carry out installing on fingerprint sensing module originally and drive the operation of becket so that processing procedure is more complicated.
Utility model content
This creation proposes a kind of fingerprint sensing module, comprises substrate, controls wafer, fingerprint sensing wafer, molding layer and fan-out layer.Substrate has multiple electrical wiring and multiple conductive pole, and these conductive poles are electrically connected to these and electrically connect up.Control wafer and there is control contact face and the bottom surface relative to control contact face, control wafer and there is multiple point being positioned on contact face.Control wafer to be arranged on substrate and make these contacts be electrically connected to these electrically to connect up, and the bottom surface controlling wafer has groove.Fingerprint sensing wafer has sense-junction face, multiple connection post and multiple induction electrode.Sense-junction face is divided into induction zone and circuit region, and these connection posts are positioned at circuit region and these induction electrodes are positioned at induction zone.Fingerprint sensing wafer is positioned at groove.Molding layer is covered in substrate, controls on wafer, fingerprint sensing wafer and these conductive poles.Fan-out layer is covered on molding layer and has the wiring of multiple fan-out, and the wiring of these fan-outs is positioned on molding layer and is electrically connected with these and connects post and these conductive poles.
In an embodiment, described fingerprint sensing wafer includes multiple driving post being positioned at circuit region, fan-out layer includes the first dielectric layer, the second dielectric layer and multiple driving body and ring shaped conductive pattern, first dielectric layer is covered on molding layer and has multiple first perforation, second dielectric layer is positioned on the first dielectric layer, multiple driving bodies lay respectively at multiple first perforation and are electrically connected with multiple driving post so that the multiple driving body of ring shaped conductive pattern transfers and multiple driving post and be electrically connected with fingerprint sensing wafer.
In above-described embodiment, described fingerprint sensing module further includes cover layer, and cover layer is arranged on fan-out layer.
In an embodiment, described fingerprint sensing wafer includes multiple sensing post, and fan-out layer includes multiple sensing block and multiple sensing wiring, and these induction electrodes are electrically connected with these sensing blocks through these sensing posts and these sensing wirings.
In above-described embodiment, described sensing block senses wafer in order to sense the lines of a finger to produce a fingerprint sensing signal and sense wiring, these mutual disjunctors and these sensing post transmission fingerprint sensing signals through these to fingerprint.
In above-described embodiment, described fan-out layer includes the first dielectric layer, the second dielectric layer and multiple mutual disjunctor, first dielectric layer is covered on molding layer and has at least one first through hole, second dielectric layer is covered on the first dielectric layer and has at least one second through hole, and these sensing wirings are positioned on the first dielectric layer, and these sensing blocks are positioned on the second dielectric layer, these mutual disjunctors lay respectively at the first through hole and the second through hole so that these sensing wirings and these sensing blocks are electrically connected to induction electrode.
In above-described embodiment, described fan-out layer includes the first dielectric layer, second dielectric layer, 3rd dielectric layer and multiple mutual disjunctor, first dielectric layer is covered on molding layer and has at least one first through hole, second dielectric layer is covered on the first dielectric layer and has at least one second through hole, 3rd dielectric layer is covered on the second dielectric layer and has at least one third through-hole, and these sensing wirings lay respectively on the first dielectric layer and the second dielectric layer, and these sensing blocks are positioned on the 3rd dielectric layer, these mutual disjunctors lay respectively at the first through hole, second through hole and third through-hole are so that these sensing wirings and these sensing blocks are electrically connected to induction electrode.
In above-described embodiment, described fingerprint sensing module further includes cover layer, and cover layer is arranged on fan-out layer.
In sum, the encapsulation module that fingerprint sensing module is independence and modularity of this creation, the electrical contact connecting electrode and connection post can be connect to extending out by the fingerprint sensing module of this creation embodiment through fan-out wiring fan-out layer within, fingerprint sensing signal is transferred to through conductive pole and substrate control wafer, and then control wafer can interpolate that whether the fingerprint sensing signal received meets stored user fingerprint data.
Additionally, the drive electrode of the fingerprint sensing wafer of one of this creation embodiment and driving post are electrically connected with the ring shaped conductive pattern within fan-out layer through driving body so that ring shaped conductive pattern can pass through the signal that drives of output and reaches the function of identification of fingerprint.
In addition, the electrical contact of induction electrode can be connect to extending out by the fingerprint sensing module of one of this creation embodiment through dielectric layer, sensing wiring, mutual disjunctor and the sensing block of fan-out layer, the distribution area of induction electrode can increase, thus sense area and increase the most therewith.
What deserves to be explained is, fan-out layer mainly connects to extending out in order to fingerprint to sense the electrical contact of wafer, and therefore the quantity of the dielectric layer included by fan-out layer and the distribution of sensing wiring, mutual disjunctor and sensing block all can adjust according to being electrically connected with design.
The fingerprint sensing module of this creation is the encapsulation module of independence and modularity, therefore can independent work, sense fingerprint and carry out whether the fingerprint sensing signal that follow-up judgement receives meets stored user fingerprint data, thus this creation can be applicable to Smartphone, notebook computer etc. or is applied to access control system etc..
Hereinafter detailed features and the advantage of this creation are described the most in detail, its content be enough to make any relevant art of being familiar with understand the technology contents of this creation and to implement according to this, and according to the content disclosed by this specification, claim and graphic, any relevant art of being familiar with can be readily understood upon the relevant purpose of this creation and advantage.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the fingerprint sensing module of this creation first embodiment.
Fig. 2 is that this creates the cross-sectional view of fingerprint sensing module of the second embodiment.
Fig. 3 is the cross-sectional view of the fingerprint sensing module of this creation the 3rd embodiment.
Fig. 4 is the cross-sectional view of the fingerprint sensing module of this creation the 4th embodiment.
[symbol description]
100,200,300,400 fingerprint sensing module
110 substrates
112 electrically connect up
114 conductive poles
120 control wafer
120a controls contact face
120b bottom surface
130,230,330,430 fingerprint sensing wafer
130b sense-junction face
131a connects electrode
131b connects post
132a, 332a, 432a induction electrode
140 molding layers
150,250,350,450 fan-out layer
150L fan-out connects up
233a drive electrode
233b drives post
250C ring shaped conductive pattern
250D driving body
251 first dielectric layers
252 second dielectric layers
260,460 cover layer
332b, 432b sense post
351,451 first dielectric layer
352,452 second dielectric layer
The mutual disjunctor of 350B, 450B
350S, 450S sense block
350W, 450W sense wiring
370 second fingerprint sensing wafers
370b the second sense-junction face
371a second connects electrode
371b second connects post
372a the second induction electrode
372b second senses post
453 the 3rd dielectric layers
H1 the first through hole
H2 the second through hole
H3 third through-hole
M1 induction zone
M2 circuit region
P1 contact
T1 groove
U1 the first perforation
Detailed description of the invention
Fig. 1 is the cross-sectional view of the fingerprint sensing module of this creation first embodiment.Referring to Fig. 1, fingerprint sensing module 100 includes substrate 110, controls wafer 120, fingerprint sensing wafer 130, molding layer 140 and fan-out layer 150.Controlling wafer 120 to be arranged on substrate 110, fingerprint sensing wafer 130 is arranged on control wafer 120, is packaged on substrate 110, control wafer 120 and this fingerprint sensing wafer 130 through molding layer 140, and fan-out layer 150 is covered on molding layer 140.
Substrate 110 has multiple electrical wiring 112 and multiple conductive pole 114, and these conductive poles 114 are electrically connected to these electrically wirings 112.Substrate 110 is in order to as controlling the support plate (carrier) that wafer 120 is configured, in practice, substrate 110 can be circuit board or flexible circuit board, and electrically connecting up the 112 wiring figures being the surface being arranged at substrate 110, it can design according to the electric connection demand controlling wafer 120.
Control wafer 120 and there is a control contact face 120a and relative to the bottom surface 120b controlling contact face 120a.Control contact face 120a and there is multiple contact P1, and these contacts P1 is positioned on control contact face 120a.Making these contacts P1 be electrically connected to these electrically wirings 112 through flip chip bonding techniques (flip chip technology), can be arranged on substrate 110 so that controlling wafer 120a.The bottom surface 120b controlling wafer 120 has a groove T1.Specifically, control wafer 120 main in order to process signal or comparison information, the fingerprint data of user inside it, can be stored.
Fingerprint sensing wafer 130 is configured on the groove T1 controlling wafer 120.Fingerprint sensing wafer 130 has one relative to controlling the sense-junction face 130b of bottom surface 120b of wafer 120, and sense-junction face is divided into induction zone M1 and circuit region M2.Wherein, induction zone M1 is generally in order to the induction electrode configuring area of the fingerprint as sensing finger, and circuit region M2 is generally in order to as the process circuit configuring area processing fingerprint sensing signal.Fingerprint sensing wafer 130 includes multiple connection electrode 131a, multiple induction electrode 132a and multiple connection post 131b.These induction electrodes 132a obtains fingerprint sensing signal as the induction electrode of the fingerprint of sensing finger, and it is positioned at induction zone M1.These connect the electrode 131a circuit as process fingerprint sensing signal, and it is positioned at circuit region M2, and these connect corresponding each position connecting electrode 131a individually, position of post 131b and are connected electrode 131a electric connection with each.
Molding layer 140 covers substrate 110, controls on wafer 120, fingerprint sensing wafer 130 and multiple conductive pole 114.It should be noted that molding layer 140 exposes multiple conductive pole 114 and the end face of multiple connection post 131b, in order to the processing procedure operation of follow-up electric connection.In general; molding layer 140 is used for protecting the control wafer 120 of inside, fingerprint sensing wafer 130 and multiple conductive pole 114; its material is epoxy molding compound (Epoxy Molding Compound, EMC), phenolic resin (Phenolics) or silicones (Silicones) etc..
Fan-out layer 150 is covered on molding layer 140.Fan-out layer 150 has multiple fan-out wiring 150L, these fan-outs wiring 150L and is positioned on molding layer 140 and is electrically connected with connection post 131b and conductive pole 114.What deserves to be explained is, when finger contact fingerprint sensing module 100, the electric capacity between the induction electrode 132a of the contact position of corresponding finger produces change and produces fingerprint sensing signal.Connect electrode 131a and other process after circuit (not illustrating) processes fingerprint sensing signal through fingerprint sensing signal being transferred to substrate 110 by connecting post 131b, fan-out wiring 150L and conductive pole 114.And fingerprint sensing signal is transferred to control wafer 120 by substrate 110.Control wafer 120 and can carry out, according to the user fingerprint data stored by its inside, the fingerprint sensing signal that comparison analysis receives, and then judge whether the fingerprint sensing signal received meets stored user fingerprint data.According to this, fingerprint sensing module 100 can be applied to the electronic installation with finger print identification function, e.g. Smartphone, notebook computer etc. or be applied to access control system etc..
Thereby, fingerprint sensing module 100 can connect connecting the electrical contact of electrode 131a and connection post 131b to extending out through fan-out wiring 150L fan-out layer 150 within, fingerprint sensing signal is transferred to through conductive pole 114 and substrate 110 control wafer 120, and then control wafer 120 can interpolate that whether the fingerprint sensing signal received meets stored user fingerprint data.
Fig. 2 is that this creates the cross-sectional view of fingerprint sensing module of the second embodiment.In the present embodiment, fingerprint sensing module 200 is the appearance formula fingerprint sensing module that hangs down, but this is not any limitation as by this creation.Fingerprint sensing wafer 230 includes multiple drive electrode 233a being positioned at circuit region M2 and drives post 233b.These drive post 233b the most corresponding each drive electrode 233a in position position and with each drive electrode 233a be electrically connected with.Drive electrode 233a and driving post 233b is in order to the driving signal within transmission fingerprint sensing wafer 230.
Fan-out layer 250 includes first dielectric layer the 251, second dielectric layer 252 and multiple driving body 250D and ring shaped conductive pattern 250C.First dielectric layer 251 is covered on molding layer 140 and has multiple first perforation U1, and the position correspondence ring shaped conductive pattern 250C of the first perforation U1 and drive the position of post 233b.These driving bodies 250D lays respectively in each first perforation U1.Ring shaped conductive pattern 250C is electrically connected with fingerprint sensing wafer 230 through driving body 250D, driving post 233b.Fingerprint sensing wafer 230 exports driving signal through multiple drive electrode 233a, and drive signal can transmit the ring shaped conductive pattern 250C to fan-out layer 250 through driving post 233b, and then the driving signal of the permeable output of ring shaped conductive pattern 250C reaches the function of identification of fingerprint.
Second dielectric layer 252 is positioned on the first dielectric layer 251.In the present embodiment, the second dielectric layer 252 covers on annular conductive pattern 250C and the first dielectric layer 251.So in other embodiments, the second dielectric layer 252 can also only cover on the first dielectric layer 251 and be positioned at the hollow part of ring shaped conductive pattern 250C and be not covered with ring shaped conductive pattern 250C.This is not any limitation as by this creation.
Cover layer 260 is positioned on fan-out layer 250, and covers the second dielectric layer 252.Cover layer 260 may be used to provide module Global Macros, and it can be the base material of light-permeable, can be e.g. glass cover-plate, plastic cement cover plate or sapphire cover plate etc..Cover layer 260 can also be the base material of alternatively non-transparent, e.g. ceramic cover plate etc..It addition, cover layer 260 can also be non-hard material, e.g. it is coated with cloth material, color coating etc..Additionally, remaining identical feature then it is no longer repeated.
Thereby, fingerprint sensing module 200 and can connect the electrical contact of post 131b connect connecting electrode 131a to extending out through fan-out wiring 150L fan-out layer 250 within, and fingerprint sensing signal is transferred to control wafer 120 through conductive pole 114 and substrate 110.In addition, the drive electrode 233a and driving post 233b of fingerprint sensing wafer 230 are electrically connected with the ring shaped conductive pattern 250C within fan-out layer 250 through driving body 250D so that ring shaped conductive pattern 252 can pass through the signal that drives of output and reaches the function of identification of fingerprint.
Fig. 3 is the cross-sectional view of the fingerprint sensing module of this creation the 3rd embodiment.In the present embodiment, fingerprint sensing module 300 is mutual capacitance type fingerprint sensing module, but this is not any limitation as by this creation.Fingerprint sensing wafer 330 includes multiple sensing post 332b being positioned at induction zone M1.The position of the most corresponding each induction electrode 332a in position of these sensings post 332b is also electrically connected with each induction electrode 332a, so that the electrical contact of the induction electrode 332a of the fingerprint of sensing finger connects to extending out.It should be noted that molding layer 140 exposes multiple conductive pole 114, multiple connection post 131b and the end face of multiple sensing post 332b, in order to the processing procedure operation of follow-up electric connection.
Fingerprint sensing module 300 further includes the second fingerprint sensing wafer 370.In practice, second fingerprint sensing wafer 370 is also in order to sense user fingerprint information, it is with the difference of fingerprint sensing wafer 330, and the second fingerprint sensing wafer 370 is arranged on substrate 110, and fingerprint sensing wafer 330 is arranged on the groove T1 controlling wafer 120.Second fingerprint sensing wafer 370 has the second sense-junction face 370b, the second sense-junction face 370b and is also divided into induction zone M1 and circuit region M2.Second fingerprint sensing wafer 370 includes that multiple second connects electrode 371a, multiple second induction electrode 372a, multiple second connection post 371b and multiple second sensing post 372b.These second induction electrodes 372a is positioned at induction zone M1, and the position of the most corresponding each second induction electrode 372a in position of these second sensings post 372b being electrically connected with each second induction electrode 372a, so that the electrical contact of the induction electrode 332a of the fingerprint of sensing finger connects to extending out.These second connections electrode 371a is positioned at circuit region M2, and these second positions the most corresponding each second connecting post 371b connect the position of electrode 371a and are connected electrode 371a electric connection with each second.These second connections post 371b is electrically connected with conductive pole 114 through the fan-out wiring 150L of this fan-out layer 350.
Fan-out layer includes fan-out wiring 150L, at least one dielectric layer, sensing block, sensing wiring and mutual disjunctor.In the present embodiment, fan-out layer 350 includes first dielectric layer the 351, second dielectric layer 352, multiple sensing wiring 350W, multiple mutual disjunctor 350B and multiple sensing block 350S.
First dielectric layer 351 is covered on molding layer 140 and fan-out wiring 150L and has at least one first through hole H1, wherein, the position of the position correspondence sensing post 332b of the first through hole H1, and the mutual disjunctor 350B of part is positioned at the first through hole H1.Sensing wiring 350W is positioned on the first dielectric layer 351 and is electrically connected with the mutual disjunctor 350B being positioned at the first through hole H1.
Second dielectric layer 352 is covered on the sensing wiring 350W of the first dielectric layer 351 and part and has at least one second through hole H2, wherein, the mutual disjunctor 350B of other parts is positioned at the second through hole H2 and is electrically connected with the sensing wiring 350W being positioned on the first dielectric layer 351.Multiple sensing block 350S are positioned on the second dielectric layer 352, and are electrically connected with the mutual disjunctor 350B being positioned at the second through hole H2.Each induction electrode 332a and each second induction electrode 372a is electrically connected with sensing post 332b and second sensing post 372b respectively, and all it is electrically connected to each sensing block 350S through these sensing post 332b, mutual disjunctor 350B and sensing wiring 350W, make these sensings block 350S that the lines of one finger can sense to produce a fingerprint sensing signal, and through these sensings wiring 350W, mutual disjunctor 350B and sensing post 332b, fingerprint sensing signal is transferred to fingerprint sensing wafer 330 and the second fingerprint sensing wafer 370.
Thereby, fingerprint sensing signal can be transferred to control wafer 120 by connecting electrode 131a, connecting post 131b, second connect electrode 371a and second and connect the electrical contact of post 371b and connect to extending out through fan-out wiring 150L fan-out layer 350 within by fingerprint sensing module 300 through conductive pole 114 and substrate 110.In addition, fingerprint sensing module 300 is through the dielectric layer (first dielectric layer 351 and the second dielectric layer 352) fan-out layer 350 within, sensing wiring 350W, mutual disjunctor 350B and senses block 350S and can be connect to extending out by the electrical contact of induction electrode 332a, the distribution area of induction electrode 332a can increase, thus sense area and increase the most therewith.In addition, fingerprint sensing module 300 can arrange the second fingerprint sensing wafer 370 to increase induction area depending on design requirement, that is increase inducing pixel unit (pixel cell) quantity of sensing array, thus the induction area of fingerprint sensing module 300 can reach extendibility so that overall module has more design flexibility.The quantity of the second fingerprint sensing wafer 370 is not any limitation as by this creation.
Fig. 4 is the cross-sectional view of the fingerprint sensing module of this creation the 4th embodiment.The fingerprint sensing module 400 of the 4th embodiment is similar to both fingerprint sensing modules 300 structure of the 3rd embodiment, and its architectural difference essentially consists in fingerprint sensing module 400 and further includes cover layer 460 and fan-out layer 450 further includes the 3rd dielectric layer 453.
In the present embodiment, fan-out layer 450 includes first dielectric layer the 451, second dielectric layer the 452, the 3rd dielectric layer 453, multiple sensing wiring 450W, multiple mutual disjunctor 450B and multiple sensing block 450S.
First dielectric layer 451 is covered on molding layer 140 and fan-out wiring 150L and has at least one first through hole H1, wherein, the position of the position correspondence sensing post 432b of the first through hole H1, and the mutual disjunctor 450B of part is positioned at the first through hole H1.Sensing wiring 450W is positioned on the first dielectric layer 451 and is electrically connected with the mutual disjunctor 450B being positioned at the first through hole H1.
Second dielectric layer 452 is covered on the sensing wiring 450W of the first dielectric layer 451 and part and has at least one second through hole H2, the mutual disjunctor 450B of part and is positioned at the second through hole H2 and is electrically connected with the sensing wiring 450W being positioned on the first dielectric layer 451.The sensing wiring 450W of part is positioned on the second dielectric layer 452 and is electrically connected with the mutual disjunctor 450B being positioned at the second through hole H2.
The sensing wiring 450W that 3rd dielectric layer 453 is covered on the second dielectric layer 452 and the second dielectric layer 452, and there is at least one third through-hole H3.The mutual disjunctor 450B of part is positioned at third through-hole H3 and is electrically connected with the sensing wiring 450W being positioned on the second dielectric layer 452.Multiple sensing block 450S are positioned on the 3rd dielectric layer 453, and are electrically connected with the mutual disjunctor 450B being positioned at third through-hole H3.Each induction electrode 432a is electrically connected to each sensing block 450S through these sensing post 432b, mutual disjunctor 450B and sensing wiring 450W, make these sensings block 450S that the lines of one finger can sense to produce a fingerprint sensing signal, and through these sensings wiring 450W, mutual disjunctor 450B and sensing post 432b, fingerprint sensing signal is transferred to fingerprint sensing wafer 430.
Cover layer 460 is positioned on fan-out layer 450, and covers the 3rd dielectric layer 453.Cover layer 460 may be used to provide module Global Macros, and it can be the base material of light-permeable, can also be the base material of alternatively non-transparent, or is coated with cloth material.Additionally, remaining identical feature then it is no longer repeated.
Thereby, fingerprint sensing module 400 and can connect the electrical contact of post 131b connect connecting electrode 131a to extending out through fan-out wiring 150L fan-out layer 450 within, and fingerprint sensing signal is transferred to control wafer 120 through conductive pole 114 and substrate 110.In addition, fingerprint sensing module 400 is through the dielectric layer (first dielectric layer the 451, second dielectric layer 452 and the 3rd dielectric layer 453) fan-out layer 450 within, sensing wiring 450W, mutual disjunctor 450B and senses block 450S and can be connect to extending out by the electrical contact of induction electrode 432a, the distribution area of induction electrode 432a can increase, thus sense area and increase the most therewith.What deserves to be explained is, fan-out layer mainly connects to extending out in order to fingerprint to sense the electrical contact of wafer, and therefore the quantity of the dielectric layer included by fan-out layer and the distribution of sensing wiring, mutual disjunctor and sensing block all can adjust according to being electrically connected with design.
In sum, the electrical contact connecting electrode and connection post can be connect to extending out by the fingerprint sensing module of this creation embodiment through fan-out wiring fan-out layer within, fingerprint sensing signal is transferred to through conductive pole and substrate control wafer, and then control wafer can interpolate that whether the fingerprint sensing signal received meets stored user fingerprint data.
Additionally, the drive electrode of the fingerprint sensing wafer of one of this creation embodiment and driving post are electrically connected with the ring shaped conductive pattern within fan-out layer through driving body so that ring shaped conductive pattern can pass through the signal that drives of output and reaches the function of identification of fingerprint.
In addition, the electrical contact of induction electrode can be connect to extending out by the fingerprint sensing module of one of this creation embodiment through dielectric layer, sensing wiring, mutual disjunctor and the sensing block of fan-out layer, the distribution area of induction electrode can increase, thus sense area and increase the most therewith.
What deserves to be explained is, fan-out layer mainly connects to extending out in order to fingerprint to sense the electrical contact of wafer, and the quantity of the dielectric layer included by fan-out layer is the most, then can be by the electrical contact of induction electrode to extending out the quantity connect and area is the most, therefore the quantity of the dielectric layer included by fan-out layer and the distribution of sensing wiring, mutual disjunctor and sensing block all can adjust according to being electrically connected with design.
The fingerprint sensing module of this creation is the encapsulation module of independence and modularity, therefore can independent work, sense fingerprint and carry out whether the fingerprint sensing signal that follow-up judgement receives meets stored user fingerprint data, thus this creation can be applicable to Smartphone, notebook computer etc. or is applied to access control system etc..
Although the technology contents of this creation is disclosed above with preferred embodiment; so it is not limited to this creation; any it is familiar with this those skilled in the art; a little change and retouching is made in the spirit without departing from this creation; all should be covered by the category of this creation, therefore the protection domain of this creation when depending on after attached the defined person of claim be as the criterion.
Claims (9)
1. a fingerprint sensing module, including:
One substrate, has multiple electrical wiring and multiple conductive pole, and those conductive poles are electrically connected to those and electrically connect up；
One controls wafer, there is a control contact face and relative to the bottom surface in this control contact face, this control wafer has multiple contact being positioned on this control contact face, and this control wafer is arranged on this substrate and makes those contacts be electrically connected to those electrically to connect up, and this bottom surface has a groove；
One fingerprint sensing wafer, having a sense-junction face, multiple connection post and multiple induction electrode, this sense-junction face is divided into an induction zone and a circuit region, and those connect post and are positioned at this circuit region, those induction electrodes are positioned at this induction zone, and this fingerprint sensing wafer is positioned at this groove；
One molding layer, is covered on this substrate, this control wafer, this fingerprint sensing wafer and those conductive poles；And
One fan-out layer, is covered on this molding layer and has the wiring of multiple fan-out, and the wiring of those fan-outs is positioned on this molding layer and is electrically connected with those and connects post and those conductive poles.
2. fingerprint sensing module as claimed in claim 1, wherein this fingerprint sensing wafer includes multiple driving post being positioned at this circuit region, this fan-out layer includes one first dielectric layer, one second dielectric layer and multiple driving body and a ring shaped conductive pattern, this first dielectric layer is covered on this molding layer and has multiple first perforation, this second dielectric layer is positioned on this first dielectric layer, those driving bodies lay respectively at those first perforations and be electrically connected with those drive post so that these those driving bodies of ring shaped conductive pattern transfers and those drive post and be electrically connected with this fingerprint sensing wafer.
3. fingerprint sensing module as claimed in claim 2, further includes a cover layer, and this cover layer is arranged on this fan-out layer.
4. fingerprint sensing module as claimed in claim 1, wherein this fingerprint sensing wafer includes multiple sensing post, this fan-out layer includes multiple sensing block and multiple sensing wiring, and those induction electrodes are electrically connected with those sensing blocks through those sensing posts and those sensing wirings.
5. fingerprint sensing module as claimed in claim 4, wherein this fan-out layer includes one first dielectric layer, one second dielectric layer and multiple mutual disjunctor, this first dielectric layer is covered on this molding layer and has at least one first through hole, this second dielectric layer is covered on this first dielectric layer and has at least one second through hole, and those sensing wirings are positioned on this first dielectric layer, and those sensing blocks are positioned on this second dielectric layer, those mutual disjunctors lay respectively at this first through hole and this second through hole so that those sensing wirings and those sensing blocks are electrically connected to this induction electrode.
6. fingerprint sensing module as claimed in claim 4, wherein this fan-out layer includes one first dielectric layer, one second dielectric layer, one the 3rd dielectric layer and multiple mutual disjunctor, this first dielectric layer is covered on this molding layer and has at least one first through hole, this second dielectric layer is covered on this first dielectric layer and has at least one second through hole, 3rd dielectric layer is covered on this second dielectric layer and has at least one third through-hole, and those sensing wirings lay respectively on this first dielectric layer and this second dielectric layer, and those sensing blocks are positioned on the 3rd dielectric layer, those mutual disjunctors lay respectively at this first through hole, this second through hole and this third through-hole are so that those sensing wirings and those sensing blocks are electrically connected to this induction electrode.
7. fingerprint sensing module as claimed in claim 4, further includes a cover layer, and this cover layer is arranged on this fan-out layer.
8. fingerprint sensing module as claimed in claim 1, further include one second fingerprint sensing wafer, this second fingerprint sensing wafer is positioned on this substrate, and this second fingerprint sensing wafer has multiple second and connects post, and those the second connection posts are electrically connected with this conductive pole through this fan-out layer.
9. fingerprint sensing module as claimed in claim 8, this second fingerprint sensing wafer includes multiple second induction electrode and multiple second sensing post, this fan-out layer includes multiple sensing block and multiple sensing wiring, and those second induction electrodes are electrically connected with those sensing blocks through those second sensing posts and those sensing wirings.
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| CN201620130522.8U CN205621722U (en) | 2016-02-19 | 2016-02-19 | Fingerprint sensing module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620130522.8U CN205621722U (en) | 2016-02-19 | 2016-02-19 | Fingerprint sensing module |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018113037A1 (en) * | 2016-12-23 | 2018-06-28 | 创智能科技股份有限公司 | Fingerprint sensing and recognition device having antistatic structure |
| CN110662352A (en) * | 2019-10-28 | 2020-01-07 | 维沃移动通信有限公司 | Circuit board device, processing method thereof and mobile terminal |
| WO2020201872A1 (en) * | 2019-03-29 | 2020-10-08 | International Business Machines Corporation | Spacer for die-to-die communication in an integrated circuit |
| CN112216784A (en) * | 2019-07-12 | 2021-01-12 | 茂丞科技(深圳)有限公司 | Wafer-level ultrasonic sensing device and manufacturing method thereof |
-
2016
- 2016-02-19 CN CN201620130522.8U patent/CN205621722U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018113037A1 (en) * | 2016-12-23 | 2018-06-28 | 创智能科技股份有限公司 | Fingerprint sensing and recognition device having antistatic structure |
| WO2020201872A1 (en) * | 2019-03-29 | 2020-10-08 | International Business Machines Corporation | Spacer for die-to-die communication in an integrated circuit |
| US11031373B2 (en) | 2019-03-29 | 2021-06-08 | International Business Machines Corporation | Spacer for die-to-die communication in an integrated circuit |
| GB2596693A (en) * | 2019-03-29 | 2022-01-05 | Ibm | Spacer for die-to-die communication in an integrated circuit |
| US11521952B2 (en) | 2019-03-29 | 2022-12-06 | International Business Machines Corporation | Spacer for die-to-die communication in an integrated circuit and method for fabricating the same |
| GB2596693B (en) * | 2019-03-29 | 2023-07-19 | Ibm | Spacer for die-to-die communication in an integrated circuit |
| CN112216784A (en) * | 2019-07-12 | 2021-01-12 | 茂丞科技(深圳)有限公司 | Wafer-level ultrasonic sensing device and manufacturing method thereof |
| CN110662352A (en) * | 2019-10-28 | 2020-01-07 | 维沃移动通信有限公司 | Circuit board device, processing method thereof and mobile terminal |
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