CN205501403U - A lining pot for coating film - Google Patents
A lining pot for coating film Download PDFInfo
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- CN205501403U CN205501403U CN201620258964.0U CN201620258964U CN205501403U CN 205501403 U CN205501403 U CN 205501403U CN 201620258964 U CN201620258964 U CN 201620258964U CN 205501403 U CN205501403 U CN 205501403U
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- China
- Prior art keywords
- inner pot
- supporting part
- crucible
- plated film
- sidewall
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Abstract
The utility model discloses a lining pot for coating film, have the bottom and with the lateral wall that the bottom is connected, the lateral wall outside of lining pot have outstanding in the supporting part of lateral wall is worked as lining pot places that heat or when cooling off, its lateral wall passes through in the crucible the supporting part with the crucible contact, area of contact is less than the surface area of the lateral wall of lining pot. The lining pot increases the supporting part around, is keeping under the unchangeable circumstances of body size, reduces crucible and cooling device's area of contact for the coating by vaporization metal obtains better heat preservation effect under the electron beam bombardment.
Description
Technical field
This utility model relates to a kind of vacuum evaporator, is specially a kind of Novel film-coated inner pot.
Background technology
Vapour deposition method is belonging to the vacuum coating technology of a kind of physical vapour deposition (PVD).It is typically be placed directly in crucible by the material of evaporation or be positioned among inner pot, again inner pot is placed among crucible (as shown in Figure 1), by material being carried out applying heat energy, make material from the solid state transformed atom for gaseous state, atomic group or molecule, then condensing upon substrate surface to be coated and form thin film, this technology is widely used in multiple fields such as solar energy film, semiconductor wafer, flat pannel display, optical crystal chip.
In LED chip bonding technology, mainly use electron-beam vapor deposition method, by Au-Au, luminescence epitaxial wafer is bonded together with Si sheet.In order to increase the adhesiveness between metal Au and Si sheet, on Si sheet, typically prepare adhesiveness preferable Ti metallic film, then prepare Pt metallic film, stop that other metal migrates to bonding end, finally prepare the Au thin film of 4K as bonded layer.Electron-beam vapor deposition method is utilized to prepare Ti/Pt/Au metallic film on Si sheet, it is to utilize electron beam to carry out directly heating metal Ti/Pt/Au under vacuum to evaporate material, make the gasification of evaporation material and transport to substrate (Si sheet), Si sheet condenses the method forming thin film.In electron beam heater, dispose multiple lining misfortune, it is achieved evaporate respectively, deposit multiple different material, thus prepare high purity films simultaneously.
In electron beam evaporation process, heated material Ti/Pt/Au is positioned in the inner pot of water-cooled.But, Pt melting point metal (~ 1772 DEG C) is higher than fusing point (~ 1660 DEG C) and the fusing point (~ 1063 DEG C) of Au of metal Ti, make Pt metal need to strengthen electron gun power when evaporation, it is placed in the crucible of water-cooled due to inner pot again simultaneously, the Pt in inner pot is caused not reach the effect being completely melt, during making evaporation, Pt atom condenses on Si sheet with the form reunited, form salient point, this problem greatly limit the further process optimization after substrate shifts to raising external quantum efficiency, affects the light extraction efficiency of LED component.
Summary of the invention
For above-mentioned technical problem, a kind of novel inner pot of this reality new design, reduces the cooling water cooling effect to inner pot, make Pt metal under beam bombardment, obtain higher temperature, reduce Pt salient point and formed, reduce the feasibility difficulty of follow-up raising external quantum efficiency process implementing.
A kind of inner pot for plated film described in the utility model, there is bottom and the sidewall being connected with described bottom, the side-wall outer side of described inner pot has the supporting part protruding from described sidewall, when being heated or cooled in described inner pot is positioned over crucible, its sidewall is contacted with described crucible by described supporting part, and contact area is less than the surface area of the sidewall of described inner pot.
Preferably, described supporting part shape ringwise.
Preferably, described support zone is in the middle part of described substrate outer wall or top.
Preferably, described supporting part is the block structure of series of discrete distribution.
Preferably, the width of described supporting part is 1 ~ 10mm.
Preferably, the number of described supporting part is 3 ~ 10.
Preferably, the bottom of described inner pot is provided with the second supporting part, and the bottom of described inner pot is contacted with the bottom of described crucible by described second supporting part, and its contact area is less than the surface area bottom described inner pot.
Preferably, described second supporting part is the block structure of series of discrete distribution.
Preferably, the number of described second supporting part is 2-5.
Preferably, the material of described inner pot is quartz glass or molybdenum or tungsten or oxygen-free copper refractory metal.
Preferably, the material of described vapor deposition source is chromium or platinum or titanium or silver or aluminum or gold or aforementioned combinatorial.
Compared with prior art, this utility model has the advantages that increase supporting part around inner pot, in the case of keeping inner pot overall dimensions constant, reduce the contact area of crucible and chiller, make evaporation metal under beam bombardment, it is thus achieved that preferably heat insulation effect reach higher temperature.This utility model part easily designs, and production process management and control is simple, it is simple to industrialization produces.
Accompanying drawing explanation
Fig. 1 is the structure sectional view of existing optical coating container.
Fig. 2 is the structure sectional view of novel inner pot described in the utility model.
Illustrate: 1: crucible;2: inner pot;20: the sidewall of inner pot;21: the bottom of inner pot;22,23: support sector.
Detailed description of the invention
This utility model is explained further below in conjunction with embodiment, but this utility model is not done any restriction by embodiment.
Below in conjunction with the accompanying drawings this utility model is described in further detail, to make those skilled in the art can implement according to this with reference to description word.
As shown in Figure 2, the open one of this utility model is for Novel film-coated inner pot 2, including bottom 21 with bottom the sidewall 20 that is connected, there is outside the sidewall 20 of inner pot the supporting part 22 protruding from sidewall, when being heated or cooled in inner pot is positioned over crucible, its sidewall is contacted with described crucible by described supporting part, and contact area is less than the surface area of the sidewall of inner pot.
Inner pot select heat conductivity higher, high temperature resistant and not with the material of Coating Materials generation chemical reaction, can such as quartz glass or molybdenum or tungsten or oxygen-free copper refractory metal.
Supporting part 22 is positioned at the middle part off normal of the side-wall outer side of inner pot 2 and puts, can shape or discrete bulk ringwise, its width D is 1mm ~ 10mm, preferably 5mm.
Further, the second supporting part 23 also can be set in the bottom of inner pot 2, reduce the contact area of inner pot and crucible further.This second supporting part shape the most ringwise or discrete bulk, it is also preferred that the left be block, its number is preferred with 2-5.
In the present embodiment, being respectively provided with three massive support portions at the sidewall 20 of inner pot 2 and the outside of bottom 21, each width is 3mm.
In above-mentioned inner pot, by arranging the supporting part protruding from inner pot sidewall in the outside of inner pot so that crucible is greatly reduced with the contact area of chiller, reaches the effect of energy efficient.
This utility model part easily designs, and production process management and control is simple, it is simple to industrialization produces.
Although embodiment of the present utility model is disclosed as above, but it is not restricted in description and embodiment listed utilization, it can be applied to various applicable field of the present utility model completely, for those skilled in the art, it is easily achieved other amendment, therefore, under the general concept limited without departing substantially from claim and equivalency range, this utility model is not limited to specific details and shown here as the legend with description.
Claims (10)
1. the inner pot for plated film, there is the sidewall that bottom is connected with described bottom, it is characterized in that: the side-wall outer side of described inner pot has the supporting part protruding from described sidewall, when being heated or cooled in described inner pot is positioned over crucible, its sidewall is contacted with described crucible by described supporting part, and contact area is less than the surface area of described inner pot sidewall.
A kind of inner pot for plated film the most according to claim 1, it is characterised in that: described supporting part shape ringwise.
A kind of inner pot for plated film the most according to claim 2, it is characterised in that: the width of described supporting part is 1mm ~ 10mm.
A kind of inner pot for plated film the most according to claim 1, it is characterised in that: described support zone is in the middle part of the sidewall of described inner pot or top.
A kind of inner pot for plated film the most according to claim 1, it is characterised in that: described supporting part is the block structure of series of discrete distribution.
A kind of inner pot for plated film the most according to claim 5, it is characterised in that: the width of described supporting part is 1 ~ 10mm.
A kind of inner pot for plated film the most according to claim 5, it is characterised in that: the number of described supporting part is 3 ~ 10.
A kind of inner pot for plated film the most according to claim 1, it is characterized in that: the bottom of described inner pot is provided with the second supporting part, the bottom of described inner pot is contacted with the bottom of described crucible by described second supporting part, and its contact area is less than the surface area bottom described inner pot.
A kind of inner pot for plated film the most according to claim 8, it is characterised in that: described second supporting part is the block structure of series of discrete distribution.
A kind of inner pot for plated film the most according to claim 9, it is characterised in that: the number of described second supporting part is 2 ~ 5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620258964.0U CN205501403U (en) | 2016-03-31 | 2016-03-31 | A lining pot for coating film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620258964.0U CN205501403U (en) | 2016-03-31 | 2016-03-31 | A lining pot for coating film |
Publications (1)
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CN205501403U true CN205501403U (en) | 2016-08-24 |
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CN201620258964.0U Active CN205501403U (en) | 2016-03-31 | 2016-03-31 | A lining pot for coating film |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112695279A (en) * | 2020-11-17 | 2021-04-23 | 威科赛乐微电子股份有限公司 | Method for plating Au by electron beam evaporation |
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2016
- 2016-03-31 CN CN201620258964.0U patent/CN205501403U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112695279A (en) * | 2020-11-17 | 2021-04-23 | 威科赛乐微电子股份有限公司 | Method for plating Au by electron beam evaporation |
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