CN205355079U

CN205355079U - Solid brilliant machine of LED lamp pearl

Info

Publication number: CN205355079U
Application number: CN201620086548.7U
Authority: CN
Inventors: 杨广科
Original assignee: ZHEJIANG FEITIAN LIGHTING TECHNOLOGY Co Ltd
Current assignee: Zhejiang Feitian Photoelectric Co., Ltd.
Priority date: 2016-01-28
Filing date: 2016-01-28
Publication date: 2016-06-29
Anticipated expiration: 2026-01-28

Abstract

The utility model relates to a field, especially a solid brilliant machine of LED lamp pearl are made to LED lamp pearl. The utility model discloses well hot -blast main is located gets core swing arm both sides, and the hot -blast main is used for blowing high -temperature gas to near the position tin cream layer after preset position places the LED chip getting the core swing arm, makes the tin cream layer melt and has shortened the tin cream and coat to the fusional time of tin cream. The utility model discloses well hot -blast main is located gets core swing arm both sides, and the hot -blast main is used for blowing high -temperature gas to near the position tin cream layer after preset position places the LED chip getting the core swing arm, makes the tin cream layer melt and has shortened the tin cream and coat to the fusional time of tin cream.

Description

A kind of bonder of LED lamp bead

Technical field

This utility model relates to LED lamp bead and manufactures field, the particularly bonder of a kind of LED lamp bead.

Background technology

Growing along with LED technology, LED application in people's daily life is also more and more extensive.Adopting flip-chip type package LED, the die bond mode of more general solid type LED encapsulation is simply many, has higher reliability, and can keep away mixed and disorderly technique so that volume production feasibility is significantly promoted.Owing to crystal covering type LED has the shortening advantage such as the processing time of high-temperature baking, high yield, good, the high amount of light of heat-conducting effect concurrently, then show one's talent in market, be the industry technology doing one's utmost to carry out.

In general, the processing procedure of crystal covering type LED encapsulation includes die bond, some glue, grows the operations such as roasting.Wherein, die bond operation includes the steps such as coating, paster, heating.Further, prior art generally adopt different equipment perform each step in die bond operation.Such as, utilize bonder to perform coating, paster step, and utilize drying baker to perform heating steps.So, in whole die bond operation, it is necessary to intermediate (semi-finished product) is transferred to from the equipment performing current procedures the equipment performing next step.But, in such transfer process, the material such as tin cream is oxidized easily or is mixed into impurity etc., thus causes intermediate contaminated, thus reducing the yields of crystal covering type LED encapsulation.Such as: owing to tin cream is oxidized or has been mixed into impurity etc. in tin cream so that follow-up LED chip and loose contact in substrate welding process, thus reducing the yields of crystal covering type LED encapsulation.

The document of CN203481262U discloses a kind of bonder, for by LED chip flip-chip type package at substrate.This bonder includes: board, and it can be placed with substrate；Coating unit, for being coated in the conductive pattern of the substrate being placed on board by tin cream；Chip unit, is placed on board for being covered by LED chip and is coated with the substrate of tin cream, so that the anelectrode of LED chip and negative electrode can be electrically connected via the conductive pattern of tin cream with substrate；And heating unit, it is heated for being opposite on board and being coated with the substrate of LED chip, so that tin cream fusing, so that the positive and negative electrode of LED chip is in electrical contact via the conductive pattern of tin cream Yu substrate.Bonder makes the die bond operation of chip package LED chip can complete on same board, is prevented effectively from operation transfer process the contaminated problem of semi-finished product, thus improve the yields of chip package LED chip.

Bonder of the prior art processes multiple LED chip successively owing to typically requiring on same workbench, and tin cream coating is still long to the time of tin cream fusing.

In this utility model, warm-air pipe is positioned at coring swing arm both sides, and warm-air pipe, for placing after LED chip position blowing high temperature gas near tin paste layer in precalculated position in coring swing arm, makes tin paste layer melt the time shortening tin cream coating to tin cream fusing.

Utility model content

This utility model purpose is in that to provide the bonder of a kind of LED lamp bead, shortens the tin cream coating time to tin cream fusing.

For reaching above-mentioned advantage, this utility model provides the bonder of a kind of LED lamp bead, and the bonder of described LED lamp bead includes: coring swing arm, warm-air pipe；

Described warm-air pipe is positioned at coring swing arm both sides, and warm-air pipe, for placing after LED chip position blowing high temperature gas near tin paste layer in precalculated position in coring swing arm, makes tin paste layer melt.

Accompanying drawing explanation

Fig. 1 show the structural representation of the bonder of the LED lamp bead of this utility model first embodiment.

Description of reference numerals:

The bonder of 10:LED lamp bead, 11: coring swing arm, 13: warm-air pipe, 21:LED chip, 23: electrode, 25: tin paste layer, 27: conductive pattern, 29: substrate.

Detailed description of the invention

For further setting forth that this utility model is reach technological means and effect that predetermined utility model purpose is taked, below in conjunction with accompanying drawing and preferred embodiment, to according to the utility model proposes detailed description of the invention, structure, feature and effect thereof, describe in detail as after.

Referring to Fig. 1, the bonder 10 of the LED lamp bead of this utility model first embodiment includes: coring swing arm 11, warm-air pipe 13.Warm-air pipe 13 is positioned at coring swing arm 11 both sides.The bonder 10 of LED lamp bead is used for capturing LED chip 21 and fixes with being connected by tin paste layer 25 on substrate 29, and makes electrode 23 be electrically connected by tin paste layer 25 with the conductive pattern 27 on substrate 29.

Coring swing arm 11 can draw or place LED chip 21, and in coring swing arm 11 after LED chip 21 is placed in precalculated position, LED chip 21 can be applied certain pressure by coring swing arm 11.

Warm-air pipe 13 for coring swing arm 11 after LED chip 21 is placed in precalculated position to position blowing high temperature gas near tin paste layer 25, make tin paste layer 25 melt.Warm-air pipe 13 is preferably made up of insulation material.Warm-air pipe 13 is fixing with coring swing arm 11 to be connected or removably connects.

Warm-air pipe 13 also includes bending section 131 and nozzle 133.Bending section 131 is for making the outlet of high temperature gas flow towards tin paste layer 25.The internal diameter of nozzle 133 tapers into, so can make the air-flow in warm-air pipe 13 more efficient spray to tin paste layer 25, it is also possible to reduce the high temperature gas flow impact on miscellaneous part on workbench or LED part.

To sum up, of the present utility model at least have the advantage that

Above, it it is only preferred embodiment of the present utility model, not this utility model is done any pro forma restriction, although this utility model is disclosed above with preferred embodiment, but it is not limited to this utility model, any those skilled in the art, without departing within the scope of technical solutions of the utility model, when the technology contents of available the disclosure above makes a little change or is modified to the Equivalent embodiments of equivalent variations, in every case it is without departing from technical solutions of the utility model content, any simple modification above example made according to technical spirit of the present utility model, equivalent variations and modification, all still fall within the scope of technical solutions of the utility model.

Claims

1. the bonder of a LED lamp bead, it is characterised in that: the bonder of described LED lamp bead includes: coring swing arm, warm-air pipe；

Described warm-air pipe is positioned at coring swing arm both sides, and warm-air pipe, for placing after LED chip position blowing high temperature gas near tin paste layer in precalculated position in coring swing arm, makes tin paste layer melt, and warm-air pipe also includes nozzle, and the internal diameter of nozzle tapers into.