CN204103926U - A kind of LED-based underwater high-speed optical communication system - Google Patents
A kind of LED-based underwater high-speed optical communication system Download PDFInfo
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- CN204103926U CN204103926U CN201420576020.9U CN201420576020U CN204103926U CN 204103926 U CN204103926 U CN 204103926U CN 201420576020 U CN201420576020 U CN 201420576020U CN 204103926 U CN204103926 U CN 204103926U
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Abstract
The utility model relates to a kind of LED-based underwater high-speed optical communication system.Power module circuitry in the utility model provides 3.3V power supply to governor circuit.5V ,-5V power supply is provided to optical transmitter module, optical receiver module.PC modular circuit is responsible for providing the signal of needs transmitting to main control module circuit and receiving the signal come from the transmission of optical receiver module circuit, main control module circuit provides signal for optical transmitter module circuit, and optical receiver module circuit is responsible for receiving the signal that optical transmitter module circuit sends.System involved by the utility model can carry arbitrary equipment possessing lift-launch condition, can survey the state that equipment runs, and for equipment provides the means of transmitting and receiving data, can be implemented in short-range, the subsurface communication at a high speed of various underwater environment.
Description
Technical field
The utility model belongs to areas of information technology, relates to a kind of LED-based undersea optical communications system of high speed, be mainly used at a high speed, moderate distance, among lower powered, simpler Communication System Design.
Background technology
At present, we to explore in ocean in detection face one huge challenge how to complete transfer of data fast and accurately by transducer or unmanned systems.At present, underwater communications system mainly relies on Sonar system to realize, but Sonar system exists the deficiencies such as traffic rate is low, communication delay is large, and therefore more and more scientist starts to explore the possibility of being carried out underwater wireless transmission data by light.The scientist that Massachusetts Institute Technology's WHOI (WHOI) applies Marine Sciences and engineering department (AOPE) proposes to utilize optical communication technique to improve subsurface communication ability.
Optical communication technique can overcome the defects such as the narrow bandwidth of underwater acoustic communications, large, applicatory carrier frequency affected by environment time delay that is low, transmission is large.Frequency of light wave is high, and its information carrying capacity is strong, and anti-electromagnetic interference capability is strong, and light wave can reach gigabit in the transmission rate of aqueous medium, makes the fast transport of large information capacity data under water become possibility.
Terminal (can be PC or microprocessor) is sent data to transmitter by the task of the LED-based undersea optical communications system of reliable high speed exactly, converts the electrical signal to light signal.Signal is transmitted, until reach receiver by transmission medium (such as water).Receiver by detection light signal, then converts thereof into the signal of telecommunication, and data send it back reception computer the most at last.Submarine optical communication is widely applied in the communication of coastal waters, its high bandwidth and can change operation advantage at such as UAV navigation, submarine, naval vessel; buoy; the short haul connection between the platform such as Docking station and diver is applied, compensate for the deficiency of underwater sonar communication and electromagnetic communication.
Summary of the invention
Short-range in order to guarantee to carry out between platforms, high bandwidth, the problem of transfer of data at a high speed, the utility model provides a kind of LED-based underwater high-speed optical communication system.
The technical solution of the utility model is as follows:
The utility model comprises power module, main control module, optical transmitter module, optical receiver module.
Power module circuitry comprises primary power source conversion chip IC1, IC2, secondary power supply conversion chip IC3, voltage stabilizing didoe D1, D2, four electrochemical capacitors EC1, EC2, EC3, EC4, seven ceramic disc capacitors C1, C2, C3, C4, C5, C6, C7, two inductance L 1, L2, eight resistance R1, R2, R3, R4, R5, R6, R7, R8.7 pin of primary power source conversion chip IC1, IC2 are all connected with the input positive pole of Vin and electrochemical capacitor EC1 and one end of ceramic disc capacitor C3, the negative pole of electrochemical capacitor EC1 and the other end ground connection of ceramic disc capacitor C3; 5 pin of primary power source conversion chip IC1, IC2 are all connected with one end of resistance R3, R4, and the other end of resistance R3 is connected with input Vin, the other end ground connection of resistance R4; 1 pin of primary power source conversion chip IC1 is connected with one end of ceramic disc capacitor C1, the other end of ceramic disc capacitor C1 is connected with one end of inductance L 1,8 pin of primary power source conversion chip IC1 and the negative electrode of voltage stabilizing didoe D1, the other end of inductance L 1 is connected with one end of the positive pole of electrochemical capacitor EC2, ceramic disc capacitor C2 and one end of resistance R1, and this end points is 5V output.The other end of resistance R1 is connected with 4 pin of one end of resistance R2 and primary power source conversion chip IC1, the other end ground connection of resistance R2.6 pin of primary power source conversion chip IC1, the anode of voltage stabilizing didoe D1, the negative pole of electrochemical capacitor EC2, the other end ground connection of ceramic disc capacitor C2.1 pin of primary power source conversion chip IC2 is connected with one end of ceramic disc capacitor C4, the other end of ceramic disc capacitor C4 is connected with the negative electrode of one end of inductance L 2, voltage stabilizing didoe D2 and 8 pin of primary power source conversion chip IC2, the other end of inductance L 2 is connected with one end of the positive pole of electrochemical capacitor EC3, ceramic disc capacitor C5 and one end of resistance R5 and ground connection, and the other end of resistance R5 is connected with 4 pin of one end of resistance R6 and primary power source conversion chip IC2; The anode of 6 pin of primary power source conversion chip IC2 and the negative pole of electrochemical capacitor EC4, voltage stabilizing didoe D2, the negative pole of electrochemical capacitor EC3, the other end of ceramic disc capacitor C5, the other end of resistance R6 are connected, and this end points is-5V output.The positive pole of electrochemical capacitor EC4 is connected with input Vin.1 pin, 3 pin of secondary power supply conversion chip IC3 are connected with one end of 5V output, ceramic disc capacitor C7; 2 pin of secondary power supply conversion chip IC3 are connected with the other end of ceramic disc capacitor C7 and ground; 4 pin of secondary power supply conversion chip IC3 are connected with one end of one end of resistance R7 and resistance R8, the other end ground connection of resistance R8.The other end of resistance R7 is connected with 5 pin of one end of ceramic disc capacitor C6 and secondary power supply conversion chip IC3, and this end points is 3.3V output.The other end ground connection of ceramic disc capacitor C6.
Main control module is by main control chip IC4, level transferring chip IC5, infrared coding chip IC 6, three crystal oscillator X1, X2, X3,13 electric capacity C8, C9, C10, C11, C12, C13, C14, C15, C16, C17, C18, C19, C20, three resistance R9, R10, R11, a button S1.1 pin of main control chip IC4 is connected with one end of ceramic disc capacitor C9 with the 3.3V voltage output end in power module circuitry, the other end ground connection of ceramic disc capacitor C9.64 pin of main control chip IC4 are connected with one end of ceramic disc capacitor C8 with the 3.3V voltage output end in power module circuitry, the other end ground connection of ceramic disc capacitor C8.62 pin of main control chip IC4,63 pin ground connection; 8 pin of main control chip IC4 are connected with one end of crystal oscillator X1, and the other end of crystal oscillator X1 is connected with 9 pin of main control chip IC4; 53 pin of main control chip IC4 are connected with one end of ceramic disc capacitor C10 with one end of crystal oscillator X2, the other end ground connection of ceramic disc capacitor C10.The other end of crystal oscillator X2 is connected with one end of ceramic disc capacitor C11 with 52 pin of main control chip IC4, the other end ground connection of ceramic disc capacitor C11.32 pin of main control chip IC4,33 pin are connected with 10 pin of level transferring chip IC5,9 pin respectively.58 pin of main control chip IC4 are connected with one end of one end of button S1, resistance R9, one end of electric capacity C12, the other end of resistance R9 connects 3.3V voltage output end, the button S1 other end is connected with one end of resistance R10, the other end of resistance R10 and the other end ground connection of electric capacity C12.16 pin of level transferring chip IC5 are connected with one end of power module circuitry 3.3V voltage output end and ceramic disc capacitor C20, the other end ground connection of ceramic disc capacitor C20; 1 pin of level transferring chip IC5 is connected with one end of ceramic disc capacitor C19, and the other end of ceramic disc capacitor C19 is connected with 3 pin of level transferring chip IC5; 4 pin of level transferring chip IC5 are connected with one end of ceramic disc capacitor C18, and the other end of ceramic disc capacitor C18 is connected with 5 pin of level transferring chip IC5; 2 pin of level transferring chip IC5 are connected with one end of ceramic disc capacitor C17, the other end ground connection of ceramic disc capacitor C17; 6 pin of level transferring chip IC5 are connected with one end of ceramic disc capacitor C16, the other end ground connection of ceramic disc capacitor C16; 1 pin of infrared coding chip IC 6 is connected with 36 pin of main control chip IC4; 2 pin of infrared coding chip IC 6 are connected with 37 pin of main control chip IC4; 3 pin of infrared coding chip IC 6 are connected with 35 pin of main control chip IC4; 4 pin of infrared coding chip IC 6 are connected with 34 pin of main control chip IC4; 6 pin of infrared coding chip IC 6 are connected with one end of one end of resistance R16, crystal oscillator X3, one end of ceramic disc capacitor C14, and 7 pin of infrared coding chip IC 6 are connected with the other end of the other end of resistance R11, crystal oscillator Y1, one end of ceramic disc capacitor C15; The other end ground connection of ceramic disc capacitor C14, C15; 16 pin of infrared coding chip IC 6 are connected with one end of 5V power output end and ceramic disc capacitor C13, the other end ground connection of ceramic disc capacitor C13.
Optical transmitter module circuit is by LED drive chip IC7, five electrochemical capacitors EC5, EC6, EC7, EC8, EC9, a ceramic disc capacitor C21,5 resistance R12, R13, R14, R15, R16, a voltage stabilizing didoe D3, a MOS driving tube Q1,12 LED L3, L4, L5, L6, L7, L8, L9, L10, L11, L12, L13, L14, compositions.1 pin of LED drive chip IC7 is connected with the positive pole of input Vin, electrochemical capacitor EC7 and the anode of voltage stabilizing didoe D3; 2 pin of LED drive chip IC7 are connected with 14 pin of main control module circuit infrared coding chip IC 6; 3 pin of LED drive chip IC7 are connected with the positive pole of electrochemical capacitor EC9; The minus earth of 4 pin of LED drive chip IC7,5 pin, 6 pin, electrochemical capacitor EC7, EC9; 8 pin of LED drive chip IC7 are connected with the positive pole of the negative electrode of voltage stabilizing didoe D3 and electrochemical capacitor EC8, the minus earth of electrochemical capacitor EC8; 7 pin of LED drive chip IC7 are connected with one end of resistance R16, and the other end of resistance R16 is connected with the grid of MOS driving tube Q1, the grounded drain of MOS driving tube Q1; The source electrode of MOS driving tube Q1 is connected with one end of LED L5, L8, L11, L14; The other end of LED L5 is connected with one end of LED L4, and the other end of LED L8 is connected with one end of LED L7, and the other end of LED L11 is connected with one end of LED L10, and the other end of LED L14 is connected with one end of LED L13; The other end of LED L4 is connected with one end of LED L3, and the other end of LED L7 is connected with one end of LED L6, and the other end of LED L10 is connected with one end of LED L9, and the other end of LED L13 is connected with one end of LED L12; The other end of LED L3, L6, L9, L12 is all connected with one end of resistance R15; The other end of resistance R15 is connected with one end of resistance R14, the other end of resistance R14 is connected with one end of resistance R13, the other end of resistance R13 is connected with one end of resistance R12, and the other end of resistance R12 and voltage input end Vin and the positive pole of electrochemical capacitor EC5, EC6, one end of ceramic disc capacitor C21 are connected; The negative pole of electrochemical capacitor EC5, EC6, the other end ground connection of ceramic disc capacitor C21.
Optical receiver module circuit is by operational amplifier chip IC 8, IC9, comparator chip IC 10,11 ceramic disc capacitor C22, C23, C24, C25, C26, C27, C28, C29, C30, C31, C32,11 resistance R17, R18, R19, R20, R21, R22, R23, R24, R25, R26, R27, a light-receiving head D4, three electrochemical capacitors EC10, EC11, EC12.4 pin of operational amplifier chip IC 8 are connected with the negative pole of power module circuitry-5V output, electrochemical capacitor EC11, one end of ceramic disc capacitor C24; The other end ground connection of 3 pin of operational amplifier chip IC 8, the positive pole of electrochemical capacitor EC11, ceramic disc capacitor C24.7 pin of operational amplifier chip IC 8 are connected with the positive pole of power module circuitry 5V output, electrochemical capacitor EC10, one end of ceramic disc capacitor C23, and the positive pole of electrochemical capacitor EC10, the other end of ceramic disc capacitor C23 connect ground.2 pin of operational amplifier chip IC 8 are connected with one end of the anode of light-receiving head D4, ceramic disc capacitor C22, resistance R17; The negative electrode of light-receiving head D4 connects power module circuitry 5V output; The other end of ceramic disc capacitor C22 is connected with one end of the other end of resistance R17, resistance R18, and the other end of resistance R18 is connected with one end of ceramic disc capacitor C25 with 6 pin of operational amplifier chip IC 8.The other end of ceramic disc capacitor C25 is connected with one end of resistance R19; The other end of resistance R19 is connected with one end of one end of resistance R20, resistance R21, one end of ceramic disc capacitor C28; The other end ground connection of ceramic disc capacitor C28; 6 pin of another termination operational amplifier chip IC 9 of resistance R20 and one end of ceramic disc capacitor C27 connect; The other end of resistance R21, the other end of ceramic disc capacitor C27 are connected with 2 pin of operational amplifier chip IC 9; 3 pin ground connection of operational amplifier chip IC 9; 4 pin of operational amplifier chip IC 9 are connected with the negative pole of power module circuitry-5V output, electrochemical capacitor EC13, one end of ceramic disc capacitor C30; The positive pole of electrochemical capacitor EC13, the other end ground connection of ceramic disc capacitor C30; 7 pin of operational amplifier chip IC 9 are connected with the positive pole of power module circuitry 5V output, electrochemical capacitor EC12, one end of ceramic disc capacitor C29; The negative pole of electrochemical capacitor EC12, the other end ground connection of ceramic disc capacitor C29; 6 pin of operational amplifier chip IC 9 are connected with one end of ceramic disc capacitor C26, and the other end of ceramic disc capacitor C26 is connected with one end of resistance R22, and the other end of resistance R22 is connected with one end of one end of ceramic disc capacitor C31, resistance R23; The other end of resistance R23 is connected with one end of one end of resistance R27, ceramic disc capacitor C32; The other end ground connection of ceramic disc capacitor C31, C32; 4 pin ground connection of operational amplifier chip IC 10; 5 pin of operational amplifier chip IC 10 are connected with one end of the other end of resistance R27, resistance R24; 6 pin of operational amplifier chip IC 10 are connected with one end of resistance R25, R26; The other end of resistance R25 is connected with the 5V output of power module circuitry; The other end ground connection of resistance R26; 7 pin of operational amplifier chip IC 10 are connected with 15 pin of the infrared coding chip IC 6 of the other end of resistance R24, main control module circuit; 8 pin of operational amplifier chip IC 10 are connected with the 5V output of power module circuitry.
Wherein, primary power source conversion chip IC1, IC2 adopt the TPS5430 of Texas Instruments, and secondary power supply conversion chip IC3 adopts the TPS78001 of Texas Instruments; Main control chip IC4 adopts the MSP430F149 of Texas Instruments, and level transferring chip IC5 adopts the MAX3232 of MAXIM company, and infrared coding chip IC 6 adopts the TOIM4232 of VISHAY company; LED drive chip adopts the IR2125 of International Rectifier company; LED drive chip IC7 adopts the IR2125 of International Rectifier company; Operational amplifier IC8 adopts the OPA656 of Texas Instruments, and operational amplifier IC9 adopts the OPA847 of Texas Instruments, and comparator chip IC 10 adopts the LM393 of Texas Instruments.
The beneficial effects of the utility model: the system involved by the utility model can carry arbitrary equipment possessing lift-launch condition, the state that equipment runs can be surveyed, for equipment provides the means of transmitting and receiving data, can be implemented in short-range, the subsurface communication at a high speed of various underwater environment.
Accompanying drawing explanation
Fig. 1 is a kind of theory diagram of LED-based undersea optical communications system of high speed;
Fig. 2 is the most basic circuit schematic diagram of power module in this undersea optical communications system;
Fig. 3 is the most basic circuit schematic diagram of main control module in this undersea optical communications system;
Fig. 4 is the most basic circuit schematic diagram of optical transmitter module in this undersea optical communications system;
Fig. 5 is the most basic circuit schematic diagram of Optical Receivers in this undersea optical communications system.
Embodiment
Below in conjunction with accompanying drawing to LED-based underwater high-speed optical communication system detailed description in addition.In accompanying drawing 1, the effect of each functional block is as follows:
1. power module: the operating voltage that whole system is provided;
2.PC: the required signal of transmission and the reception of signal are provided;
3. main control module: signal is carried out to the operations such as transmission and reception, conversion, control;
4. optical transmitter module: light signal to be sent, the operation such as change;
5. optical receiver module: light signal to be received, the operation such as conversion.
As shown in Figure 1, power module circuitry 1 provides 3.3V power supply to governor circuit 3.5V ,-5V power supply is provided to optical transmitter module, optical receiver module.PC modular circuit 2 is responsible for providing the signal of needs transmitting to main control module circuit 3 and receiving the signal come from optical receiver module circuit 5 transmission, main control module circuit 3 provides signal for optical transmitter module circuit 4, and optical receiver module circuit 5 is responsible for receiving the signal that optical transmitter module circuit 4 sends.
As shown in Figure 2, power module circuitry comprises primary power source conversion chip IC1, IC2, secondary power supply conversion chip IC3, voltage stabilizing didoe D1, D2, four electrochemical capacitors EC1, EC2, EC3, EC4, seven ceramic disc capacitors C1, C2, C3, C4, C5, C6, C7, two inductance L 1, L2, eight resistance R1, R2, R3, R4, R5, R6, R7, R8.Wherein, primary power source conversion chip IC1, IC2 adopt the TPS5430 of Texas Instruments, and secondary power supply conversion chip adopts the TPS78001 of Texas Instruments.
7 pin of power conversion chip IC1, IC2 are connected with input, jump to electric capacity EC1, C3 to ground simultaneously; The equal cross-over connection R3 of 5 pin of power conversion chip IC1, IC2 is to input, and cross-over connection R4 is to ground; 1 pin of power conversion chip IC1,7 pin flying capcitor C1 are to inductance L 1; Cross-over connection diode D1 is to ground; Inductance L 1 draws 5V output flying capcitor EC2, C2 to ground, cross-over connection R1 to R2, R2 ground connection; The 6 pin ground connection of power conversion chip IC1; 1 pin of power conversion chip IC2,8 pin flying capcitor C10 to inductance L 2, inductance L 2 ground connection; Jump to the negative electrode of diode D2,6 pin of power conversion chip IC2 jump to the anode of diode D2, and flying capcitor EC1, C5 are to ground; Cross-over connection R6 to R5, R5 ground connection; Flying capcitor EC4 is to input; 1 pin, 2 pin of power conversion chip IC3 jump to electric capacity C7, and 1 pin, 3 pin connect 5V output, 2 pin ground connection; 4 pin cross-over connection resistance R8 are to ground; 5 pin cross-over connection resistance R7 electric capacity C6 are to ground; And draw 5 pin as 3.3V output.
Main control module is by main control chip IC4, level transferring chip IC5, infrared coding chip IC 6, three crystal oscillator X1, X2, Y1,13 electric capacity C8, C9, C10, C11, C12, C13, C14, C15, C16, C17, C18, C19, C20, three resistance R9, R10, R11, a button S1.Main control chip IC4 adopts the MSP430F149 of Texas Instruments, and level transferring chip IC5 adopts the MAX3232 of MAXIM company, and infrared coding chip IC 6 adopts the TOIM4232 of VISHAY company.
1 pin of IC4 connects 3.3V voltage output end, and flying capcitor C9 is to ground; 8 pin, 9 pin cross-over connection crystal oscillator X1; 52 pin, 53 pin cross-over connection crystal oscillator X2, flying capcitor C10, C11 are to ground; 58 pin cross-over connection R9 to 3.3V outputs, flying capcitor C12 is to ground, and cross-over connection button S1 is to resistance R10, R10 ground connection; 9 pin, 10 pin of 32 pin of IC4,33 pin and IC5 are connected; The 1 pin 3 pin flying capcitor C19 of IC5,4 pin, 5 pin flying capcitor C18,2 pin flying capcitor C17 are to ground; 6 pin flying capcitor C16 are to ground; 16 pin connect 3.3V output, and flying capcitor C20 is to ground; 15 pin ground connection; 1 pin of 34 pin of IC6,35 pin, 36 pin, 37 pin and IC6,2 pin, 3 pin, 4 pin are connected; 6 pin, 7 pin cross-over connection resistance R11, crystal oscillator Y1,6 pin flying capcitor C14 are to ground, and 7 pin flying capcitor C15 are to ground; 8 pin ground connection; 16 pin connect 5V voltage output end and flying capcitor C13 to ground.
As shown in Figure 4, optical transmitter module circuit is made up of LED drive chip IC7, five electrochemical capacitor EC5, EC6, EC7, EC8, EC9, ceramic disc capacitor C21,5 resistance R12, R13, R14, R15, R16, voltage stabilizing didoe D3, MOS driving tube Q1,12 LED L3, L4, L5, L6, L7, L8, L9, L10, L11, L12, L13, L14.LED drive chip adopts the IR2125 of International Rectifier company, and metal-oxide-semiconductor adopts the sdu40n10 of SamHop Microelectronics company, and emitting head LED adopts the hlmpcm36x1000 of Agilent company.
1 pin of IC7 is connected with input, and flying capcitor EC7 is to ground, and cross-over connection diode D3 is to 8 pin; 2 pin are connected with 4 pin of IC6; 3 pin flying capcitor EC9 are to ground; 4 pin, 5 pin, 6 pin ground connection; 8 pin flying capcitor EC8 are to ground; 7 pin cross-over connection resistance R16 to metal-oxide-semiconductor Q1 grids, grounded drain, source electrode meets the cross-over connection of LED difference L5, L8, L11, L14 to LED L4, L7, L10, L13, LED L4, the cross-over connection of L7, L10, L13 difference L3, L6, L9, L12 are to resistance R15, R15 cross-over connection R14 to R13, cross-over connection R13 to R12, cross-over connection R12 are to input, electric capacity C14, C19, C22 to ground.
As shown in Figure 5, optical receiver module circuit is made up of operational amplifier chip IC 8, IC9, comparator chip IC 10, ten ceramic disc capacitor C22, C23, C24, C25, C26, C27, C28, C29, C30, C31, C32,12 resistance R18, R19, R20, R21, R22, R23, R24, R25, R26, R27, R28, R29, light-receiving head D4, three electrochemical capacitors EC10, EC11, EC12.Operational amplifier IC8 adopts the OPA656 of Texas Instruments, and operational amplifier IC9 adopts the OPA847 of Texas Instruments, and comparator chip IC 10 adopts the LM393 of Texas Instruments, and Receiver adopts the pin-13dsb of Finisar company.
The negative electrode of light-receiving head D4 connects 5V output, 2 pin of anode concatenation operation amplifier chip IC8, and 2 pin flying capcitor C22, the resistance R17 of IC8 are to the 6 pin connections of resistance R18, R18 and IC8; The 3 pin ground connection of IC8,4 pin of IC8 connect 5V output, and flying capcitor EC11, C24 are to ground; 7 pin of IC8 connect 5V output, and flying capcitor EC10, C23 are to ground; 6 pin flying capcitor C25 to the R19 of IC8, R19 cross-over connection C28 is to ground, 6 pin of cross-over connection resistance R20 to operational amplifier IC9, and flying capcitor C45 to R6, R17 cross-over connection resistance R18, R18 connect 2 pin of IC9, and 6 pin of flying capcitor C27 to IC9, the 3 pin ground connection of IC9,4 pin of IC9 connect 5V output, and flying capcitor EC13, C30 are to ground; 6 pin cross-over connection C26 to the R22 of IC9, cross-over connection R22 to C31 are to ground, and R22 cross-over connection C23 to R27, cross-over connection C32 are to ground; 5 pin of R23 and IC10 connect, and 7 pin of cross-over connection R24 to IC10, the 4 pin ground connection of IC10,6 pin cross-over connection R25 to the 5V outputs of IC10, cross-over connection R26 is to ground.
The core of the optical transmitter module in the utility model is light source and drive circuit.Optical sender light source adopts light-emitting diode, and the color of light-emitting diode is green, can obtain maximum brightness and export; Optical sender LED drive circuit adopts metal-oxide-semiconductor driving chip to form boostrap circuit and drives high-power MOS tube, and light-emitting diode can normally be worked; Optical receiver module forms primarily of photodiode, transimpedance amplifier, unlimited many gains low pass filter, passive RC low pass filter and comparator, current conversion by photodiode is become voltage by transimpedance amplifier, and amplifying signal, obtain purer signal by unlimited many gains low pass filter and passive RC low pass filter again, obtain TTL data-signal by comparator.Achieve carry out between platform under water short-range, the transfer of data of the high speed of high bandwidth, compensate for the deficiency of underwater sonar communication and electromagnetic communication, do not grudge it such as at UAV navigation, submarine, naval vessel, buoy, is applied in the communication system between the platform such as Docking station and diver.
Adopt above technical scheme, this LED-based optical communication system can easy to doly reach under water between platform at a high speed, the object of the short range data transmission of high bandwidth, and facts have proved that it is in the process of transfer of data, work that can be steady in a long-term.
Claims (1)
1. a LED-based underwater high-speed optical communication system, comprises power module, main control module, optical transmitter module, optical receiver module, it is characterized in that:
Power module circuitry comprises primary power source conversion chip IC1, IC2, secondary power supply conversion chip IC3, voltage stabilizing didoe D1, D2, four electrochemical capacitors EC1, EC2, EC3, EC4, seven ceramic disc capacitors C1, C2, C3, C4, C5, C6, C7, two inductance L 1, L2, eight resistance R1, R2, R3, R4, R5, R6, R7, R8; 7 pin of primary power source conversion chip IC1, IC2 are all connected with the input positive pole of Vin and electrochemical capacitor EC1 and one end of ceramic disc capacitor C3, the negative pole of electrochemical capacitor EC1 and the other end ground connection of ceramic disc capacitor C3; 5 pin of primary power source conversion chip IC1, IC2 are all connected with one end of resistance R3, R4, and the other end of resistance R3 is connected with input Vin, the other end ground connection of resistance R4; 1 pin of primary power source conversion chip IC1 is connected with one end of ceramic disc capacitor C1, the other end of ceramic disc capacitor C1 is connected with one end of inductance L 1,8 pin of primary power source conversion chip IC1 and the negative electrode of voltage stabilizing didoe D1, the other end of inductance L 1 is connected with one end of the positive pole of electrochemical capacitor EC2, ceramic disc capacitor C2 and one end of resistance R1, and this end points is 5V output; The other end of resistance R1 is connected with 4 pin of one end of resistance R2 and primary power source conversion chip IC1, the other end ground connection of resistance R2; 6 pin of primary power source conversion chip IC1, the anode of voltage stabilizing didoe D1, the negative pole of electrochemical capacitor EC2, the other end ground connection of ceramic disc capacitor C2; 1 pin of primary power source conversion chip IC2 is connected with one end of ceramic disc capacitor C4, the other end of ceramic disc capacitor C4 is connected with the negative electrode of one end of inductance L 2, voltage stabilizing didoe D2 and 8 pin of primary power source conversion chip IC2, the other end of inductance L 2 is connected with one end of the positive pole of electrochemical capacitor EC3, ceramic disc capacitor C5 and one end of resistance R5 and ground connection, and the other end of resistance R5 is connected with 4 pin of one end of resistance R6 and primary power source conversion chip IC2; The anode of 6 pin of primary power source conversion chip IC2 and the negative pole of electrochemical capacitor EC4, voltage stabilizing didoe D2, the negative pole of electrochemical capacitor EC3, the other end of ceramic disc capacitor C5, the other end of resistance R6 are connected, and this end points is-5V output; The positive pole of electrochemical capacitor EC4 is connected with input Vin; 1 pin, 3 pin of secondary power supply conversion chip IC3 are connected with one end of 5V output, ceramic disc capacitor C7; 2 pin of secondary power supply conversion chip IC3 are connected with the other end of ceramic disc capacitor C7 and ground; 4 pin of secondary power supply conversion chip IC3 are connected with one end of one end of resistance R7 and resistance R8, the other end ground connection of resistance R8; The other end of resistance R7 is connected with 5 pin of one end of ceramic disc capacitor C6 and secondary power supply conversion chip IC3, and this end points is 3.3V output; The other end ground connection of ceramic disc capacitor C6;
Main control module is by main control chip IC4, level transferring chip IC5, infrared coding chip IC 6, three crystal oscillator X1, X2, X3,13 electric capacity C8, C9, C10, C11, C12, C13, C14, C15, C16, C17, C18, C19, C20, three resistance R9, R10, R11, a button S1; 1 pin of main control chip IC4 is connected with one end of ceramic disc capacitor C9 with the 3.3V voltage output end in power module circuitry, the other end ground connection of ceramic disc capacitor C9; 64 pin of main control chip IC4 are connected with one end of ceramic disc capacitor C8 with the 3.3V voltage output end in power module circuitry, the other end ground connection of ceramic disc capacitor C8; 62 pin of main control chip IC4,63 pin ground connection; 8 pin of main control chip IC4 are connected with one end of crystal oscillator X1, and the other end of crystal oscillator X1 is connected with 9 pin of main control chip IC4; 53 pin of main control chip IC4 are connected with one end of ceramic disc capacitor C10 with one end of crystal oscillator X2, the other end ground connection of ceramic disc capacitor C10; The other end of crystal oscillator X2 is connected with one end of ceramic disc capacitor C11 with 52 pin of main control chip IC4, the other end ground connection of ceramic disc capacitor C11; 32 pin of main control chip IC4,33 pin are connected with 10 pin of level transferring chip IC5,9 pin respectively; 58 pin of main control chip IC4 are connected with one end of one end of button S1, resistance R9, one end of electric capacity C12, the other end of resistance R9 connects 3.3V voltage output end, the button S1 other end is connected with one end of resistance R10, the other end of resistance R10 and the other end ground connection of electric capacity C12; 16 pin of level transferring chip IC5 are connected with one end of power module circuitry 3.3V voltage output end and ceramic disc capacitor C20, the other end ground connection of ceramic disc capacitor C20; 1 pin of level transferring chip IC5 is connected with one end of ceramic disc capacitor C19, and the other end of ceramic disc capacitor C19 is connected with 3 pin of level transferring chip IC5; 4 pin of level transferring chip IC5 are connected with one end of ceramic disc capacitor C18, and the other end of ceramic disc capacitor C18 is connected with 5 pin of level transferring chip IC5; 2 pin of level transferring chip IC5 are connected with one end of ceramic disc capacitor C17, the other end ground connection of ceramic disc capacitor C17; 6 pin of level transferring chip IC5 are connected with one end of ceramic disc capacitor C16, the other end ground connection of ceramic disc capacitor C16; 1 pin of infrared coding chip IC 6 is connected with 36 pin of main control chip IC4; 2 pin of infrared coding chip IC 6 are connected with 37 pin of main control chip IC4; 3 pin of infrared coding chip IC 6 are connected with 35 pin of main control chip IC4; 4 pin of infrared coding chip IC 6 are connected with 34 pin of main control chip IC4; 6 pin of infrared coding chip IC 6 are connected with one end of one end of resistance R16, crystal oscillator X3, one end of ceramic disc capacitor C14, and 7 pin of infrared coding chip IC 6 are connected with the other end of the other end of resistance R11, crystal oscillator Y1, one end of ceramic disc capacitor C15; The other end ground connection of ceramic disc capacitor C14, C15; 16 pin of infrared coding chip IC 6 are connected with one end of 5V power output end and ceramic disc capacitor C13, the other end ground connection of ceramic disc capacitor C13;
Optical transmitter module circuit is by LED drive chip IC7, five electrochemical capacitors EC5, EC6, EC7, EC8, EC9, a ceramic disc capacitor C21,5 resistance R12, R13, R14, R15, R16, a voltage stabilizing didoe D3, a MOS driving tube Q1,12 LED L3, L4, L5, L6, L7, L8, L9, L10, L11, L12, L13, L14, compositions; 1 pin of LED drive chip IC7 is connected with the positive pole of input Vin, electrochemical capacitor EC7 and the anode of voltage stabilizing didoe D3; 2 pin of LED drive chip IC7 are connected with 14 pin of main control module circuit infrared coding chip IC 6; 3 pin of LED drive chip IC7 are connected with the positive pole of electrochemical capacitor EC9; The minus earth of 4 pin of LED drive chip IC7,5 pin, 6 pin, electrochemical capacitor EC7, EC9; 8 pin of LED drive chip IC7 are connected with the positive pole of the negative electrode of voltage stabilizing didoe D3 and electrochemical capacitor EC8, the minus earth of electrochemical capacitor EC8; 7 pin of LED drive chip IC7 are connected with one end of resistance R16, and the other end of resistance R16 is connected with the grid of MOS driving tube Q1, the grounded drain of MOS driving tube Q1; The source electrode of MOS driving tube Q1 is connected with one end of LED L5, L8, L11, L14; The other end of LED L5 is connected with one end of LED L4, and the other end of LED L8 is connected with one end of LED L7, and the other end of LED L11 is connected with one end of LED L10, and the other end of LED L14 is connected with one end of LED L13; The other end of LED L4 is connected with one end of LED L3, and the other end of LED L7 is connected with one end of LED L6, and the other end of LED L10 is connected with one end of LED L9, and the other end of LED L13 is connected with one end of LED L12; The other end of LED L3, L6, L9, L12 is all connected with one end of resistance R15; The other end of resistance R15 is connected with one end of resistance R14, the other end of resistance R14 is connected with one end of resistance R13, the other end of resistance R13 is connected with one end of resistance R12, and the other end of resistance R12 and voltage input end Vin and the positive pole of electrochemical capacitor EC5, EC6, one end of ceramic disc capacitor C21 are connected; The negative pole of electrochemical capacitor EC5, EC6, the other end ground connection of ceramic disc capacitor C21;
Optical receiver module circuit is by operational amplifier chip IC 8, IC9, comparator chip IC 10,11 ceramic disc capacitor C22, C23, C24, C25, C26, C27, C28, C29, C30, C31, C32,11 resistance R17, R18, R19, R20, R21, R22, R23, R24, R25, R26, R27, a light-receiving head D4, three electrochemical capacitors EC10, EC11, EC12; 4 pin of operational amplifier chip IC 8 are connected with the negative pole of power module circuitry-5V output, electrochemical capacitor EC11, one end of ceramic disc capacitor C24; The other end ground connection of 3 pin of operational amplifier chip IC 8, the positive pole of electrochemical capacitor EC11, ceramic disc capacitor C24; 7 pin of operational amplifier chip IC 8 are connected with the positive pole of power module circuitry 5V output, electrochemical capacitor EC10, one end of ceramic disc capacitor C23, and the positive pole of electrochemical capacitor EC10, the other end of ceramic disc capacitor C23 connect ground; 2 pin of operational amplifier chip IC 8 are connected with one end of the anode of light-receiving head D4, ceramic disc capacitor C22, resistance R17; The negative electrode of light-receiving head D4 connects power module circuitry 5V output; The other end of ceramic disc capacitor C22 is connected with one end of the other end of resistance R17, resistance R18, and the other end of resistance R18 is connected with one end of ceramic disc capacitor C25 with 6 pin of operational amplifier chip IC 8; The other end of ceramic disc capacitor C25 is connected with one end of resistance R19; The other end of resistance R19 is connected with one end of one end of resistance R20, resistance R21, one end of ceramic disc capacitor C28; The other end ground connection of ceramic disc capacitor C28; 6 pin of another termination operational amplifier chip IC 9 of resistance R20 and one end of ceramic disc capacitor C27 connect; The other end of resistance R21, the other end of ceramic disc capacitor C27 are connected with 2 pin of operational amplifier chip IC 9; 3 pin ground connection of operational amplifier chip IC 9; 4 pin of operational amplifier chip IC 9 are connected with the negative pole of power module circuitry-5V output, electrochemical capacitor EC13, one end of ceramic disc capacitor C30; The positive pole of electrochemical capacitor EC13, the other end ground connection of ceramic disc capacitor C30; 7 pin of operational amplifier chip IC 9 are connected with the positive pole of power module circuitry 5V output, electrochemical capacitor EC12, one end of ceramic disc capacitor C29; The negative pole of electrochemical capacitor EC12, the other end ground connection of ceramic disc capacitor C29; 6 pin of operational amplifier chip IC 9 are connected with one end of ceramic disc capacitor C26, and the other end of ceramic disc capacitor C26 is connected with one end of resistance R22, and the other end of resistance R22 is connected with one end of one end of ceramic disc capacitor C31, resistance R23; The other end of resistance R23 is connected with one end of one end of resistance R27, ceramic disc capacitor C32; The other end ground connection of ceramic disc capacitor C31, C32; 4 pin ground connection of operational amplifier chip IC 10; 5 pin of operational amplifier chip IC 10 are connected with one end of the other end of resistance R27, resistance R24; 6 pin of operational amplifier chip IC 10 are connected with one end of resistance R25, R26; The other end of resistance R25 is connected with the 5V output of power module circuitry; The other end ground connection of resistance R26; 7 pin of operational amplifier chip IC 10 are connected with 15 pin of the infrared coding chip IC 6 of the other end of resistance R24, main control module circuit; 8 pin of operational amplifier chip IC 10 are connected with the 5V output of power module circuitry;
Wherein, primary power source conversion chip IC1, IC2 adopt the TPS5430 of Texas Instruments, and secondary power supply conversion chip IC3 adopts the TPS78001 of Texas Instruments; Main control chip IC4 adopts the MSP430F149 of Texas Instruments, and level transferring chip IC5 adopts the MAX3232 of MAXIM company, and infrared coding chip IC 6 adopts the TOIM4232 of VISHAY company; LED drive chip adopts the IR2125 of International Rectifier company; LED drive chip IC7 adopts the IR2125 of International Rectifier company; Operational amplifier IC8 adopts the OPA656 of Texas Instruments, and operational amplifier IC9 adopts the OPA847 of Texas Instruments, and comparator chip IC 10 adopts the LM393 of Texas Instruments.
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| US9490911B2 (en) | 2013-03-15 | 2016-11-08 | Fairfield Industries Incorporated | High-bandwidth underwater data communication system |
| US9490910B2 (en) | 2013-03-15 | 2016-11-08 | Fairfield Industries Incorporated | High-bandwidth underwater data communication system |
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| US10488537B2 (en) | 2016-06-30 | 2019-11-26 | Magseis Ff Llc | Seismic surveys with optical communication links |
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