CN204083927U

CN204083927U - A kind of chip upside-down mounting type LED daylight lamp

Info

Publication number: CN204083927U
Application number: CN201420531113.XU
Authority: CN
Inventors: 卢莹; 廖永发
Original assignee: Individual
Current assignee: Individual
Priority date: 2014-09-16
Filing date: 2014-09-16
Publication date: 2015-01-07
Anticipated expiration: 2024-09-16

Abstract

The utility model relates to a kind of chip upside-down mounting type LED daylight lamp, and this LED daylight lamp comprises fluorescent tube, substrate and joint, and substrate surface, with circuit and some circuit nodes, often pair of circuit node connects respectively N pole and the P pole of a flip-chip LED; In the outside of described circuit, flip-chip LED with layer of silica gel, and in layer of silica gel, be mixed with fluorescent material particulate; Circuit on substrate is connected with the joint of lamp tube ends.The utility model fluorescent lamp adopts flip chip structure, flip-chip unification is placed in direct the connecting with the circuit node on substrate of substrate top electrode and contacts, the unified silica gel with containing fluorescent material particulate encapsulates again, its production process without the need to weld gold thread, encapsulation once can complete, without the need to specific LED support, therefore production efficiency is high, cost is low, and flip LED chips by its electrode directly and circuit connect and dispel the heat, contact area is large, radiating efficiency is higher, therefore be conducive to making LED chip operating temperature be unlikely to too high, thus guarantee its service life.

Description

A kind of chip upside-down mounting type LED daylight lamp

Technical field:

The utility model relates to LED lamp technical field, refers in particular to a kind of chip upside-down mounting type LED daylight lamp.

Background technology:

What existing LED daylight lamp adopted is all welds one one packaged positive-installed LED as light emitting source on substrate, from integral production technique, this one one packaged after the mode production efficiency of welding again lower, chip is needed to be fixed in particular stent, weld gold thread etc. again, artificial and material cost is high; From configuration aspects, this positive-installed LED is poor in heat dispersion, and chip cooling is mainly by gold thread conduction, and therefore heat transfer efficiency is low, is unfavorable for the working environment of LED, affects its service life.

Utility model content:

The purpose of this utility model is the above-mentioned weak point overcoming prior art, provides a kind of chip upside-down mounting type LED daylight lamp.

The utility model realizes the technical scheme that its object adopts: a kind of chip upside-down mounting type LED daylight lamp, this LED daylight lamp comprises fluorescent tube, be arranged on the substrate in fluorescent tube and be arranged on the joint of lamp tube ends, it is characterized in that: described substrate surface, with circuit and some circuit nodes, often pair of circuit node connects respectively N pole and the P pole of a flip-chip LED; In the outside of described circuit, flip-chip LED with layer of silica gel, and in layer of silica gel, be mixed with fluorescent material particulate; Circuit on substrate is connected with the joint of lamp tube ends; In described fluorescent tube, the back side of substrate is provided with driving power.

Described substrate is transparent or nontransparent substrate, when for nontransparent substrate, substrate offers some loopholes, and the position of loophole can be arranged between adjacent flip-chip LED.

The utility model fluorescent lamp adopts flip chip structure, flip-chip unification is placed in direct the connecting with the circuit node on substrate of substrate top electrode and contacts, the unified silica gel with containing fluorescent material particulate encapsulates again, its production process is without the need to welding gold thread, encapsulation once can complete, and without the need to specific LED support, because this simplify production technology, production efficiency is high, cost is low, and flip LED chips by its electrode directly and circuit connect and dispel the heat, contact area is large, radiating efficiency is higher, therefore be conducive to making LED chip operating temperature be unlikely to too high, thus guarantee its service life.In addition, by adding fluorescent material particulate in the silica gel of encapsulation, luminescence can be made more even, before making, line luminescence is changed in the some luminescence of LED lamp tube, solve current LED lamp tube LED luminous point to the problem of the injury of eyes, also can solve the problem of blue light harm simultaneously by the proportioning adjusting fluorescent material; Moreover substrate can use transparent material, or during employing opaque material, loophole can be opened at substrate surface, thus reach the effect of fluorescent lamp Omnibearing even bright dipping.

Accompanying drawing illustrates:

Fig. 1 is the overall structure schematic diagram of the utility model LED daylight lamp.

Detailed description of the invention:

Below in conjunction with specific embodiments and the drawings, the utility model is further illustrated.

As shown in Figure 1, described in the utility model is a kind of chip upside-down mounting type LED daylight lamp, this LED daylight lamp comprises fluorescent tube 1, be arranged on the substrate 2 in fluorescent tube 1 and be arranged on the joint 11 at fluorescent tube 1 two ends, described substrate 2 surface, with circuit 3 and some circuit nodes 31, often pair of circuit node 31 connects respectively N pole 41 and the P pole 42 of a flip-chip LED4; In the outside of described circuit 3, flip-chip LED4 with layer of silica gel 5, and be mixed with fluorescent material particulate 51 in layer of silica gel 5; Circuit 3 on substrate 2 is electrically connected with the joint 11 at fluorescent tube 1 two ends; In described fluorescent tube 1, the back side of substrate 2 is provided with driving power 6.

Described substrate 2 is transparent or nontransparent substrate, when for nontransparent substrate, substrate 2 offers some loopholes 21, and the position of loophole 21 can be arranged between adjacent flip-chip LED4.

The utility model fluorescent lamp adopts flip chip structure, flip-chip LED is unified to be placed on substrate 2, its N pole and P extremely directly connect with the circuit node 31 on substrate 2 and contact, the unified silica gel with containing fluorescent material particulate encapsulates again, its production process is without the need to welding gold thread, encapsulation once can complete, and without the need to specific LED support, because this simplify production technology, production efficiency is high, cost is low, and flip LED chips by its electrode directly and circuit connect and dispel the heat, contact area is large, radiating efficiency is higher, therefore be conducive to making LED chip operating temperature be unlikely to too high, thus guarantee its service life.In addition, by adding fluorescent material particulate in the silica gel of encapsulation, luminescence can be made more even, before making, line luminescence is changed in the some luminescence of LED lamp tube, solve current LED lamp tube LED luminous point to the problem of the injury of eyes, also can solve the problem of blue light harm simultaneously by the proportioning adjusting fluorescent material; Moreover substrate can use transparent material, or during employing opaque material, loophole can be opened at substrate surface, thus reach the effect of fluorescent lamp Omnibearing even bright dipping.

Claims

1. a chip upside-down mounting type LED daylight lamp, this LED daylight lamp comprises fluorescent tube, be arranged on the substrate in fluorescent tube and be arranged on the joint of lamp tube ends, it is characterized in that: described substrate surface, with circuit and some circuit nodes, often pair of circuit node connects respectively N pole and the P pole of a flip-chip LED; In the outside of described circuit, flip-chip LED with layer of silica gel, and in layer of silica gel, be mixed with fluorescent material particulate; Circuit on substrate is connected with the joint of lamp tube ends; In described fluorescent tube, the back side of substrate is provided with driving power.

2. chip upside-down mounting type LED daylight lamp according to claim 1, is characterized in that: described substrate is transparent or nontransparent substrate, when for nontransparent substrate, substrate offers some loopholes.