CN203708731U - Intermittent impact jet fractal fin cooling device - Google Patents
Intermittent impact jet fractal fin cooling device Download PDFInfo
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- CN203708731U CN203708731U CN201320764025.XU CN201320764025U CN203708731U CN 203708731 U CN203708731 U CN 203708731U CN 201320764025 U CN201320764025 U CN 201320764025U CN 203708731 U CN203708731 U CN 203708731U
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- fractal
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- impact jet
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Abstract
The utility model relates to a cooling device of an electronic device, and especially relates to an intermittent impact jet fractal fin cooling device which is formed in a manner of combining the jet cooling technology and a finned radiator. The intermittent impact jet fractal fin cooling device mainly comprises two portions including an intermittent jet generation device and a fractal finned radiator, and is characterized in that gas is used as cooling medium, unstable intermittent air flow is formed by the intermittent impact jet generation device and directly impacts surfaces of fins, an electronic device with large heat flux density can be rapidly cooled, and energy consumption can be reduced. The fin network designed according to the fractal structure has good plane space filling capability and spatial distribution uniformity, heat exchange surface areas of the fins can be increased, radiating efficiency can be improved, temperature distribution of the radiator can be improved, local hot spots on the surface of a chip can be eliminated, the chip is prevented from being damaged, and service lifetime of the chip can be effectively prolonged.
Description
Technical field
The invention belongs to the cooling device of a kind of electronic devices and components of microelectronics technology, particularly the compound intensified heat-transfer system of a kind of combination Jet Cooling and finned radiator.
Background technology
Along with the development of microelectric technique, the integrated and microminiaturized constantly upgrading of electronic device, speed and power increase substantially.The density of heat flow rate of the microelectronic component of these high power densities is very large, and magnitude reaches 100W/cm
2left and right or higher.Therefore, for electronic equipment of new generation, the design and fabrication technology of traditional heat-dissipating device can not meet the demands, and heat radiation becomes the major obstacle that microelectronic industry further develops.
Jet Cooling is a kind of efficient and economic cooling technology, because the lip-deep flow boundary layer that flow process is short and impacted is thin, thereby makes stationary point annex produce very strong heat transfer effect.But, along with microminiaturization, the electronic circuit of electronics and computer are integrated, the unit caloric value of electronic module sharply rises, its density of heat flow rate is very large, only rely on traditional Jet Cooling to be difficult to meet modern technologies to develop the heat radiation requirement of the high heat flux bringing, therefore must seek more efficiently heat dissipating method and solve " thermal boundary " problem of electronic component.The overall size of electronic equipment, quality, consume metal material and flow resistance performance increases under few prerequisite, adopt finned radiator can increase heat removal surface area, improve heat dissipation capacity.But structure and spatial distribution limitation that most of finned radiators are arranged due to fin, cause the temperature distributing disproportionation on electronic chip even.
For the problems referred to above, can adopt freely ventilates reduces the thermal resistance of radiator with forced ventilation, but these methods need to consume larger pump merit conventionally, and high heat flux also can produce thermal noise or dark current.In a word, high heat flux electronic device is very urgent for the demand of efficient cooling technology.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of cooling device rapidly and uniformly of electronic device, and this cooling system combines Jet Cooling and finned radiator, is a kind of Combination Intensified Heat Transfer Technology.The heat and mass transfer process that adopts astable batch (-type) impact jet flow strengthening finned radiator, improves radiating efficiency, reduces energy consumption.Fin is arranged according to fractal structure, improves the uniformity of electronic chip Temperature Distribution.
The fractal fin cooling device of batch (-type) impact jet flow, comprise Micropump, gas bomb, microcontroller chip, cooling chamber, radiator substrate, it is characterized in that: the controlled valve of pressure-control valve and pressure chamber is linked by microcontroller chip control, form batch (-type) air-flow, and directly impact fractal fin and radiator substrate through nozzle array, form astable batch (-type) impact jet flow.
And this device adopts gas as coolant, forms astable batch (-type) impact jet flow by batch (-type) impact jet flow generating means.
The fin of described finned radiator is according to the two bifurcated fractal structure designs in symmetrical right angle, and fin adopts square-section, fin width and highly equal, and fin branch length is than keeping constant.
The beneficial effect that the present invention can produce: adopt astable batch (-type) impact jet flow cooling technology, for the effectively fast cooling of electronic device of large density of heat flow rate, reduce energy consumption; According to the fractal finned radiator of fractal structure design, can make full use of the space surface of electronic chip, increase fin heat exchange surface area, improve radiating efficiency, be applicable to the design of square chip cooling system; Fractal finned radiator has good spatial distribution uniform properties, can effectively improve the uniformity that chip temperature distributes, and eliminates the local focus of chip surface, prevents that chip from damaging, and effectively extends the useful life of electronic chip.The fin of square-section is easy to processing and installs, and is applicable to Mass production.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention
Fig. 2 is the structural representation of impact jet flow finned radiator
Fig. 3 is the structure chart of fractal finned radiator
Fig. 4 is the branched structure schematic diagram of fractal fin network
Fig. 5 has shown the elementary cell of fractal fin network
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
As shown in Figure 1, the present invention adopts gas as coolant, and native system mainly comprises batch (-type) jet flow generating apparatus and fractal finned radiator two parts.Micropump 1 driving gas enters gas bomb 2, when pressure-control valve 3 exceedes a certain particular pressure, microcontroller chip 4 control switch valves 6 are opened, gas in pressure chamber 4 enters cooling chamber 7, and the atmospheric pressure value of working as pressure-control valve 3 is lower than a certain pressure, microcontroller chip 4 closing switch valves, form batch (-type) air-flow.Air-flow directly impacts fin 10 and the substrate 11 of fractal finned radiator by the slit-type nozzle array 9 being formed by dividing plate 8, form batch (-type) impact jet flow, and the heat that electronic component 13 is produced is taken away.When electronic chip temperature sharply declines, gas flow temperature raises, and high temperature gas flow is by exporting 14 discharges.
As shown in Figure 2, the heat that electronic chip 13 produces mainly passes to fractal finned radiator with heat-conducting mode by heat insulating washer 12, and fractal finned radiator is made up of fractal fin 10 and substrate 11, and fractal finned radiator transfers heat to surrounding environment.Coolant directly impacts fractal fin surface via the multiple nozzles 9 on dividing plate 8, and the Air Flow on strengthening fin surface, improves heat exchange efficiency, for the effectively fast cooling of electronic device of large density of heat flow rate.
Fig. 3 has shown fractal finned radiator according to an embodiment of the invention, first molds the radiator blank of being made by extrudate, and fractal fin network 10 is processed on the substrate 11 of material of the same race.Fin is by waiting width combine according to the mode of right angle SYMMETRIC BIFURCATION and be connected with the rectangle fin of height, the Length Ratio of adjacent two-stage fin keeps constant, and choosing of the primary branch length of fractal fin network and bifurcated progression need to be determined and design according to concrete chip size and overall package requirements.
As shown in Figure 4, show fractal fin network according to an embodiment of the invention, there is the fractal net work of the two bifurcation structures in 5 grades of symmetrical right angles.
As shown in Figure 5, every one-level mother stock props up bifurcated and goes out two identical sub-branches, the Length Ratio (l of arbitrary continuation two-stage right angle bifurcated
i+1/ l
i) be 2
-1/2.Bifurcated elementary cell shown in Fig. 5, according to above-mentioned bifurcation ratio iteration 5 times, is generated to 5 grades of bifurcated network as shown in Figure 4.
Claims (2)
1. the fractal fin cooling device of batch (-type) impact jet flow, comprise Micropump (1), gas bomb (2), microcontroller chip (5), cooling chamber (7) and radiator substrate (11), it is characterized in that: the controlled valve (6) of pressure-control valve (3) and pressure chamber (4) is controlled interlock by microcontroller chip (5), form batch (-type) air-flow, and directly impact fractal fin (10) and radiator substrate (11) through nozzle array (9), form astable batch (-type) impact jet flow.
2. the fractal fin cooling device of batch (-type) impact jet flow according to claim 1, is characterized in that: adopt gas as coolant, form astable batch (-type) impact jet flow by batch (-type) impact jet flow generating means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320764025.XU CN203708731U (en) | 2013-11-19 | 2013-11-19 | Intermittent impact jet fractal fin cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320764025.XU CN203708731U (en) | 2013-11-19 | 2013-11-19 | Intermittent impact jet fractal fin cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203708731U true CN203708731U (en) | 2014-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201320764025.XU Expired - Fee Related CN203708731U (en) | 2013-11-19 | 2013-11-19 | Intermittent impact jet fractal fin cooling device |
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| CN (1) | CN203708731U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107516808A (en) * | 2017-09-30 | 2017-12-26 | 中国工程物理研究院应用电子学研究所 | A kind of low distortion cooler of laser |
| CN109640593A (en) * | 2018-12-29 | 2019-04-16 | 浙江大学 | A kind of micro- rib battle array radiator and method being equipped with synthesizing jet-flow excitor |
| US11609053B2 (en) | 2016-07-12 | 2023-03-21 | Fractal Heatsink Technologies LLC | System and method for maintaining efficiency of a heat sink |
-
2013
- 2013-11-19 CN CN201320764025.XU patent/CN203708731U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11609053B2 (en) | 2016-07-12 | 2023-03-21 | Fractal Heatsink Technologies LLC | System and method for maintaining efficiency of a heat sink |
| CN107516808A (en) * | 2017-09-30 | 2017-12-26 | 中国工程物理研究院应用电子学研究所 | A kind of low distortion cooler of laser |
| CN109640593A (en) * | 2018-12-29 | 2019-04-16 | 浙江大学 | A kind of micro- rib battle array radiator and method being equipped with synthesizing jet-flow excitor |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 Termination date: 20141119 |
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| EXPY | Termination of patent right or utility model |