CN203689298U - Liquid-cooled heat dissipation device - Google Patents
Liquid-cooled heat dissipation device Download PDFInfo
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- CN203689298U CN203689298U CN201320775155.3U CN201320775155U CN203689298U CN 203689298 U CN203689298 U CN 203689298U CN 201320775155 U CN201320775155 U CN 201320775155U CN 203689298 U CN203689298 U CN 203689298U
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- Prior art keywords
- liquid
- heat radiation
- cooling
- computer housing
- radiation row
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- 230000017525 heat dissipation Effects 0.000 title abstract description 4
- 238000001816 cooling Methods 0.000 claims abstract description 88
- 239000007788 liquid Substances 0.000 claims abstract description 37
- 238000005086 pumping Methods 0.000 claims abstract description 24
- 239000002826 coolant Substances 0.000 claims abstract description 14
- 230000005855 radiation Effects 0.000 claims description 93
- 230000035515 penetration Effects 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000012530 fluid Substances 0.000 description 7
- 238000009434 installation Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
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Abstract
A liquid-cooled heat dissipation device is used for pumping a coolant liquid to cool a heat source in a computer chassis after being mounted in the computer chassis. The computer chassis comprises one or more slots. The liquid-cooled heat dissipation device comprises one or more liquid-cooled heads, a radiator assembly, a plurality of connecting pipes and a baffle, wherein the liquid-cooled heads are used for being in contact with the heat source; the radiator assembly is arranged outside the computer chassis, and comprises one or more radiators; the connecting pipes are used for connecting the liquid-cooled heads with the radiators so as to form a cooling circulation passage through which the coolant liquid can flow; the baffle is mounted in the slots of the computer chassis in a demountable manner to be fixed in the computer chassis and close the slots; one or more penetration holes are formed in the baffle; the connecting pipes penetrate through the penetration holes, so that the liquid-cooled heads and the radiator assembly are respectively arranged inside and outside the computer chassis.
Description
Technical field
The utility model is relevant with liquid-cooling heat radiation technology, particularly about the liquid-cooling heat radiator that applies to computer installation.
Background technology
For the water cooling plant of main frame, generally include a heat radiation row, a pumping and a water-cooling head, form circulation line by connecting pipe.In the situation that having multiple water cooling plant, between individual other water-cooling head and heat radiation row, can connect with series system.In series connection in the situation that, the hydraulic pressure that pumping provides may because heat radiation row too much and hydraulic pressure deficiency, or the power of pumping is excessive and cause noise to increase.Meanwhile, when multiple heat radiation rows arrange simultaneously, be limited to the part placement of casing inside, the most employing of multiple heat radiation rows is arranged in parallel or stacking mode arranges; This kind arranges that easily to cause being positioned at the heat radiation row radiating efficiency of cooling draught path ends not good, and must increase pumping or fan power, increases problem and further aggravate noise.
Commercially available water cooling plant, mainly contains two kinds of modular water device for cooling and combined type water cooling devices.
Modular water device for cooling is in factory, just to complete the operation that connects water-cooling head, pumping and heat radiation row with connecting pipe, and fills liquid coolant.Conventionally, water-cooling head and pumping also can be combined into single module, in order to follow-up assembling.In the time of assembling computing machine, consumer only need to be fixed on thermal source by water-cooling head, and fixing heat radiation is arranged in the assigned address of computer housing inside.But because connecting pipe length is fixed, therefore, the relative position between water-cooling head and heat radiation row will be restricted.In addition, heat radiation row also can occupy computer housing inner space, and installation site is restricted, and must not be applicable to each casing layout.
Combined type water cooling device claims again DIY water-cooled external member.Combined type water cooling device is to provide individually connecting pipe, water-cooling head, pumping and heat radiation row to consumer.Consumer can place water-cooling head, pumping and heat radiation row according to the demand of oneself, casing layout, then connects aforementioned components with connecting pipe.But the pipeline that user connects voluntarily easily has seepy question.Similarly, can, for fixing fixed mount, the lockhole etc. of heat radiation row, also mostly be positioned at casing inside, have equally heat radiation row also can occupy the problem of casing inner space.
Utility model content
Liquid-cooling heat radiator in known technology, exists work can not adapt to computer housing layout, or the follow-up pipeline seepy question that assembling occurs voluntarily of user.Meanwhile, heat radiation row is arranged in parallel or when stacking setting, the not good problem of radiating efficiency also can occurs.
Based on the problems referred to above, the utility model provides a kind of liquid-cooling heat radiator, can solve heat radiation and arrange the problem that occupies casing inner space.In addition, at least one specific embodiment, the utility model also proposes new fan arrangement, thereby heat radiation row is arranged in parallel or radiating efficiency when stacking setting.
At least one embodiment of the present utility model proposes a kind of liquid-cooling heat radiator, in order to be installed on a computer housing, with pumping one liquid coolant to carry out cooling to the thermal source in computer housing.Computer housing comprises at least one slotted eye; Liquid-cooling heat radiator comprises at least one liquid cooling head, heat radiation row assembly, several connecting pipes and an at least one baffle plate.
Liquid cooling head is in order to contact thermal source; Heat radiation row assembly is in order to be arranged at outside computer housing, and heat radiation row assembly comprises at least one heat radiation row; Several connecting pipes, in order to connecting fluid cold head and heat radiation row, to form a cool cycles passage for coolant flow; And baffle plate is removably installed in the slotted eye of computer housing, and is fixed on computer housing and seals described slotted eye, and baffle plate has at least one perforation, connecting pipe is through perforation.
In at least one specific embodiment of the utility model, liquid-cooling heat radiator more comprises a pumping, is arranged on cool cycles passage, circulates in cool cycles passage in order to pumping liquid coolant.
In at least one specific embodiment of the utility model, pumping is incorporated into described liquid cooling head, and forms single module.
In at least one specific embodiment of the utility model, liquid-cooling heat radiator more comprises two fans, is arranged on heat radiation row assembly, and heat radiation row assembly is carried out to forced air cooling.
Heat radiation row's assembly comprises the ventilating surface that air feed stream passes through, and two fans are arranged at respectively each ventilating surface, and the wind direction of two fans is forward configuration, makes air-flow enter heat radiation row assembly by a ventilating surface, and leaves heat radiation by another ventilating surface and arrange assembly.
Described two fans periodically change wind direction, and repeatedly change the flow direction of air-flow.
In at least one specific embodiment of the utility model, liquid-cooling heat radiator comprises three liquid cooling heads and three corresponding heat radiation rows, and three heat radiation rows are configuration side by side.
In at least one specific embodiment of the utility model, liquid-cooling heat radiator comprise several heat radiation rows and and several fans, the upper configuration of each heat radiation row one fan, and heat radiation row is around forming a tunnel-like plenum area.
Fan is simultaneously with the direction band moving air flow away from this tunnel-like plenum area.
In at least one specific embodiment of the utility model, baffle plate more comprises several fasteners, extends the edge of baffle plate, for clip in computer housing, with fixed dam in described computer housing.
In at least one specific embodiment of the utility model, baffle plate system is incorporated into heat radiation row assembly, thereby the total city of fixing heat radiation row is in computer housing.
By the disclosed liquid-cooling heat radiator of the utility model, liquid cooling head and heat radiation row assembly are arranged at respectively inside and the outside of computer housing, make heat radiation row assembly can not be subject to the restriction of computer housing interior layout.In addition, at least one specific embodiment, the utility model sees through baffle plate and the intrinsic slotted eye of computer housing, and can fast heat radiation row assembly be fixed on to the outside of computer housing.Again, at least one specific embodiment, the utility model proposes new fan arrangement, solve multiple heat radiations and arrange the heat dissipation problem while simultaneously configuration.
Brief description of the drawings
Fig. 1 is the exploded perspective view of the utility model the first embodiment.
Fig. 2 is the exploded perspective view that the utility model the first embodiment is arranged at a computer housing.
Fig. 3 is the stereographic map that the utility model the first embodiment is arranged at computer housing.
Fig. 4 and Fig. 5 are in the utility model the first embodiment, fan and heat radiation row's relative position schematic diagram.
Fig. 6 is the exploded perspective view that the utility model the second embodiment is arranged at a computer housing.
Fig. 7 is the stereographic map that the utility model the second embodiment is arranged at computer housing.
Fig. 8 is in the utility model, another kind of fan and heat radiation row's relative position schematic diagram.
Embodiment
Refer to shown in Fig. 1, Fig. 2 and Fig. 3, it is the disclosed a kind of liquid-cooling heat radiator 100 of the utility model the first embodiment, be used for being installed on a computer housing 900, with pumping one liquid coolant to carry out cooling to the thermal source 910 in described computer housing 900.Aforementioned thermal source 910 for example, including but not limited to the integrated circuit (IC) chip (central processing unit or drawing chip) of a high power running.Computer housing 900 is for the part of accommodating computer installation, to form computer installation.Computer housing 900 comprises at least one slotted eye 920.This slotted eye 920 can be the perforate of storage device posting port (for example CD-ROM drive is installed by slotted eye or Winchester disk drive is installed slotted eye), the reserved I/O of installation baffle plate.
As shown in Figure 1, Figure 2 and shown in Fig. 3, liquid-cooling heat radiator 100 comprises at least one liquid cooling 110, a heat radiation row assembly 120, several connecting pipes 130, a baffle plate 140, at least one pumping 150 and at least two fans 160.
As shown in Figure 1, Figure 2 and Figure 3, liquid cooling 110 is generally a derby or other possess the block that heat-conduction coefficient is made, to conduct fast heat.Liquid cooling 110 is in order to contact thermal source 910, the heat producing to absorb thermal source 910; Therefore, the quantity of liquid cooling 110 depends on thermal source 910 quantity; As the first embodiment, while three thermals source 910 being set in the computer housing 900 of computer installation, liquid-cooling heat radiator 100 comprises three liquid cooling 110.Liquid cooling 110 has at least one heat exchange zone, in order to for liquid coolant by carrying out heat interchange.Described heat exchange zone can be the passage of the described liquid cooling of a perforation 110, can also be that the surface of liquid cooling 110 covers by outer cover or pumping 150 chamber forming.
As shown in Figure 1, Figure 2 and shown in Fig. 3, heat radiation row assembly 120 comprises at least one heat radiation row 122, and described heat radiation is arranged 122 inside and had fluid passage, and for example metal tube runs through the fluid passage that some fins form.Heat radiation row 122 the common fluid,matching cold head 110 of quantity, as shown in Figure 1, the first embodiment comprises three heat radiations arranged side by side rows 122, and coordinate respectively three liquid cooling 110 one of them, but this case embodiment is not got rid of a liquid cooling 110 yet and is coordinated several heat radiations row 122.
As shown in Figure 1, Figure 2 and Figure 3, connecting pipe 130 connecting fluid cold heads 110 and heat radiation row 122, the particularly heat exchange zone of connecting fluid cold head 110 and heat radiation row's 122 fluid passage, and form a cool cycles passage.Liquid coolant flows in described cool cycles passage, uses liquid cooling 110 torrid zone that absorb are arranged to 122 to heat radiation, and dispelled the heat after receiving forced air cooling by heat radiation row 122.
As shown in Figure 1, Figure 2 and Figure 3, baffle plate 140 is removably installed in the slotted eye 920 of computer housing 900, and is fixed on computer housing 900 and seals described slotted eye 920.Baffle plate 140 has several perforation 142, uses for connecting pipe 130 and passes, and makes heat radiation row's assembly 120 and liquid cooling 110 can be disposed at respectively inside and the outside of described computer housing 900.
Consult shown in Fig. 1, baffle plate 140 more comprises several fasteners 144 again, and described fastener 144 vertically extends the edge of baffle plate 140.When baffle plate 140 closed trench holes 920, described several fasteners 144 are arranged in computer housing 900, and clip is in computer housing 900, with fixed dam 140 in computer housing 900.
Refer to shown in Fig. 1, Fig. 2 and Fig. 3, pumping 150 is arranged on cool cycles passage, circulates in cool cycles passage with pumping liquid coolant.In a specific embodiment, pumping 150 is incorporated into liquid cooling 110, and forms single module.
Consult shown in Fig. 1, Fig. 2 and Fig. 3, fan 160 is fixed on heat radiation row's assembly 120, in order to heat radiation row assembly 120 is blown or air-breathing, so that heat radiation row assembly 120 is carried out to forced air cooling.
Consult shown in Fig. 4 and Fig. 5, described heat radiation row 122 is combined into heat radiation row assembly 120 side by side.Heat radiation row assembly 120 comprises two ventilating surface 120a that pass through in order to air feed stream, 120b.Described two fans 160 are arranged at respectively each ventilating surface 120a, 120b.The wind direction of described two fans 160, for forward configuration, makes by two ventilating surface 120a, and the air-flow of 120b forms following state: air-flow enters described heat radiation row assembly 120 by a ventilating surface 120a, and leaves described heat radiation row assembly 120 by other ventilating surface 120b.In addition, not good for fear of the heat radiation row's 122 of air-flow end air cooling efficiency, described fan 160 periodically changes wind direction, and repeatedly change the flow direction of air-flow, make to be positioned at ventilating surface 120a, the heat radiation row 122 of 120b can not be positioned at air-flow end for a long time, and improving heat radiation efficiency.In addition, air-flow changes flow direction repeatedly, can make again to accumulate on ventilating surface 120a, particularly one side windward of 120b() dust blown off, and form dust removing effects.
Refer to shown in Fig. 6 and Fig. 7, for the disclosed a kind of liquid-cooling heat radiator 100 of the utility model the second embodiment, roughly identical with the first embodiment, below only describe for difference place.
As shown in Figure 6, baffle plate 140 is incorporated into heat radiation row assembly 120, and connecting pipe 130 is through described perforation (not shown in Fig. 6, Fig. 7).
As shown in Figure 7, when baffle plate 140 closed trench holes 920, and while being fixed on computer housing 900, heat radiation row assembly 120 is fixed in computer housing 900, uses the fixing means of simplifying heat radiation row assembly 120.
As shown in FIG. 6 and 7, liquid-cooling heat radiator 100 more comprises an input interface 190 and a display interface 200.Input interface 190 use are for user's operation, with input speed setting value; The specific embodiment of input interface 190 is knob.Display interface 200 is in order to show the flow of temperature and liquid coolant of liquid cooling head.
Referring to shown in Fig. 8, is the layout of the disclosed another kind of heat radiation row 122 of the utility model and fan 160.
Described several heat radiations row 122 is around forming a tunnel-like plenum area T, and each heat radiation row 122 configuration one fan 160.Wherein, described fan 160 is simultaneously with the direction band moving air flow away from tunnel-like plenum area T, makes to produce chimney effect in the T of plenum area, and sucks outside air by the two ends of plenum area T, and on average force cooling to individual heat radiation row 122.
By the disclosed liquid-cooling heat radiator 100 of the utility model, liquid cooling 110, heat radiation row assembly 120, connecting pipe 130, pumping 150 and fan 160 can first form a module, assemble voluntarily in order to user.In addition, heat radiation row assembly 120 can be arranged at the outside of computer housing 900, for example top of computer housing 900, and the perforation 142 providing by baffle plate 140 is passed through for connecting pipe 130.Consumer only need to be fixed on thermal source 910 by liquid cooling 110, and the heat radiation row assembly 120 that is positioned at computer housing 900 outsides can not be subject to computer housing 900 interior layouts restrictions; Thereby heat radiation row assembly 120 can not occupy computer housing 900 inner spaces, and has preferably air cooling environment, and promotes the cooling efficiency to thermal source 910.
In addition, see through the position of fan 160 and the adjustment of wind direction, the utility model can guarantee that multiple heat radiation rows 122 can maintain average air cooling effect, avoid single heat radiation to arrange the not good problem of 122 cooling effectiveness.
Above-described embodiment is intended to disclose technical characterictic of the present utility model; so it is not in order to limit the utility model; anyly have the knack of alike skill person; not departing from spirit and scope of the present utility model; when doing a little change and retouching, therefore scope of patent protection of the present utility model must be as the criterion depending on this instructions appending claims person of defining.
Claims (11)
1. a liquid-cooling heat radiator, in order to be installed on a computer housing, cooling so that the thermal source in described computer housing is carried out with pumping one liquid coolant, and described computer housing comprises at least one slotted eye; It is characterized in that, described liquid-cooling heat radiator comprises:
At least one liquid cooling head, in order to contact described thermal source;
One heat radiation row assembly, in order to be arranged at outside described computer housing, and described heat radiation row assembly comprises at least one heat radiation row;
Several connecting pipes, in order to connect described liquid cooling head and described heat radiation row, to form a cool cycles passage for described coolant flow; And
One baffle plate, is removably installed in the slotted eye of described computer housing, and is fixed on described computer housing and seals described slotted eye, and described baffle plate has at least one perforation, and described several connecting pipes are through described perforation.
2. liquid-cooling heat radiator according to claim 1, is characterized in that, also comprises a pumping, is arranged on described cool cycles passage, circulates in described cool cycles passage in order to liquid coolant described in pumping.
3. liquid-cooling heat radiator according to claim 2, is characterized in that, described pumping is incorporated into described liquid cooling head, and forms single module.
4. liquid-cooling heat radiator according to claim 1, is characterized in that, also comprises two fans, is arranged on described heat radiation row assembly, and described heat radiation row assembly is carried out to forced air cooling.
5. liquid-cooling heat radiator according to claim 4, it is characterized in that, described heat radiation row assembly comprises the ventilating surface that air feed stream passes through, described two fans are arranged at respectively ventilating surface described in each, and the wind direction of described two fans is forward configuration, make air-flow enter described heat radiation row assembly by a ventilating surface, and leave described heat radiation row assembly by another ventilating surface.
6. liquid-cooling heat radiator according to claim 5, is characterized in that, described two fans periodically change wind direction, and repeatedly change the flow direction of air-flow.
7. liquid-cooling heat radiator according to claim 4, is characterized in that, described liquid-cooling heat radiator comprises three liquid cooling heads and three corresponding heat radiation rows, and described three heat radiation rows are configuration side by side.
8. liquid-cooling heat radiator according to claim 1, it is characterized in that, described liquid-cooling heat radiator comprise several heat radiation rows and and several fans, the upper configuration of heat radiation row one fan described in each, and described several heat radiations row is around forming a tunnel-like plenum area.
9. liquid-cooling heat radiator according to claim 8, is characterized in that, described several fans are simultaneously with the direction band moving air flow away from described tunnel-like plenum area.
10. liquid-cooling heat radiator according to claim 1, is characterized in that, described baffle plate also comprises several fasteners, extends the edge of described baffle plate, for clip in described computer housing, to fix described baffle plate in described computer housing.
11. liquid-cooling heat radiators according to claim 1, is characterized in that, described baffle plate is incorporated into described heat radiation row assembly, thereby fixing described heat radiation is arranged total city in described computer housing.
Priority Applications (1)
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CN201320775155.3U CN203689298U (en) | 2013-11-29 | 2013-11-29 | Liquid-cooled heat dissipation device |
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CN201320775155.3U CN203689298U (en) | 2013-11-29 | 2013-11-29 | Liquid-cooled heat dissipation device |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110399022A (en) * | 2019-06-28 | 2019-11-01 | 联想(北京)有限公司 | Electronic equipment |
CN112286322A (en) * | 2020-11-05 | 2021-01-29 | 苏州浪潮智能科技有限公司 | Method, system, equipment and medium for actively radiating heat of server memory |
CN116483186A (en) * | 2023-05-09 | 2023-07-25 | 东莞汉旭五金塑胶科技有限公司 | Integrated liquid cooling heat dissipation device with heat resistance structure |
-
2013
- 2013-11-29 CN CN201320775155.3U patent/CN203689298U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110399022A (en) * | 2019-06-28 | 2019-11-01 | 联想(北京)有限公司 | Electronic equipment |
CN112286322A (en) * | 2020-11-05 | 2021-01-29 | 苏州浪潮智能科技有限公司 | Method, system, equipment and medium for actively radiating heat of server memory |
CN116483186A (en) * | 2023-05-09 | 2023-07-25 | 东莞汉旭五金塑胶科技有限公司 | Integrated liquid cooling heat dissipation device with heat resistance structure |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140702 |
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CF01 | Termination of patent right due to non-payment of annual fee |