CN203133803U - Novel OGS (One Glass Solution) structure - Google Patents

Novel OGS (One Glass Solution) structure Download PDF

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Publication number
CN203133803U
CN203133803U CN 201320158136 CN201320158136U CN203133803U CN 203133803 U CN203133803 U CN 203133803U CN 201320158136 CN201320158136 CN 201320158136 CN 201320158136 U CN201320158136 U CN 201320158136U CN 203133803 U CN203133803 U CN 203133803U
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layer
ink
transparent
new
transparency conducting
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CN 201320158136
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Chinese (zh)
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何莲芝
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Abstract

The utility model discloses a novel OGS (One Glass Solution) structure which comprises a transparent base material, a transparent conductive layer sputtered on the transparent base material, a transparent disapparation layer which eliminates ''etched grains'' and a printing ink layer around the transparent base material. A conductive material is communicated with a flexible printed circuit board (FPC) and the transparent conductive layer through the printing ink layer at one end and is fixed through a bonding layer. With the adoption of the technical scheme provided by utility model, the process flow of primarily sputtering the transparent conductive layer and then manufacturing the printing ink layer around is adopted. The printing ink needs not to bear high temperature when the transparent conductive layer is sputtered. Under the condition that original characteristics and advantages of the original OGS are maintained, the problem for conventional OGS structure that the material and process flow costs are high and the selectivity of the printing ink is single are solved, so that the novel OGS structure provided by the utility model has better market prospect.

Description

A kind of New O GS structure
Technical field
The utility model relates to the photoelectric display field, relates in particular to a kind of New O GS structure.
Background technology
Capacitive touch screen is market-oriented touch-screen of new generation after resistive touch screen, he has had qualitative leap by the product than previous generation on performance, not only be quick on the draw, and support multi-point touch, the playability of touch-control product and operability are improved greatly.And OGS (the one glass solution) product of a new generation is the new developing direction of capacitive touch screen, and from technological layer, the OGS technology is simple in structure than the G/G touch technology of present main flow, and is light, thin, light transmission is good; Owing to save a slice glass baseplate and bonding process, be beneficial to and reduce production costs, improve the product yield.
Traditional OGS structure, consult shown in Figure 1, generally be around transparent base 91, to lay ink lay 92, transparent base top sputter ITO layer 93, and be electrically connected with flexible PCB (PCF) 95 by anisotropic conductive film (ACF) 93, on manufacture craft, this traditional OGS structure all needs to make earlier the ink lay all around of transparent base, sputter ITO layer then, because the temperature of sputter ITO is higher relatively, reach temperature more than 200 ℃, therefore require ink lay to resist high temperature and nondiscolouring causes two problems like this: the one, printing ink need be selected high temperature resistance printing ink for use, and material and technological process cost raise; The 2nd, except black ink, other color inks all can't reach the high temperature resistance requirement at present.Therefore present traditional OGS scheme can't realize the application such as ink colors such as white, pink colours.
The utility model content
The purpose of this utility model is to provide a kind of New O GS structure at the deficiencies in the prior art, comprises transparent base, sputter transparency conducting layer, the transparent shadow layer that disappears of elimination " etching line ", the transparent base ink lay all around on transparent base.Conductive material sees through an end ink lay and is communicated with flexible PCB (FPC) and transparency conducting layer, fixes by bonding coat.
First sputter transparency conducting layer on the described New O GS structure fabrication flow process, ink lay around making then, ink lay can use traditional printing printing ink, common photoresist, comprises black and non-black photoresist.
The described transparent optional OC of shadow layer material, the SiO of disappearing 2, Nb 2O 5And other transparent materials, the material refractive index is close with electrically conducting transparent layer material refractive index, the shadow layer that disappears can be selected to be coated on ink area and viewing area, the position is set on transparency conducting layer or below all can.
Described conductive material can be selected Metal Ball, material with carbon element or other conductive materials, except being coated on the lead-in wire electrode zone, also can be coated on part or whole ink area.
The optional glass of the material of described transparent base, PET, PC; Transparent conductive materials such as the optional ITO of the material of described transparency conducting layer, Nano Silver, the rare alkene of graphite; The optional epoxy resin of the material of described bonding coat, acryl resin and other bonding class materials.
A kind of New O GS structure described in the utility model, by setting up the layer of transparent shadow layer that disappears, the material that the selective refraction rate is close with the transparency conducting layer refractive index, eliminate " etching line " problem of ink area, and by lateral isolation conductive materials such as adding Metal Ball in printing ink, perhaps solved the conduction problem of lead-in wire electrode zone and FPC at the conductive material of horizontal conductings such as the electrode coating carbon slurry close with the printing ink color and luster, electrically conductive ink.Just can adopt first sputter transparency conducting layer thus, the technological process of ink lay around making then, high temperature when printing ink does not need to bear the sputter transparency conducting layer again, use traditional printing printing ink to get final product, under the situation that keeps original OGS primary characteristic and advantage, well solved material and technological process cost height, printing ink is selected the single problem that waits these traditional OGS structures to face, thereby has market outlook preferably.
Description of drawings
Utilize accompanying drawing to come the utility model is further detailed below, but the embodiment in the accompanying drawing does not constitute any restriction of the present utility model.
Fig. 1 is the structural representation of traditional OGS structure.
Fig. 2 is the structural representation of New O GS structure described in the utility model.
Embodiment
Come the utility model is described below in conjunction with concrete embodiment.
As shown in Figure 2, the utility model provides a kind of New O GS structure, comprises transparent base 1, sputter transparency conducting layer 4, the transparent shadow layer 3 that disappears of eliminating " etching line ", the transparent base ink lay 2 all around on transparent base.Conductive material 5 sees through an end ink lay 2 and is communicated with flexible PCB (FPC) 7 and transparency conducting layer 4, fixes by bonding coat 6.
First sputter transparency conducting layer 4 on the described New O GS structure fabrication flow process, ink lay 2 around making then, ink lay can use traditional printing printing ink, common photoresist, comprises black ink and non-black printing ink.
The described transparent optional OC of shadow layer 3 material, the SiO of disappearing 2, the material refractive index is close with transparency conducting layer 4 material refractive indexes, the shadow layer 3 that disappears can be selected to be coated on ink area and viewing area, the position is set on transparency conducting layer 4 or below all can.
Described conductive material 5 can be selected Metal Ball, material with carbon element or other conductive materials, except being coated on the lead-in wire electrode zone, also can be coated on part or whole ink area.
The optional glass of the material of described transparent base 1, PET, PC; The optional ITO of the material of described transparency conducting layer 4, Nano Silver; The optional epoxy resin of the material of described bonding coat 6 or acryl resin.
Adopt technical scheme described in the utility model, can adopt first sputter transparency conducting layer, the technological process of ink lay around making then, high temperature when printing ink does not need to bear the sputter transparency conducting layer again, under the situation that keeps original OGS primary characteristic and advantage, well solved material and technological process cost height, the problem that printing ink selects single these traditional OGS structures to face, thus have market outlook preferably.
Above content only is preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, the part that all can change in specific embodiments and applications, this description should not be construed as restriction of the present utility model.

Claims (5)

1. New O GS structure, it is characterized in that: comprise transparent base, sputter transparency conducting layer, the transparent shadow layer that disappears of elimination " etching line ", the transparent base ink lay all around on transparent base, conductive material sees through an end ink lay and is communicated with flexible PCB and transparency conducting layer, fixes by bonding coat.
2. a kind of New O GS structure according to claim 1, it is characterized in that: first sputter transparency conducting layer on the described New O GS structure fabrication flow process, ink lay around making then, ink lay can use traditional printing printing ink, common photoresist, comprises black ink and non-black printing ink.
3. a kind of New O GS structure according to claim 1 is characterized in that: the described transparent optional OC of shadow layer material, the SiO of disappearing 2, the material refractive index is close with electrically conducting transparent layer material refractive index, the shadow layer that disappears can be selected to be coated on ink area and viewing area, the position is set on transparency conducting layer or below all can.
4. a kind of New O GS structure according to claim 1, it is characterized in that: described conductive material can be selected Metal Ball, material with carbon element or other conductive materials, except being coated on the lead-in wire electrode zone, also can be coated on part or whole ink area.
5. a kind of New O GS structure according to claim 1, it is characterized in that: the optional glass of the material of described transparent base, PET, PC, the optional ITO of the material of described transparency conducting layer, Nano Silver, the optional epoxy resin of the material of described bonding coat or acryl resin.
CN 201320158136 2013-03-29 2013-03-29 Novel OGS (One Glass Solution) structure Expired - Fee Related CN203133803U (en)

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CN 201320158136 CN203133803U (en) 2013-03-29 2013-03-29 Novel OGS (One Glass Solution) structure

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Application Number Priority Date Filing Date Title
CN 201320158136 CN203133803U (en) 2013-03-29 2013-03-29 Novel OGS (One Glass Solution) structure

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103456392A (en) * 2013-08-27 2013-12-18 南昌欧菲光科技有限公司 Transparent electric conductor and manufacturing method thereof
CN103838454A (en) * 2014-03-18 2014-06-04 天津多点科技有限公司 Pasting film, cover plate and electronic device related to capacitive touch screen
CN103927066A (en) * 2014-04-24 2014-07-16 深圳秋田微电子有限公司 Via-hole conductive material for OGS capacitive touch screen and application thereof
CN104035644A (en) * 2014-06-19 2014-09-10 深圳市宝明科技股份有限公司 Color capacitive touch screen and manufacturing method thereof
CN104199584A (en) * 2014-09-11 2014-12-10 苏州胜利精密制造科技股份有限公司 Novel-structured capacitive touch screen and production method thereof
WO2016101495A1 (en) * 2014-12-25 2016-06-30 京东方科技集团股份有限公司 Method for manufacturing touch panel, touch panel, touch screen and display device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103456392A (en) * 2013-08-27 2013-12-18 南昌欧菲光科技有限公司 Transparent electric conductor and manufacturing method thereof
CN103456392B (en) * 2013-08-27 2016-04-06 南昌欧菲光科技有限公司 Transparent conductive body and manufacture method thereof
CN103838454A (en) * 2014-03-18 2014-06-04 天津多点科技有限公司 Pasting film, cover plate and electronic device related to capacitive touch screen
CN103927066A (en) * 2014-04-24 2014-07-16 深圳秋田微电子有限公司 Via-hole conductive material for OGS capacitive touch screen and application thereof
CN104035644A (en) * 2014-06-19 2014-09-10 深圳市宝明科技股份有限公司 Color capacitive touch screen and manufacturing method thereof
CN104199584A (en) * 2014-09-11 2014-12-10 苏州胜利精密制造科技股份有限公司 Novel-structured capacitive touch screen and production method thereof
WO2016101495A1 (en) * 2014-12-25 2016-06-30 京东方科技集团股份有限公司 Method for manufacturing touch panel, touch panel, touch screen and display device
US10509516B2 (en) 2014-12-25 2019-12-17 Boe Technology Group Co., Ltd. Touch panel manufacturing method, touch panel, touch screen and display device

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Granted publication date: 20130814

Termination date: 20140329