CN203102072U - Electronic device - Google Patents
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- CN203102072U CN203102072U CN 201220592355 CN201220592355U CN203102072U CN 203102072 U CN203102072 U CN 203102072U CN 201220592355 CN201220592355 CN 201220592355 CN 201220592355 U CN201220592355 U CN 201220592355U CN 203102072 U CN203102072 U CN 203102072U
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Abstract
The utility model discloses an electronic device. The electronic device comprises a first rigid circuit board, a second rigid circuit board, a third rigid circuit board, a first flexible circuit board and a second flexible circuit board, wherein electric signals can be transmitted between the first rigid circuit and the third rigid circuit board by the first flexible circuit board, the electric signals can be transmitted between the second rigid circuit board and the third rigid circuit board by the second flexible circuit board, and the first rigid circuit board is provided with a first side and a second side which are opposite; the second rigid circuit board is provided with a third side and a fourth side which are opposite; the first flexible circuit board is provided with a fifth side and a sixth side which are opposite, and the fifth side is coupled to the first side of the first rigid circuit board; the second flexible circuit board is provided with a seventh side and an eighth side which are opposite, and the seventh side is coupled to the third side of the second rigid circuit board; the sixth side is coupled to a first region of the third rigid circuit board, and the eighth side is coupled to a second region of the third rigid circuit board; and the width of the sixth side is larger than that of the first side, and the width of the eighth side is larger than that of the third side.
Description
Technical field
The utility model relates to electronic equipment, and more specifically, the utility model relates to and is used for solid storage device (Sol id Storage Device, printed circuit board system SSD).
Background technology
Similar with the mechanical type hard disk, solid storage device (SSD) also is high capacity, the non-volatile memory device that is used for computer system.Solid storage device generally with flash memory (Flash) as storage medium.High performance solid storage device is used to high-performance computer.
In patented claim WO2011085131A2, provide the solid state hard disc of the capacity expanded shown in Figure 1A, 1B.Among Figure 1A, on the main printed circuit board 205 of solid state hard disc, be furnished with a plurality of connectors 204, and the flash chip (not shown).Connector 204 can be connected to subcard removedly.Subcard can comprise flash chip, so that additional storage capacity to be provided to solid state hard disc.Subcard 608,610 is provided among Figure 1B, and each subcard comprises flash chip 609 and connector 607.Receive each subcard by connector 606.Each subcard 608 and 610 can be separately or together is connected to main PCB (Printed Circuit Board, printed circuit board (PCB)) 601.Controller 602 is presented to main frame with the capacity of the flash chip of subcard by interface 603.If subcard 608 and 610 all is inserted into, the capacity of the flash chip 609 on each subcard of controller 602 polymerizables is logically to present to main frame.
In utility model patent CN201402611Y, provide solid state hard disc as shown in Figure 2.The first hard and soft coupling PCB4 as memory module comprises a plurality of flash chips 41, and comprises control chip 51 as the second hard and soft coupling PCB5 of master control borad.The first hard and soft coupling PCB4 comprises that rigidity PCB42 and flexible PCB 43, the second hard and soft coupling PCB5 comprise rigidity PCB52 and flexible PCB 53.The first hard and soft coupling PCB4 and the second hard and soft coupling PCB5 realize being connected of signal on the first hard and soft coupling PCB4 and the second hard and soft coupling PCB5 by the signal wire that is provided with on flexible PCB 43 and the flexible PCB 53 and via hole.Flexible PCB 43 and flexible PCB 53 are as described in the diagonal line hatches zone among Fig. 2.Flexible PCB 43 and flexible PCB 53 and rigidity PCB42 and rigidity PCB52 can form in time processing.
In US2007165390A1, provide PCB, as shown in Figure 3 with flexible PCB.Comprise first base plate 100, second base plate 200 and signal transmission flexible circuit (FPC, Flexible, Printed Circ uit) among Fig. 3.First base plate 100 and second base plate 200 are disconnected from each other, and use FPC to transmit signal.Electronic component 201,202 can be installed on second base plate 200, electronic component 101,102 can be installed on first base plate 100, and micro-control unit (MCU, Micro Control Unit).First base plate 100 comprises opening portion 300, and it is formed on the zone with dimension D, and dimension D is less than the full-size (d) of first base plate 100.Signal hop FPC can extend from opening portion 300.
Yet,, need in limited space, arrange more storage chip for improving the memory capacity of memory device.But more storage chip needs more lead-in wire implement control, and this contradicts with the limited space of memory device.And, the memory device with multiple different memory sizes and/or different storage chip quantity need be provided, and significantly not increase cost.
The utility model content
A kind of electronic equipment is provided, has comprised first rigid circuit board, second rigid circuit board, the 3rd rigid circuit board, first flexible PCB and second flexible PCB; Described first flexible PCB transmits electric signal between described first rigid circuit board and described the 3rd rigid circuit board, described second flexible PCB transmits electric signal between described second rigid circuit board and described the 3rd rigid circuit board, described first rigid circuit board has the first relative limit and second limit; Described second rigid circuit board has the 3rd relative limit and the 4th limit; Described first flexible PCB has the 5th relative limit hexagon, and first limit of described first rigid circuit board is coupled on described the 5th limit; Described second flexible PCB has relative the 8th limit, the 7th limit, and the 3rd limit of described second rigid circuit board is coupled on described the 7th limit; Described hexagon is coupled to the first area of described the 3rd rigid circuit board, and the second area of described the 3rd rigid circuit board is coupled on described the 8th limit; The width of described hexagon is greater than the width on described first limit, and the width on described the 8th limit is greater than the width on described the 3rd limit.
According to electronic equipment of the present utility model, extend from first limit of described first rigid circuit board on wherein said the 5th limit; Extend from the 3rd limit of described second rigid circuit board on described the 7th limit.
According to electronic equipment of the present utility model, wherein, the hexagon of described first flexible PCB is furnished with first connector, and the 8th limit of described second flexible PCB is furnished with second connector; Described first connector is used for first area that described first flexible PCB is coupled to described the 3rd rigid circuit board; Described second connector is used for described second flexible PCB is coupled to the second area of described the 3rd rigid circuit board; Described first area is furnished with and the corresponding connector of described first connector, and described second area is furnished with and the corresponding connector of described second connector.
According to electronic equipment of the present utility model, wherein, the hexagon of described first flexible PCB extends from the first area of described the 3rd rigid circuit board, and extend from the second area of described the 3rd rigid circuit board on the 8th limit of described second flexible PCB.
According to electronic equipment of the present utility model, wherein said first area is the part on the 9th limit of described the 3rd rigid circuit board, and/or described second area is the part of the odd plots of land that can be cultivated of described the 3rd rigid circuit board.
According to electronic equipment of the present utility model, also comprise first supporting seat and second supporting seat, described first supporting seat is pressed on described first connector on described the 3rd rigid circuit board, and described second supporting seat is pressed on described second connector on described the 3rd rigid circuit board; Described first supporting seat supports first limit of described first rigid circuit board, and described first supporting seat also supports the 4th limit of described second rigid circuit board; Described second supporting seat supports second limit of described first rigid circuit board, and described second supporting seat also supports the 3rd limit of described second rigid circuit board.
According to electronic equipment of the present utility model, wherein, the plane at described first flexible PCB and the described first rigid circuit board place has first and second respect to one another; The plane at described second flexible PCB and the described second rigid circuit board place has the 3rd and fourth face respect to one another; Described first connector is arranged on described first, and described second connector is arranged on described the 3rd; Described first connector is used for first area that described first flexible PCB is coupled to described the 3rd rigid circuit board, make described first connector when described the 3rd rigid circuit board, described dorsad the 3rd rigid circuit board of first face of described first rigid circuit board; Described second connector is used for described second flexible PCB is coupled to the second area of described the 3rd rigid circuit board, make described second connector when described the 3rd rigid circuit board, described dorsad the 3rd rigid circuit board of first face of described second rigid circuit board.
According to electronic equipment of the present utility model, be furnished with storer on wherein said first rigid circuit board, be furnished with storer on described second rigid circuit board, be furnished with controller and host interface on described the 3rd rigid circuit board.
According to electronic equipment of the present utility model, the memory capacity of the storer on wherein said first rigid circuit board is two times of memory capacity of the storer on described second rigid circuit board.
According to electronic equipment of the present utility model, first limit of wherein said first rigid circuit board is positioned at the top of described first area, and the 3rd limit of described second rigid circuit board is positioned at the top of described second area; The 4th limit of described second rigid circuit board is positioned at the top of described first area, and second limit of described first rigid circuit board is positioned at the top of described second area.
According to electronic equipment of the present utility model, be furnished with the wiring of the memory capacity of the storer on described first rigid circuit board of indication on wherein said first flexible PCB, be furnished with the wiring of the memory capacity of the storer on described second rigid circuit board of indication on described second flexible PCB.
According to a first aspect of the invention, a kind of electronic equipment is provided, comprise first rigid circuit board, second rigid circuit board and flexible PCB, described flexible PCB transmits electric signal between described first rigid circuit board and described second rigid circuit board, described first rigid circuit board has the first relative limit and second limit; Described flexible PCB has the 3rd relative limit and the 4th limit; First limit of described first rigid circuit board is coupled on the 3rd limit of described flexible PCB, and the first area of described second rigid circuit board is coupled on the 4th limit of described flexible PCB; The width on described the 4th limit is greater than the width on described first limit.
In the electronic equipment according to a first aspect of the invention, be furnished with connector on the described flexible PCB, described connector is used for described flexible PCB is coupled to the first area of described second rigid circuit board; Described first area is furnished with and the corresponding connector of described first connector.
In the electronic equipment according to a first aspect of the invention, extend from first limit of described first rigid circuit board on described the 3rd limit, and/or extend from the first area of described second rigid circuit board on described the 4th limit.
In the electronic equipment according to a first aspect of the invention, first limit of wherein said first rigid circuit board is positioned at the top of described first area.
In the electronic equipment according to a first aspect of the invention, also comprise first supporting seat, described first supporting seat is pressed on described connector on described second rigid circuit board, and described first supporting seat supports first limit of described first rigid circuit board.
In the electronic equipment according to a first aspect of the invention, also comprise second supporting seat; Described second supporting seat supports second limit of described first rigid circuit board.
In the electronic equipment according to a first aspect of the invention, be furnished with connector on the described flexible PCB, the plane at described flexible PCB and the described first rigid circuit board place has first and second respect to one another, described connector is arranged on described first, described connector is used for described flexible PCB is coupled to the first area of described second rigid circuit board, make described connector when described second rigid circuit board, described dorsad second rigid circuit board of first face of described first rigid circuit board.
In the electronic equipment according to a first aspect of the invention, be furnished with storer on described first rigid circuit board, and be furnished with controller and host interface on described second rigid circuit board.
In the electronic equipment according to a first aspect of the invention, be furnished with the wiring of the configuration of described first rigid circuit board of indication on the wherein said flexible PCB.
In the electronic equipment according to a first aspect of the invention, wherein said first rigid circuit board is a rectangle, the minor face that described first limit and described second limit are described rectangles.
According to a second aspect of the invention, a kind of method that is used to install electronic equipment is provided, described electronic equipment comprises first rigid circuit board, second rigid circuit board and flexible PCB, described flexible PCB extends from one side of described first rigid circuit board, and described method comprises: first connector that will be arranged on the flexible PCB is connected with second connector on being arranged in second rigid circuit board; Use supporting seat that first connector is pressed on described second rigid circuit board; With the surface curvature of described flexible PCB along described supporting seat; And described first rigid circuit board is fixed on the described supporting seat.
Method according to a second aspect of the invention, the lower surface of wherein said supporting seat compress described first connector, and described first rigid circuit board is placed in the groove of upper surface of described supporting seat.
According to a forth aspect of the invention, a kind of method that is used to install electronic equipment is provided, described electronic equipment comprises first rigid circuit board, second rigid circuit board, the 3rd rigid circuit board, first flexible PCB and second flexible PCB, described first flexible PCB extends from one side of described first rigid circuit board, extend on just waken up one side of circuit board of the described second flexible PCB green onion described second, and described method comprises: first connector that will be arranged on first flexible PCB is connected with second connector on being arranged in the 3rd rigid circuit board; Use first supporting seat that first connector is pressed on described the 3rd rigid circuit board; With the surface curvature of described first flexible PCB along described first supporting seat; Described first rigid circuit board is fixed on described first supporting seat; The 3rd connector that is arranged on second flexible PCB is connected with the 4th connector on being arranged in the 3rd rigid circuit board; Use second supporting seat that described the 3rd connector is pressed on described the 3rd rigid circuit board; With the surface curvature of described second flexible PCB along described second supporting seat; Described second rigid circuit board is fixed on described second supporting seat; Described second rigid circuit board is fixed on described first supporting seat; And described first rigid circuit board is fixed on described second supporting seat.
Method according to a forth aspect of the invention, the lower surface of wherein said first supporting seat compress described first connector, and described first rigid circuit board is placed in first groove of upper surface of described first supporting seat; The lower surface of described second supporting seat compresses described the 3rd connector, and described second rigid circuit board is placed in first groove of upper surface of described second supporting seat; Described first rigid circuit board is positioned in second groove of upper surface of described second supporting seat, and described second rigid circuit board is positioned in first groove of upper surface of described first supporting seat.
According to a fifth aspect of the invention, provide a kind of memory device, comprised first circuit board, second circuit board and tertiary circuit plate; Be furnished with one or more memory chips on the described first circuit board, be furnished with one or more memory chips on the described second circuit board, be furnished with controller and host interface on the described tertiary circuit plate; Described first circuit board is coupled with described tertiary circuit plate, described second circuit board is coupled with described tertiary circuit plate, makes to be arranged in the one or more memory chips on the described first circuit board by described controller access and to be arranged in one or more memory chips on the described second circuit board via described host interface; The capacity of the memory chip on the described first circuit board is two times of capacity of the memory chip on the described second circuit board.
Memory device according to a fifth aspect of the invention, wherein said first circuit board is coupled to described tertiary circuit plate by first connector that is arranged on the described tertiary circuit plate, and described second circuit board is coupled to described tertiary circuit plate by being arranged in the electrical connection of second on the described tertiary circuit plate.
Memory device according to a fifth aspect of the invention, one or more pins of wherein said first connector are used to transmit the signal of the capacity of indicating the memory chip on the described first circuit board, and/or one or more pins of described second connector are used to transmit the signal of the capacity of indicating the memory chip on the described second circuit board.
Memory device according to a fifth aspect of the invention, wherein said first circuit board is coupled to described tertiary circuit plate by first connector and second connector that is arranged on the described tertiary circuit plate, described second circuit board is coupled to described tertiary circuit plate by the 3rd connector and the 4th connector that is arranged on the described tertiary circuit plate, wherein said first connector is identical with described the 3rd connector, and described second connector is identical with described the 4th connector.
Memory device according to a fifth aspect of the invention, one or more pins of wherein said first connector and/or described second connector are used to transmit the signal of the capacity of indicating the memory chip on the described first circuit board, and one or more pins of described the 3rd connector and/or described the 4th connector are used to transmit the signal of the capacity of indicating the memory chip on the described second circuit board.
Memory device according to a fifth aspect of the invention, also comprise first flexible PCB and second flexible PCB, described first flexible PCB is used for described first circuit board is coupled to described tertiary circuit plate, and described second flexible PCB is used for described second circuit board is coupled to described tertiary circuit plate.
Memory device according to a fifth aspect of the invention, wherein, described first circuit board has the first relative limit and second limit; Described second circuit board has the 3rd relative limit and the 4th limit; Described first flexible PCB has the 5th relative limit hexagon, and first limit of described first circuit board is coupled on described the 5th limit; Described second flexible PCB has relative the 8th limit, the 7th limit, and the 3rd limit of described second circuit board is coupled on described the 7th limit; Described hexagon is coupled to first connector of described tertiary circuit plate, and second connector of described tertiary circuit plate is coupled on described the 8th limit; The width of described hexagon is greater than the width on described first limit, and the width on described the 8th limit is greater than the width on described the 3rd limit; First limit of described first circuit board is positioned at the top of described first connector, and the 3rd limit of described second circuit board is positioned at the top of described second connector; The 4th limit of described second circuit board is positioned at the top of described first connector, and second limit of described first circuit board is positioned at the top of described second connector.
Memory device according to a fifth aspect of the invention, wherein, extend from first limit of described first circuit board on described the 5th limit; Extend from the 3rd limit of described second circuit board on described the 7th limit.
Memory device according to a fifth aspect of the invention, also comprise first supporting seat and second supporting seat, described first supporting seat is fastened on the hexagon of described first flexible PCB on described first connector, and described second supporting seat is fastened on the 8th limit of described second flexible PCB on described second connector; Described first supporting seat supports first limit of described first circuit board, and described first supporting seat also supports the 4th limit of described second circuit board; Described second supporting seat supports second limit of described first circuit board, and described second supporting seat also supports the 3rd limit of described second circuit board.
Memory device according to a fifth aspect of the invention comprises a plurality of described first circuit boards and/or a plurality of described second circuit board.
Memory device according to a fifth aspect of the invention, be furnished with one or more memory chips on described the 4th circuit board, described the 4th circuit board is coupled with described tertiary circuit plate, makes to be arranged in one or more memory chips on described the 4th circuit board via described host interface by described controller access; The capacity of the memory chip on described the 4th circuit board is two times of capacity of the memory chip on the described second circuit board, and the capacity of the memory chip on the capacity of the memory chip on perhaps described the 4th circuit board and the described second circuit board is identical.
According to a sixth aspect of the invention, provide a kind of memory device, comprised first circuit board, second circuit board and tertiary circuit plate; Be furnished with a plurality of memory chips on the described first circuit board, be furnished with a plurality of memory chips on the described second circuit board, be furnished with controller and host interface on the described tertiary circuit plate; Described first circuit board is coupled with described tertiary circuit plate, described second circuit board is coupled with described tertiary circuit plate, makes to be arranged in a plurality of memory chips on the described first circuit board by described controller access and to be arranged in a plurality of memory chips on the described second circuit board via described host interface; Described a plurality of memory chips on the described first circuit board are configured to first passage and second channel, described first passage comprises the memory chip of first quantity, described second channel comprises the memory chip of second quantity, and described first quantity is different from described second quantity.
Memory device according to a sixth aspect of the invention wherein, also comprises third channel on the described first circuit board, described third channel comprises the memory chip of the 3rd quantity, and described the 3rd quantity is different from described first quantity.
Memory device according to a sixth aspect of the invention, wherein, described a plurality of memory chips on the described second circuit board are configured to four-way and five-way road, described four-way comprises the memory chip of the 4th quantity, described five-way road comprises the memory chip of the 5th quantity, and described the 4th quantity is different from described the 5th quantity.
Memory device according to a sixth aspect of the invention, wherein, the quantity of the described a plurality of memory chips on the described second circuit board is different from the quantity of the described a plurality of memory chips on the described first circuit board.
Memory device according to a sixth aspect of the invention, wherein, wherein said first circuit board is coupled to described tertiary circuit plate by first connector that is arranged on the described tertiary circuit plate, and described second circuit board is coupled to described tertiary circuit plate by being arranged in the electrical connection of second on the described tertiary circuit plate; And described first connector is identical with described second connector, make described first circuit board to be coupled to described tertiary circuit plate by second connector that is arranged on the described tertiary circuit plate, described second circuit board can be coupled to described tertiary circuit plate by being arranged in the electrical connection of first on the described tertiary circuit plate.
Memory device according to a sixth aspect of the invention, wherein, one or more pins of described first connector are used to transmit the signal of the quantity of indicating the memory chip on the described first circuit board; One or more pins of described second connector are used to transmit the signal of the quantity of indicating the memory chip on the described second circuit board.
Memory device according to a sixth aspect of the invention, wherein, one or more pins of described first connector are used to transmit the signal of the quantity of indicating the memory chip that each channel had on the described first circuit board; One or more pins of described second connector are used to transmit the signal of the quantity of indicating the memory chip that each channel had on the described second circuit board.
Memory device according to a sixth aspect of the invention, wherein memory chip has identical memory capacity.
According to a seventh aspect of the invention, provide a kind of memory device, comprised controller, first memory passage and second memory passage; Described first memory passage and described second memory passage are coupled to described controller respectively; Described first memory passage comprises the memory chip of first quantity, and described second memory passage comprises the memory chip of second quantity, and described first quantity is different from described second quantity.
Memory device according to a seventh aspect of the invention, wherein, the memory chip of described first quantity is coupled to described controller by first bus of sharing, and the memory chip of described second quantity is coupled to described controller by second bus of sharing.
Description of drawings
When reading together with accompanying drawing, by the detailed description of reference back, will understand the utility model best and preferably use pattern and its further purpose and advantage the embodiment of illustrating property, wherein accompanying drawing comprises:
Figure 1A, 1B are the solid state hard discs according to the capacity expanded of prior art;
Fig. 2 is the solid state hard disc that comprises rigidity PCB and flexible PCB according to prior art;
Fig. 3 is the electronic equipment that comprises rigidity PCB and flexible PCB according to the another kind of prior art;
Fig. 4 is the front elevation according to the memory device of embodiment of the present utility model;
Fig. 5 A is the front elevation according to the circuit daughter board of the memory device of embodiment of the present utility model;
Fig. 5 B-5E is the side view according to the memory circuit daughter board of embodiment of the present utility model;
Fig. 5 F-5J is the schematic diagram according to the connected mode of the flash chip of the circuit daughter board of the memory device of embodiment of the present utility model and control circuit;
Fig. 6 A shows the side view according to the connected mode of the daughter board of the memory device of embodiment of the present utility model and motherboard;
Fig. 6 B shows the side view according to another connected mode of the daughter board of the memory device of embodiment of the present utility model and motherboard;
Fig. 7 shows the front elevation according to the connected mode of the daughter board of the memory device of embodiment of the present utility model and flexible PCB;
Fig. 8 is another front elevation according to the memory device of embodiment of the present utility model;
Fig. 9 is the stereographic map according to the memory device of embodiment of the present utility model;
Figure 10 is the vertical view according to the memory device of embodiment of the present utility model;
Figure 11 A, 11B, 11C are the stereographic maps that is used for according to the supporting seat of the memory device of embodiment of the present utility model;
Figure 12 is another stereographic map according to the memory device of embodiment of the present utility model;
Figure 13 is the front elevation according to the memory device of another embodiment of the present utility model; And
Figure 14 is the front elevation according to the memory device of another embodiment of the present utility model.
Embodiment
Fig. 4 is the front elevation according to the memory device of embodiment of the present utility model.Memory device shown in Figure 4 comprises circuit motherboard 400.Circuit motherboard 400 is the circuit boards with PCIE half high card form, and it can be connected to computing machine by the PCIE slot.Be furnished with circuit daughter board 410,420 and 430 on the circuit motherboard 400.In one embodiment, be furnished with flash chip 411-413,421-423 and 431-433 respectively on the circuit daughter board 410,420 and 430, make circuit daughter board 410,420,430 provide memory capacity to memory device shown in Figure 4.Also be furnished with the flash controller (not shown) on circuit motherboard 400, in order to the visit of control to the flash chip on circuit daughter board 410,420 and 430, and processing is from the interface command of computing machine.Though figure 4 illustrates the memory device that comprises flash chip with PCIE interface, but one of ordinary skill in the art will recognize, it only is a kind of giving an example, the utility model is applicable to the various electronic with other functions, and can be coupled to computing machine by the multiple interfaces mode, multiple interfaces includes but not limited to SATA(Serial Advanced Technology Attachment, Serial Advanced Technology Attachment), USB(Universal Serial Bus, USB (universal serial bus)), PCIE(Periph eral Component Interconnect Express, quick peripheral assembly interconnecting), SCSI(Small Compute r System Interface, small computer system interface), IDE(Integrated Drive Electronics, the integrated drive electronics) etc.And the utility model also is applicable to the storage chip that comprises flash memory other types in addition, for example, and phase transition storage, Memister, ferroelectric memory etc.
As shown in Figure 4, circuit daughter board 410 and 420 arranges that with opposite directions circuit daughter board 410 is arranged with identical direction with 430.Thereby make and on circuit motherboard 400, to arrange more flash chip with specific dimensions.And circuit daughter board 410,420 and 430 has identical physical dimension and identical interface, makes and can replace each other between circuit daughter board 410,420 and 430, also can adopt other circuit daughter board replacement circuit daughter board 410,420 and 430.
Fig. 5 A is the front elevation of daughter board of implementing the memory device of embodiment of the present utility model.More clearly showed the circuit subcard 410 among Fig. 4 among Fig. 5 A.Circuit subcard 420 and 430 can have the physical aspect identical with circuit subcard 410, but can have the memory capacity identical or different with circuit subcard 410.In preferred example, the memory capacity of circuit subcard 420 is two times of circuit subcard 410.On circuit subcard 410, be furnished with flash chip 411,412 and 413.In an example, the unshowned one side at circuit subcard 410 also is furnished with flash chip.Flash chip 411,412 and 413 can be the flash chip with same capability, also can be the flash chip with different capabilities.Flash chip on the circuit subcard 410 can be organized as a plurality of passages, comprises the flash chip of two or other quantity on each passage.Each passage is parallel, can receive data to circuit motherboard 400 transmission data or from circuit motherboard 400 simultaneously.On circuit subcard 410, also can arrange a plurality of flash chips with other quantity.
Under the situation that can hold flash chip 411,412 and/or 413, be provided with the size of circuit subcard 410 as far as possible little, so that on circuit motherboard 400, can arrange the circuit subcard of greater number, thereby improve the capacity of memory device.Owing to can arrange polylith circuit subcard 410,420 and/or 430 on circuit motherboard, and circuit subcard 410,420 and 430 can have the capacity that differs from one another, thereby memory device can have the combination of multiple different memory capacity.Referring to table 1, when circuit subcard 410,420 and 430 can have 192GB(Giga Byte) when two kinds of memory capacity of 394GB, and in the time that maximum 6 circuit subcards 410,420 or 430 can be arranged, can obtain having the memory device of multiple different memory sizes on circuit motherboard 400.Comprise 4 configurations though in table 1, illustrated to the memory device of 6 circuit subcards,, also can on circuit motherboard 400, arrange 1-3 circuit subcard, so that how different memory capacity to be provided.
Table 1 memory device, stores capacities chart
Thus,, obtained having the memory device of multiple different capabilities, can satisfy the demand of multiple different occasions by the circuit subcard of two kinds of different memory sizes is provided.
And because circuit subcard 410,420 has identical physical aspect with 430, thereby the installation of circuit subcard 410,420 and 430 on circuit motherboard 400 is interchangeable, thereby simplified the process of installing, and, when one of a plurality of circuit subcards break down, also can easily change.And, by with high capacity more and/or existing circuit subcard on the circuit subcard replacement circuit motherboard 400 of high-performance (access speed, reliability etc.) more, can easily realize renewal or upgrading to memory device.
One of ordinary skill in the art will recognize, the circuit subcard with three kinds or more kinds of different memory sizes also can be provided, thereby the memory device with more kinds of memory capacity can be provided.For example, referring to table 2, the storage chip that can arrange varying number on circuit daughter board 410 (for example, 3-6 storage chip), thereby, have at each storage chip under the situation of 64GB memory capacity, can provide have 192GB, 256GB respectively, the circuit subcard of 320GB and 384GB memory capacity.And, can obtain having the memory device of more kinds of different memory sizes by multiple circuit subcard with different memory sizes is provided.Obviously, each storage chip on the ifs circuit daughter board 410 has different memory capacity, then can provide to have the memory device that further multiple different memory capacity makes up.
Table 2 circuit subcard memory capacity table
| Chip capacity | Number of chips | The subcard capacity |
| 64GB | 3 | |
| 64GB | ||
| 4 | | |
| 64GB | ||
| 5 | 320GB | |
| 64GB | 6 | 384GB |
Fig. 5 B-5E is the side view of circuit daughter board 410 of implementing the memory device of embodiment of the present utility model.In Fig. 5 B, be furnished with storage chip 411,412,413,414,415 and 416 on the circuit daughter board 410.When each storage chip provided 64GB memory capacity, the circuit daughter board among Fig. 5 B can provide the memory capacity of 384GB.In Fig. 5 C, be furnished with storage chip 411,412,413,414 and 415 on the circuit daughter board 410.When each storage chip provided 64GB memory capacity, the circuit daughter board among Fig. 5 C can provide the memory capacity of 320GB.In Fig. 5 D, be furnished with storage chip 411,412,413 and 414 on the circuit daughter board 410.When each storage chip provided 64GB memory capacity, the circuit daughter board among Fig. 5 D can provide the memory capacity of 256GB.In Fig. 5 E, be furnished with storage chip 411,412 and 413 on the circuit daughter board 410.When each storage chip provided 64GB memory capacity, the circuit daughter board among Fig. 5 E can provide the memory capacity of 192GB.
Continuation is referring to Fig. 5 F-5J, and Fig. 5 F-5J is the schematic diagram according to the connected mode of the flash chip of the circuit daughter board 410 of the memory device of embodiment of the present utility model and control circuit 660.For the concurrency of the operation that promotes a plurality of flash chips, and the IO resource of saving the needed control circuit 660 of a plurality of flash chips of control, a plurality of flash chips on the circuit daughter board 410 are arranged in a plurality of passages.Be furnished with a plurality of flash chips in each passage, a plurality of flash chip shared datas and/or control bus in each passage, and in order to visit each flash chip, chip enable (the Chip Enable of a plurality of flash chips (and/or tube core) in each passage, CE) port can be controlled individually by control circuit 660.
Referring to Fig. 5 F, be furnished with 3 passages on the circuit daughter board 410.Flash chip 411,414 is included in the first passage, and is coupled to control circuit 660 by shared bus 490.Control circuit 660 can be controlled the CE port of flash chip 411,414 independently.Flash chip 412,415 is included in the second channel, and is coupled to control circuit 660 by shared bus 492.Control circuit 660 can be controlled the CE port of flash chip 412,415 independently.Flash chip 413,416 is included in the third channel, and is coupled to control circuit 660 by shared bus 494.Control circuit 660 can be controlled the CE port of flash chip 413,416 independently.
The flash chip that other quantity can be arranged on each passage alternatively.Referring to Fig. 5 G, flash chip 411,412 and 413 is included in the first passage, and is coupled to control circuit 660 by shared bus 490.Control circuit 660 can be controlled the CE port of flash chip 411,412 and 413 independently.Flash chip 414,415 and 416 is included in the second channel, and is coupled to control circuit 660 by shared bus 494.Control circuit 660 can be controlled the CE port of flash chip 414,415 and 416 independently.
The flash chip that can have still alternatively, varying number on each passage.Referring to Fig. 5 H, flash chip 411,414 is included in the first passage, and is coupled to control circuit 660 by shared bus 490.Control circuit 660 can be controlled the CE port of flash chip 411,414 independently.Flash chip 412,415 is included in the second channel, and is coupled to control circuit 660 by shared bus 492.Control circuit 660 can be controlled the CE port of flash chip 412,415 independently.Flash chip 413 is included in the third channel, and is coupled to control circuit 660 by bus 494.Control circuit 660 can be controlled the CE port of flash chip 413.Noticing does not provide flash chip 416 in Fig. 5 H, it is corresponding to the example that provides in Fig. 5 C.Notice, in Fig. 5 H, in first passage and the second channel, be furnished with 2 flash chips, and in third channel, only be furnished with 1 flash chip promptly, have the flash chip of varying number on each passage equally.Though it is pointed out that the flash chip that has varying number on each passage, the memory capacity on each passage can be the same or different.When the flash chip 411-415 among Fig. 5 H had identical memory capacity, the memory capacity on the third channel was half of memory capacity of first passage.Also can provide flash chip 413, make that its memory capacity is two times of flash chip 411,412,414 or 415, thereby make that the memory capacity on each passage is identical.
Though still it is pointed out that in the embodiment of Fig. 5 H, not comprise flash chip 416,, in the circuit daughter board 410 of corresponding Fig. 5 C with it, preferably, provide the interface arrangement identical with the circuit daughter board 410 of Fig. 5 B.Promptly, though circuit daughter board 410 at Fig. 5 C, the lead-in wire of the CE port that is coupled to flash chip 416 need be provided in interface, but for multiple different circuit daughter board provides identical interface arrangement is favourable, this will allow the different circuit daughter board of coupling on the connector of circuit motherboard 400, thereby improve the dirigibility of memory device, and simplified the installation process of memory device 400, be not limited to be installed on the specific motherboard connector because have the circuit daughter board 410 of particular memory capacity or flash chip quantity.
In one embodiment, in the interface of circuit daughter board 410, provide 3 lead-in wires, every lead-in wire is by being furnished with 1 flash chip or 2 flash chips on the passage in electric signal indication first passage, second channel and the third channel of its transmission.One of ordinary skill in the art also can recognize the mode of the configuration of other indicating circuit daughter boards 410.For example, in the interface of circuit daughter board 410, provide 2 lead-in wires, it can transmit " 00 ", " 01 ", " 10 " and " 11 " four kinds of different states, a kind of customized configuration of each condition indication circuit daughter board 410.Service wire is indicated, can also be the quantity of the storage chip on the circuit daughter board 410, perhaps the memory capacity that provides on the circuit daughter board 410.
Referring to Fig. 5 I, flash chip 411,414 is included in the first passage, and is coupled to control circuit 660 by shared bus 490.Control circuit 660 can be controlled the CE port of flash chip 411,414 independently.Flash chip 412 is included in the second channel, and is coupled to control circuit 660 by bus 492.Control circuit 660 can be controlled the CE port of flash chip 412.Flash chip 413 is included in the third channel, and is coupled to control circuit 660 by bus 494.Control circuit 660 can be controlled the CE port of flash chip 413.Noticing does not provide flash chip 415 and 416 in Fig. 5 H, it is corresponding to the example that provides in Fig. 5 D.
Referring to Fig. 5 J, flash chip 411 is included in the first passage, and is coupled to control circuit 660 by bus 490.Control circuit 660 can be controlled the CE port of flash chip 411 independently.Flash chip 412 is included in the second channel, and is coupled to control circuit 660 by bus 492.Control circuit 660 can be controlled the CE port of flash chip 412 independently.Flash chip 413 is included in the third channel, and is coupled to control circuit 660 by bus 494.Control circuit 660 can be controlled the CE port of flash chip 413 independently.Notice that in Fig. 5 J flash chip 414,415 and 416 is not provided, and it is corresponding to the example that provides in Fig. 5 E.
Fig. 6 A shows the side view according to the connected mode of the circuit daughter board of the memory device of embodiment of the present utility model and circuit motherboard.On circuit daughter board 410, be furnished with flash chip 411,412 and 413.A side relative with flash chip 411,412 and 413 on circuit daughter board 410 also can be furnished with one or more flash chips.On circuit motherboard 400, be furnished with connector 510,520, be used for being connected respectively with 540, thereby circuit daughter board 410 is coupled to circuit motherboard 400 with connector 530. Connector 530 and 540 is arranged in an end of flexible PCB 550 and 560 respectively, and the other end of flexible PCB 550,560 extends from circuit daughter board 410 relative both sides.Flexible PCB 550 and 560 can form in time processing with circuit daughter board 410.Owing to be connected respectively to connector 510,520 by connector 530,540, thereby each connector 530 and 540 signal wires that transmitted can be half quantity of access circuit daughter board 410 desired signal lines, thereby, connector 530 and 540 size can be less, to reduce the space that occupies on circuit motherboard 400.Owing to, make that circuit daughter board 410 is removable by connector 510,520,530 and 540 connecting circuit motherboards 400 and circuit daughter board 410.
As an example, also can not use connector 510,520,530 and 540 be coupled flexible PCB 550 and 560, but on circuit motherboard 400, the open area is set, and make flexible PCB 550,560 extend from the open area on the circuit motherboard 400.Perhaps, flexible PCB 550,560 is extended respectively from the relative both sides of circuit motherboard 400, and flexible PCB 550,560 and circuit motherboard 400 form in time processing.
Still as an example, flexible PCB 550,560 also can be connected to circuit daughter board 410 by connector.And connector also is set in circuit subcard 410 relative both sides, be used to connect flexible PCB 550,560.
Fig. 6 B shows the side view according to the another kind of connected mode of the circuit daughter board of the memory device of embodiment of the present utility model and circuit motherboard.On circuit daughter board 410, be furnished with flash chip 411,412 and 413.A side relative with flash chip 411,412 and 413 on circuit daughter board 410 also can be furnished with one or more flash chips.A side relative with flash chip 411,412 and 413 on circuit daughter board 410 also can be furnished with one or more flash chips.On circuit motherboard 400, be furnished with connector 620, be used for being connected, thereby circuit daughter board 410 is coupled to circuit motherboard 400 with connector 630.Connector 630 is arranged in an end of flexible PCB 640, and the other end of flexible PCB 640 extends from circuit daughter board 410 relative both sides.Flexible PCB 640 can form in time processing with circuit daughter board 410.Owing to be connected to connector 620 by connector 630, thereby the signal wire that connector 630 is transmitted can be the entire quantity of access circuit daughter board 410 desired signal lines, thereby, the connector 630 and 620 of large-size need be provided.In a preferred embodiment, for being provided at reliable connection the between flexible PCB 640 and the circuit motherboard 400, and be provided with the size of connector 630 greater than the length of flexible PCB 640 from circuit subcard 410 connections.In the case, flexible PCB 640 is trapezoidal, will be described further in Fig. 7.Though use single connector 630 connecting circuit daughter boards 410 and circuit motherboard 400 to need larger sized connector, but can bring the convenience of installation, because only need carry out the one-step installation operation, just circuit subcard 410 can be connected to circuit motherboard 400, and not have an end of connector to provide the space on the circuit subcard 410 for fitting operation.
As an example, also can on circuit motherboard 400, the open area be set, and make flexible PCB 640 extend from the open area on the circuit motherboard 400.Perhaps, flexible PCB 640 is extended respectively from the relative both sides of circuit motherboard 400, and flexible PCB 640 form in time processing with circuit motherboard 400.
Still as an example, flexible PCB 640 also can be connected to circuit daughter board 410 by connector.And connector also is set on circuit subcard 410, be used to connect flexible PCB 640.
In order to improve the space availability ratio of circuit motherboard 400, be provided with connector 620 near one side of circuit motherboard 400.And make circuit subcard 410 place perpendicular to this limit.
Fig. 7 shows according to the circuit daughter board 410 of the memory device of embodiment of the present utility model and the front elevation of the connected mode of flexible PCB 640.On circuit daughter board 410, be furnished with flash chip 411,412 and 413.Flexible PCB 640 has relative limit 681 and 682.Extend from one side of circuit daughter board 410 on one side 681 of flexible PCB 640.On the limit 682 relative of flexible PCB 640, be furnished with connector 630, be used for being connected with circuit motherboard 400 with limit 681.Because the signal wire that transmitted of the connector 630 required whole signal wires that can be access circuit daughter board 410, thereby the length on limit 682 is greater than the length on limit 681, thereby make the signal wire that can hold sufficient amount in the connector 630, and guarantee the connection reliability of flexible PCB 640 and circuit motherboard 400.
Be also noted that in Fig. 7 extended flexible PCB 640 has formed a plane with circuit subcard 410 from one side of circuit subcard 410, and connector 630 and flash chip 411,412 and/or 413 the same sides on this plane.Referring to Fig. 6 B, when flexible PCB 640 was connected to circuit motherboard 400, the flexible PCB bending made connector 630 towards circuit motherboard 400 at this, and flash chip 411,412 and/or 413 circuit motherboard 400 dorsad.In Fig. 8, will further describe this.
Circuit daughter board 410 can have multiple memory capacity.By the wiring that is connected to circuit motherboard 400 is set in flexible PCB 640 and connector 630, with the memory capacity of the controller indicating circuit daughter board 410 on circuit motherboard.When circuit daughter board 410 has two kinds of different memory capacity, for example one of 192GB and 384GB, a wiring can be set, by high level or low level are coupled in this wiring on circuit daughter board 410, coming the memory capacity of the controller indicating circuit daughter board 410 on circuit main board 400 is 192GB or 384GB.Also can keep the memory capacity of coming indicating circuit daughter board 410 more than a wiring.In another example, circuit daughter board 410 is with the coding of the storage capacity information on it, and the information after will encoding passes to the controller on the circuit motherboard 400.In another example still, the addressable flash chip 411,412 and 413 of the control circuit on the circuit motherboard 400 obtaining the memory capacity of each flash chip, thereby obtains the memory capacity of circuit daughter board 410.One of ordinary skill in the art also will recognize, in the connected mode of as shown in Figure 6A circuit daughter board 410 and circuit motherboard 400, also can in connector 530 and/or 540, provide wiring, with memory capacity, and make connector 530 and connector 540 have identical physical dimension and wiring arrangement to circuit motherboard 400 indicating circuit daughter boards 410.
Fig. 8 is another front elevation according to the memory device of embodiment of the present utility model.Circuit daughter board 410 has been shown among Fig. 8 to be connected on the circuit motherboard 400 by flexible PCB 640 and the connector 630 that is arranged on the flexible PCB 640.It may be noted that in Fig. 8 connector 630 is towards circuit daughter board 400, and flash chip 411,412 and/or 413 circuit motherboard 400 dorsad.Connector 630 is connected to the connector (not shown) on the one side that is arranged in circuit motherboard.In a preferred embodiment, connector 630 is arranged in the on one side long of circuit motherboard 400, and circuit daughter board 410 is perpendicular to the longer sides of circuit motherboard 400.Thereby can be on circuit motherboard 400 a plurality of circuit daughter boards 410 of parallel arranged.Flexible PCB 640 bendings, one side make it on one side from the extending of circuit daughter board 410, and connector 630 is towards circuit motherboard 400, and be connected to circuit motherboard 400.When flexible PCB 640 was in not case of bending, connector 630 and flash chip 411,412 and/or 413 were towards the same side.Among Fig. 8, circuit daughter board 410 parallels with circuit motherboard 400, and circuit daughter board 410 is spatially separated from one another with circuit motherboard 400.Space between circuit daughter board 410 and circuit motherboard 400 can be used for the installation of circuit daughter board 410.By this space, can apply power to the back side of connector 630, thereby connector 630 is installed on the connector on the circuit motherboard 400.
Can also see that from Fig. 8 the length of connector 630 is greater than one side of circuit daughter board 410, flexible PCB 640 extends from this limit.That is, the length on one side of flexible PCB 640 connecting circuit daughter boards 410 is less than the length of arranging one side of connector 630 on the flexible PCB.
Fig. 9 is the stereographic map according to the memory device of embodiment of the present utility model. Circuit daughter board 410 and 420 has been shown among Fig. 9 can be not shown by flexible PCB 640() and flexible PCB 642 be connected on the circuit motherboard 400.Be furnished with flash chip 411,412 and 413 on the circuit daughter board 410, be furnished with flash chip 421,422 and 423 on the circuit daughter board 420.Circuit daughter board 410,420 also can be furnished with one or more flash chips towards a side of circuit motherboard 400.Connector 630 is arranged on the flexible PCB 640, and can be connected with the connector 620 on being arranged in circuit motherboard.Connector 632 is arranged on the flexible PCB 642, and can be connected with the connector 622 on being arranged in circuit motherboard.Preferably, flexible PCB 642 is flexible PCBs identical with flexible PCB 640, and connector 632 is identical with connector 630, and connector 622 is identical with connector 620, thereby makes circuit daughter board 410 and circuit daughter board 420 be connected to circuit motherboard 400 convertibly.
When circuit daughter board 420 is connected to connector 622 by connector 632, and circuit daughter board 410 is when being connected to connector 620 by connector 630, the limit 415 of circuit daughter board 410 is positioned at the top of connector 632, and the limit 425 of circuit daughter board 420 is positioned at the top of connector 630.Flexible PCB 640(is not shown) extend from the limit 417 relative of circuit daughter board 410 with limit 415, and flexible PCB 642 extends from the limit 427 relative with limit 425 of circuit daughter board 420.In this way, though the length of connector 630,632 is greater than the limit 417 of circuit daughter board 410 and the limit 427 of circuit daughter board 420, but, make and on circuit motherboard 400, to arrange more circuit subcard because connector 630 and 632 pairing spaces are shared by circuit daughter board 410 and 420.
And, when being installed to circuit daughter board 410,420 on the circuit motherboard 400, because flexible PCB 6 40 and 642 can be in non-case of bending, thereby can apply power to the back side of connector 630 and 632 easily, it is connected respectively to connector 620 and 622.Next, flexible flexible PCB 640 and 642 makes circuit daughter board 410 parallel with circuit motherboard 400 with 420, thereby reduces by circuit motherboard and circuit daughter board 410, the 420 occupied spaces of the memory device that is constituted.
Because circuit daughter board 410 is parallel to each other with 420 and head and the tail are relative, and shared connector 630 and 632 formed spaces, thereby circuit daughter board 410 and 420 can be regarded as a circuit daughter board group.
Figure 10 is the vertical view according to the memory device of embodiment of the present utility model.In Figure 10, show circuit daughter board 410,420 and 430, circuit daughter board 430 can be to have the circuit daughter board of same physical profile with circuit daughter board 410,420, but has the memory capacity identical or different with circuit daughter board 410,420.Circuit daughter board 410 is connected to circuit motherboard 400 via flexible PCB 640, connector 630, connector 620.Circuit daughter board 430 is connected to circuit motherboard 400 via flexible PCB 644, connector 634, connector 624.Connector 634 is arranged on the flexible PCB 644, and connector 624 is arranged on the circuit motherboard 400.Preferably, connector 620 and 624 is placed on the same straight line along circuit motherboard 400 long limits.The limit 437 of the limit 417 of circuit daughter board 410, the limit of circuit daughter board 420 425 and circuit daughter board 430 is placed on the same substantially straight line.As shown in figure 10, because flexible PCB 640 is trapezoidal, promptly the length of connector 630 makes the limit 425 of circuit subcard 420 can be positioned at the below of connector 630 greater than the length on limit 417, and be separated with connector 630, and limit 425 is on the same substantially straight line with limit 417.
As an example, from Figure 10, also can see, though the length of connector 630 is greater than the length on limit 417, less than the length sum of limit 417 with limit 425, make the length of connector 630 be suitable for guaranteeing the reliability that connects and have less size, to reduce the manufacturing cost of connector 630.
Figure 11 A, 11B, 11C are the stereographic maps that is used for according to the supporting seat 1100 of the memory device of embodiment of the present utility model.Supporting seat 1100 comprises side wall 1110,1112, and side wall 1110 and 1112 is oppositely arranged, and parallel to each other, and supporting seat 1100 and circuit motherboard 400 are used to be coupled.In an example, on side wall 1110 and 1112, have screw, further supporting seat is fixed in motherboard 400 by bolt.Supporting seat also comprises plate 1120.Plate 1120 is vertical coupled between side wall 1110 and 1112.Plate 1120 can be integrally formed with side wall 1110,1120.Plate 1120 has opposite first 1122 and second surface 1124.First surface 1122 is circuit motherboard 400 dorsad, and is used to support two circuit daughter boards, and second surface 1124 is towards circuit motherboard 400, and is used to compress the connector that is arranged on the flexible PCB.Projection 1132 is arranged on the direction perpendicular to first surface 1122, be used to cut apart two circuit daughter boards, and the restricting circuits daughter board is mobile.On the direction that is parallel to first surface 1122, form second projection 1134.In Figure 12, will further describe the coupled relation between supporting seat 1100, circuit daughter board 410,420 and the circuit motherboard 400.Though described supporting seat 1100 in conjunction with Figure 11 A, 11B, 11C above with ad hoc structure, one of ordinary skill in the art will recognize can adopt supporting seat or the like with other structures, provide circuit daughter board 410 and/or 420 with circuit motherboard 400 between reliable the connection.
Figure 12 is another stereographic map according to the memory device of embodiment of the present utility model.Compare with the memory device shown in Fig. 9, in Figure 12, also gone out supporting seat 1100 and 1200.In Figure 12, for purpose clearly, supporting seat 1100 is illustrated in the below of connector 632, supporting seat 1200 is illustrated in the below of connector 630.And when mounted, and in the memory device after installation, supporting seat 1100 is used for connector 632 is pressed on connector 622, and supporting seat 1200 is used for connector 630 is pressed on connector 620.
In installation process, connector 632 is connected with connector 622.Then, supporting seat 1100 is placed on the back side of connector 632, and the second surface 1124 of the plate 1120 of supporting seat is compressed connector 632.In an example, can also pass through bolt, two side walls of supporting seat 1100 are fixed on the circuit motherboard 400.With supporting seat 1100 similar ground, supporting seat 1200 is pressed on connector 630 on the connector 620.
The face 1229 of supporting seat 1100 and first surface 1122(are referring to Figure 11 A, 11B and 11C) vertical with second surface 1124, and be positioned at projection 1134(referring to Figure 11 A, 11B and 11C) opposite direction.
The plate 1120 of supporting seat 1100 is used to fill the space between connector 632, flexible PCB 642 and the circuit daughter board 410,420, and support circuit daughter board 410 and 420.Projection 1132 is divided into groove 1217 and 1218 with plate 1120.After being pressed on supporting seat 1100 on the connector 632, flexible PCB 642 along face 1229 bendings, and is placed on a side on the close limit 427 of circuit subcard 420 on the groove 1218 of supporting seat 1100.Groove 1218 is set makes circuit subcard 420 be placed on just in the groove 1218, and moving by the side wall restricting circuits subcard 420 of projection 1132 and supporting seat 1100.
Similarly, be pressed on supporting seat 1200 on the connector 630 after, not shown among crooked flexible PCB 640(Figure 12), make the side on the close limit 417 of circuit daughter board 410 be placed on the first surface of supporting seat 1200.And a side that makes the close limit 425 of circuit daughter board 420 is placed on the first surface of supporting seat 1200, and the second surface of supporting seat 1200 is used for pressed connector 630.And a side on the close limit 415 of circuit subcard 410 is placed on the groove 1217 of supporting seat 1100.Groove 1217 is set makes circuit subcard 410 be placed on just in the groove 1217, and moving by another side wall restricting circuits subcard 410 of projection 1132 and supporting seat 1100.
Supporting seat 1100,1200 has limited circuit subcard 410,420 perpendicular to moving on the direction of circuit motherboard 400, thereby has improved the reliability of memory device.In a preferred embodiment, also circuit daughter board 410 and 420 is fixed on the supporting seat 1100 via projection 1134 by screw.In a similar fashion, circuit daughter board 410 and 420 is fixed on the supporting seat 1200.
Figure 13 is the front elevation according to the memory device of another embodiment of the present utility model.Memory device shown in Figure 13 comprises circuit motherboard 400.Circuit motherboard 400 is the circuit boards with PCIE half high card form, and it can be connected to computing machine by the PCIE slot.Be furnished with circuit daughter board 410,420,430 and 440 on the circuit motherboard 400.In one embodiment, be furnished with flash chip 411-413,421-423,431-433 and 441-443 respectively on the circuit daughter board 410,420,430 and 440, make circuit daughter board 410,420,430 and 440 provide memory capacity to memory device shown in Figure 13.Though figure 13 illustrates and on each of circuit daughter board 410-440, place three flash chips, one of ordinary skill in the art will recognize also can place the flash chip of other quantity on circuit daughter board 410-440, for example, placing flash chip on the circuit daughter board 410 with on the surperficial facing surfaces at flash chip 411-413 place.Also be furnished with control circuit 660 on circuit motherboard 400, in order to the visit of control to the flash chip on circuit daughter board 410,420,430 and 440, and processing is from the interface command of computing machine.Also be furnished with Memory on the circuit motherboard 400, dynamic RAM such as DRAM(Dynamic Random Access) storer 662,664,666 and 668.Storer 662,664,666 and 668 can be coupled to control circuit 660.Control circuit 660 can be FPGA(Field-programmable gate array, field programmable gate array), ASIC(Application Specific Integrated Circuit, the application specific integrated circuit) or the form of its combination.Control circuit 660 also can comprise processor or controller.Can comprise one, two or more processor core in the control circuit 600, each processor core is used to control or visit the part or all of of a plurality of circuit subcards.Each processor core also can be used for visiting or the control circuit subcard on a plurality of flash chips partly or entirely.
Also be furnished with connector 628 and 629 on the circuit motherboard 400 as shown in figure 13.Can also will respectively the circuit subcard be connected to circuit motherboard 400 by connector 628 and 629.Thereby, on circuit motherboard 400 as shown in figure 13, can connect nearly 6 circuit subcards with PCIE half high card form.Circuit subcard 410 is connected to circuit motherboard 400 by flexible PCB 640.Circuit subcard 420 is connected to circuit motherboard 400 by flexible PCB 642.Circuit subcard 430 is connected to circuit motherboard 400 by flexible PCB 644.Circuit subcard 440 is connected to circuit motherboard 400 by flexible PCB 646.In a similar fashion, the circuit subcard also is connected to circuit motherboard 400 by flexible PCB via connector 628 or 629.
A plurality of circuit subcards placement parallel to each other on the circuit motherboard 400.The minor face of the long edge circuit motherboard 400 of a plurality of circuit subcards is placed, and the minor face of a plurality of circuit subcards is placed along the long limit of circuit motherboard 400.The minor face of a plurality of circuit subcards is placed along same straight line substantially.Circuit subcard 410 is relative with 420 head and the tail, and the space of shared flexible PCB 640,642 formation, thereby forms circuit subcard group.Circuit subcard 430 is relative with 440 head and the tail, and the space of shared flexible PCB 644,646 formation, thereby forms circuit subcard group.Similarly, it is relative with 629 circuit subcard also head and the tail to be connected to connector 628, and formation circuit subcard group.Can have the space between a plurality of circuit subcards and the circuit motherboard, in this space, can arrange other electronic components.
In a preferred embodiment, also provide heat abstractor, be used for the flash chip on a plurality of circuit subcards and/or control circuit 660 and/or storer 662,664,666 and 668 heat transferred that produced to the memory device outside.
Figure 14 is the front elevation according to the memory device of another embodiment of the present utility model.Memory device shown in Figure 14 comprises circuit motherboard 400.Circuit motherboard 400 is the circuit boards with PCIE overall height card form, and it can be connected to computing machine by the PCIE slot.Be furnished with circuit daughter board 410,420,430,440,450,460,470 and 480 on the circuit motherboard 400.In one embodiment, be furnished with flash chip 411-413,421-423,431-433,441-443,451-453,461-463,471-473 and 481-483 respectively on the circuit daughter board 410-480, make circuit daughter board 410-480 provide memory capacity to memory device shown in Figure 14.Each of circuit daughter board 410-480 is connected to circuit motherboard 400 by flexible PCB, especially, is connected to the connector on the circuit motherboard 400.Circuit daughter board 410-480 is placed as two row, four row.The short side direction of the long edge circuit motherboard 400 of each of circuit daughter board 410-480 is placed, and each the minor face of circuit daughter board 410-480, along the direction placement on the long limit of circuit motherboard 400.
Also be furnished with connector 628,629,688 and 689 on the circuit motherboard 400 as shown in figure 14.Can also will respectively the circuit subcard be connected to circuit motherboard 400 by connector 628,629,688 and 689.Thereby, on the circuit motherboard 400 shown in 14, can connect nearly 12 circuit subcards with PCIE half high card form.
Also be furnished with control circuit 660,670 on circuit motherboard 400, in order to the visit of control to the flash chip on the circuit daughter board 410-480, and processing is from the interface command of computing machine.Also be furnished with storer 662,664,666,668,672,674,676 and 678 on the circuit motherboard 400 such as DRAM.Storer 662-668 and 672-678 can be coupled to control circuit 660,670 respectively, also can share between control circuit 660,670.Control circuit 660,670 can be the form of FPGA, ASIC or its combination.Control circuit 660,670 also can comprise processor or controller.In the control circuit 660,670 each is used to control or visit the part or all of of a plurality of circuit subcards, and for example, control circuit 660 is used for control or access circuit subcard 410-440, and control circuit 670 is used for visit or control circuit subcard 450-480.Control circuit 660,670 also can be used for visiting or the control circuit subcard on a plurality of flash chips partly or entirely.
In a preferred embodiment, also provide heat abstractor, the heat transferred that is used for the flash chip on a plurality of circuit subcards and/or control circuit 660,670 and/or storer 662-668,672-678 are produced is to the memory device outside.
Represented description of the present utility model, and be not intended to disclosed form limit or restriction the utility model in order to illustrate with purpose of description.To one of ordinary skill in the art, many adjustment and variation are conspicuous.
Claims (11)
1. an electronic equipment comprises first rigid circuit board, second rigid circuit board, the 3rd rigid circuit board, first flexible PCB and second flexible PCB;
Described first flexible PCB transmits electric signal between described first rigid circuit board and described the 3rd rigid circuit board,
Described second flexible PCB transmits electric signal between described second rigid circuit board and described the 3rd rigid circuit board,
Described first rigid circuit board has the first relative limit and second limit;
Described second rigid circuit board has the 3rd relative limit and the 4th limit;
Described first flexible PCB has the 5th relative limit hexagon, and first limit of described first rigid circuit board is coupled on described the 5th limit;
Described second flexible PCB has relative the 8th limit, the 7th limit, and the 3rd limit of described second rigid circuit board is coupled on described the 7th limit;
Described hexagon is coupled to the first area of described the 3rd rigid circuit board, and the second area of described the 3rd rigid circuit board is coupled on described the 8th limit;
The width of described hexagon is greater than the width on described first limit, and the width on described the 8th limit is greater than the width on described the 3rd limit.
2. electronic equipment according to claim 1, wherein
Extend from first limit of described first rigid circuit board on described the 5th limit;
Extend from the 3rd limit of described second rigid circuit board on described the 7th limit.
3. electronic equipment according to claim 1, wherein,
The hexagon of described first flexible PCB is furnished with first connector, and the 8th limit of described second flexible PCB is furnished with second connector; Described first connector is used for first area that described first flexible PCB is coupled to described the 3rd rigid circuit board; Described second connector is used for described second flexible PCB is coupled to the second area of described the 3rd rigid circuit board; Described first area is furnished with and the corresponding connector of described first connector, and described second area is furnished with and the corresponding connector of described second connector.
4. electronic equipment according to claim 1, wherein, the hexagon of described first flexible PCB extends from the first area of described the 3rd rigid circuit board, and extend from the second area of described the 3rd rigid circuit board on the 8th limit of described second flexible PCB.
5. electronic equipment according to claim 1, wherein said first area are the parts on the 9th limit of described the 3rd rigid circuit board, and/or described second area is the part of the odd plots of land that can be cultivated of described the 3rd rigid circuit board.
6. electronic equipment according to claim 3 also comprises first supporting seat and second supporting seat,
Described first supporting seat is pressed on described first connector on described the 3rd rigid circuit board, and described second supporting seat is pressed on described second connector on described the 3rd rigid circuit board;
Described first supporting seat supports first limit of described first rigid circuit board, and described first supporting seat also supports the 4th limit of described second rigid circuit board;
Described second supporting seat supports second limit of described first rigid circuit board, and described second supporting seat also supports the 3rd limit of described second rigid circuit board.
7. according to claim 3 or 6 described electronic equipments, wherein,
The plane at described first flexible PCB and the described first rigid circuit board place has first and second respect to one another; The plane at described second flexible PCB and the described second rigid circuit board place has the 3rd and fourth face respect to one another;
Described first connector is arranged on described first, and described second connector is arranged on described the 3rd;
Described first connector is used for first area that described first flexible PCB is coupled to described the 3rd rigid circuit board, make described first connector when described the 3rd rigid circuit board, described dorsad the 3rd rigid circuit board of first face of described first rigid circuit board;
Described second connector is used for described second flexible PCB is coupled to the second area of described the 3rd rigid circuit board, make described second connector when described the 3rd rigid circuit board, described dorsad the 3rd rigid circuit board of first face of described second rigid circuit board.
8. according to the described electronic equipment of one of claim 1-6, be furnished with storer on wherein said first rigid circuit board, be furnished with storer on described second rigid circuit board, be furnished with controller and host interface on described the 3rd rigid circuit board.
9. electronic equipment according to claim 8, the memory capacity of the storer on wherein said first rigid circuit board are two times of memory capacity of the storer on described second rigid circuit board.
10. electronic equipment according to claim 1, first limit of wherein said first rigid circuit board is positioned at the top of described first area, and the 3rd limit of described second rigid circuit board is positioned at the top of described second area;
The 4th limit of described second rigid circuit board is positioned at the top of described first area, and second limit of described first rigid circuit board is positioned at the top of described second area.
11. according to claim 1-6, one of 10 described electronic equipments, be furnished with the wiring of the memory capacity of the storer on described first rigid circuit board of indication on wherein said first flexible PCB, be furnished with the wiring of the memory capacity of the storer on described second rigid circuit board of indication on described second flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220592355 CN203102072U (en) | 2012-11-11 | 2012-11-11 | Electronic device |
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| CN 201220592355 CN203102072U (en) | 2012-11-11 | 2012-11-11 | Electronic device |
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| CN203102072U true CN203102072U (en) | 2013-07-31 |
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| CN (1) | CN203102072U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014071694A1 (en) * | 2012-11-11 | 2014-05-15 | 北京忆恒创源科技有限 公司 | Storage device |
| WO2014071695A1 (en) * | 2012-11-11 | 2014-05-15 | 北京忆恒创源科技有限公司 | Electronic equipment |
| CN113068303A (en) * | 2014-03-14 | 2021-07-02 | 桑迪士克科技有限责任公司 | Self-supporting thermal ducting system for electronic assemblies |
-
2012
- 2012-11-11 CN CN 201220592355 patent/CN203102072U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014071694A1 (en) * | 2012-11-11 | 2014-05-15 | 北京忆恒创源科技有限 公司 | Storage device |
| WO2014071695A1 (en) * | 2012-11-11 | 2014-05-15 | 北京忆恒创源科技有限公司 | Electronic equipment |
| CN113068303A (en) * | 2014-03-14 | 2021-07-02 | 桑迪士克科技有限责任公司 | Self-supporting thermal ducting system for electronic assemblies |
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Address after: 100192 room A302, building B-2, Dongsheng Science Park, Zhongguancun, 66 xixiaokou Road, Haidian District, Beijing Patentee after: Beijing yihengchuangyuan Technology Co.,Ltd. Address before: 312, building D, entrepreneurship Park, No. 2, Shangdi Information Road, Haidian District, Beijing 100085 Patentee before: BEIJING MEMBLAZE TECHNOLOGY Co.,Ltd. |
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Granted publication date: 20130731 |
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