CN202949055U - Connector - Google Patents
Connector Download PDFInfo
- Publication number
- CN202949055U CN202949055U CN 201220640847 CN201220640847U CN202949055U CN 202949055 U CN202949055 U CN 202949055U CN 201220640847 CN201220640847 CN 201220640847 CN 201220640847 U CN201220640847 U CN 201220640847U CN 202949055 U CN202949055 U CN 202949055U
- Authority
- CN
- China
- Prior art keywords
- connector
- port
- finger shaped
- jerk finger
- shaped part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The utility model relates to a connector. The connector comprises a cover, a housing, a heat transmitting plate, a first elastic finger-shaped carrier and a second elastic finger-shaped carrier, wherein the cover limits a first port and a second port; the housing is located in the cover and comprises a first clamping slot and a second clamping slot, and the first clamping slot and the second clamping slot are respectively arranged in the first port and the second port; the heat transmitting plate is provided with a main wall, a first side wall and a second wall, and the main wall extends vertically along the first port and the second port; the first elastic finger-shaped carrier is installed on the first side wall and supports a plurality of elastic finger-shaped parts, and a plurality of elastic finger-shaped parts on the first elastic finger-shaped carrier can be jointed with a module which is inserted in the first port; and the second elastic finger-shaped carrier is installed on the second side wall and supports a plurality of elastic finger-shaped parts, and a plurality of elastic finger-shaped parts on the second elastic finger-shaped carrier can be jointed with a module which is inserted in the second port. During working, the heat of the inserted modules can be transmitted to elastic finger-shaped parts from modules, then the heat transmitting plate and a radiating system.
Description
The cross reference of related application
The application advocates the priority of No. the 61/640th, 786, the U.S. Provisional Application submitted on May 1st, 2012.
Technical field
The utility model relates to electric connector field, relates more specifically to I/O (I/O) field of connectors.
Background technology
Typical I/O connector system comprises that a cable assembly and is arranged on the connector on circuit board.Cable assembly is usually included in a pair of pin connector on the opposite end of a cable, and it is set to signal transmission on the distance of an expectation.Be arranged on the socket that connector on circuit board is arranged in a panel typically, this socket is set to accommodate pin connector and docks with pin connector.
Along with the increase of data transmission rate, problem that is difficult to overcome is the physical restriction for the medium that is used for signal transmission between pin connector.For example, passive cable still tends to be subject to the restriction of distance for have cost benefit for short distance along with the lifting of signal frequency.Active copper cable and fiber optic cables are highly suitable for the upper signal transmission of long distance, but need the energy, if therefore connector system is not suitably designed easily produces the problem of heat radiation.Solution is to use a cross-over connection radiator (riding heat sink) on socket, although existing some effect of solution still has difficulties providing on enough radiating treatment ability.Therefore, further improve the appreciation that its heat management will obtain some people.
The utility model content
Because the problems referred to above of prior art, the utility model provides a kind of connector that can improve heat management.
For this reason, the utility model provides a kind of connector, comprising: a cover body, described cover body define one first port and one second port; One housing, described housing is arranged in described cover body, and described housing comprises one first draw-in groove that is arranged in described the first port and one second draw-in groove that is arranged in described the second port; One heat transfer plate, described heat transfer plate have along described the first port and vertical Yi Zhubi, a first side wall and one second sidewall that extends of the second port; One first jerk finger shaped part support plate, described the first jerk finger shaped part support plate is installed on described the first side wall and is supported with a plurality of jerk finger shaped parts, and a plurality of jerk finger shaped parts on described the first jerk finger shaped part support plate are set to engage a module that is inserted in described the first port; And one second jerk finger shaped part support plate, described the second jerk finger shaped part support plate is installed on described the second sidewall and is supported with a plurality of jerk finger shaped parts, and a plurality of jerk finger shaped parts on described the second jerk finger shaped part support plate are set to engage a module that is inserted in described the second port.
Preferably, described main wall is supported with a plurality of fins.
Preferably, described fin and described main wall are an integral body.
Preferably, described the first side wall supports additional a plurality of fins.
Preferably, described additional a plurality of fins and described the first side wall are an integral body.
Preferably, described the first side wall and the second sidewall lay respectively at the same side of port separately.
Preferably, described a plurality of jerk finger shaped part is arranged as a plurality of row.
Preferably, at least one jerk finger shaped part support plate is soldered to described sidewall.
Preferably, described the first jerk finger shaped part support plate comprises that a vertical wall and keeps pin.
Preferably, described the first jerk finger shaped part support plate also comprises a retaining member of a wall that is set to engage described cover body.
Preferably, one of them of described main wall and described the first side wall is supported with a heat dissipation element.
Preferably, described main wall and described the first side wall respectively are supported with a heat dissipation element.
Socket connector comprises a port that is set to accommodate a pair of connection module.This port is provided with and a plurality ofly is set to engage this to the jerk finger shaped part of connection module.Jerk finger shaped part and a heat transfer plate thermal communication, this heat transfer plate are set to provide the part of the wall that limits this port.Fin can be installed on heat transfer plate.In when work, the heat energy of module is delivered to jerk finger shaped part from module, and its heat energy is delivered to heat transfer plate from jerk finger shaped part successively, then to fin (if comprising).Connector system can be provided so that air flows from front to back, and therefore shown connector system for example is suitable for being used in usually in the structure of rack system of the opposite side that air is directed to carriage from the side (for example, front side or rear side) of carriage.If expectation, socket can be to have two vertically stacked connector structures of the ports of alignment.
By using the utility model, can improve the heat dissipation problem of connector in prior art, and have better radiating effect.
Description of drawings
The utility model illustrates via example but is not limited to accompanying drawing, and Reference numeral identical in accompanying drawing refers to similar elements, wherein:
Fig. 1 shows the stereogram of an embodiment of a connector assembly.
Fig. 2 shows a three-dimensional exploded view of connector assembly shown in Figure 1.
Fig. 3 shows the stereogram of an embodiment of a stacked socket connector.
Fig. 4 shows a sectional perspective exploded view of stacked socket connector shown in Figure 3.
Fig. 5 shows another sectional perspective exploded view of stacked socket connector shown in Figure 3.
Fig. 6 shows along the perspective, cut-away view of an embodiment of a part of jack connector system of the intercepting of the line 6-6 in Fig. 1.
Fig. 7 shows the partial side view in a cross section of an embodiment of a port of a socket connector.
Fig. 8 shows along a perspective, cut-away view of a part of jack connector system of the intercepting of the line 8-8 in Fig. 1.
Fig. 9 shows the three-dimensional exploded view of an embodiment of a heat management system.
Figure 10 shows a flow chart that conducts heat from a module.
Figure 11 shows the stereogram of an embodiment of a socket connector.
Figure 12 shows a sectional perspective exploded view of socket connector shown in Figure 11.
Figure 13 shows the stereogram of an embodiment of a heat transfer plate.
Figure 14 shows the three-dimensional exploded view of an embodiment of a heat transfer plate.
Figure 15 A shows along a stereogram of a cross section of the intercepting of the line 15-15 in embodiment shown in Figure 11.
Figure 15 B shows another stereogram of the embodiment shown in Figure 15 A.
Embodiment
A plurality of illustrative examples have been described in following detailed description, and are not to be intended to be limited to these disclosed combinations expressly.Therefore, unless otherwise indicated, feature disclosed herein can be combined in together, to consist of other combination that does not illustrate in addition for simple and clear purpose.
If understand from figure, a socket connector 10 usually is installed in a baffle plate 20(and shows part baffle plate 20) the back.Be considered to a back if baffle plate is considered to be positioned at a front and its opposite end of socket, a System Construction can allow air to flow from front to back.If this System Construction is set to allow air to flow from front to back, baffle plate 20 can comprise air inlet 25 so, and air inlet 25 can be formed by the hole of the one or more intended shape on baffle plate.If understand, the main air-flow by cooling this needed expectation of system of arranging in the size in hole and these holes is determined, so those skilled in the art can determine based on system requirements the structure of the air inlet 25 of expectation.
A connector system 1 comprises a connector 10 that is positioned on a circuit board 5, and comprises a plurality of ports 30 of a plurality of openings 22 that are arranged in baffle plate 20, and port 30 is set to be used to the pin connector of accommodating docking.As shown, this design allows air to pass baffle plate 20.One EMI seal 26 and a pad 28 help connector 10 is sealed in baffle plate 20.
As shown, a shield assembly 50 comprises the top cover 51 that first, second socket 90 is combined.As shown, selectable top cover 51 comprises a hole 40, and this hole 40 can be used for steering current and leave circuit board 5, and two adjacent socket connectors are combined.Because top cover 51 extends between two cover body assemblies 100, so top cover also is inclined to the rear path 42 that formation can be set to guide from front to back air.
As shown, each socket 90 includes cover body assembly 100, and this cover body assembly 100 comprises a main part 100b and a rear portion 100a, and comprises two heat transfer plates 125,125 ' of the wall 105 that is installed to this main part 100b.One central lead piece 110 is positioned between heat transfer plate 125,125 ', and comprises the surface 111 that can support heat transfer plate 125.If understand, this surface can be stair-stepping, and then the space of abundance is provided for heat transfer plate 125.Certainly, it should be noted that shown socket 90 provides stacked two-port 30.A lower profile form with socket connector of single port is also suitable, and can omit selectable central lead piece 110, and has single heat transfer plate 125.Although should also be noted that shown system comprises the two jerk finger shaped part support plates 151,152 of top side and the bottom side that can consider to be arranged on port 30, also can consider other structure.For the structure that has than the low heat emission problem, for example, can use single jerk finger shaped part support plate.Jerk finger shaped part support plate and heat transfer plate also can be set to when one conduct heat the zone be positioned at module above or below engage the one or both sides (rather than the top of a module and bottom) of a module when (rather than side as shown in the figure).
Each cover body assembly 100 surrounds housings 200, and this housing 200 comprises and supports two noses 215, a main part 210 of 215 '.Each nose 215,215 ' supports respectively a draw-in groove 220,220 ', and this draw-in groove 220,220 ' is set to be used to accommodating from the plug-in card to connection module.One front shroud body wall 230 includes a plurality of afterbodys 232 that help limit around a conductive wall of main part 210.As shown, a plurality of photoconductive tubes 245 can locate and be set to extend forward between two noses 215,215 '.
If desired, heat transfer plate can extend beyond single port vertically.For example, heat transfer plate 125 shown in Fig. 9 can be provided so that Yi Zhubi (main wall) C extends the height of two ports vertically, each sidewall A, B all engage one one-sided (sidewall B engages the top side, and sidewall A engages the bottom side) of a plug that is inserted in corresponding ports.It shall yet further be noted that if desired, not necessarily one of heat transfer plate, and can be consisted of by many institutes.If understand, this just allows heat transfer plate to have the Yi Zhubi that vertically extends along two stacked ports, also is provided for simultaneously engaging a plurality of sidewalls on two surfaces of a pin connector that is inserted into.If further understand, main wall C will be along the one first side 30a of (or a plurality of) port, and sidewall A will be along a side 30b of port, and sidewall B will be along a side 30c of port.Should be noted in the discussion above that side 30b, 30c can be the two relative sides of same port, or two of two different ports ipsilaterals not.What also should further note is, although shown heat transfer plate is plotted as the design with a U-shaped, can remove the one side, to provide more as a L shaped shape.Jerk finger shaped part can also be set directly on main wall, but this structure trends towards reducing the quantity of the heat energy that can be removed.
In addition, if the more complicated heat transfer plate of expectation, heat transfer plate can have by a vapor chamber (vaporchamber) or have some other systems lower than the thermal resistance of a copper coin and consists of main wall.Yet for most application, the heat transfer plate that is made of copper coin is with enough.Should also be noted that in addition fin 300 need not to be arranged on side between connector (as shown in the figure).This system provides some benefit, if but this system is designed to have benefited from the air-flow of connector top, what may more expect so is, heat transfer plate upwards is directed to heat energy the top of connector, and the thermal energy transfer system of fin 300(or other expectation is such as adopting liquid cools etc.) be positioned in the top of connector 10.
If understand, shown structure has the ability of allowing schuppen structure valuably, and utilizes the surface area of the increase that rectangular module (for example SFP pattern piece) has advantages of on end face and bottom surface to minimize thermal resistance.In addition, provide the jerk finger shaped part support plate to help to provide a mechanical balance system on two opposite sides, because two relative jerk finger shaped parts are easy to make module centering.Should be noted in the discussion above that the contact force that each jerk finger shaped part 161 provides can change according to the thermal resistance (increase contact force and will be easy to improve heat conduction) of expectation and the module insertion force (increase contact force and will be easy to increase the insertion force that needs) of expectation.Therefore, can adjust on demand profile and contact force, to satisfy system requirements, wherein this contact force can be but be not limited to the approximately scope of 100 to 400 gram forces of each jerk finger shaped part.
As shown, heat transfer plate 125 comprises a plurality of passages 130.Shown passage 130 extends through heat transfer plate 125, and when jerk finger shaped part 161,161 ' contact 162,162 ' join on the module of insertion, and passage 130 provides displacement region for jerk finger shaped part 161,161 ' afterbody 163,163 '.Therefore, when connection module was inserted along a first direction 166, jerk finger shaped part 161,161 ' was respectively along a second direction 164 and third direction 165 translations, and second direction 164 and third direction 165 opposite each other.If be understood that in optional embodiment, the function that passage provides also can be provided by a plurality of depressions that do not extend through heat transfer plate in heat transfer plate 125 or a plurality of groove.Therefore, the displacement region in heat transfer plate 125 can be depression or the passage that does not extend through heat transfer plate.
Each jerk finger shaped part support plate 151,152,153,154 comprises a plurality of jerk finger shaped parts 161, and each jerk finger shaped part includes contact surface 162,162 ' and afterbody 163,163 '.As shown, jerk finger shaped part 161 is lined up a plurality of row 160, and every row comprise a plurality of jerk finger shaped parts 161.It should be noted, the pattern of shown a plurality of row makes it forward straight, so that the passage 130 in heat transfer plate 125 aligns with afterbody 163,163 ', thereby when module was inserted in port 30, afterbody 163,163 ' can be displaced in passage 130.Yet the use of a plurality of row can be unwanted, also can be set to other pattern according to expectation.
Jerk finger shaped part 161 is set to engage a module that is inserted into, in order to a plurality of thermal contacts are provided for the module that is inserted into.With trend towards coming the existing design of splice module to compare with single plate, the usefulness of this design is, a plurality of jerk finger shaped parts 161 are the surface of splice module individually, therefore is more suitable in the variation of the surface smoothness of reply module.Although total surface area (with usually comparing with the large plate that uses together with the cross-over connection fansink designs) reduces, but determine to have used a plurality of jerk finger shaped parts in fact very effective, and in fact can some unexpectedly provide between module and jerk finger shaped part support plate than usually in the lower thermal resistance of the thermal resistance that provides between module and the unsteady radiator with a plane.
Thermal resistance can be by increasing the spring force that is associated with each jerk finger shaped part and being managed by the quantity that changes jerk finger shaped part.Generally speaking, will be based on acceptable maximum insertion force and need to be from the heat energy of the module removal that is inserted into to the restriction of spring force and jerk finger shaped part quantity.
The jerk finger shaped part support plate can be installed on heat transfer plate 125, in order to minimize two thermal resistances between structure.For example, in one embodiment, the jerk finger shaped part support plate can be soldered to heat transfer plate by enough reflow soldering processes.In one embodiment, reflow soldering process can carry out to the installation of heat transfer plate in conjunction with fin 300, in order to a high efficiency manufacturing process is provided.Certainly, also can use other installation method (for example using a heat-conductive bonding agent or like that).Although the method for being welded to connect can provide low-down thermal resistance, use heat-conductive bonding agent (when keeping thinly) also to be fit to, because its total surface area is enough to provide low thermal resistance between two docking structures.It should be noted that in one embodiment, heat transfer plate and jerk finger shaped part support plate can be combined into a monomer structure, yet this structure has more challenge to large-scale production, therefore think that two-part construction provides lower total cost.
Fin 300 is set to provide a surface area that increases, in order to improve the heat transmission of the air from socket to the socket of flowing through.As shown, fin 300 is set to provide good heat transfer (or vice versa) to the air that flows from front to back.Yet the shape of fin 300 can change, in order to be fit to the airflow direction of expectation, therefore shown shape is only schematic.Should be noted in the discussion above that fin is optional, also can replace fin with the surface of heat transfer plate.In addition, the system that arranges for liquid cools can provide and is shelved on heat transfer plate and is configured such that heat conducts a conduit that leaves heat transfer plate.In addition, if fin is used in expectation, fin can form the part of heat transfer plate.Yet, if understand, separating with heat transfer plate an advantage that forms fin is, the orientation that fin can designed to be used special airflow configurations and be positioned at expectation (for example, on the side of connector, above connector etc.), therefore the design for connector provides considerable flexibility.
If understand from Fig. 8, fin 300 can occupy sizable space between two stacked connectors.Therefore, can change as in this discussion the size of fin 300 and position to allow to reduce the interval between port 30.
Therefore, in general, the heat energy of module is passed to jerk finger shaped part (and therefore being passed to the jerk finger shaped part support plate).If the jerk finger shaped part support plate is soldered to heat transfer plate, the thermal resistance between jerk finger shaped part support plate and heat transfer plate can be minimum.Similarly, if optional fin is soldered to heat transfer plate, thermal resistance can minimize.Therefore, with reference to the heat energy path shown in Figure 10, can make the temperature difference between module and fin less than 15 ℃, and be about in certain embodiments 10 ℃.In general, maximum temperature decline (the temperature decline between any extraneous air of fin and the fin of flowing through) will exist between module and jerk finger shaped part support plate, and in one embodiment, the temperature difference between module and jerk finger shaped part can be basically greater than the temperature difference between other parts.
Although expection has diversified embodiment, it should be noted, shown module is arranged so that with heat passage between fin passage can align with the heat passage of expection, and so only thermal resistance is had minimum influence.
If understand from Figure 10, in step 400, when a module is inserted connector, produce heat energy by module.Next, in step 410, heat energy is directed leaving this module by jerk finger shaped part.Then in step 420, heat energy is passed to heat transfer plate.At last, in step 430, heat energy is passed to a system and leaves this system (step 430, for example but restriction can not carried out by fin 300) with guiding heat energy.Yet, should be noted that and can omit fin (or any special heat transfer system) in some system, because leaving the improvement performance of module, guiding heat energy has been enough to cooling this system.Yet in many application, the power stage that module increases can make that to have some heat transfer system be comparatively desirable.
Figure 11-Figure 15 B shows another embodiment of a socket connector 210 of the modification that comprises feature discussed above.As shown, socket connector 210 comprises a cover body assembly 350 of being arranged to surround a housing 400.Cover body assembly 350(can be made of many independently elements combinations as shown together) comprise the side opening 360 and the apical pore 355 that allow a cooling system 301 to be used.Cooling system 301 comprises the heat transfer plate 301a with a main wall 302, a upper side wall 306 and a lower wall 304.Certainly, if expectation, can increase the sidewall of some other quantity, and if a sidewall (the most useful although this system will trend towards a non-stacked structure) can be only used in expectation.
If understand, main wall 302 vertically extends along two port 230a, 230b, has avoided thus carrying out between two ports the needs (therefore helping to keep low thermal resistance) that heat shifts.If expectation, and as shown, main wall 302 can even extend above top port, in order to extra surface area is provided.
If understand, when the design of above two fins about Fig. 1-Fig. 9 discussion and wall is suitable time marquis, the main wall 302 of the heat transfer plate shown in Figure 11-Figure 15 B can form via extruding, making selectable fin 307 is an integral body with main wall 302, reduces thus heat potential between two elements and shifts.Fin 307 serves as a heat dissipation element.Certainly, the liquid cooling scheme with container of filling liquid also can be used as heat dissipation element, leaves one of them (replacing thus fin) of main wall 302 or a plurality of sidewalls with the heat energy that helps to transmit.Expectedly, the use of the liquid cooling scheme integral body more complicated (for example, heat dissipation element can be benefited from and be soldered to heat transfer plate) slightly that will make heat transfer plate and heat dissipation element.
Shown upper side wall 306 supports jerk finger shaped part support plates 316, and this jerk finger shaped part support plate 316 comprises a fingers 317 of the wall that is configured to engage cover body assembly 350.This jerk finger shaped part support plate 316 also supports a plurality of jerk finger shaped parts 318 that can play similar jerk finger shaped part discussed above 161.Especially, its supporting side walls is left in these jerk finger shaped parts extensions, and is set to the supporting side walls deflection.A difference is, jerk finger shaped part 318 do not comprise need to be in this supporting side walls the afterbody with a recess.If understand, comprise or do not comprise that afterbody will depend on expectation contact interface and the desired amt of lead-in (lead-in).Shown jerk finger shaped part support plate 315,316 also comprises a vertical wall 321 and is supported on a maintenance pin 320 of below, the bottom extension of corresponding ports, and can comprise a retaining member 322, the two all helps cooling system 301 is fixed to corresponding cover body assembly.Yet, should be noted that vertical wall 321, keep pin 320 and retaining member 322 to select, can use one of them or another (or omitting both) according to using.
For sidewall 304,306 being fixed to main wall 302, groove 311a, 311b can be set help the sidewall fix in position.In one embodiment, sidewall 304,306 can solderedly put in place.When expectation also is welded in place the jerk finger shaped part support plate (although can not need this structure), if all parts can be welded together quickly, just can obtain certain scale and benefit.
If understand from Figure 15 A and Figure 15 B, a benefit of shown design is to remove the heat energy at the top of the module that is inserted into.Along with the increase of heat energy, the top of module trends towards the hottest, and shown design keeps this system relatively compacter thus, and relatively more efficient when making heat energy derive this system from module.A benefit of Figure 11-shown design of Figure 15 B is that its compact conformation also is conducive to increase the quantity that can be positioned at the connector in particular space thus.Certainly, this additional compactedness has reduced the surface area of selectable fin, thereby has limited heat-sinking capability.Expectedly, may more expect to remove the fin on main wall and replace fin on upper side wall with the liquid cooling chamber for some design.Therefore, shown connector system is not limited to work together with a specific cooling system.
Disclosure provided herein has been described a plurality of features of preferred embodiment and illustrative examples.Those skilled in the art will recognize that and also have many other embodiment, change and modification in claims and scope of the disclosure and spirit.
Claims (12)
1. a connector, is characterized in that, comprising:
One cover body, described cover body define one first port and one second port;
One housing, described housing is arranged in described cover body, and described housing comprises one first draw-in groove that is arranged in described the first port and one second draw-in groove that is arranged in described the second port;
One heat transfer plate, described heat transfer plate have along described the first port and vertical Yi Zhubi, a first side wall and one second sidewall that extends of the second port;
One first jerk finger shaped part support plate, described the first jerk finger shaped part support plate is installed on described the first side wall and is supported with a plurality of jerk finger shaped parts, and a plurality of jerk finger shaped parts on described the first jerk finger shaped part support plate are set to engage a module that is inserted in described the first port; And
One second jerk finger shaped part support plate, described the second jerk finger shaped part support plate is installed on described the second sidewall and is supported with a plurality of jerk finger shaped parts, and a plurality of jerk finger shaped parts on described the second jerk finger shaped part support plate are set to engage a module that is inserted in described the second port.
2. connector as claimed in claim 1, is characterized in that, described main wall is supported with a plurality of fins.
3. connector as claimed in claim 2, is characterized in that, described fin and described main wall are an integral body.
4. connector as claimed in claim 2, is characterized in that, described the first side wall supports additional a plurality of fins.
5. connector as claimed in claim 4, is characterized in that, described additional a plurality of fins and described the first side wall are an integral body.
6. connector as claimed in claim 1, is characterized in that, described the first side wall and the second sidewall lay respectively at the same side of port separately.
7. connector as claimed in claim 1, is characterized in that, described a plurality of jerk finger shaped parts are arranged as a plurality of row.
8. connector as claimed in claim 1, is characterized in that, wherein at least one jerk finger shaped part support plate is soldered to described sidewall.
9. connector as claimed in claim 1, is characterized in that, described the first jerk finger shaped part support plate comprises that a vertical wall and keeps pin.
10. connector as claimed in claim 9, is characterized in that, described the first jerk finger shaped part support plate also comprises a retaining member of a wall that is set to engage described cover body.
11. connector as claimed in claim 1 is characterized in that, one of them of described main wall and described the first side wall is supported with a heat dissipation element.
12. connector as claimed in claim 1 is characterized in that, described main wall and described the first side wall respectively are supported with a heat dissipation element.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261640786P | 2012-05-01 | 2012-05-01 | |
| US61/640,786 | 2012-05-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202949055U true CN202949055U (en) | 2013-05-22 |
Family
ID=48424739
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220640847 Withdrawn - After Issue CN202949055U (en) | 2012-05-01 | 2012-11-28 | Connector |
| CN201210496765.XA Active CN103384037B (en) | 2012-05-01 | 2012-11-28 | Adapter |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210496765.XA Active CN103384037B (en) | 2012-05-01 | 2012-11-28 | Adapter |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN202949055U (en) |
| TW (2) | TWI549381B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103384037A (en) * | 2012-05-01 | 2013-11-06 | 莫列斯公司 | Connector |
| CN107482333A (en) * | 2017-07-13 | 2017-12-15 | 广东欧珀移动通信有限公司 | Connector, connector assembly, power supply module and terminal device |
| CN107634399A (en) * | 2016-07-18 | 2018-01-26 | 泰连公司 | Jack assemblies for pluggable module and the communication system with the jack assemblies |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM461182U (en) | 2011-11-08 | 2013-09-01 | Molex Inc | Connector and connector system |
| CN104981131B (en) * | 2014-04-09 | 2017-08-08 | 至良科技股份有限公司 | Plug-in module |
| CN108306143B (en) * | 2017-02-16 | 2020-04-24 | 番禺得意精密电子工业有限公司 | Electrical connector |
| US10575442B2 (en) | 2018-07-06 | 2020-02-25 | Te Connectivity Corporation | Heat sink assembly for an electrical connector |
| TWI707227B (en) * | 2018-08-21 | 2020-10-11 | 大陸商泰科電子（上海）有限公司 | Connector |
| US10547133B1 (en) | 2018-12-17 | 2020-01-28 | Te Connectivity Corporation | Vertical communication system |
| US11653474B2 (en) | 2019-11-20 | 2023-05-16 | Molex, Llc | Connector assembly |
| TWI733445B (en) * | 2019-12-05 | 2021-07-11 | 台灣莫仕股份有限公司 | Connector assembly |
| TWI730817B (en) * | 2020-06-18 | 2021-06-11 | 台灣莫仕股份有限公司 | Connector assembly |
| CN113937540A (en) * | 2020-07-14 | 2022-01-14 | 莫列斯有限公司 | Connector assembly |
| TWI733519B (en) * | 2020-07-14 | 2021-07-11 | 台灣莫仕股份有限公司 | Connector assembly |
| TW202404196A (en) * | 2021-01-14 | 2024-01-16 | 美商莫仕有限公司 | Cage assemblies for high-speed data connectors |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003220046A1 (en) * | 2002-03-06 | 2003-09-22 | Tyco Electronics Corporation | Transceiver module assembly ejector mechanism |
| DE202004001202U1 (en) * | 2004-01-28 | 2005-06-09 | Molex Incorporated, Lisle | Modular socket connector system |
| US7764504B2 (en) * | 2007-05-16 | 2010-07-27 | Tyco Electronics Corporation | Heat transfer system for a receptacle assembly |
| JP4962871B2 (en) * | 2008-07-01 | 2012-06-27 | 山一電機株式会社 | Card connector |
| CN201838836U (en) * | 2008-09-09 | 2011-05-18 | 莫列斯公司 | Connector component |
| CN202949055U (en) * | 2012-05-01 | 2013-05-22 | 莫列斯公司 | Connector |
-
2012
- 2012-11-28 CN CN 201220640847 patent/CN202949055U/en not_active Withdrawn - After Issue
- 2012-11-28 CN CN201210496765.XA patent/CN103384037B/en active Active
- 2012-12-17 TW TW101147795A patent/TWI549381B/en active
- 2012-12-17 TW TW101224401U patent/TWM458683U/en unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103384037A (en) * | 2012-05-01 | 2013-11-06 | 莫列斯公司 | Connector |
| CN103384037B (en) * | 2012-05-01 | 2016-07-06 | 莫列斯有限公司 | Adapter |
| CN107634399A (en) * | 2016-07-18 | 2018-01-26 | 泰连公司 | Jack assemblies for pluggable module and the communication system with the jack assemblies |
| CN107482333A (en) * | 2017-07-13 | 2017-12-15 | 广东欧珀移动通信有限公司 | Connector, connector assembly, power supply module and terminal device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI549381B (en) | 2016-09-11 |
| CN103384037A (en) | 2013-11-06 |
| TW201347316A (en) | 2013-11-16 |
| CN103384037B (en) | 2016-07-06 |
| TWM458683U (en) | 2013-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202949055U (en) | Connector | |
| CN202949071U (en) | Connector | |
| TWI568083B (en) | Connector | |
| US9391407B1 (en) | Electrical connector assembly having stepped surface | |
| CN107454794B (en) | Heat spreader for a caged electrical connector assembly | |
| US9668378B2 (en) | Receptacle assembly with heat extraction from a pluggable module | |
| CN104409913B (en) | For receiving the jack assemblies of pluggable module | |
| EP3079208A1 (en) | Receptacle assembly for a communication system | |
| US9673570B2 (en) | Stacked cage having different size ports | |
| CN104470321B (en) | Connector and connector combination for plug | |
| CN106981781B (en) | Electric cage member with support structure | |
| CN107196089B (en) | Connector module assembly with gasket plate | |
| JP2017152400A (en) | Method for cooling module | |
| TW201721990A (en) | Connector system with thermal management | |
| CN107039855A (en) | Cage electric coupler component with indicator lamp | |
| CN104536103A (en) | Opto-electronic device assembly | |
| CN112243335A (en) | Dual heat transfer assembly for a receptacle assembly | |
| CN217983884U (en) | Socket connector | |
| CN214315298U (en) | Switch and mining data transmission system | |
| CN109672050B (en) | Electrical connector assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Illinois Patentee after: MOLEX INC Address before: Illinois Patentee before: Molex Incorporated |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20130522 Effective date of abandoning: 20160706 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |