CN202769337U - Semiconductor light source module - Google Patents
Semiconductor light source module Download PDFInfo
- Publication number
- CN202769337U CN202769337U CN2012203539797U CN201220353979U CN202769337U CN 202769337 U CN202769337 U CN 202769337U CN 2012203539797 U CN2012203539797 U CN 2012203539797U CN 201220353979 U CN201220353979 U CN 201220353979U CN 202769337 U CN202769337 U CN 202769337U
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- semiconductor light
- light sources
- reflection cavity
- sleeve pipe
- housing
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to a semiconductor light source module. The semiconductor light source module comprises a shell body, a light-permeable piece fixed at a light-emitting end of the shell body, an illumination device arranged inside the shell body, a drive electronic device, an insulation piece and a heat sink, wherein a funnel-shaped reflection cavity which is roughly in a circular truncated cone shape is arranged inside the shell body, the position of a larger opening of the reflection cavity is close to the light-emitting end of the shell body, a plurality of guide pillars are arranged in the position of a smaller opening of the reflection cavity, and holes or notches which are matched with the guide pillars are formed in the illumination device, the drive electronic device and the insulation piece. One ends of the guide pillars are arranged on the inner wall of the reflection cavity, and the other ends of the guide pillars are connected with the heat sink. The semiconductor light source module can be matched with an existing lamp, is compact and firm in structure, and capable of enlarging the design space of the matched lamp. The semiconductor light source module can be wholly detached from the lamp for replacement when damaged, and therefore the installation time and the labor cost are saved.
Description
Technical field
The utility model relates to the modularity lighting device, relates in particular to a kind of semiconductor light sources module.
Background technology
Along with the development of semiconductor light sources (LED) technology, the product that adopts at present semiconductor light sources just progressively substitutes conventional light source and is widely used in all kinds of lighting fields.Current semiconductor light sources is just towards the future development of modularity, miniaturization, so each manufacturer has released different semiconductor light sources module products one after another.Because the effects limit such as technical characteristic of semiconductor light sources self, the semiconductor light sources module must comprise the elements such as heat conduction, heat abstractor and driving power (external or built-in) usually, how these necessary elements are optimized improvement, add simultaneously the illuminating effect that improves light fixture such as other components and parts such as reflector, Optical devices, the final independent light source module form that realizes miniaturization is the target of present semiconductor light sources module product scope development.
Summary of the invention
The purpose of this utility model be to provide a kind of can adaptive existing light fixture, the semiconductor light sources module of compact conformation.
A kind of semiconductor light sources module comprises housing, is fixed on the transmission element of housing bright dipping end and is arranged on housing interior light-emitting device, drive electronics, insulating part and heat sink.Establish the funnel shaped reflection cavity that substantially is round table-like in the described housing, the larger opening part of described reflection cavity is near the bright dipping end of housing, and its less opening part is provided with many guide pillars.Be formed with hole or breach with described guide pillar coupling on described light-emitting device, drive electronics and the insulating part.One end of described guide pillar is located at the inwall of reflection cavity, and the other end links to each other with heat sink.
In a preferred embodiment, described semiconductor light sources module also comprises an infundibulate reflecting element, and described reflecting element covers the inwall of described reflection cavity and the end that guide pillar links to each other with the reflection cavity inwall.
In a preferred embodiment, described insulating part comprises that insulating trip, insulation board reach the sleeve pipe from the insulation board umbo, and the profile of described insulating trip and the profile of light-emitting device are similar but slightly large; Described sleeve pipe contacts with guide pillar.
In a preferred embodiment, described drive electronics comprises that be used to the drive circuit that drives described semiconductor light sources the middle part of described drive electronics is formed with the hole that can supply described sleeve pipe to pass, and described insulating trip is arranged between light-emitting device and the sleeve pipe.
In a preferred embodiment, describedly heat sinkly comprise heat conductive pad and from the heating column of heat conductive pad umbo, described heating column insert described sleeve pipe and with insulating trip and sleeve pipe close contact.
In a preferred embodiment, described heating column is the column of hollow substantially.
In a preferred embodiment, described heating column inside is filled with highly heat-conductive material.
In a preferred embodiment, described reflecting element can be a kind of in following: be coated with diffuse-reflective material on the inwall of (1) reflecting element; (2) reflecting element is made by the total diffuse reflection polymer composite.
The utility model also provides a kind of semiconductor light sources module, comprises housing, is fixed on the transmission element of housing bright dipping end and is arranged on housing interior light-emitting device, drive electronics, insulating part and heat sink.Establish the funnel shaped reflection cavity that substantially is round table-like in the described housing.The larger opening part of described reflection cavity is near the bright dipping end of housing, and described light-emitting device is fixed on the smaller opening place of reflection cavity, and the outer wall of reflection cavity is provided with many guide pillars.Be formed with the hole or the breach that mate with described guide pillar on described insulation board, drive electronics and the heat conductive pad, an end of described guide pillar is located at the outer wall of reflection cavity, and the other end links to each other with heat sink.
In a preferred embodiment, described insulating part comprises that insulating trip, insulation board reach the sleeve pipe from the insulation board umbo, and the profile of described insulating trip and the profile of light-emitting device are similar but slightly large; Described sleeve pipe contacts with guide pillar; Described drive electronics comprises that be used to the drive circuit that drives described semiconductor light sources the middle part of described drive electronics is formed with the hole that can supply described sleeve pipe to pass, and described insulating trip is arranged between light-emitting device and the sleeve pipe; Describedly heat sinkly comprise heat conductive pad and from the heating column of heat conductive pad umbo, described heating column insert described sleeve pipe and with insulating trip and sleeve pipe close contact.
Semiconductor light sources module of the present utility model can adaptive existing light fixture, its guide pillar links to each other with the reflection cavity inwall, thereby has shortened semiconductor light sources module length, compact conformation, firm, can increase the design space of adaptive light fixture, and when damaging, need not to consider the internal damage reason, directly integral body is removed to change from light fixture and is got final product, need not whole lamp depot repair, save set-up time and human cost, compact structure is more conducive to Product transport simultaneously, reduces cost of transportation.In addition, many guide pillars are arranged near light source die group switching centre position, have increased the support force between heat sink and shell, make reflection cavity more firm with heat sink space, are difficult for because causing the damage of light source module from excessive the subsiding of the pressure in the heat sink outside.
Description of drawings
Fig. 1 is the explosive view of the semiconductor light sources module of an embodiment.
Fig. 2 is the part of the semiconductor light sources module of Fig. 1 figure that decides what is right and what is wrong.
Fig. 3 is the stereogram of Fig. 1 middle shell.
Fig. 4 is the stereogram at another visual angle of Fig. 1 middle shell.
Fig. 5 is the explosive view of the semiconductor light sources module of another embodiment.
The specific embodiment
Below in conjunction with specific embodiment and accompanying drawing the utility model semiconductor light sources module is described in further detail.
As shown in Figure 1, in one preferred embodiment, semiconductor light sources module of the present utility model mainly comprises housing 1, is fixed on the transmission element 6 of housing 1 bright dipping end, is used for that transmission element 6 is fixed on the pressure ring 7 on the housing 1 and is successively set on reflecting element 8, light-emitting device 2, drive electronics 3, insulating part 5 and heat sink 4 in the housing 1.Wherein, housing 1 is the tubular type of both-side opening substantially, and remaining part is arranged in the housing or is fixed on shell end, forms thus one by the arbitrary source body of housing 1 packing, gets final product bright dipping by the civil power access.
Establish the funnel shaped reflection cavity 11 that substantially is round table-like in the housing 1.Reflection cavity 11 is one-body molded with housing 1 outer wall, can form by plastotype, has reduced the cost of actual production, has improved the efficient of assembling, has strengthened the stress when housing can carry each module element combination.The larger opening part of reflection cavity 11 is near the bright dipping end of housing 1, and its less opening part is provided with many guide pillar 12(and sees Fig. 3 and Fig. 4, is provided with three guide pillars in the present embodiment).Preferably, guide pillar 12 is fixed on the smaller opening place of reflection cavity 12 equably.Be formed with hole or breach with guide pillar 12 coupling on light-emitting device 2, drive electronics 3 and the insulating part 5, guide pillar 12 passes these holes or breach and links to each other with heat sink 4 or contact.Guide pillar 12 ends can be formed with screw, be formed with the fixing hole corresponding with guide pillar 12 on heat sink 4, can be fixed up with guide pillar 12 heat sink 4 by screw, thereby light-emitting device 2, drive electronics 3 and insulating part 5 are fixed in reflection cavity 11, housing 1 and heat sink 4 spaces that surround.
Reflecting element 8 is round table-like infundibulate substantially, the size of its size and reflection cavity 11 is mated, and just covers inwall and the fixed station 121 of reflection cavity 11, forms the opening of a circle at the smaller opening place near reflection cavity 11, light source on the light-emitting device 2 is exposed, as shown in Figure 2.Reflecting element 8 can be made by diffuse-reflective material, as: the total diffuse reflection material polymer composite of Whiteoptics company is attached at reflection cavity 11 sidewalls.Perhaps, be coated with diffuse-reflective material on the inwall of reflecting element 8, to reach diffuse effect, enlarge the bright dipping radius of light-emitting device 2, strengthen the light efficiency of semiconductor light sources module.
Transmission element 6 is round, and is adaptive with the bright dipping end (opening) of housing 1, and its material can be selected diffusion barrier or the reflectance coating made such as the transparent material of processing through atomizing, the PC material that adds diffusion particle, by materials such as PET according to the different optical application demand.
Light-emitting device 2 comprises substrate and is fixed on semiconductor light sources on the substrate.Semiconductor light sources is relative with the smaller opening place of reflection cavity 11.Be formed with hole or the breach that can supply guide pillar 12 to pass on the substrate.Substrate is substantially rounded in the present embodiment, and its size is large than the smaller opening of reflection cavity 11, and its edge is formed with a plurality of breach 21 that supply guide pillar 12 to pass symmetrically.
Drive electronics 3 comprises the ringwise substrate of cardinal principle and is arranged on drive circuit on the substrate, that be used for driving semiconductor light sources.The circular open of substrate center is formed with a plurality of locating holes with guide pillar 12 couplings less than the circle of guide pillar 12 definition on the substrate.
Insulating part 5 comprises that insulating trip 51, insulation board 52 reach from the sleeve pipe 53 of the both ends open of insulation board 52 umbos.The profile of the profile of insulating trip 51 and light-emitting device 2 is similar but slightly large, also is formed with a plurality of holes or the breach that mate with guide pillar 12 on it, and it is arranged between light-emitting device 2 and the sleeve pipe 53.Sleeve pipe 53 can insert the opening at the basic center of drive electronics 3, and with guide pillar 12 close contacts, thereby light-emitting device 2, insulating trip 51 and drive electronics 3 are compressed and are fixed between reflection cavity 11 and the insulation board 52.Sleeve pipe 53 also for guide pillar 12 provides the cross-brace protection, prevents that guide pillar 12 from fractureing when providing circumferential location for insulation board 52.Insulating part 5 integral body are made by insulating heat-conduction material, and for example makrolon material or hot slit cushion material are made.
Heat sink 4 are made by highly heat-conductive material, and it comprises heat conductive pad 41 and from the heating column 42 of heat conductive pad 41 umbos.Also be formed with a plurality of fixing holes with guide pillar 12 coupling on the heat conductive pad 41, heat conductive pad 41 surfaces be insulated that plate 52 covers and with insulation board 52 close contacts.Heating column 42 can insert sleeve pipe 53 and with the sidewall close contact of insulating trip 51 and sleeve pipe 53, derive heat with this and think that the heat abstractor transferring heat on the adaptive light fixture makes necessary preparation to the heat conductive pad 41.In the present embodiment, heating column 42 is the cylindrical of hollow substantially, and its inside is filled with highly heat-conductive material, improves heat sink 4 heat conduction and radiating efficiency.
Light-emitting device 2 by heating column 42 top support insulating trips 51 and top thereof, drive electronics 3 is then by its set hole, middle part, pass the sleeve pipe 53 of insulating part 5, and place insulating part 5 to be covered on the part on the heat conductive pad 41, satisfy to prevent from leaking electricity and withstand voltage demand for security, carry out the light source module that screw cooperates to form an integral body by each guide pillar 12 with each corresponding fixing hole of heat sink 4 at last.
Among other embodiment, the back side of heat sink 4 heat conductive pad 41 (one side of heating column is not set) is formed with radiating fin.Heating column 42 also can be solid.
Among other embodiment, as shown in Figure 5, guide pillar 12 can be arranged on the outer wall of reflection cavity 11, corresponding, be formed with at least the fixing hole with this guide pillar coupling on drive electronics 3, the heat conductive pad 5 and heat sink 4.And light-emitting device 2 is fixed on the smaller opening place of reflection cavity 11, and insulation board 51 is crushed between light-emitting device 2 and the heat sink heating column 42.
Although description of the present utility model is carried out in conjunction with above specific embodiment,, those skilled in the art that can carry out many replacements, modifications and variations, be apparent according to above-mentioned content.Therefore, all are such substitute, improve and change all is included in the spirit and scope of attached claim.
Claims (10)
1. semiconductor light sources module, comprise housing, be fixed on the transmission element of housing bright dipping end and be arranged on the interior light-emitting device of housing, drive electronics, insulating part and heat sink, it is characterized in that, establish the funnel shaped reflection cavity that substantially is round table-like in the described housing, the larger opening part of described reflection cavity is near the bright dipping end of housing, its less opening part is provided with many guide pillars, described light-emitting device, be formed with hole or breach with described guide pillar coupling on drive electronics and the insulating part, one end of described guide pillar is located at the inwall of reflection cavity, and the other end links to each other with heat sink.
2. semiconductor light sources module according to claim 1 is characterized in that, described semiconductor light sources module also comprises an infundibulate reflecting element, and described reflecting element covers the inwall of described reflection cavity and the end that guide pillar links to each other with the reflection cavity inwall.
3. semiconductor light sources module according to claim 1 is characterized in that, described insulating part comprises that insulating trip, insulation board reach the sleeve pipe from the insulation board umbo, and described insulating trip is a bit larger tham light-emitting device; Described sleeve pipe contacts with guide pillar.
4. semiconductor light sources module according to claim 3, it is characterized in that, described drive electronics comprises be used to the drive circuit that drives described semiconductor light sources, the middle part of described drive electronics is formed with the hole that can supply described sleeve pipe to pass, and described insulating trip is arranged between light-emitting device and the sleeve pipe.
5. semiconductor light sources module according to claim 4 is characterized in that, describedly heat sinkly comprises heat conductive pad and from the heating column of heat conductive pad umbo, described heating column insert described sleeve pipe and with insulating trip and sleeve pipe close contact.
6. semiconductor light sources module according to claim 5 is characterized in that, described heating column is the column of hollow substantially.
7. semiconductor light sources module according to claim 6 is characterized in that, described heating column inside is filled with highly heat-conductive material.
8. semiconductor light sources module according to claim 1 is characterized in that, described reflecting element is a kind of in following: be coated with diffuse-reflective material on the inwall of reflecting element; Reflecting element is made by the total diffuse reflection polymer composite.
9. semiconductor light sources module, comprise housing, be fixed on the transmission element of housing bright dipping end and be arranged on housing interior light-emitting device, drive electronics, insulating part and heat sink, it is characterized in that, establish the funnel shaped reflection cavity that substantially is round table-like in the described housing; The larger opening part of described reflection cavity is near the bright dipping end of housing, described light-emitting device is fixed on the smaller opening place of reflection cavity, the outer wall of reflection cavity is provided with many guide pillars, be formed with hole or breach with described guide pillar coupling on described insulation board, drive electronics and the heat conductive pad, one end of described guide pillar links to each other with the outer wall of reflection cavity, and the other end links to each other with heat sink.
10. semiconductor light sources module according to claim 9 is characterized in that, described insulating part comprises that insulating trip, insulation board reach the sleeve pipe from the insulation board umbo, and described insulating trip is a bit larger tham light-emitting device; Described sleeve pipe contacts with guide pillar; Described drive electronics comprises that be used to the drive circuit that drives described semiconductor light sources the middle part of described drive electronics is formed with the hole that can supply described sleeve pipe to pass, and described insulating trip is arranged between light-emitting device and the sleeve pipe; Describedly heat sinkly comprise heat conductive pad and from the heating column of heat conductive pad umbo, described heating column insert described sleeve pipe and with insulating trip and sleeve pipe close contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203539797U CN202769337U (en) | 2012-07-20 | 2012-07-20 | Semiconductor light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203539797U CN202769337U (en) | 2012-07-20 | 2012-07-20 | Semiconductor light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202769337U true CN202769337U (en) | 2013-03-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012203539797U Expired - Fee Related CN202769337U (en) | 2012-07-20 | 2012-07-20 | Semiconductor light source module |
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| Country | Link |
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| CN (1) | CN202769337U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103090220A (en) * | 2012-07-20 | 2013-05-08 | 重庆雷士实业有限公司 | Semiconductor light source module |
-
2012
- 2012-07-20 CN CN2012203539797U patent/CN202769337U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103090220A (en) * | 2012-07-20 | 2013-05-08 | 重庆雷士实业有限公司 | Semiconductor light source module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: NVC (CHINA) CO., LTD. Free format text: FORMER NAME: CHONGQING NVC INDUSTRIES CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Nanbin road 400060 Chongqing Nan'an District No. 76 (Chongqing international financial center) 22 floor Patentee after: NVC (China) Co., Ltd. Patentee after: Huizhou Leishi Optoelectronic Technology Co., Ltd. Address before: Nanbin road 400060 Chongqing Nan'an District No. 76 (Chongqing international financial center) 22 floor Patentee before: Chongqing NVC Industries Co., Ltd. Patentee before: Huizhou Leishi Optoelectronic Technology Co., Ltd. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20170207 Address after: 516001 Guangdong city of Huizhou province Ru Town East Village Bridge (NVC Industrial Park) Patentee after: Huizhou Leishi Optoelectronic Technology Co., Ltd. Address before: Nanbin road 400060 Chongqing Nan'an District No. 76 (Chongqing international financial center) 22 floor Patentee before: NVC (China) Co., Ltd. Patentee before: Huizhou Leishi Optoelectronic Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130306 Termination date: 20210720 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |