CN202472486U - Combined mainboard for extending multibus through DDR3 slot - Google Patents

Combined mainboard for extending multibus through DDR3 slot Download PDF

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Publication number
CN202472486U
CN202472486U CN2011205703255U CN201120570325U CN202472486U CN 202472486 U CN202472486 U CN 202472486U CN 2011205703255 U CN2011205703255 U CN 2011205703255U CN 201120570325 U CN201120570325 U CN 201120570325U CN 202472486 U CN202472486 U CN 202472486U
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CN
China
Prior art keywords
interface
mainboard
ddr3
multibus
cpu motherboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011205703255U
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Chinese (zh)
Inventor
李辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN SEAVO TECHNOLOGY Co Ltd
Original Assignee
SHENZHEN SEAVO TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Priority to CN2011205703255U priority Critical patent/CN202472486U/en
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Publication of CN202472486U publication Critical patent/CN202472486U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a combined mainboard for extending multibus through a DDR3 SO-DIMM (Small Outline Dual In-line Memory Module) slot. The combined mainboard comprises a CPU motherboard capable of realizing the basic function of a mainboard, and an extending baseboard connected with the CPU motherboard in a dismountable matching mode, wherein the CPU motherboard is connected with the extending baseboard through a standard DDR3 SO-DIMM interface. The combined mainboard which adopts the combination of the CPU motherboard and the extending baseboard can meet the requirements of different industrial users at the same time, so that the development cost can be reduced greatly without lowering the product quality, and the contradiction that industrial users have special requirements and make a little order while the enterprises have high development operating cost can be effectively solved. At the same time, the combined mainboard with a common DDR3 SO-DIMM slot structure has greatly reduces production cost.

Description

A kind of combination mainboard that utilizes DDR3 slot expansion multibus
Technical field
the utility model relates to the mainboard product scope, is specifically related to a kind of mainboard that utilizes DDR3 SO-DIMM slot expansion multibus that has.
Background technology
are different with universal host machine plate market; The industry mainboard is numerous because of relating to the field, and the client disperses, and each field requires to be not quite similar to main board function; And single client's demand is less, and specification and interface that can not each field is required all be made on a plank.If independently open the case customization, then can face the R&D costs height, problems such as cycle length.
The scheme of the existing CPU board+base plate of current industry through customizable diversity base plate, solves the contradiction of product demand variation and enterprise production, research and development, inventory cost;
are like Chinese invention patent notification number CN101872213A; Denomination of invention is: a kind of combined type server master board method for designing based on the QPI link architecture; Disclosing a kind of mainboard of CPU board+base arrangement, is that the QPI link architecture is incorporated in the server master board design, and server master board is adopted modular division; The mainboard of server is divided into CPU board and IO base plate; Realizing linking through the QPI high-speed bus between the processor, between processor and the north bridge, wherein: CPU board comprises memory bank or the interface of memory board submodule is provided, and becomes the calculating sub module assembly; The IO base plate is the important FW firmware of data channel, power distribution and plate loading system of link CPU and external unit.
In the mainboard that the CPU board of but said structure+base plate constitutes, the specialized high-speed signaling interface price that connects CPU board and base plate is costliness very, even reaches hundreds of units, can bring great lifting to cost of products.
Summary of the invention
For overcoming above-mentioned defective, the purpose of the utility model promptly is to provide a kind of combination mainboard that adopts low cost to utilize the CPU board+base arrangement of DDR3 SO-DIMM slot expansion multibus .
The purpose of the utility model realizes through following technical scheme: the combination mainboard of a kind of DDR3 of utilization slot expansion of the utility model multibus; Comprise: the CPU motherboard that can realize the function of x86 platform motherboard; The telescopic backboard that detachably is connected with this CPU motherboard; Wherein, be connected through standard DDR3 SO-DIMM slot interface between said CPU motherboard and the telescopic backboard.
are further, and described CPU motherboard comprises and constitutes the host computer system assembly: CPU, chipset, internal memory, I/O chip.
are further, and said standard DDR3 SO-DIMM slot interface is drawn demonstration, SATA, PCI-E, USB, LPC interface signal.
are further, and said telescopic backboard has: USB expansion interface, SATA interface, LVDS interface, PCI-E interface, com interface, LPT interface.
the utility model utilizes the combination mainboard of DDR3 slot expansion multibus; Comprise: the CPU motherboard that can realize the function of mainboard; The telescopic backboard that detachably is connected with this CPU motherboard; Wherein, be connected through standard DDR3 SO-DIMM interface between said CPU motherboard and the telescopic backboard; The form of employing " a CPU board+telescopic backboard " just can satisfy different industries user's requirement simultaneously; Under the situation that does not reduce product quality; Greatly reduce cost of development, effectively solved the industry customer require special, order volume is little and the high contradiction of enterprise research and development operation cost; Simultaneously, the utility model has adopted common DDR3 SO-DIMM inserting slot construction, and its cost reduces greatly.
Description of drawings
In order to be easy to explanation, the utility model is done to describe in detail by following preferred embodiment and accompanying drawing .
Fig. 1 overlooks direction structure figure for the CPU motherboard;
Fig. 2 for Fig. 1 in the corresponding telescopic backboard of motherboard overlook direction structure figure.
Embodiment
, are further elaborated to the utility model below in conjunction with accompanying drawing and embodiment for purpose, technical scheme and the advantage that makes the utility model is clearer.
should be appreciated that specific embodiment described herein only in order to explanation the utility model, and are not used in qualification the utility model.
See also Fig. 1 to Fig. 2, a kind of combination mainboard that utilizes DDR3 slot expansion multibus of the utility model comprises:
The CPU motherboard 1 of the function of mainboard can be realized in , and the telescopic backboard 2 that detachably is connected with this CPU motherboard 1 wherein, is connected through standard DDR3 SO-DIMM slot interface between said CPU motherboard 1 and the telescopic backboard 2.
described CPU motherboard 1 comprises formation host computer system assembly: CPU, chipset, internal memory, I/O chip.
said standard DDR3 SO-DIMM slot interface is drawn demonstration (VGA, HDMI, LVDS, DDI), SATA, PCI-E, USB, LPC interface signal.
said telescopic backboard 2 has: USB expansion interface, SATA interface, LVDS interface, PCI-E interface, com interface, LPT or the like interface.
telescopic backboard 2 can provide multifarious interface; Like USB expansion interface, SATA interface, LVDS interface, PCI-E interface, com interface, LPT interface etc.; The user can customize according to oneself requirement, has satisfied the demand of user to special function interface.
The research and development of CPU motherboard can be absorbed in mainboard manufacturer like this, and several kinds of standard C PU motherboards, telescopic backboard are provided, and for customer selecting, combination, realize required function.For the relatively low base plate of development difficulty, the client also can design voluntarily, on the basis of CPU motherboard, carries out secondary development.
adopt the form of " a CPU board+telescopic backboard " just can satisfy different industries user's requirement simultaneously; Under the situation that does not reduce product quality; Greatly reduce cost of development, effectively solved the industry customer require special, order volume is little and the high contradiction of enterprise research and development operation cost; Simultaneously, the utility model has adopted common DDR3 SO-DIMM inserting slot construction, and its cost reduces greatly; Another benefit of this separate type design is, when the client upgrades to product performance demands, can only change the CPU board of high standard more and do not change base plate, reduced the cost that upgrades so to greatest extent.
the above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection domain of the utility model.

Claims (2)

1. combination mainboard that utilizes DDR3 slot expansion multibus; Comprise: the CPU motherboard that can realize x86 platform motherboard function; The telescopic backboard that detachably is connected with this CPU motherboard; It is characterized in that, be connected through standard DDR3 SO-DIMM slot interface between said CPU motherboard and the telescopic backboard.
2. the combination mainboard that utilizes DDR3 slot expansion multibus according to claim 1 is characterized in that, described CPU motherboard comprises and constitutes the host computer system assembly: CPU, chipset, internal memory, I/O chip.
3. the combination mainboard that utilizes DDR3 slot expansion multibus according to claim 2 is characterized in that said standard DDR3 SO-DIMM slot interface is drawn demonstration, SATA, PCI-E, USB, LPC interface signal.
4. the combination mainboard that utilizes DDR3 slot expansion multibus according to claim 3 is characterized in that said shows signal comprises: VGA, HDMI, LVDS, DDI signal.
5. the combination mainboard that utilizes DDR3 slot expansion multibus according to claim 4 is characterized in that said telescopic backboard has: USB expansion interface, SATA interface, LVDS interface, PCI-E interface, com interface, LPT interface.
CN2011205703255U 2011-12-31 2011-12-31 Combined mainboard for extending multibus through DDR3 slot Expired - Fee Related CN202472486U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011205703255U CN202472486U (en) 2011-12-31 2011-12-31 Combined mainboard for extending multibus through DDR3 slot

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011205703255U CN202472486U (en) 2011-12-31 2011-12-31 Combined mainboard for extending multibus through DDR3 slot

Publications (1)

Publication Number Publication Date
CN202472486U true CN202472486U (en) 2012-10-03

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CN2011205703255U Expired - Fee Related CN202472486U (en) 2011-12-31 2011-12-31 Combined mainboard for extending multibus through DDR3 slot

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103164385A (en) * 2013-04-10 2013-06-19 北京盛博协同科技有限责任公司 Small-sized and multifunctional MINI CPU module specification
CN106484655A (en) * 2016-10-21 2017-03-08 合肥哦走信息技术有限公司 A kind of navigation scheduling system based on ARM kernel embedded computer software and hardware
CN107861901A (en) * 2017-10-26 2018-03-30 郑州云海信息技术有限公司 A kind of storage method and system based on NVDIMM F
CN110471874A (en) * 2019-08-21 2019-11-19 山东浪潮人工智能研究院有限公司 A method of extension PCIe card application

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103164385A (en) * 2013-04-10 2013-06-19 北京盛博协同科技有限责任公司 Small-sized and multifunctional MINI CPU module specification
CN106484655A (en) * 2016-10-21 2017-03-08 合肥哦走信息技术有限公司 A kind of navigation scheduling system based on ARM kernel embedded computer software and hardware
CN107861901A (en) * 2017-10-26 2018-03-30 郑州云海信息技术有限公司 A kind of storage method and system based on NVDIMM F
CN110471874A (en) * 2019-08-21 2019-11-19 山东浪潮人工智能研究院有限公司 A method of extension PCIe card application

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121003

Termination date: 20141231

EXPY Termination of patent right or utility model