CN202282342U

CN202282342U - Heat dissipation device

Info

Publication number: CN202282342U
Application number: CN201120319360XU
Authority: CN
Inventors: 杨修维
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2011-08-29
Filing date: 2011-08-29
Publication date: 2012-06-20
Anticipated expiration: 2021-08-29

Abstract

A heat dissipation device comprises a heat dissipation element; wherein the heat dissipation element is provided with a heat-conducting part, and the other end of the heat dissipation element, which is opposite to the heat-conducting part, is provided with a heat dissipation part; the heat-conducting part is connected with a ceramic body; and the heat dissipation device and the ceramic body are directly combined through a welding way or a DBC (Direct Bonding Copper) way, in order to improve the problem of crack of combined boundary between the heat dissipation device and a heat source caused by thermal fatigue.

Description

Heat abstractor

Technical field

A kind of heat abstractor refers to a kind ofly directly with the combination of elements of heat dissipation element and ceramic material especially, uses to improve between heat abstractor and pyrotoxin producing the heat abstractor that engages boundary's splintering problem because of thermal fatigue (thermal fatigue).

Background technology

Press, along with the progress of semiconductor technology, the volume of IC also dwindles gradually; And in order to make IC can handle more data, the IC under the equal volume can hold than Duo the computing element more than the several times in the past; When the computing element quantity in the IC was more and more, the heat energy that is produced during computing element work was also increasing, is example with common central processing unit; When the fully loaded workload of height, the temperature that central processing unit gives out is enough to make that central processing unit is whole burns; Therefore, the heat abstractor of IC becomes and is important problem.

Central Processing Unit and wafer system is the pyrotoxin in the electronic equipment among in the electronic equipment; When electronic equipment operates; Then pyrotoxin will produce heat, this CPU and wafer outer enclosure mainly be with ceramic material as encapsulating material, this ceramic material has character such as thermal coefficient of expansion is low and non-conductive; And this thermal coefficient of expansion system is close with wafer, so be used in encapsulating material and semi-conducting material in a large number.

Heat abstractor generally adopts aluminium, copper material to do the material of radiator structure; And heat dissipation elements such as collocation fan and heat pipe strengthen radiating effect; But when considering heat abstractor integral body reliability, the design of employing cooling fan and heat pipe all can undermine the reliability value of integral product.

Generally speaking design heal simple heat abstractor integral body reliability better, therefore, as if can directly improving the transmission of heat energy with doing the radiator structure material than copper heat-sinking capability better material.

In addition, " thermal stress " is another reliability potential problems between heat abstractor and pyrotoxin.The thermal coefficient of expansion of pyrotoxin (like the wafer in the CPU) is low, and industry adopts AlN (aluminium nitride) or the SiC low ceramic materials of thermal coefficient of expansion such as (carborundum) to come encapsulated wafer for pursuing production reliability more.

Moreover; For instance; In the application of LED heat radiation; The thermal coefficient of expansion of aluminium, copper material is more much higher than sapphire (sapphire), causes high-brightness LED composition surface under long-term the use to engage the boundary because of thermal fatigue (thermal fatigue) produces easily and breaks (crack), and the joint interface thermal resistance of deriving rises.For the high-brightness LED product, when the rising of heat dissipation interface thermal resistance can cause heat history and and then damage LED wafer, cause the luminous element permanent damages.

So then is the existing target that need improve to the composition surface of deriving because of different thermal coefficient of expansions between the heat abstractor of pyrotoxin external ceramic material and metal material because of thermal fatigue (thermal fatigue) produces joint circle (crack) this problem of breaking.

The utility model content

For this reason, for solving the shortcoming of above-mentioned known techniques, the main purpose of the utility model is to provide kind to improve between heat abstractor and pyrotoxin to produce the heat abstractor that engages boundary's splintering problem because of thermal fatigue (thermal fatigue).

The utility model secondary objective is to provide kind to improve between heat abstractor and pyrotoxin the manufacturing approach that produces the heat abstractor that engages boundary's splintering problem because of thermal fatigue (thermal fatigue).

For reaching above-mentioned purpose, the utility model system provides a kind of heat abstractor, is to comprise: a heat dissipation element;

Said heat dissipation element has a heat-conducting part, and the in addition end of the opposite aforementioned heat-conducting part of this heat dissipation element has a radiating part, and this heat-conducting part connects a ceramic body.

Said heat dissipation element system is that a radiator and a temperature-uniforming plate and a heat pipe and a water-cooled head are wherein arbitrary.

The material system of said ceramic body is silicon nitride (Si ₃N ₄), zirconia (ZrO ₂), aluminium oxide (Al ₂O ₃) wherein arbitrary.

Particularly, the utility model provides a kind of heat abstractor, comprises:

One heat dissipation element has a heat-conducting part, and the in addition end of the opposite aforementioned heat-conducting part of this heat dissipation element has a radiating part, and this heat-conducting part connects a ceramic body.

Preferably, described heat abstractor, said heat dissipation element are that a radiator and a temperature-uniforming plate and a heat pipe and a water-cooled head are wherein arbitrary.

Preferably, described heat abstractor, the material of said ceramic body is silicon nitride (Si ₃N ₄), zirconia (ZrO ₂), aluminium oxide (Al ₂O ₃) wherein arbitrary.

Preferably, described heat abstractor, said heat dissipation element and this ceramic body combine through soft soldering and hard solder and diffusion bond and ultrasonic waves welding and directly cover the copper method (Direct Bonding Cooper, DBC) wherein arbitrary.

The utility model directly combines ceramic body with heat dissipation element; Combine with the ceramic outer surface of pyrotoxin outside by ceramic body again, can improve between heat abstractor and pyrotoxin because of what the thermal fatigue (thermal fatigue) that different heat expansion coefficient produced was derived engaging boundary's splintering problem.

Description of drawings

Fig. 1 a system is the stereogram of heat abstractor first embodiment of the utility model;

Fig. 1 b system is the stereogram of heat abstractor first embodiment of the utility model;

Fig. 2 system is the front view of heat abstractor first embodiment of the utility model;

Fig. 3 system is the three-dimensional exploded view of heat abstractor second embodiment of the utility model;

Fig. 4 system is the three-dimensional combination figure of heat abstractor second embodiment of the utility model;

Fig. 5 system is the cutaway view of heat abstractor the 3rd embodiment of the utility model;

Fig. 6 system is the three-dimensional exploded view of heat abstractor the 4th embodiment of the utility model;

Fig. 7 system is the three-dimensional combination figure of heat abstractor the 4th embodiment of the utility model;

[main element symbol description]

Heat abstractor 1

Heat dissipation element 11

Heat-conducting part 111

Radiating part 112

Ceramic body 12

Embodiment

Characteristic on above-mentioned purpose of the utility model and structure thereof and the function will be explained according to appended graphic preferred embodiment.

See also Fig. 1 a, Fig. 1 b, Fig. 2, be three-dimensional decomposition and constitutional diagram and front view for heat abstractor first embodiment of the utility model, as shown in the figure, said heat abstractor 1 is to comprise: a heat dissipation element 11;

Said heat dissipation element 11 has a heat-conducting part 111; And the end in addition of these heat dissipation element 11 opposite aforementioned heat-conducting parts 111 has a radiating part 112; This heat-conducting part 111 connects a ceramic body 12; In heat dissipation element described in the present embodiment 11 is to be a radiator, and the material system of said ceramic body 12 is silicon nitride (Si ₃N ₄), zirconia (ZrO ₂), aluminium oxide (Al ₂O ₃) wherein arbitrary.

See also Fig. 3, Fig. 4; System decomposes and constitutional diagram for the solid of heat abstractor second embodiment of the utility model; As shown in the figure, present embodiment system is identical with aforementioned first embodiment part-structure and connection relationship, so will repeat no more at this; It is for said heat dissipation element 11 is to be a temperature-uniforming plate that thought present embodiment and aforementioned first embodiment do not exist together, and said ceramic body 12 is that the heat-conducting part 111 of being located at aforementioned heat dissipation element 11 combines with this heat dissipation element 11.

See also Fig. 5; System is the cutaway view of heat abstractor the 3rd embodiment of the utility model; As shown in the figure, present embodiment system is identical with aforementioned first embodiment part-structure and connection relationship, so will repeat no more at this; It is for said heat dissipation element 11 is to be a heat pipe that thought present embodiment and aforementioned first embodiment do not exist together, and said ceramic body 12 is that the heat-conducting part 111 of being located at aforementioned heat dissipation element 11 combines with this heat dissipation element 11.

See also Fig. 6, Fig. 7; System decomposes and constitutional diagram for the solid of heat abstractor the 4th embodiment of the utility model; As shown in the figure, present embodiment system is identical with aforementioned first embodiment part-structure and connection relationship, so will repeat no more at this; It is for said heat dissipation element 11 is to be a water-cooled head that thought present embodiment and aforementioned first embodiment do not exist together, and said ceramic body 12 is that the heat-conducting part 111 of being located at aforementioned heat dissipation element 11 combines with this heat dissipation element 11.

The utility model mainly is to combine a ceramic body 12 through the position that contacts the conduction heat in heat dissipation element 11 (first-class like radiator, temperature-uniforming plate, heat pipe, water-cooled) with pyrotoxin; Thermal coefficient of expansion through ceramic body 12 is close with the ceramic package of pyrotoxin outer enclosure; So can avoid between heat dissipation element 11 and pyrotoxin being engaged boundary's splintering problem, and can increase the field that heat dissipation element is suitable for because of what the thermal fatigue (thermal fatigue) that different heat expansion coefficient produced derived.

Claims

1. the kind heat abstractor is characterized in that, comprises:

One heat dissipation element has heat-conducting part, and the in addition end of the opposite aforementioned heat-conducting part of this heat dissipation element has a radiating part, and this heat-conducting part connects a ceramic body.

2. heat abstractor as claimed in claim 1 is characterized in that, said heat dissipation element is that a radiator and a temperature-uniforming plate and a heat pipe and a water-cooled head are wherein arbitrary.

3. heat abstractor as claimed in claim 1 is characterized in that, the material of said ceramic body is that silicon nitride, zirconia, aluminium oxide are wherein arbitrary.

4. heat abstractor as claimed in claim 1 is characterized in that, it is through soft soldering and hard solder and diffusion bond and ultrasonic waves welding that said heat dissipation element and this ceramic body combine and directly to cover the copper method wherein arbitrary.