CN201876765U - Double-layer adapter board device - Google Patents
Double-layer adapter board device Download PDFInfo
- Publication number
- CN201876765U CN201876765U CN2010206256108U CN201020625610U CN201876765U CN 201876765 U CN201876765 U CN 201876765U CN 2010206256108 U CN2010206256108 U CN 2010206256108U CN 201020625610 U CN201020625610 U CN 201020625610U CN 201876765 U CN201876765 U CN 201876765U
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- China
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- circuit board
- golden finger
- finger group
- double
- card extender
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- Expired - Fee Related
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Abstract
A double-layer adapter board device is arranged in a server system and used for transmitting storage signals and supplies power to at least one mainboard. The double-layer adapter board device comprises a first circuit board, a second circuit board and at least one tab group, the first circuit board comprises a power interface, the second circuit board is electrically connected to the first circuit board, the second circuit comprises a transmission interface, and each tab group is electrically connected to the first circuit board and the second circuit board and includes a first tab group and a second tab group. By the aid of the double-layer adapter board device, elements and circuits which are arranged on the same circuit board originally are distributed to the first circuit board and the second circuit board, area of the single circuit board can be reduced and area occupied by a server is reduced. Further, the first circuit board and the second circuit board are arranged to be parallel to at least one mainboard, affection onto heat dissipation due to blockage of airflow in the server system can be avoided.
Description
Technical field
The utility model relates to a kind of card extender device, refers in particular to a kind ofly to be used for transmitting storage assembly and at least one motherboard is given in power supply, and is parallel at least one motherboard, to avoid the double-deck card extender device that air-flow is blocked in the servomechanism.
Background technology
Today of information blast, general computing electronics has not applied to be used in handles a large amount of data computings, at present, generally use powerful arithmetic units such as servomechanism to handle, and the technology of high in the clouds computing also is the trend of the powerful development in various countries, make the use amount of servomechanism continue to rise, and, plural motherboard often is set in a server system in response to polynary Data Processing.
In general, two districts are divided in configuration in the servomechanism usually, one district is provided with power supply unit, fan, and Storage Media, another district is provided with main board module, wherein include the main frame plate body, memory module, CPU (central processing unit) or interface card etc., in the middle of two districts by circuit board with transmission signal and electric power, owing on the circuit board many circuits are arranged, power interface or transmission interface etc., thus existingly be used for connecting power supply unit, Storage Media and motherboard circuit board need certain size and come ccontaining this class component.
In general, circuit board can be arranged between the motherboard and hard disc district in the servomechanism, and being provided with of circuit board can be parallel to motherboard, but the casing inner volume of server system is limited, when being provided with a plurality of motherboard in the servomechanism, its pairing power supply unit or Storage Media quantity also can with increase, make in the casing of server system more apparent crowdedly, put the situation that fails to lay down so circuit board may take place.And because the casing of server system has limitation in height, if the mode of this circuit board with vertical motherboard is provided with, may be subject to the height of casing and can't pack into, even if can pack into, also meeting stops the problem of servomechanism inner air flow just before circuit board, and influences the heat radiation in the servomechanism, if heat radiation is obstructed in the servomechanism, may cause in the servomechanism heater element overheated, make servomechanism work as the problem of machine.
Therefore need badly and a kind ofly transmit storage assembly and at least one motherboard is given in power supply, and can avoid the double-deck card extender device that air-flow is blocked in the servomechanism to solve the problem that located by prior art produces.
Summary of the invention
The utility model is a kind of double-deck card extender device, and it is used for transmitting storage assembly and at least one motherboard is given in power supply, and first circuit board and second circuit board be set to be parallel at least one motherboard, air-flow is blocked in the servomechanism to avoid.
The utility model provides a kind of double-deck card extender device, it is arranged in the servomechanism, this bilayer card extender device is used for transmitting storage assembly and at least one motherboard is given in power supply, and this bilayer card extender device comprises: a first circuit board, and it comprises a power interface; One second circuit board, its telecommunications is connected in this first circuit board, and this second circuit board comprises a transmission interface; And at least one golden finger group, its telecommunications is connected in this first circuit board and this second circuit board, each golden finger group comprises one first golden finger group and one second golden finger group respectively, this first golden finger group is in order to transmission signals between this at least one motherboard and this transmission interface, and this second golden finger group is in order to supply power to this motherboard.
Preferably, this at least one golden finger group is arranged at this first circuit board or this second circuit board.
Preferably, this second circuit board is parallel to this first circuit board, and this first circuit board and this second circuit board are parallel to this at least one motherboard.
Preferably, also comprise at least one arrangements of electric connection, this arrangements of electric connection is connected in this first circuit board and this second circuit board, in order to transmission signals or power supply.
Preferably, this transmission interface be SAS interface SAS (Serial Attached SCSI, connected in series; SCSI, Small Computer System Interface, small computer system interface).In another embodiment, a kind of double-deck card extender device, it is arranged in the servomechanism, and this bilayer card extender device is used for transmitting storage assembly and at least one motherboard is given in power supply, this bilayer card extender device comprises: a first circuit board, and it comprises a power interface and a transmission interface; One second circuit board, its telecommunications is connected in this first circuit board; And at least one golden finger group, its telecommunications is connected in this first circuit board and this second circuit board, each golden finger group comprises one first golden finger group and one second golden finger group respectively, this first golden finger group is used to transmission signals between this at least one motherboard and this transmission interface, and this second golden finger group is in order to supply power to this motherboard.
Preferably, this at least one golden finger group is arranged at this first circuit board or this second circuit board.
Preferably, this second circuit board is parallel to this first circuit board, and this first circuit board and this second circuit board are parallel to this at least one motherboard.
Preferably, more comprise at least one arrangements of electric connection, this arrangements of electric connection is connected in this first circuit board and this second circuit board, in order to transmission signals or power supply.
Preferably, this transmission interface is the SAS interface.Should be arranged in the casing of servomechanism by bilayer card extender device of the present utility model, not only can reduce the plane space that circuit board accounts for, because the direction of this first circuit board and this second circuit board is parallel with this at least one motherboard, so, make the interior heat radiation of servomechanism unaffected than the air flow that more can not stop perpendicular to this at least one motherboard in the servomechanism.
Description of drawings
Figure 1A is a double-deck card extender schematic representation of apparatus of the present utility model;
Figure 1B is a double-deck card extender schematic representation of apparatus of the present utility model;
Fig. 2 is arranged at the synoptic diagram of system for double-deck card extender device of the present utility model.
Description of reference numerals: 0-servomechanism; The 00-motherboard; The 1-first circuit board; The 2-second circuit board; 3-golden finger group; The 31-first golden finger group; The 32-second golden finger group; The 4-power interface; The 5-transmission interface; The 6-arrangements of electric connection.
Embodiment
For making your juror further cognitive and understanding be arranged to feature of the present utility model, purpose and function, hereinafter the spy describes the relevant thin portion structure of system of the present utility model and the theory reason of design, so that the juror can understand characteristics of the present utility model, detailed description is presented below:
See also Figure 1A, Figure 1A is a double-deck card extender schematic representation of apparatus of the present utility model, the utility model provides a kind of double-deck card extender device, it is arranged in the servomechanism 0, this bilayer card extender device is used for transmitting storage assembly and at least one motherboard 00 is given in power supply, this bilayer card extender device comprises: a first circuit board 1, one second circuit board 2, and at least one golden finger group 3.This first circuit board 1 comprises a power interface 4; These second circuit board 2 telecommunications are connected in this first circuit board 1, this second circuit board 2 is parallel to this first circuit board 1, this first circuit board 1 can be arranged at the top or the below of this second circuit board 2, this second circuit board 2 comprises a transmission interface 5, in the present embodiment, this transmission interface 5 is mini SAS interface, but these transmission interface 5 kinds are not as limit; This at least one golden finger group 3 is electrically connected on this first circuit board 1 and this second circuit board 2, this at least one golden finger group 3 can be arranged at this first circuit board 1 or this second circuit board 2, each golden finger group 3 comprises one first golden finger group 31 and one second golden finger group 32 respectively, this first golden finger group 31 is used to transmission signals between this at least one motherboard 00 and this transmission interface 5, this second golden finger group 32 is in order to supply power to this motherboard 00, in the present embodiment, comprise a slit between this first golden finger group 31 and this second golden finger group 32, certainly, also can directly link to each other between this first golden finger group 31 and this second golden finger group and seamless.In addition, this bilayer card extender device comprises an electrical connection device 6, the mode utilization that this second circuit board 2 is electrically connected on this first circuit board 1 is connected in this electrical connection device 6 of this first circuit board 1 and this second circuit board 2, transmit the signal between this first circuit board 1 and this second circuit board 2, in the present embodiment, this electrical connection device 6 is a metal column, still do not do outside support and the interval between this first circuit board 1 and this second circuit board 2, more can carry out the circulation of electric current by metal column with metal column.
In another embodiment, see also Figure 1B, Figure 1B is a double-deck card extender schematic representation of apparatus of the present utility model, a kind of double-deck card extender device, it is arranged in the servomechanism 0, and this bilayer card extender device is used for transmitting storage assembly and at least one motherboard 00 is given in power supply, and this bilayer card extender device comprises: a first circuit board 1, one second circuit board 2, and at least one golden finger group 3.This first circuit board 1 comprises a power interface 4 and a transmission interface 5, and in the present embodiment, this transmission interface 5 is mini SAS interface, but these transmission interface 5 kinds are not as limit; This second circuit board 2 is electrically connected on this first circuit board 1, the mode utilization that this second circuit board 2 is electrically connected on this first circuit board 1 is connected in an electrical connection device 6 of this first circuit board 1 and this second circuit board 2, transmit the signal between this first circuit board 1 and this second circuit board 2, in the present embodiment, this electrical connection device 6 is a metal column, but the kind of this electrical connection device 6 is not as limit, and this second circuit board 2 is parallel to this first circuit board 1; These at least one golden finger group 3 telecommunications are connected in this first circuit board 1 and this second circuit board 2, this at least one golden finger group 3 can be arranged at this first circuit board 1 or this second circuit board 2, each golden finger group 3 comprises one first golden finger group 31 and one second golden finger group 32 respectively, this first golden finger group 31 is used to transmission signals between this at least one motherboard 00 and this transmission interface 5, this second golden finger group 32 is in order to supply power to this motherboard 00, in the present embodiment, comprise a slit between this first golden finger group 31 and this second golden finger group 32, certainly, also can directly link to each other between this first golden finger group 31 and this second golden finger group and seamless.
See also Fig. 2, Fig. 2 is the synoptic diagram that double-deck card extender device of the present utility model is arranged at system, and this bilayer card extender device is arranged at a side of this at least one motherboard 00, so that should at least one golden finger group 5 be connected to this at least one motherboard 00.And this first circuit board 1 and this second circuit board 2 are parallel to this at least one motherboard 00, and air-flow is blocked in the servomechanism to avoid, and influences the heat radiation in the servomechanism.
Because the utility model is dispensed to this first circuit board 1 and this second circuit board 2 with element and the circuit that originally is arranged at a circuit board, so the area of single circuit board can dwindle, and because this first circuit board 1 and this second circuit board 2 be arranged in parallel, just this first circuit board 1 can be arranged on this second circuit board 2, or, this first circuit board 1 can be arranged under this second circuit board 2, so this bilayer card extender device only accounts for the sub-fraction in servomechanism inner plane space, in the utility model, this at least one golden finger group 3, the demand of this power interface 4 and this transmission interface 5 visual behaviours in service, be configured on this first circuit board 1 and this second circuit board 2, that is to say, can be that this at least one golden finger group 3 is arranged on a wherein circuit board, and this power interface 4 and this transmission interface 5 be arranged on another circuit board; Or, should at least one golden finger group 3 and this power interface 4 be arranged on a wherein circuit board, and this transmission interface 5 is arranged on another circuit board; Again or, should at least one golden finger group 3 and this transmission interface 5 be arranged on a wherein circuit board, and this power interface 4 is arranged on another circuit board; Again or, should at least one golden finger group 3, this power interface 4 and this transmission interface 5 all be arranged on wherein on the circuit board; And element and circuit are dispensed to the mode and the element of circuit board is to be configured in this first circuit board 1 or this second circuit board 2, does not then exceed with above-mentioned.Should be arranged in the casing of servomechanism by bilayer card extender device of the present utility model, not only can reduce the plane space that circuit board accounts for, because the direction of this first circuit board 1 and this second circuit board 2 is parallel with this at least one motherboard 00, so, make the interior heat radiation of servomechanism unaffected than the air flow that more can not stop perpendicular to this at least one motherboard 00 in the servomechanism.
Only the above person only is preferred embodiment of the present utility model, when can not with restriction the utility model scope.Promptly the equalization of being done according to the utility model claim generally changes and modifies, and will not lose main idea of the present utility model place, and the former capital should be considered as further enforcement situation of the present utility model.
Claims (10)
1. double-deck card extender device, it is arranged in the servomechanism, and this bilayer card extender device is used for transmitting storage assembly and at least one motherboard is given in power supply, it is characterized in that this bilayer card extender device comprises:
One first circuit board, it comprises a power interface;
One second circuit board, it is electrically connected on this first circuit board, and this second circuit board comprises a transmission interface; And
At least one golden finger group, it is electrically connected on this first circuit board and this second circuit board, each golden finger group comprises one first golden finger group and one second golden finger group respectively, this first golden finger group is in order to transmission signals between this at least one motherboard and this transmission interface, and this second golden finger group is in order to supply power to this motherboard.
2. double-deck card extender device according to claim 1 is characterized in that, this at least one golden finger group is arranged at this first circuit board or this second circuit board.
3. double-deck card extender device according to claim 1 is characterized in that this second circuit board is parallel to this first circuit board, and this first circuit board and this second circuit board are parallel to this at least one motherboard.
4. double-deck card extender device according to claim 1 is characterized in that, also comprises at least one arrangements of electric connection, and this arrangements of electric connection is connected in this first circuit board and this second circuit board, in order to transmission signals or power supply.
5. double-deck card extender device according to claim 1 is characterized in that this transmission interface is the SAS interface.
6. double-deck card extender device, it is arranged in the servomechanism, and this bilayer card extender device is used for transmitting storage assembly and at least one motherboard is given in power supply, it is characterized in that this bilayer card extender device comprises:
One first circuit board, it comprises a power interface and a transmission interface;
One second circuit board, it is electrically connected on this first circuit board; And
At least one golden finger group, it is electrically connected on this first circuit board and this second circuit board, each golden finger group comprises one first golden finger group and one second golden finger group respectively, this first golden finger group is used to transmission signals between this at least one motherboard and this transmission interface, and this second golden finger group is in order to supply power to this motherboard.
7. double-deck card extender device according to claim 6 is characterized in that, this at least one golden finger group is arranged at this first circuit board or this second circuit board.
8. double-deck card extender device according to claim 6 is characterized in that this second circuit board is parallel to this first circuit board, and this first circuit board and this second circuit board are parallel to this at least one motherboard.
9. double-deck card extender device according to claim 6 is characterized in that, more comprises at least one arrangements of electric connection, and this arrangements of electric connection is connected in this first circuit board and this second circuit board, in order to transmission signals or power supply.
10. double-deck card extender device according to claim 6 is characterized in that this transmission interface is the SAS interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206256108U CN201876765U (en) | 2010-11-23 | 2010-11-23 | Double-layer adapter board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206256108U CN201876765U (en) | 2010-11-23 | 2010-11-23 | Double-layer adapter board device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201876765U true CN201876765U (en) | 2011-06-22 |
Family
ID=44164679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206256108U Expired - Fee Related CN201876765U (en) | 2010-11-23 | 2010-11-23 | Double-layer adapter board device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201876765U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102866746A (en) * | 2011-07-05 | 2013-01-09 | 英业达股份有限公司 | Transfer module |
| CN106415434A (en) * | 2014-03-14 | 2017-02-15 | 桑迪士克科技有限责任公司 | Thermal isolation techniques |
-
2010
- 2010-11-23 CN CN2010206256108U patent/CN201876765U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102866746A (en) * | 2011-07-05 | 2013-01-09 | 英业达股份有限公司 | Transfer module |
| CN106415434A (en) * | 2014-03-14 | 2017-02-15 | 桑迪士克科技有限责任公司 | Thermal isolation techniques |
| CN106415434B (en) * | 2014-03-14 | 2019-08-06 | 桑迪士克科技有限责任公司 | Technology is thermally isolated |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110622 Termination date: 20131123 |