CN201401671Y

CN201401671Y - High-power LED lamp

Info

Publication number: CN201401671Y
Application number: CN2009201313224U
Authority: CN
Inventors: 薛信培; 薛信燊
Original assignee: Individual
Current assignee: Individual
Priority date: 2009-04-21
Filing date: 2009-04-21
Publication date: 2010-02-10
Anticipated expiration: 2019-04-21

Abstract

The utility model relates to a high-power LED lamp which comprises a heat-conducting insulating base plate and a heat-conducting base post which has the same thickness as the base plate, and is embedded in the base plate, wherein the lower surface of the base post is connected with a heat-radiating plate, the upper surface is fixed with a chip, a transparent cover is fixed on the upper surface ofthe base plate, the upper surface of the base plate is provided with a circuit and electrodes, the edge is provided with a through hole for the circuit to pass through, the bottom of the through holeis connected with conductive electrode slices, and a lens is packed on the transparent cover of the base plate. The unique design of the utility model breaks traditional design of LED lamps, can improve reliability and uniformity of products, can greatly improve production efficiency, and reduces cost of products through using machinery and equipment to produce.

Description

A kind of high-powered LED lamp

Technical field

The utility model relates to field of semiconductor illumination, more particularly, relates to a kind of high-powered LED lamp.

Background technology

LED (Light Emitting Diode), also claim light emitting diode, as a kind of new type light source, it has, and volume is little, power consumption less, strong, the stability height of applicability, response time weak point, environmentally safe, multicolor luminous etc. advantage, be widely used in the illumination and decoration field.With the lamp of high-power LED as light source, it has advantages such as luminous efficiency height, energy-saving and environmental protection.

But great power LED adopts rack-like structures direct insertion, SMD, plastic cement TOP mostly in existing, and the product heat radiation is bad, and sealing is poor, and decay is fast, light efficiency is low.Incompatibility LED is to the development of illumination application.

The utility model content

The technical problem that the utility model solves is that the above-mentioned defective at prior art provides a kind of high-powered LED lamp.

The technical scheme that its technical problem that solves the utility model adopts is: design a kind of high-powered LED lamp, comprise that the substrate of a heat conductive insulating is identical with substrate thickness with one and embed heat conduction pilum in the substrate, the lower surface of described pilum connects heat sink, upper surface fixed chip; Described upper surface of base plate is translucent cover fixedly, and circuit and electrode are set, and the edge is provided with the through hole that circuit passes through, and the bottom of through hole connects the electrode slice of conduction, and on the translucent cover of substrate package lens.Described pilum can be the material of copper, silver, the contour heat conduction of alloy.Described substrate can adopt the material of heat conductive insulatings such as aluminium nitride, pottery, silicon substrate.

Further improvement as above-mentioned technology, above-described a kind of high-powered LED lamp, the bottom surface of described pilum is in same plane, is linked in turn and the non-intersect figure of forming by some line segments or curve head and the tail, and pilum bottom surface and substrate bottom surface are on same plane.Described pilum can be shapes such as cuboid, cylinder, round platform.

As the further improvement of above-mentioned technology, above-described a kind of high-powered LED lamp, described translucent cover adopts transparent material, is shaped as up big and down small inverted conical shape, and the side wall upper part of translucent cover is provided with step, is full of fluorescent material in the translucent cover.The setting of ledge structure can effectively prevent to climb glue.

As the further improvement of above-mentioned technology, above-described a kind of high-powered LED lamp, the upper surface plating reflectorized material of described substrate.

As the further improvement of above-mentioned technology, above-described a kind of high-powered LED lamp, described lens adopt silica gel material.Silica gel material has good thermal conductivity.

As the further improvement of above-mentioned technology, above-described a kind of high-powered LED lamp, described pilum are cuboid.

Implement a kind of high-powered LED lamp of the present utility model, have following beneficial effect:

1, described pilum adopts the material of high heat conduction, and lower surface connects heat sink, embeds in the substrate, and the heat that produces when helping chip light emitting is derived rapidly, guarantees the stable of chip quality.

2, substrate adopts the material of heat conductive insulatings such as aluminium nitride, pottery, silicon substrate, and not only heat-transfer rate is fast, and integral insulation, can directly make circuit and electrode on sheet material, saves cost.Dull and stereotyped design makes the lighting angle of chip big, the light extraction efficiency height.

3, design and the through hole that electrode slice is connected separately on the substrate can be guided to the back side with circuit, and accomplish that heat conduction separates with the part of conduction, increases the stability of product.

4, reflectorized material such as plating aluminium oxide etc. on substrate can reflect the bottom light of led chip to the front, improves the utilization ratio and the light emission rate of light.

5, the fixing translucent cover of the upper surface of substrate is up big and down small inverted conical, and certain angle is arranged, and makes things convenient for dot fluorescent powder, and transparent material can make the light of chip sides transmit simultaneously, has increased light extraction efficiency.The upper inside wall of conic transparent cover adopts special process to handle, and makes upper inside wall become step-like, can prevent to climb glue, makes hot spot even, and consistent in batches, visual effect is good.

6, described lens adopt stability and the good silica gel material of thermal diffusivity, and one-shot forming has the advantage of two aspects on substrate: the one, use as lens, and be packaged into different radians, can obtain different LED illumination effects; The 2nd, play the effect of sealing and protection chip, make led chip or the fluorescent material can be oxidized or damage.

7, the utility model particular structure has broken through the design of traditional LED lamp, can improve product reliability, uniformity, utilizes machinery equipment production simultaneously, can enhance productivity greatly, reduces the cost of product.

Description of drawings

The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:

Fig. 1 is the STRUCTURE DECOMPOSITION schematic diagram of a kind of high-powered LED lamp of the utility model;

Fig. 2 is the structural representation of a kind of high-powered LED lamp embodiment of the utility model;

Fig. 3 is the profile of a kind of high-powered LED lamp embodiment of the utility model;

Fig. 4 is the upward view of the embodiment of a kind of high-powered LED lamp of the utility model.

The specific embodiment

As shown in drawings, in the embodiment of a kind of high-powered LED lamp of the utility model, comprise that the substrate 10 of a heat conductive insulating is identical with substrate 10 thickness with one and embed heat conduction pilum 20 in the substrate 10, described pilum 20 is a cuboid, its lower surface connects heat sink 21, upper surface fixed chip 22; Described substrate 10 upper surfaces are translucent cover 23 fixedly, and circuit and electrode be set, the edge is provided with the through hole 11 that circuit passes through, the bottom of through hole 11 connects the electrode slice 12 of conduction, separate with the heat sink 21 of pilum 20, the heat conduction and the part of conduction are separated, and on the translucent cover 23 of substrate 10 package lens 13.

Described translucent cover 23 is up big and down small inverted conical shape, and dot fluorescent powder in cup carries out special process in the upper inside wall of translucent cover 23 and handles, and makes upper inside wall become step-like 231, prevents to climb glue.Because climb the uniformity that glue can influence hot spot, uniformity in batches causes bad order easily.

Reflectorized materials 14 such as the upper surface of substrate 10 plating aluminium oxide reflect the bottom light of led chip to the front, can improve the utilization ratio and the light emission rate of light.

Described lens 13 adopt the good silica gel material of heat conduction.One-shot forming can be played the effect of two aspects on substrate 10: the one, use as lens, and be packaged into different ellipses, can obtain the different illumination effects of LED; The 2nd, play the effect of sealing and protection chip, make led chip or the fluorescent material can be oxidized or damage.

In sum; as those of ordinary skill is scrutable in the art; described in this specification is a preferred embodiment of the present utility model, and all change or modifications of making according to design of the present utility model all should be in claim protection domain of the present utility model.

Claims

1, a kind of high-powered LED lamp is characterized in that, comprises that the substrate of a heat conductive insulating is identical with substrate thickness with one and embeds heat conduction pilum in the substrate, and the lower surface of described pilum connects heat sink, upper surface fixed chip; Described upper surface of base plate is translucent cover fixedly, and circuit and electrode are set, and the edge is provided with the through hole that circuit passes through, and the bottom of through hole connects the electrode slice of conduction, and on the translucent cover of substrate package lens.

2, a kind of high-powered LED lamp according to claim 1, it is characterized in that, the bottom surface of described pilum is in same plane, is linked in turn and the non-intersect figure of forming by some line segments or curve head and the tail, and the bottom surface of pilum and substrate bottom surface are on same plane.

3, a kind of high-powered LED lamp according to claim 1 is characterized in that, described translucent cover adopts transparent material, is shaped as up big and down small inverted conical shape, and the side wall upper part of translucent cover is provided with step, is full of fluorescent material in the translucent cover.

4, a kind of high-powered LED lamp according to claim 1 is characterized in that, the upper surface plating reflectorized material of described substrate.

5, a kind of high-powered LED lamp according to claim 1 is characterized in that, described lens adopt silica gel material.

6, a kind of high-powered LED lamp according to claim 2 is characterized in that, described pilum is a cuboid.