CN201215517Y - Pressure detecting device with temperature compensation - Google Patents
Pressure detecting device with temperature compensation Download PDFInfo
- Publication number
- CN201215517Y CN201215517Y CNU2008200363698U CN200820036369U CN201215517Y CN 201215517 Y CN201215517 Y CN 201215517Y CN U2008200363698 U CNU2008200363698 U CN U2008200363698U CN 200820036369 U CN200820036369 U CN 200820036369U CN 201215517 Y CN201215517 Y CN 201215517Y
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- China
- Prior art keywords
- pressure
- temperature compensation
- unit
- temperature
- signal processing
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Abstract
A pressure detector with temperature compensation comprises a pressure sensing unit, a pressure signal processing unit and a temperature compensation unit, wherein the pressure sensing unit is connected with the pressure signal processing unit. The utility model prints a voltage dependent resistor at the back of a pressure sensing ceramic membrane, the collection and conversion of pressure signals are fulfilled by an integrated circuit chip, an AD converter circuit is integrated in the chip to convert the pressure signals into digital quantity for transmitting, which not only improves interference resistance, and is beneficial for the processing in later circuits. The special temperature compensation unit senses external temperature by using a temperature sensor, outputs and pressure modified value to correct the pressure changes caused by temperature changes, thereby improving the accuracy of output pressure signals.
Description
Technical field
The utility model is a kind of pressure-detecting device that temperature compensation is arranged.
Background technology
Conventional pressure sensor pressure detection part mostly is to utilize ceramic piezoresistance sensor to gather pressure signal, the voltage signal that is converted to by circuit then, in the transmission course of voltage signal, the attenuation ratio of signal is bigger, the ability of anti-interference is also poor, and be unfavorable for the processing of late-class circuit needing extra A/D convertor circuit.In addition, traditional piezoresistance sensor, though self have the function of temperature compensation owing to be subjected to assembly structure influence, temperature compensation be limited in scope poor effect.
Summary of the invention
Problem to be solved in the utility model is: conventional pressure sensor pressure detection part is transmitted in the pressure signal collection, and aspects such as conversion and temperature compensation exist not enough.
The technical solution of the utility model is: a kind of pressure-detecting device that temperature compensation is arranged, comprise pressure sensitive unit and pressure signal processing unit, pressure sensitive unit is the wheatstone bridge circuits of being made up of voltage dependent resistor (VDR), and described voltage dependent resistor (VDR) is printed on the back side of pressure sensing ceramic diaphragm; Pressure sensitive unit connects the pressure signal processing unit, and the pressure signal processing unit is one to have the integrated circuit (IC) chip that AD transforms.
The utility model also is provided with temperature compensation unit, and temperature compensation unit is a thermistor and a temperature sensor, and thermistor is connected in parallel on the Wheatstone bridge of pressure sensitive unit, and temperature sensor connects the pressure signal processing unit.A shunt resistance also in parallel on the thermistor.
The utility model is printed on voltage dependent resistor (VDR) at the back side of pressure sensing ceramic diaphragm, finish the collection and the conversion of the signal of pressure by integrated circuit (IC) chip, chip internal is integrated A/D convertor circuit, pressure signal can be converted to digital quantity transmits, not only can improve anti-jamming capacity, and help the processing of late-class circuit; Be provided with special temperature compensation unit, the temperature of utilizing temperature sensor to come the sensing external world, and the processing by integrated circuit (IC) chip, the modified value of output pressure is revised because the variation of the pressure that variation of temperature causes makes the pressure signal of output more accurate.
Description of drawings
Fig. 1 is circuit theory diagrams of the present utility model.
Embodiment
Circuit theory diagrams of the present utility model as shown in Figure 1, temperature-compensation circuit is shown in the frame of broken lines among figure part.
The utility model comprises pressure sensitive unit and pressure signal processing unit, and pressure sensitive unit is with voltage dependent resistor (VDR) R
1-R
4Be printed on the back side of pressure sensing ceramic diaphragm, and connect into a Wheatstone bridge, this electric bridge is connected with integrated circuit die I C, IC can select AM681 for use, finish the collection and the conversion of the signal of pressure and since this IC inner integrated A/D convertor circuit, just pressure signal can be converted to digital quantity and transmit, improve anti-jamming capacity greatly, and helped the processing of late-class circuit.
Temperature compensation unit of the present utility model is thermistor R in parallel on the Wheatstone bridge of pressure sensitive unit shown in frame of broken lines part among Fig. 1
t, shunt resistance R also in parallel on thermistor
5, R
5Through laser calibration.Voltage dependent resistor (VDR) R
1, R
2, R
3, R
4The bridge circuit of forming is encapsulated in the ceramic diaphragm, and the diaphragm that composition can pressure sensor is called foil gauge, is in identical temperature in order to make Rt with the bridge circuit foil gauge, and foil gauge and Rt are packaged together.As thermistor R
tBe in identical temperature with foil gauge, when the sensitivity of foil gauge descends with the temperature rising, thermistor R
tResistance descend, the input voltage of electric bridge is raise with temperature to be increased, thereby improves the output voltage of electric bridge.Select shunt resistance R
5Value, the influence that foil gauge sensitivity is descended to electric bridge output is well compensated.Temperature sensor is a digital temperature-sensitive chip, the variation of collecting temperature, and the input ic chip, chip compensates pressure signal according to the temperature information that collects.
Claims (3)
1, a kind of pressure-detecting device that temperature compensation is arranged, it is characterized in that comprising pressure sensitive unit and pressure signal processing unit, pressure sensitive unit is the wheatstone bridge circuits of being made up of voltage dependent resistor (VDR), and described voltage dependent resistor (VDR) is printed on the back side of pressure sensing ceramic diaphragm; Pressure sensitive unit connects the pressure signal processing unit, and the pressure signal processing unit is one to have the integrated circuit (IC) chip that AD transforms.
2, a kind of pressure-detecting device that temperature compensation is arranged according to claim 1, it is characterized in that also being provided with temperature compensation unit, temperature compensation unit is a thermistor and a temperature sensor, thermistor is connected in parallel on the Wheatstone bridge of pressure sensitive unit, and temperature sensor connects the pressure signal processing unit.
3, a kind of pressure-detecting device that temperature compensation is arranged according to claim 2 is characterized in that a shunt resistance also in parallel on the thermistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200363698U CN201215517Y (en) | 2008-05-28 | 2008-05-28 | Pressure detecting device with temperature compensation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200363698U CN201215517Y (en) | 2008-05-28 | 2008-05-28 | Pressure detecting device with temperature compensation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201215517Y true CN201215517Y (en) | 2009-04-01 |
Family
ID=40520721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200363698U Expired - Fee Related CN201215517Y (en) | 2008-05-28 | 2008-05-28 | Pressure detecting device with temperature compensation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201215517Y (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102445301A (en) * | 2011-11-23 | 2012-05-09 | 无锡芯感智半导体有限公司 | SOI (silicon on insulator) pressure sensor with self- temperature drift compensation |
| CN103196600A (en) * | 2013-03-14 | 2013-07-10 | 福建省计量科学研究院 | Mathematical temperature compensation method of strain type load sensor |
| CN105049042A (en) * | 2015-06-15 | 2015-11-11 | 深圳市芯海科技有限公司 | Circuit for reducing offset of bridge type sensor |
| CN105806521A (en) * | 2016-05-25 | 2016-07-27 | 深圳市欧利德仪器仪表有限公司 | Ceramic pressure sensor |
| CN106370326A (en) * | 2015-07-22 | 2017-02-01 | 旺玖科技股份有限公司 | Impedance type sensor and electronic device using same |
| CN108871483A (en) * | 2018-07-13 | 2018-11-23 | 深圳电通纬创微电子股份有限公司 | A kind of corrosion-resistant fuel gas table temperature and pressure compensation integrated transducer and its manufacturing method |
| CN109000830A (en) * | 2018-06-26 | 2018-12-14 | 常州元晶电子科技有限公司 | A kind of double Wheatstone bridge temperature-compensating differential pressure pressure sensors and preparation method thereof |
| CN110207865A (en) * | 2019-07-05 | 2019-09-06 | 北京中硕众联智能电子科技有限公司 | A kind of plantar pressure sensor that amendment temperature influences and corresponding modification method |
| CN111147629A (en) * | 2019-12-10 | 2020-05-12 | 维沃移动通信有限公司 | Folding angle detection method of folding screen and electronic equipment |
| WO2023037779A1 (en) * | 2021-09-10 | 2023-03-16 | Tdk株式会社 | Pressure sensor |
-
2008
- 2008-05-28 CN CNU2008200363698U patent/CN201215517Y/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111076856A (en) * | 2011-11-23 | 2020-04-28 | 无锡芯感智半导体有限公司 | Float self-compensating SOI pressure sensor |
| CN111076856B (en) * | 2011-11-23 | 2021-09-21 | 无锡芯感智半导体有限公司 | Temperature drift self-compensating SOI pressure sensor |
| CN102445301A (en) * | 2011-11-23 | 2012-05-09 | 无锡芯感智半导体有限公司 | SOI (silicon on insulator) pressure sensor with self- temperature drift compensation |
| CN103196600A (en) * | 2013-03-14 | 2013-07-10 | 福建省计量科学研究院 | Mathematical temperature compensation method of strain type load sensor |
| CN105049042A (en) * | 2015-06-15 | 2015-11-11 | 深圳市芯海科技有限公司 | Circuit for reducing offset of bridge type sensor |
| CN106370326A (en) * | 2015-07-22 | 2017-02-01 | 旺玖科技股份有限公司 | Impedance type sensor and electronic device using same |
| CN105806521A (en) * | 2016-05-25 | 2016-07-27 | 深圳市欧利德仪器仪表有限公司 | Ceramic pressure sensor |
| CN109000830A (en) * | 2018-06-26 | 2018-12-14 | 常州元晶电子科技有限公司 | A kind of double Wheatstone bridge temperature-compensating differential pressure pressure sensors and preparation method thereof |
| CN108871483A (en) * | 2018-07-13 | 2018-11-23 | 深圳电通纬创微电子股份有限公司 | A kind of corrosion-resistant fuel gas table temperature and pressure compensation integrated transducer and its manufacturing method |
| CN110207865A (en) * | 2019-07-05 | 2019-09-06 | 北京中硕众联智能电子科技有限公司 | A kind of plantar pressure sensor that amendment temperature influences and corresponding modification method |
| CN110207865B (en) * | 2019-07-05 | 2024-02-02 | 北京中硕众联智能电子科技有限公司 | Plantar pressure sensor for correcting temperature influence and corresponding correction method |
| CN111147629A (en) * | 2019-12-10 | 2020-05-12 | 维沃移动通信有限公司 | Folding angle detection method of folding screen and electronic equipment |
| WO2023037779A1 (en) * | 2021-09-10 | 2023-03-16 | Tdk株式会社 | Pressure sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090401 Termination date: 20150528 |
|
| EXPY | Termination of patent right or utility model |