CN1945844A - LED array - Google Patents
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- CN1945844A CN1945844A CN 200510108253 CN200510108253A CN1945844A CN 1945844 A CN1945844 A CN 1945844A CN 200510108253 CN200510108253 CN 200510108253 CN 200510108253 A CN200510108253 A CN 200510108253A CN 1945844 A CN1945844 A CN 1945844A
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Abstract
This invention provides a LED array, which uniforms the wound current volume flown into the light emission part in the units in a matrix driving mode to uniform the illumination output and the drive voltage of the illumination part including a conduction layer, multiple independent illumination parts, a first groove dividing the illumination part into units, a first electrode formed on part of the illumination part, a second electrode formed on the conduction layer directly in the units, general routing for switching, a first weld pad connecting to the general routings and a second weld pad connecting to the electrodes of the second electrode, n light emission parts matched in the units laterally, a second groove formed on the conduction layer among adjacent conduction layers, and the second groove adjacent to the first is short and the next one is long to be alternate.
Description
Technical field
The present invention relates to the big and uniform light emitting diode matrix of a kind of luminous output, particularly relate to the light emitting diode matrix of printer light source of being suitable for the electrofax mode etc.
Background technology
The printer of electrofax mode forms electrostatic latent image according to the light of corresponding diagram picture signals on photosensitive drums, copy to after adhering toner is developed selectively and obtain image on the paper.As the light source that is used to form sub-image, laser mode and light emitting diode matrix mode are adopted widely.The light source of light emitting diode matrix mode particularly is so light path is suitable for small-sized printer because it needn't extend as laser mode.In addition, because light emitting diode matrix can be laterally long, so also be suitable for carrying out the printer of large scale printing.Recently, for the high speed high quality of tackling printing and the demand of the further miniaturization of printer, require to carry out height and export and the low-cost light-emitting diode array with high-fineness ground more.
In order to realize the cost degradation of light-emitting-diode array heads, do not adopt and possess the mode of the IC of driven for emitting lights diode (static drive mode) independently of one another, but preferably adopt a plurality of light-emitting diodes are made as a unit, carry out mode (dynamic driving mode or matrix driving mode) the [Red テ Network ニ カ Le レ PVC ユ one that time-division driving is cut down drive IC and switching number by switching with matrix wiring, in January, 2002, No. 189, Vol.69, No.1 (non-patent literature)].
Given this, a kind of light emitting diode matrix scheme (special Willing 2003-289909 number) of cutting apart the matrix driving mode of the previous proposition of the applicant, by first welded gasket is connected with first electrode via general wiring, thereby cut down the welded gasket sum, making the first welded gasket number that is connected with first electrode is 1 with the ratio of the second welded gasket number that is connected with second electrode: n (n 〉=3).Fig. 7 is the vertical view that 4 of this structure is cut apart the light emitting diode matrix of matrix driving mode.In this example, assembly is made of 64 illuminating part, the welded gasket 6c that is connected with first electrode (negative electrode) 2 via the general wiring 4 of switching usefulness ... with the welded gasket 6a that is connected with second electrode (anode) 3 ... become row by 1: 4 proportional arrangement.
Fig. 8 is the local vertical view that amplifies of light emitting diode matrix shown in Figure 7, and Fig. 9 (a) is the C-C sectional drawing of Fig. 7, and Fig. 9 (b) is the D-D sectional drawing of Fig. 7, and Fig. 9 (c) is the E-E sectional drawing of Fig. 7.This light emitting diode matrix has substrate 10, at the conductive layer 11 that forms on the substrate 10, at a plurality of illuminating parts 1 that form on the conductive layer 11,4 the general wirings 4, the first welded gasket 6c that is connected with general wiring 4 respectively that are connected with negative electrode 2 respectively at each negative electrode that forms above the illuminating part 12, the anode 3 that on conductive layer 11, forms, via negative electrode lead-out wiring 5c and the second welded gasket 6a that is connected with anode 3 via anode lead-out wiring 5a.As shown in Figure 7, by tetragonal first groove 20 that on conductive layer 11, forms illuminating part 1 is divided into a unit by per 4.
Figure 10 be expression flow into illuminating part 1 in the unit of this light emitting diode matrix as drive current directly go into electric current 26a and around the vertical view of going into electric current 26b, Figure 11 is a vertical view of representing the periphery of illuminating part 1.The negative electrode 2 that forms on illuminating part 1 is the T fonts by the elongated extension 2b formation of the connecting portion 2a of the width that prolongs about illuminating part 1 from an end (away from a side of anode 3) and the central portion that extends to light taking-up portion 9, so be not only by under the illuminating part 1 from anode 3 directly go into electric current 26a, can also with around go into electric current 26b guide into light taking-up portion 9 under.
Can improve luminous output by the width of adjustment light taking-up portion 9 and the length of negative electrode 2.Figure 12 (a) and (b) represent the length L of connecting portion 2a of negative electrode 2 and the relation of luminous output and driving voltage respectively.Shown in Figure 12 (a) and (b), be made as smaller or equal to 20 μ m by the length L that will get connecting portion 2a, can suppress the increase of driving voltage, can also improve luminous output significantly simultaneously.About the shape of the extension 2b of negative electrode 2,, also can make shapes such as many bands, mesh if can carry out microfabrication.
But, with respect to around going into electric current 26b only from the one-sided inflow illuminating part 1a adjacent, around going into electric current 26b from two side inflows and first groove, 20 non-conterminous illuminating part 1b with first groove 20.Hence one can see that produces difference between the magnitude of current of the magnitude of current that flows into illuminating part 1a and inflow illuminating part 1b.One example of the luminous output of each illuminating part 1 in Figure 13 (a) expression unit, an example of the driving voltage of each illuminating part 1 in Figure 13 (b) expression unit.From Figure 13 (a) and (b) as can be known, there are bigger fluctuation in the luminous output of illuminating part 1 and driving voltage in each unit.
[non-patent literature 1] Red テ Network ニ カ Le レ PVC ユ in January, 1,2002, the 69th volume, No. 189,
The No.1 summary of the invention
Therefore, the object of the present invention is to provide a kind ofly in the light emitting diode matrix of matrix driving mode,, make the luminous output and the driving voltage of the illuminating part in each unit even by carrying out homogenizing around going into the magnitude of current to what flow into illuminating part in each unit.
The result who concentrates on studies in view of above-mentioned purpose, inventors of the present invention find: (a) in the light emitting diode matrix of matrix driving mode, when to make the groove that forms on conductive layer between the illuminating part in individual unit be identical length, what flow into illuminating part gets inhomogeneously around going into electrorheological, and the luminous output of each illuminating part and driving voltage become inhomogeneous as a result; (b) for addressing this problem, if it is just passable to adjust the length of described groove.This two aspect has all been expected in the present invention.
Promptly, light emitting diode matrix of the present invention is characterised in that to have: the conductive layer that forms on substrate, the independently a plurality of separately illuminating parts that on described conductive layer, form, for described illuminating part is divided into first groove that the unit forms on described conductive layer, be formed on first electrode at least a portion of each illuminating part upper surface, one second electrode that in each unit, on conductive layer, directly forms, the general wiring of switching that is connected separately with described first electrode, first welded gasket that is connected with the general wiring of described each bar and second welded gasket that is connected with each electrode of described second electrode, in each unit, the individual illuminating part of n (n is an even number) is arranged along landscape configuration, between adjacent illuminating part, be formed with second groove, second trench length of the most close described first groove is short, next second trench length is long, and length alternately then.
In light emitting diode matrix of the present invention, each unit is surrounded tetragonal described first groove constitute by the ditch portion of the ditch portion of the described first electrode side, the described second electrode side with a pair of ditch portion that adjacent unit separates, described second groove preferably is pectination and is connected with the ditch portion of the described first electrode side.
The second short groove is formed into the light taking-up portion of described illuminating part and the intersection of described first electrode always, and the second long groove preferably is formed into the big end of body (the described second electrode side) of described illuminating part at least always.
Described general wiring is the n bar, and the number of described first welded gasket and described second welded gasket is than preferably 1: n.
Described first and second welded gaskets are preferably disposed at separately independently on the weld part of the island that forms on the described conductive layer, and described illuminating part and described weld part preferably form independently of one another by the mesa etched trench.
In having the light emitting diode matrix of the present invention of said structure, owing to flow to even between the illuminating part in each unit around going into the magnitude of current, so can obtain uniform luminous output with low driving voltage.
Description of drawings
Fig. 1 is the partial top view of an assembly of the light emitting diode matrix of one embodiment of the present of invention.
Fig. 2 is the local amplification plan view of Fig. 1.
Fig. 3 is the local amplification plan view of Fig. 2.
Fig. 4 is the vertical view of a unit of the light emitting diode matrix of other embodiment of the present invention.
Fig. 5 is the local amplification profile diagram of Fig. 2, (a) is the A-A sectional drawing, (b) is the B-B sectional drawing.
Fig. 6 (a) is the luminous output of each illuminating part of Fig. 3, (b) is the driving voltage of each illuminating part of Fig. 3.
The vertical view of the light emitting diode matrix that Fig. 7 applies for before being.
Fig. 8 is the local amplification plan view of Fig. 7.
The section of Fig. 9 presentation graphs 7 (a) is the C-C sectional drawing, (b) is the D-D sectional drawing, (c) is the E-E sectional drawing.
Figure 10 is the local amplification plan view of Fig. 7.
Figure 11 is the local amplification plan view of Figure 10.
Figure 12 is the curve chart of the relation of electrode structure and performance in the light emitting diode matrix of application before the expression, and (a) relation of expression electrode structure and luminous output (b) is represented the relation of electrode structure and driving voltage.
Figure 13 (a) is the luminous output of each illuminating part of Figure 10, (b) is the driving voltage of each illuminating part of Figure 10.
Embodiment
[1] structure of light emitting diode matrix
Describe light emitting diode matrix of the present invention in detail with reference to Fig. 1～6.In Fig. 1～6, to the identical reference number of the position identical mark, only otherwise specify that the position of same reference numerals has identical structure with the described light emitting diode matrix in Fig. 7～11.In addition, the section structure of light emitting diode matrix of the present invention itself is except second groove 21 of conductive layer 11, with shown in Figure 9 identical.For the purpose of simplifying the description, from vertical view, omitted insulating barrier.
Fig. 1 is the vertical view of an assembly integral body of 4 of a preferred embodiment of the present invention light emitting diode matrix of cutting apart matrix, and Fig. 2 is the local amplification plan view of light emitting diode matrix shown in Figure 1.
In illustrated embodiment, an assembly has 16 unit B
1, B
2... B
16, each unit has 4 illuminating parts 1.Therefore, assembly is made of the illuminating part 1 of 64 dot matrix.This light emitting diode matrix have on each illuminating part 1 first electrode (negative electrode) 2 of the T font that forms, 4 switchings being connected with the negative electrode 2 of 4 illuminating parts 1 respectively with general wiring 4, be arranged on 1 second electrode (anode) 3 in each unit, with each bar of general wiring 4 connect up 4 welded gasket 6c being connected and the welded gasket 6a (totally 16) that is connected with anode 3 in each unit.Welded gasket 6c is 1: 4 with the number ratio of welded gasket 6a, thus, just the width (length direction of light emitting diode matrix) of each welded gasket 6a, 6c can be designed to such an extent that surplus is arranged, and for example can be set at 60 μ m.
4 tetragonal first groove 20 encirclements that illuminating part 1 is formed on conductive layer 11, each welded gasket 6a, 6c form on each weld part 8a, 8c.Illuminating part 1, weld part 8a and weld part 8c are separated independently of one another by mesa etching bath 19 respectively.Therefore, each illuminating part 1 is made of the epitaxial loayer that forms on substrate 10.Switch and between weld part 8a and the weld part 8c and first groove 20, form with general wiring 4.
Fig. 3 is the vertical view of a unit of light emitting diode matrix shown in Figure 2.Each unit B 1, B2 ..., B16 has 4 illuminating parts 1, surrounds tetragonal first groove 20 of illuminating part 1, second groove 21 that prolongs from the limit 20a (from anode 3 farthest sides) of first groove 20 between adjacent illuminating part 1 and the anode 3 that forms at conductive layer 11 in the position of approaching illuminating part 1.Each illuminating part 1 has light taking-up portion 9 on do not covered by negative electrode 2.Anode 3 is arranged on the position near light taking-up portion 9.
The mesa etching bath that first and second grooves 20,21 are preferably removed conductive layer 11 fully.First groove 20 makes each unit B
1, B
2..., B
16With adjacent unit electric insulation, second groove 21 is controlled at the electric current that flows between the adjacent illuminating part.
In light emitting diode matrix of the present invention, the second groove 21a that prolongs from the limit 20a of first groove 20, the length difference of 21b.Specifically, prolong respectively between near illuminating part 1a, the 1d of the 20b of ditch portion and illuminating part 1b, 1c the second short groove 21a is arranged, prolong between the illuminating part 1b of the 20b of ditch portion and 1c that the second groove 21b, the 20b of ditch portion are arranged is the ditch portion that divides adjacent unit in first groove 20 keeping off.The same with the example of Fig. 7～9, the second short groove 21a preferably extends to the end (from anode 3 side farthest) of light taking-up portion 9 substantially always, and the second long groove 21b preferably extends to the big end of body (anode 3 sides) of illuminating part 1 at least.But,, also can suitably adjust the length of the second long groove 21b for making luminous output even.
What Fig. 4 represented is a unit of the light emitting diode matrix of 8 * 8 matrixes.In this example, the second groove 21a adjacent with 1h with the illuminating part 1a that approaches the 20b of ditch portion is short, and the second groove 21b that the second groove 21a is adjacent is long, and in addition, the second groove 21a that is adjacent is short.Therefore, second groove 21 is arranged as short, long and short, long and short, long and short.Generally, at an element memory under the situation of the individual illuminating part of n (n is an even number), (n-1) length of individual second groove 21 from first groove, 20 1 sides in order for short, long and short, long ... short.
Fig. 5 (a) is the A-A sectional drawing of Fig. 2, and Fig. 5 (b) is the B-B sectional drawing of Fig. 2.For purposes of illustration, omitted third and fourth dielectric film 24,25 at Fig. 5 (a) with (b).Shown in Fig. 5 (a),, flow into around going into electric current 26b because the second groove 21a adjacent with the illuminating part 1 of the most close first groove 20 is short.With respect to this, shown in Fig. 5 (b) since with away from the adjacent second groove 21b long (extending to position) of the illuminating part 1 of first groove 20 always near anode 3, so in fact stop from anode 3 import the electric current of negative electrodes 2 around going into electric current.Therefore, as shown in Figure 3,, around going into electric current 26b, and, do not flow into each illuminating part 1 around going into electric current 26b in fact in the zone that has the second long groove 21b from each illuminating part 1 of one-sided inflow in the zone that has the second short groove 21a.Therefore, in fact same amount flow into each illuminating part 1a, 1b, 1c, 1d around going into electric current 26b, thereby the luminous output of each illuminating part 1a, 1b, 1c, 1d and driving voltage are all homogenized in each unit.Fig. 6 (a) and Fig. 6 (b) represent each illuminating part 1a, the 1b in the light emitting diode matrix of present embodiment, luminous output and the driving voltage of 1c, 1d respectively.From with Figure 13 more as can be known, can make luminous output and driving voltage even significantly by the length of adjusting second groove 21 as described above.
Below further describe the structure of the each several part of first and second grooves 20,21 light emitting diode matrix of the present invention in addition.
(1) substrate and conductive layer
(2) illuminating part
In example shown in Figure 9, the illuminating part 1 of light emitting diode matrix is made of the AlGaAs etch stop layer 12 that forms on n type GaAs substrate 10 successively via p type GaAs conductive layer 11, p type AlGaAs clad 13, p type AlGaAs active layer 14, n type AlGaAs clad 15 and n type GaAs cap layer 16.In the zone of light taking-up portion 9, remove n type GaAs cap layer 16 by etching.
Has so-called double-heterostructure with luminous directly related zone in the above-mentioned illuminating part 1, that is, pick up the structure of coming having corresponding to the bigger p type AlGaAs clad 13 (the first conductivity type clad) of the p type AlGaAs active layer 14 usefulness energy bandgaps of the energy bandgaps of emission wavelength and n type AlGaAs clad 15 (the second conductivity type clad).
(3) dielectric film
As shown in Figure 9, illuminating part 1, weld part 8 and mesa etching bath 19 are all covered by first dielectric film 17 and second dielectric film 18.In addition, as described later, in electrode and wiring, except that welded gasket 6a, 6c, also be formed with the 3rd dielectric film 24 and the 4th dielectric film 25.
(4) electrode and wiring
First and second electrodes can a side be negative electrodes, and the opposing party is an anode, and electrode separately both can be that negative electrode also can be an anode.Owing to require each electrode to have ohm connection performance and the adhesiveness of good switching characteristic, good and lower floor, so each electrode preferably is made of the multiple layer metal layer.For example, can be with multilayer electrodes such as AuZn/Ni/Au or Ti/Pt/Au as anode, with multilayer electrodes such as AuGe/Ni/Au as negative electrode.
Owing to require general wiring 4 and lead-out wiring 5 to have good switching characteristic and good and adhesiveness upper strata/lower floor, so preferably constitute by the multiple layer metal layer.Preferably have metal levels such as switching characteristic good Ti, Mo, TiW at the superiors/orlop.For example, can be the stepped construction that constitutes by Ti/Au/Ti, Mo/Au/Mo, TiW/Au/TiW etc.In addition,, form at the same time under the situation of anode 3 and general wiring 4, also can use stepped constructions such as Ti/Pt/Au/Ti in order to simplify technology.
Each metal layer of electrodes can form by vapour deposition methods such as resistance heating vapour deposition method, electron ray heating vapour deposition methods, and oxide skin(coating) can form with various known film build methods.For additional ohmic properties on metal level, preferably further implement heat treatment (alloying).
In Fig. 1～Fig. 3 and example shown in Figure 9, remove the part of the n type GaAs cap layer 16 of each illuminating part 1 by etching, become light taking-up portion 9 above the n type AlGaAs clad 15 that exposes, formation combines to constitute ohm with its negative electrode 2 with shape on remaining n type GaAs cap layer 16.The anode 3 of a direct contact conductive layer 11 is set in each unit.Anode 3 is preferably banded, so that equidistant near the whole illuminating parts 1 in each unit.As shown in Figure 3, negative electrode 2 is the T font preferably, the details of T font negative electrode 2 can with illustrated the same of Figure 11.
By first dielectric film 17 and second dielectric film 18 are carried out connecting hole 7a, the 7c that etching is provided with, lead-out wiring 5a, 5c are connected with anode 3, negative electrode 2 respectively.In addition, by second dielectric film 18 is carried out the connecting hole 7k that etching is provided with, lead-out wiring 5k is connected with general wiring 4 (forming between first dielectric film 17 and second dielectric film 18).
(5) mesa etching bath
In order to form independently a plurality of separately illuminating parts 1 and weld part 8,, and form the mesa etching bath 19 that always arrives conductive layer 11 or etch stop layer 12 promptly for illuminating part 1 and weld part 8 are divided into separately independently island.
[2] manufacture method of light emitting diode matrix
The preferable production process of light emitting diode matrix of the present invention is described with reference to Fig. 1～Fig. 3 and Fig. 9.At first, use organic metal vapor growth method (MOVPE method) growing p-type GaAs conductive layer 11 (carrier concn: 4 * 10 successively on the substrate 10 that forms by n type GaAs
19Cm
-31 μ m), AlGaAs etch stop layer 12 (carrier concn: 3 * 10, thickness:
19Cm
-30.1 μ m), p type AlGaAs clad 13 (carrier concns: 1 * 10, thickness:
18 Cm
-31 μ m), p type AlGaAs active layer 14 (carrier concns: 1 * 10, thickness:
18 Cm
-31 μ m), n type AlGaAs clad 15 (carrier concns: 2 * 10, thickness:
18 Cm
-33 μ m) and n type GaAs cap layer 16 (carrier concns: 1 * 10, thickness:
18Cm
-3, thickness: 0.5 μ m).
On formed crystallizing layer, implement wet etching selectively.At first, stay the part and the weld part 8 that contact with negative electrode 2 in the illuminating part 1, remove n type GaAs cap layer 16.In this stage, formed the light taking-up portion 9 of illuminating part 1.Then, above-mentioned mesa etching bath 19 is set till the degree of depth that etch stop layer 12 exposes, at this moment, on etch stop layer 12, forms the independently illuminating part 1 and weld part 8 independently separately separately that form by epitaxial loayer.
Further on p type GaAs conductive layer 11, form second groove 21 that illuminating part 1 is divided into first groove 20 of unit and between illuminating part 1, prolongs from one side comb shape of first groove 20.At this moment, as shown in Figure 3, the length of second groove 21 is made as along horizontal direction begins from the termination by short length ... sequence arrangement.If n type GaAs substrate 10 is also set the degree of depth of first and second grooves 20,21 as slightly carrying out etching, even there is the etching error so, can be on the position of groove 20,21 yet residual conductive layer 11.
After the use vapour deposition method and the method for peeling off form negative electrode 2 that is formed by AuGe/Ni/Au and the anode 3 that is formed by AuZn/Ni/Au, use chemical vapor-phase growing method (CVD method) growth first dielectric film 17, so that it covers the top whole of light emitting diode matrix get up.Use vapour deposition method and peel off method and on first dielectric film 17, form the general wiring 4 that forms by Ti/Au/Ti.
further use the CVD method grow second dielectric film 18 so that its above with light emitting diode matrix whole cover after, by being etched in negative electrode 2, anode 3 and the general wiring 4 connecting hole 7c, 7a, 7k are set respectively.At sputtered with Ti/Au/Ti between each connecting hole 7c and each the connecting hole 7k, between each connecting hole 7a and each the weld part 8a, between each connecting hole 7k and each the weld part 8c and on each weld part 8c, 8a, and carry out ion and grind, form lead-out wiring 5c, the 5a, 5k and welded gasket 6c, the 6a that form by Ti/Au/Ti thus.
By using CHF
3/ O
2Remove first dielectric film 17 and second dielectric film 18 on deluster taking-up portion 9 and the drawn area 23 etc. the dry-etching method of known mist.And then in order to prevent the immersion of moisture etc., evaporation the 3rd dielectric film 24 and the 4th dielectric film 25 are so that its top whole covering with light emitting diode matrix.Because the 4th dielectric film 25 is final passivating films, so the isopyknic film of nitride film preferably.Under the 3rd dielectric film 24 situation different, must set thickness according to emission wavelength, so that it is unlikely to become reflectance coating with the refractive index of the 4th dielectric film 25.Specifically, as open the spy put down in writing in the 2003-031840 communique, preferably be set at the gross thickness of the 3rd dielectric film 24 and the 4th dielectric film 25 thinner than 1 μ.
At last, the 3rd dielectric film 24 on the welded gasket 6 and the 4th dielectric film 25 are carried out etching, leave the welded gasket window.
In the example of Fig. 1～3, be as a unit with 4 illuminating parts, current electrode is made as 44 * 4 structures, but, light emitting diode matrix of the present invention is not limited to this structure, also can be 2 illuminating parts as a unit, have 2 * 2 structures of 2 current electrodes, also can be 8 * 8 (Fig. 4) structure.Usually, so long as n * n (n is an even number) structure is just passable.In addition, this routine light emitting diode matrix has for example resolution of 1200dpi, but is not limited thereto.
Claims (6)
1. a light emitting diode matrix has: the conductive layer that forms on substrate; The independently a plurality of separately illuminating parts that on described conductive layer, form; For described illuminating part is divided into first groove that the unit forms on described conductive layer; Be formed on first electrode at least a portion of each illuminating part upper surface; One second electrode that in each unit, on conductive layer, directly forms; The general wiring of switching that is connected separately with described first electrode; First welded gasket that is connected with the general wiring of described each bar and second welded gasket that is connected with each electrode of described second electrode is characterized in that,
In each unit, the individual illuminating part of n (n is an even number) is arranged along landscape configuration, on the described conductive layer between the adjacent illuminating part, be formed with second groove, second trench length of the most close described first groove is short, and next second trench length is long, length replaces then.
2. light emitting diode matrix according to claim 1 is characterized in that,
Each unit is surrounded tetragonal described first groove constitute by the ditch portion of the ditch portion of the described first electrode side, the described second electrode side with a pair of ditch portion that adjacent unit separates, described second groove is pectination and is connected with the ditch portion of the described first electrode side.
3. light emitting diode matrix according to claim 2 is characterized in that,
The second short groove is formed into the big end of body (away from a side of described second electrode) of the light taking-up portion (part beyond first electrode of described illuminating part) of described illuminating part always, and the second long groove is formed into the big end of body (side of described second electrode) of described illuminating part at least always.
4. according to each described light emitting diode matrix of claim 1～3, it is characterized in that,
Described general wiring is the n bar, and described first welded gasket is 1 with the number ratio of described second welded gasket: n.
5. according to each described light emitting diode matrix of claim 1～4, it is characterized in that,
Described first and second welded gaskets are set at separately independently on the weld part of the island that forms on the described conductive layer.
6. according to each described light emitting diode matrix of claim 1～5, it is characterized in that,
Described illuminating part and described weld part form independently of one another by the mesa etching bath.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101082531A CN100461442C (en) | 2005-10-08 | 2005-10-08 | LED array |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101082531A CN100461442C (en) | 2005-10-08 | 2005-10-08 | LED array |
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| Publication Number | Publication Date |
|---|---|
| CN1945844A true CN1945844A (en) | 2007-04-11 |
| CN100461442C CN100461442C (en) | 2009-02-11 |
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ID=38045133
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102537899A (en) * | 2010-12-01 | 2012-07-04 | 微软公司 | Light source module |
| CN108119782A (en) * | 2017-12-20 | 2018-06-05 | 西安智盛锐芯半导体科技有限公司 | LED pressure sensitive lamps |
| US10257932B2 (en) | 2016-02-16 | 2019-04-09 | Microsoft Technology Licensing, Llc. | Laser diode chip on printed circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750799B2 (en) * | 1986-04-17 | 1995-05-31 | 株式会社東芝 | Light emitting device |
| JP4115197B2 (en) * | 2002-08-02 | 2008-07-09 | 株式会社沖デジタルイメージング | Light emitting element array |
| JP2004273746A (en) * | 2003-03-07 | 2004-09-30 | Hitachi Cable Ltd | Light-emitting diode array |
| JP2005064104A (en) * | 2003-08-08 | 2005-03-10 | Hitachi Cable Ltd | Light emitting diode array |
-
2005
- 2005-10-08 CN CNB2005101082531A patent/CN100461442C/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102537899A (en) * | 2010-12-01 | 2012-07-04 | 微软公司 | Light source module |
| CN102537899B (en) * | 2010-12-01 | 2015-11-25 | 微软技术许可有限责任公司 | Light source module |
| US10234545B2 (en) | 2010-12-01 | 2019-03-19 | Microsoft Technology Licensing, Llc | Light source module |
| US10257932B2 (en) | 2016-02-16 | 2019-04-09 | Microsoft Technology Licensing, Llc. | Laser diode chip on printed circuit board |
| CN108119782A (en) * | 2017-12-20 | 2018-06-05 | 西安智盛锐芯半导体科技有限公司 | LED pressure sensitive lamps |
| CN108119782B (en) * | 2017-12-20 | 2023-04-21 | 中山市世胜源照明有限公司 | LED pressure sensing lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100461442C (en) | 2009-02-11 |
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