CN1928612B - 数码相机变焦结构 - Google Patents

数码相机变焦结构 Download PDF

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CN1928612B
CN1928612B CN200510037221A CN200510037221A CN1928612B CN 1928612 B CN1928612 B CN 1928612B CN 200510037221 A CN200510037221 A CN 200510037221A CN 200510037221 A CN200510037221 A CN 200510037221A CN 1928612 B CN1928612 B CN 1928612B
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陈杰良
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Hon Hai Precision Industry Co Ltd
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    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
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    • G02B7/10Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens
    • G02B7/102Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens controlled by a microcomputer
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F03GSPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • F03G7/065Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like using a shape memory element
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    • H01ELECTRIC ELEMENTS
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    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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    • H01L27/14685Process for coatings or optical elements
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    • H04ELECTRIC COMMUNICATION TECHNIQUE
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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    • G03B2205/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0053Driving means for the movement of one or more optical element
    • G03B2205/0076Driving means for the movement of one or more optical element using shape memory alloys

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Abstract

本发明是关于一种数码相机变焦结构,该数码相机变焦结构包括一第一镜片组,一镜筒,一致动器及一镜座;该镜筒内设置第二镜片组,该第一镜片组与该第二镜片组中心对齐;该致动器与该镜筒固定连接,其包括一变形记忆合金,该变形记忆合金在温度条件控制下驱动该镜筒轴向位移发生变化;该第一镜片组固定在该镜座内,该镜筒与该镜座可滑动连接。

Description

数码相机变焦结构
【技术领域】
本发明是关于一种数码相机变焦结构,尤其是关于一种功耗低、精度高的数码相机变焦结构。
【背景技术】
数码相机通常为方便取景,一般配有变焦镜头,通过驱动机构推拉或旋转镜头,调整镜头内镜片之间的距离,从而改变焦距,使拍摄的景物放大或缩小。
一现有驱动机构通常采用步进马达带动齿轮机构实现变焦,该种数码相机变焦结构在工作时,步进马达带动圆柱齿轮转动,同时带动齿条做直线运动,从而使镜头组在套筒内沿光轴作直线运动,改变镜头组与套筒内固定镜头之间相对位置,实现光学变焦,然而该变焦相机的变焦结构占有较大的体积,且在传动时,不仅动力损耗大,驱动速度较慢,而且光学精度低。
另一现有驱动机构采用压电致动器,该压电致动器通过压电元件的性能,在接通电流后,压电元件表面会发生弯曲,通过该弯曲从而带动数码相机的镜头前后移动。尽管该种压电致动器可实现光学变焦,且压电致动器体积小,然而其不能满足精确控制的要求。
【发明内容】
鉴于以上的缺点,提供一种功耗低、且精度高的数码相机变焦结构非常必要。
一种数码相机变焦结构,该数码相机变焦结构包括一第一镜片组,一镜筒,一致动器及一镜座;该镜筒内设置第二镜片组,该第一镜片组与该第二镜片组中心对齐;该致动器与该镜筒固定连接,其包括一变形记忆合金,该变形记忆合金在温度条件控制下驱动该镜筒轴向位移发生变化;该第一镜片组与该镜座固定连接,该镜筒与该镜座可滑动连接。
相较现有技术,所述致动器采用变形记忆合金,所需功耗低、控制精度高。此外,该致动器仅占有较小体积,可有效缩小空间。
【附图说明】
图1是本发明优选实施例数码相机变焦结构示意图;
图2是本发明优选实施例形状记忆合金的晶格变化示意图。
【具体实施方式】
本发明数码相机变焦结构应用在数码相机模组内,请参见图1,该数码相机镜头模组包括第一镜筒10、第二镜筒20、一镜座30、一致动器40、一透光板50、一影像传感器60及一基座70。
该第一镜筒10为中空圆筒状,其内设置有第一镜片组12,其外圆周设置外螺纹102。该第一镜筒10一端设有盖板14,该盖板14为一平板玻璃,即可使光线通过,也可阻挡灰尘等杂质进入而污染第一镜片组12。
该第二套筒20也为中空圆筒状,其内设置有第二镜片组22,该第二镜筒20位于第一镜筒10一侧,且二镜筒中心对齐。
镜座30为中空圆台状,该镜座30包括一容置部302及一凸缘部304。该容置部302为中空圆柱体,该凸缘部304为一立方体,一端为矩形开槽306,其与容置部302相贯通。容置部302的外径小于凸缘部304的边长,而在两者相接处形成台阶,而镜座30凸缘部304的矩形开槽306边长大于容置部302的内径。镜座30的容置部302内圆周与凸缘部304相对端设置有内螺纹308,其与第一镜筒10的外螺纹102相配合。该第二镜筒20位于第一镜筒10的下面且滑动配合在容置部302内。
致动器40包括绝缘层及包覆在绝缘层内的形状记忆合金(Shape MemoryAlloy)。该致动器40位于第二镜筒20之下且一端与第二镜筒20固定连接,另一端固定在透光板50上。该致动器40分别由温度控制设备来控制其温度,本实施方式是通过电源42供电加热来改变温度。本发明优选实施方式采用多个致动器40,每个致动器40之间叠加排列,且与电源42并联连接,从而每个致动器40可作为独立控制单元。
该形状记忆合金是一种具有记忆原来形状机能的材料,其形状记忆的机制与材料本身的相变化(phase transformation)有关。请参见图2,该变形记忆合金在常温下,其晶格为马氏体状态,通过电源供电加热至一定温度时,变形记忆合金在固体状态下,内部分子结构重新排列,其晶格转变为奥氏体状态。停止通电,变形记忆合金会快速冷却,使其晶格又恢复为马氏体状态。变形记忆合金在奥氏体状态转换为马氏体状态时,其将产生变形应力,该变形应力使该变形记忆合金轴向高度发生变化,利用该轴向高度变化可带动第二镜筒20上下移动,从而改变第二镜筒20与第一镜筒10的间距,实现变焦功能。多个致动器40控制变焦时,可通过开关控制接通电源42的致动器40数量,从而实现控制变焦间距。为保持每一致动器40相互独立性,致动器40之间可设置绝热层,从而防止热量相互影响。此外,为有效保证断电情况下,使致动器40在停止通电情况下快速降温,可在致动器外面加设散热片,从而保证致动器40在断电情况下,可通过散热片快速将热量散发,从而使变形记忆合金恢复原始状态。此外,在加热时,该散热片也可防止热量对镜筒内的镜片产生影响。
该种致动器40的变形记忆合金的材质可为铜铝铁(CuAlFe),铜铝镍(CuAlNi),镍钛(NiTi),铜镍钛(CuNiTi),铜镍钛(CuNiTi),铜锆锌(CuZrZn),铜铝锌(CuAlZn),铜铝铁锌(CuAlFeZn),镍钛铝铜(NiTiAlCu),镍钛铝锌(NiTiALZn)及镍钛铝锌铜(NiTiAlZnCu)等任一种或几种组合。该种合金具有较好的形状记忆效应,控制精度较高,且该变形记忆合金所需功耗较低,满足低耗的要求。
透光板50盖在影像感测元件60上,以保护影像感测元件60,避免灰尘水汽等污染该影像感测元件60。该透光板50为一透光玻璃,其一表面可镀覆一层红外截止滤膜(IR-cut Coating),以滤除来自于被摄物反射光线中的红外线,从而提高成像品质。
该影像感测元件60通常可为电荷耦合器(Charge Coupled Device,下称CCD),或者补充性氧化金属半导体(Complementary Metal-OxideSemiconductor,下称CMOS)。该影像感测元件60固定在基座70内,其用以将影像的光信号转变为电信号。
该基座70为一长方型腔体,用以容置影像感测元件60。
组装时,先将影像感测元件60固定在基座70内,再将透光板50盖覆在基座70之上,以保护影像感测元件60.第二镜筒20固定在致动器40的上面,再将致动器40固定在透光板50上.之后,将第一镜筒10通过其外螺纹102与镜座30的内螺纹308配合而螺纹连接在镜座30上,再将组装有第一镜筒10的镜座30固定在基座70上,之后以粘胶或热熔接等方式将镜座30与基座70连接在一起;之后,进行调焦,通过调整第一镜筒10的外螺纹102与镜座30的内螺纹308的连接,以微调第一镜筒10与影像感测元件60的间距,使所述数码相机模组处于一最佳影像摄取状态,最后通过点胶将第一镜筒10固定在镜座30上,致动器40与电源42连接,以提供热能给致动器40,至此,该数码相机模组组装完毕.
工作时,致动器40接通电源42,该致动器40内部的变形记忆合金在电流加热状态下,晶格发生变化,从而轴向高度发生变化,进而带动第二镜筒20轴向变化,从而实现数码相机变焦。为实现一定的变焦范围,可通过控制电源42与致动器40连接数量,以实现变焦距离控制。关掉电源后,该致动器40又恢复到原来形状,第二镜筒20也恢复到初始状态。
可以理解,该致动器40也可应用在数码相机对焦结构中,从而改变镜头与影像传感器60之间距离。
可以理解,该致动器40数量可为单个。
可以理解,该致动器40的变形记忆合金也为块状或片状。
可以理解,该致动器40的变形记忆合金也可为薄膜状,其可成型于基材上,该基板材质可为玻璃、Si、Cu或其它有光泽的金属上,再将Ti,Ni,Al等金属通过直流磁控溅射技术(DC Magnetron sputtering),射频磁控溅镀技术(RF Magnetron sputtering)或高频二极管溅镀技术(RF diode sputtering)成型于基材上,从而形成包含有变形记忆合金的致动器40。
可以理解,该致动器40的位置可位于其它位置,并不限于第二镜筒20的下面,例如,其可为第二镜筒20两侧,而使该致动器40提供第二镜筒20轴向位移。

Claims (10)

1.一种数码相机变焦结构,包括:一第一镜片组,一镜筒,若干致动器,一电源及一镜座,该镜筒内设置第二镜片组,该第一镜片组与该第二镜片组中心对齐;该第一镜片组固定在该镜座内,该镜筒与该镜座可滑动连接;其特征在于:所述若干致动器与该电源并联连接,所述若干致动器与该镜筒固定连接,每一致动器包括一变形记忆合金,该电源可选择地与所述致动器通电加热,使所述致动器在温度条件控制下驱动该镜筒与第一镜片组轴向位移发生变化。
2.如权利要求1所述的数码相机变焦结构,其特征在于:所述若干致动器采用叠加排列方式。
3.如权利要求2所述的数码相机变焦结构,其特征在于:该变形记忆合金材质为铜铝铁,铜铝镍,镍钛,铜镍钛,铜镍钛,铜锆锌,铜铝锌,铜铝铁锌,镍钛铝铜,镍钛铝锌或镍钛铝锌铜中一种或几种组合。
4.如权利要求1所述的数码相机变焦结构,其特征在于:该变形记忆合金为薄膜状。
5.如权利要求4所述的数码相机变焦结构,其特征在于:该变形记忆合金为Ti,Ni,Al金属采用溅镀方法于基材上所得。
6.如权利要求5所述的数码相机变焦结构,其特征在于:该溅镀方法包括直流磁控溅射技术,射频磁控溅镀技术或高频二极管溅镀技术。
7.如权利要求1所述的数码相机变焦结构,其特征在于:该致动器位于该镜筒之下且与该镜筒固定连接。
8.如权利要求1所述的数码相机变焦结构,其特征在于:该数码相机变焦结构进一步包括一透光板,该透光板盖覆于影像感测元件的上面,该致动器固定在透光板上。
9.如权利要求1所述的数码相机变焦结构,其特征在于:该致动器外侧包覆散热片。
10.如权利要求1所述的数码相机变焦结构,其特征在于:该数码相机变焦结构进一步包括另一镜筒,该第一镜片组固定在该镜筒内,该镜筒固定在该镜座内。
CN200510037221A 2005-09-09 2005-09-09 数码相机变焦结构 Expired - Fee Related CN1928612B (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021082529A1 (zh) * 2019-10-28 2021-05-06 华为技术有限公司 一种摄像头模组及终端

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2372428B1 (en) * 2006-03-30 2012-10-10 Cambridge Mechatronics Limited Camera lens actuation apparatus
KR100770866B1 (ko) * 2006-06-01 2007-10-26 삼성전자주식회사 자동 초점조절 장치를 구비하는 카메라 렌즈 모듈
CN101153945A (zh) * 2006-09-29 2008-04-02 鸿富锦精密工业(深圳)有限公司 镜头模组
CN101165527A (zh) * 2006-10-18 2008-04-23 鸿富锦精密工业(深圳)有限公司 便携式电子装置
CN100592126C (zh) * 2006-12-20 2010-02-24 鸿富锦精密工业(深圳)有限公司 镜头模组及相机模组
DE602008005847D1 (de) * 2007-02-12 2011-05-12 Cambridge Mechatronics Ltd Auslösungsvorrichtung für formgedächtnislegierung
JP2009008758A (ja) * 2007-06-26 2009-01-15 Fujinon Corp 撮像デバイス、およびカメラモジュールならびに携帯端末機器
ATE508277T1 (de) * 2007-10-30 2011-05-15 Cambridge Mechatronics Ltd Gedächtnislegierungsbetätigungsvorrichtung
US7652828B2 (en) * 2008-01-02 2010-01-26 Intermec Ip Corp. Zoom lens assembly controlled by shape memory material
US7896249B2 (en) * 2008-01-24 2011-03-01 Intermec Ip Corp. Bar code reader or imager using controlled deformation of flexible optics
TWI368098B (en) * 2008-03-27 2012-07-11 E Pin Optical Industry Co Ltd Electromagnet for lens driving mechanism thereof
GB2481146B (en) * 2008-07-30 2012-05-23 Cambridge Mechatronics Ltd Shape memory alloy actuation apparatus
US20100328015A1 (en) * 2009-06-26 2010-12-30 Nokia Corporation Apparatus for coupling an actuator
CN103307971B (zh) * 2012-03-14 2018-07-06 鸿富锦精密工业(深圳)有限公司 光学装置及应用该光学装置的影像测量仪
CN103584830A (zh) * 2013-11-14 2014-02-19 南京航空航天大学 一种可调焦内窥胶囊及系统
US9451137B2 (en) * 2014-08-21 2016-09-20 Omnivision Technologies, Inc. PCB-mountable lens adapter for a PCB-mountable camera module
CN104683671B (zh) * 2015-02-04 2017-11-14 广东欧珀移动通信有限公司 电子装置
WO2016195403A1 (ko) * 2015-06-03 2016-12-08 엘지이노텍(주) 렌즈 배럴 및 이를 포함하는 카메라 모듈
EP3340601B1 (en) * 2015-08-17 2019-12-18 LG Innotek Co., Ltd. Camera module
KR102528490B1 (ko) * 2015-10-30 2023-05-04 엘지이노텍 주식회사 렌즈의 온도 제어가 가능한 히터가 증착된 카메라 모듈
EP3390964B1 (en) * 2015-12-15 2020-03-04 Trimble AB Surveying instrument with optical stage compensating for temperature variations
US11078562B2 (en) * 2016-01-19 2021-08-03 Verispellis Skis & Snowboards, Inc. Digitally controlled variable stiffness sporting equipment
GB201603619D0 (en) * 2016-03-02 2016-04-13 Cambridge Mechatronics Ltd SMA wire handling with air suction
US20170290170A1 (en) * 2016-03-30 2017-10-05 Delphi Technologies, Inc. Method Of Making A Camera For Use On A Vehicle
CN110199119B (zh) * 2016-12-16 2022-11-18 哈钦森技术股份有限公司 一种悬架组件
KR20230035711A (ko) 2016-12-16 2023-03-14 허친슨 테크놀로지 인코포레이티드 광학 이미지 안정화 서스펜션에서의 센서 이동 구조
CN107241549A (zh) * 2017-06-16 2017-10-10 广东欧珀移动通信有限公司 双摄像头的成像方法和成像装置
JP6983550B2 (ja) * 2017-06-29 2021-12-17 日本電産サンキョー株式会社 振れ補正機能付き光学ユニットおよび振れ補正機能付き光学ユニットの製造方法
TWI712829B (zh) * 2017-08-25 2020-12-11 揚明光學股份有限公司 光學鏡頭
CN107493421B (zh) * 2017-09-30 2020-09-11 北京小米移动软件有限公司 摄像头模组、电子设备、摄像头模组控制方法及装置
US10809524B2 (en) 2018-01-08 2020-10-20 Facebook Technologies, Llc Varifocal apparatuses, systems, and methods employing a deformable stepped lens
EP3570103B1 (en) 2018-05-17 2020-07-01 Axis AB Camera arrangement and method for aligning a sensor board and an optics unit
CN111479043A (zh) * 2020-04-10 2020-07-31 Oppo广东移动通信有限公司 摄像模组和电子装置
US11194115B1 (en) 2020-09-02 2021-12-07 Hutchinson Technology Incorporated Guided autofocus assembly
CN116324562A (zh) * 2021-07-21 2023-06-23 核心光电有限公司 弹出式移动摄像机和致动器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2290151A (en) * 1994-06-06 1995-12-13 Satish Kumar Karra Flexible lens mounted in shape memory alloy wire

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4860040A (en) * 1987-06-19 1989-08-22 Canon Kabushiki Kaisha Camera
TW332348B (en) * 1992-06-23 1998-05-21 Sony Co Ltd Manufacturing method for solid state motion picture device provides a highly accurate and low cost solid state motion picture device by use of empty package made of resin.
US5995295A (en) * 1995-12-13 1999-11-30 Olympus Optical Co., Ltd. Lens system
JP3783410B2 (ja) * 1998-05-28 2006-06-07 コニカミノルタフォトイメージング株式会社 補正光学装置
US6832477B2 (en) * 2000-05-08 2004-12-21 Mark A Gummin Shape memory alloy actuator
US6449434B1 (en) * 2001-01-11 2002-09-10 Eastman Kodak Company Lens displacement or other control using shaped memory alloy driver
US6914635B2 (en) * 2001-02-08 2005-07-05 Nokia Mobile Phones, Ltd. Microminiature zoom system for digital camera
TW556038B (en) * 2001-06-29 2003-10-01 Arc Design Inc Control system of zoom lens for digital still cameras
EP1441215B1 (en) * 2001-10-31 2012-08-01 Olympus Corporation Optical scanning type observation device
AU2003244145A1 (en) * 2003-06-27 2005-01-13 Nokia Corporation Camera lens-positioning device using shape memory alloy and camera using the device
JPWO2005019897A1 (ja) * 2003-08-21 2007-11-01 コニカミノルタオプト株式会社 撮像装置
JP3728311B2 (ja) * 2003-10-14 2005-12-21 キヤノン株式会社 光学機器
JP2005195845A (ja) * 2004-01-07 2005-07-21 Alps Electric Co Ltd 撮像装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2290151A (en) * 1994-06-06 1995-12-13 Satish Kumar Karra Flexible lens mounted in shape memory alloy wire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021082529A1 (zh) * 2019-10-28 2021-05-06 华为技术有限公司 一种摄像头模组及终端

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