CN1894343B - Inorganic powder-containing resin composition, film-forming material layer, transfer sheet, method for producing substrate provided with dielectric layer, substrate provided with dielectric layer, and - Google Patents
Inorganic powder-containing resin composition, film-forming material layer, transfer sheet, method for producing substrate provided with dielectric layer, substrate provided with dielectric layer, and Download PDFInfo
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- CN1894343B CN1894343B CN2004800376103A CN200480037610A CN1894343B CN 1894343 B CN1894343 B CN 1894343B CN 2004800376103 A CN2004800376103 A CN 2004800376103A CN 200480037610 A CN200480037610 A CN 200480037610A CN 1894343 B CN1894343 B CN 1894343B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/38—Dielectric or insulating layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
- H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
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- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
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Abstract
Disclosed is an inorganic powder-containing resin composition which is excellent in deforming during the firing step and has a remarkable effect in preventing air bubbles from remaining in a dielectric layer. The inorganic powder-containing resin composition enables to form a dielectric layer having a high light transmittance and excellent optical characteristics, since the inorganic powder-containing resin composition causes no defect or cloud after firing even when it is fired in a low temperature range. The inorganic powder-containing resin composition contains an inorganic powder, a binder resin, and at least one metal compound selected from the group consisting of alkali metal compounds, alkaline earth metal compounds and lead compounds.
Description
Technical field
The present invention relates to be suitable for form the resin combination that contains inorganic powder of the dielectric layer of plasma display panel, film forming material layer and the transfer printing sheet that uses this resin combination to make, more particularly, relate to the new resin combination that contains inorganic powder, film forming material layer, transfer printing sheet, the manufacture method that has formed the substrate of dielectric layer, the substrate that has formed dielectric layer and the plasma display panel that can form high-quality dielectric layer with good optical properties.
Background technology
In recent years, in the technical field of plasma display panel, the plasma display panel (below be also referred to as " PDP ") that can be easy to realize the indicating meter of large-scale and light and thin type just is being subjected to people's attention, and the demand of its display equipment of using as family-friendly large-scale wall hung television is expected to enlarge.Usually, PDP constitutes by front panel and back panel are fitted, and in AC type PDP, is formed with electrode pattern, its surface on the surface of the glass substrate of formation front panel and is covered by transparent dielectric layer and constitute.Up to now, as the formation method of this dielectric layer, use be repeatedly to be coated on the glass substrate that is fixed with electrode until silk screen print method that obtains specific thickness etc. by the paste composition that will comprise inorganic powder, bonding (wedding agent) resin and solvent etc.But, in so multiple printing that utilizes silk screen print method, be difficult to control the fluctuation of thickness, owing to be involved in airborne tiny dust etc., it is poor to cause producing in the dielectric layer behind the sintering defective, complicated operation and scale operation when being coated with paste composition repeatedly.
Therefore,, proposed on support membrane, will comprise the above-mentioned paste composition coating flakiness shape of inorganic powder, made its drying then, obtained being pressed with the transfer film of film forming material layer on the support membrane upper strata in order to solve the problem that above-mentioned silk screen printing causes.Use this transfer film, to be formed at film forming material layer collective transfer on the support membrane to the surface of the glass substrate that is fixed with electrode, by the film forming material layer that sintering is transferred, on above-mentioned glass baseplate surface, form the method (consulting patent documentation 1) of dielectric layer.
Up to now, form dielectric layer about using such transfer film, for the characteristic that improves resulting dielectric layer is that purpose has been carried out various researchs.Wherein, in order to realize the high briliancy high image quality of PDP, the dielectric layer that is used as the indicating meter component parts requires to have higher transmittance, promptly transparent, therefore, in order to improve the transmittance of dielectric layer, the improvement of employed adhesive resin in the glass paste composition etc. is studied.
For example, disclose in above-mentioned glass paste composition, by comprising acrylic resin at adhesive resin, so that glass powder dispersive method stably with hydrophilic group.Wherein put down in writing above-mentioned glass paste composition owing in this glass paste composition, do not produce the agglutinator of glass powder, thereby can not produce film defective etc. by said composition being configured as the laminar film forming material layer that obtains, by this film forming material layer is carried out sintering processes, can obtain having (the consulting patent documentation 2) such as glass sintering bodies of high transmission rate.
Patent documentation 1: Japanese patent laid-open 9-102273 communique
Patent documentation 2: Japanese patent laid-open 10-324541 communique
Summary of the invention
The problem that invention will solve
But, when employed glass paste composition is made transfer film in the formation of using known dielectric layer in the past, when on support membrane, being formed into membrane layers, be blended in this film forming material layer bubble and in sintering circuit because the bubble that decomposition produced of organic composition in the film forming material layer, when sintering, can not fully be discharged and residual as trickle bubble in dielectric layer, make dielectric layer produce muddy and cause the reduction of transmittance.In addition, when the viscosity of the glass powder that is used to form dielectric layer during in fusion is high, the gas that bubble or organic composition produced that is present in film forming material layer inside becomes the vestige that bubble discharges and becomes defectives such as shrinkage cavity or pin hole, becomes the reason of dielectric layer surface roughen.
In addition, in the formation of dielectric layer, the distortion of the glass substrate that heat caused when preventing sintering and in order to prevent to be formed on the corrosion of the electrode pattern on this glass substrate, thereby require to carry out sintering in low temperature range, and during the made paste composition of the high glass powder of the viscosity when using fusion, the bubble of intrinsic bubble or generation is difficult to be discharged from when low temperature range is carried out sintering more in the formed film forming material layer by this paste composition, residual bubble produces detrimentally affect to the optical characteristics of dielectric layer, and this becomes problem.
The method of dealing with problems
The present invention makes in order to solve above-mentioned the problems of the prior art, the inventor finds, as the resin combination that contains inorganic powder, except inorganic powder and adhesive resin, be selected from least a metallic compound in alkali metal compound, alkaline earth metal compound and the lead compound by interpolation, the very good effect of performance in the deaeration in sintering circuit (bubble discharge), thus the present invention finished.The resin combination that contains inorganic powder of the present invention particularly has significant effect at the bubble that prevents dielectric layer aspect residual, thereby, when using by the made transfer printing sheet of the resin combination that utilizes this to contain inorganic powder, even carry out sintering in low temperature range (for example below 600 ℃ or 600 ℃), behind sintering, can not produce defective or muddiness yet, form the dielectric layer of excellent optical performance with high transmission rate.
That is, the resin combination that contains inorganic powder of the present invention is characterized in that: comprise inorganic powder, adhesive resin and be selected from least a metallic compound in alkali metal compound, alkaline earth metal compound and the lead compound.
Above-mentioned alkali metal compound is preferably and is selected from least a in lithium compound, potassium compound and the sodium compound.
In the present invention, above-mentioned inorganic powder is preferably glass powder, and above-mentioned adhesive resin is preferably (methyl) acrylic resin.In addition, the viscosity of inorganic powder under 600 ℃ is preferably below the 150Pas.
In addition, the invention still further relates to by the above-mentioned resin combination that contains inorganic powder being formed the laminar film forming material layer that obtains, and relate on the support membrane upper strata and press the transfer printing sheet of stating the film forming material layer and obtaining.
In addition, the present invention relates to comprise film forming material layer with above-mentioned transfer printing sheet be transferred on the substrate and this film forming material layer is carried out sintering processes operation formation the manufacture method of substrate of dielectric layer, and the formation of making by aforesaid method the substrate of dielectric layer.The above-mentioned transmittance that has formed the substrate of dielectric layer is preferably more than 80%, more preferably more than 81%, is preferably more than 82% especially.
In addition, the invention still further relates to the above-mentioned plasma display panel that has formed the substrate of dielectric layer of use.
The invention effect
The resin combination of inorganic powder that contains of the present invention is except comprising inorganic powder and adhesive resin, also comprise at least a metallic compound that is selected from alkali metal compound, alkaline earth metal compound and the lead compound as additive, utilize the effect of this additive in sintering circuit, to promote deaeration, thereby can residual bubble in the dielectric layer behind sintering.Particularly, even the resin combination that contains inorganic powder of the present invention also is effective when the low temperature range below 600 ℃ or 600 ℃ is carried out sintering, and behind sintering, can not producing, and the dielectric layer formation substrate that can make dielectric layer and be formed with this dielectric layer with high transmission rate owing to defective or muddinesses such as caused shrinkage cavity of bubble or pin holes.
Embodiment
Below, the present invention will be described in detail.The resin combination that contains inorganic powder of the present invention also comprises at least a metallic compound in alkali metal compound, alkaline earth metal compound and the lead compound of being selected from as additive except comprising inorganic powder and adhesive resin.Therefore, be transferred on the glass substrate that is formed with electrode pattern will having the transfer printing sheet that contains the formed film forming material layer of resin combination of inorganic powder of the present invention, and the film forming material layer that is transferred carried out in the agglomerating operation, the ability that the organic composition of above-mentioned film forming material layer decomposes the gas that produces and the deaeration when sintering of inherent bubble is good.In addition, behind sintering, because can residual bubble, thereby in dielectric layer, can not produce defective or muddiness, and can form the dielectric layer of excellent optical characteristics with high transmission rate.
In addition, the present invention particularly can not produce because the distortion of the glass substrate that causes of heat and to be formed in the sintering of low temperature range (for example below 600 ℃ or 600 ℃) of the problems such as corrosion of the electrode pattern on this glass substrate be effective.
The resin combination that contains inorganic powder of the present invention, it is characterized in that: except comprising inorganic powder and adhesive resin, for at least a metallic compound that promotes deaeration, prevent that bubble from remaining in the dielectric layer, can also comprise to be selected from alkali metal compound, alkaline earth metal compound and the lead compound as additive.
In the present invention, alkali metal compound, alkaline earth metal compound and lead compound are not the material (for example plumbous oxide etc.) that is meant that the constituent as glass powder described later comprises in advance, but in order to prevent that bubble from remaining in the dielectric layer, to the resin combination that contains inorganic powder of the present invention, separate with glass powder and add in addition, these compounds can use separately or with 2 kinds or multiple being used in combination.
Employed alkali metal compound can use oxide compound, superoxide, oxyhydroxide, inorganic salt and the organic salt of lithium, sodium, potassium, rubidium, caesium and francium among the present invention.As sodium compound, specifically can list sodium oxide, sodium peroxide, sodium hydroxide, sodium-chlor, Sodium Bromide, sodium iodide, Sodium Fluoride, yellow soda ash, sodium bicarbonate, sodium sulfate, S-WAT, SODIUMNITRATE, Sodium Nitrite, sodium-acetate, Sodium Propionate, Sodium propanecarboxylate, anhydrous sodium phosphate etc.In addition, as potassium compound, specifically can list potassium oxide, Potassium peroxide, potassium hydroxide, Repone K, Potassium Bromide, potassiumiodide, Potassium monofluoride, salt of wormwood, saleratus, vitriolate of tartar, potassium sulfite, saltpetre, potassium nitrite, Potassium ethanoate, potassium propionate, potassium butyrate, potassiumphosphate etc.For other alkali metal compound, also can list same compound.Wherein, from the transmittance that demonstrates significant effect, raising dielectric layer aspect the deaeration, preferably use lithium compound or sodium compound or potassium compound.Especially, by using sodium hydroxide or potassium hydroxide, the transmittance that dielectric layer can be formed substrate is controlled at 81% or more than it.
As employed alkaline earth metal compound among the present invention, can use oxide compound, superoxide, oxyhydroxide, inorganic salt and the organic salt of beryllium, magnesium, calcium, strontium, barium, radium.
As magnesium compound, specifically can list magnesium oxide, Magnesium peroxide, magnesium hydroxide, magnesium chloride, magnesium bromide, magnesium iodide, magnesium fluoride, magnesiumcarbonate, Magnesium hydrogen carbonate, sal epsom, magnesium sulfite, magnesium nitrate, magnesium nitrite, magnesium acetate, propionic acid magnesium, magnesium butyrate, anhydrous magnesium phosphate etc.In addition, as calcium cpd, specifically can list calcium oxide, calcium peroxide, calcium hydroxide, calcium chloride, Calcium Bromide, calcium iodide, Calcium Fluoride (Fluorspan), lime carbonate, Calcium hydrogen carbonate, calcium sulfate, calcium sulfite, nitrocalcite, calcium nitrite, calcium acetate, calcium propionate, Calcium Butyrate, calcium phosphate etc.For other alkaline earth metal compound, also can list same compound.Wherein,, preferably use magnesium compound or calcium cpd, especially preferably use magnesium oxide or calcium oxide from the transmittance that demonstrates significant effect, raising dielectric layer aspect the deaeration.
Of the present inventionly contain the alkali metal compound that added in the resin combination of inorganic powder or the ratio of alkaline earth metal compound has no particular limits, for example with respect to 100 weight part inorganic powders, be preferably 0.01 weight part～10 weight parts, more preferably 0.05 weight part～1.0 weight parts.When the addition of alkali metal compound or alkaline earth metal compound during with respect to 100 weight part inorganic powder less thaies, 0.01 weight part, in sintering circuit, lack the deaeration effect, bubble remains in the dielectric layer and can not obtain high transmission rate, so it is not preferred, on the other hand, when the addition of alkali metal compound or alkaline earth metal compound surpasses 10 weight parts with respect to 100 weight part inorganic powders, alkali metal compound or alkaline earth metal compound spot segregation in the film forming material layer in sintering circuit, not decomposed these compounds of removing fully behind sintering stays in the dielectric layer as residue and residual, optical characteristics causes the surface smoothing deterioration when reducing, so not preferred.
In addition, as employed lead compound among the present invention, oxide compound, superoxide, oxyhydroxide, inorganic salt, organic salt can be used, specifically, plumbous oxide, lead peroxide, lead hydroxide, lead chloride, lead bromide, lead iodide, lead nitrate, plumbic acetate etc. can be listed.Wherein, from the transmittance that demonstrates significant effect, raising dielectric layer aspect the deaeration, preferably use plumbous oxide.By using plumbous oxide, the transmittance that dielectric layer can be formed substrate is controlled at 81% or more than it.
The ratio that contains the above-mentioned lead compound that is added in the resin combination of inorganic powder of the present invention has no particular limits, and for example with respect to 100 weight part inorganic powders, is preferably 0.01 weight part～10 weight parts, more preferably 0.1 weight part～6 weight parts.When the addition of above-mentioned lead compound during with respect to 100 weight part inorganic powder less thaies, 0.01 weight part, in sintering circuit, lack the deaeration effect, bubble remains in the dielectric layer and can not obtain high transmission rate, so it is not preferred, on the other hand, when the addition of lead compound surpasses 10 weight parts with respect to 100 weight part inorganic powders, lead compound spot segregation in the film forming material layer in sintering circuit, being decomposed these compounds remove behind sintering fully becomes residue and residual and stays in the dielectric layer, optical characteristics causes the surface smoothing deterioration when reducing, so not preferred.
Inorganic powder of the present invention can use known inorganic powder, and not special restriction specifically, can list silicon oxide, titanium oxide, aluminum oxide, calcium oxide, boron oxide, zinc oxide, glass powder etc.These inorganic powders are from dispersion stabilization, and preferred median size is 0.1～10 μ m.
In the present invention, preferably use glass powder,, can use known glass powder, not special restriction as glass powder as inorganic powder.For example, can list: 1) zinc oxide, boron oxide, silicon oxide (ZnO-B
2O
3-SiO
2System) mixture, 2) zinc oxide, boron oxide, silicon oxide, aluminum oxide (ZnO-B
2O
3-SiO
2-Al
2O
3System) mixture, 3) plumbous oxide, boron oxide, silicon oxide, calcium oxide (PbO-B
2O
3-SiO
2-CaO system) mixture, 4) plumbous oxide, boron oxide, silicon oxide, aluminum oxide (PbO-B
2O
3-SiO
2-Al
2O
3System) mixture, 5) plumbous oxide, zinc oxide, boron oxide, silicon oxide (PbO-ZnO-B
2O
3-SiO
2System) mixture, 6) plumbous oxide, zinc oxide, boron oxide, silicon oxide, aluminum oxide (PbO-ZnO-B
2O
3-SiO
2-Al
2O
3System) mixture etc.In addition, can also add Na as required
2O, CaO, BaO, Bi
2O
3, SrO, TiO
2, CuO or In
2O
3Deng.
In addition, if consider to use above-mentioned glass powder to form dielectric layer by sintering processes, preferred softening temperature is at the glass powder of 400～650 ℃ of scopes.Wherein, as the purposes that forms dielectric layer, the inorganic powder that uses among the present invention is preferably viscosity under 600 ℃ at 150Pas or the glass powder below it, more preferably 20Pas～140Pas.On the other hand, when the viscosity of above-mentioned glass powder under 600 ℃ surpasses 150Pas, even by adding as the above-mentioned alkali metal compound of the peculiar additive of the present invention etc., thereby can effectively remove bubble and obtain high transmission rate, also can be in dielectric layer the discharge vestige of residual this bubble, can not obtain good surface smoothness.
Employed adhesive resin can use known adhesive resin among the present invention, not special restriction, but make the viewpoint that conforms to necessary difference absorptivity of the electrode pattern that is formed on the substrate and transfer printing as the film forming material layer of transfer printing sheet from raising, preferred (methyl) acrylic resin especially preferably has (methyl) acrylic resin of carboxyl.By compendency, the raising intensity that in (methyl) acrylic resin, imports carboxyl, can improve the transfer printing sheet that is formed with the film forming material layer, and the surface smoothing of the dielectric layer behind the raising sintering.
With respect to the inorganic powder of 100 weight parts, the content of the above-mentioned adhesive resin in the resin combination that contains inorganic powder of the present invention is suitably 5 weight parts～50 weight parts, is preferably 10 weight parts～40 weight parts, more preferably 15 weight parts～30 weight parts.When the content of adhesive resin during, be difficult to inorganic powder is formed laminar film forming material layer, on the other hand with respect to 100 weight part inorganic powder less thaies, 5 weight parts, when surpassing 50 weight parts, cause the thin slice distortion easily, so the shape stability deterioration during preservation is not preferred.
Above-mentioned (methyl) acrylic resin preferable weight-average molecular weight as adhesive resin is 50,000～500,000 in the present invention, further preferred 50,000～300,000.When the weight-average molecular weight less than 50,000 of above-mentioned (methyl) acrylic resin, when the resin combination that will contain inorganic powder is coated on the film forming material layer that forms thin slice on the support membrane, cause the strength deterioration of above-mentioned film forming material layer even break, in addition, when as the transfer printing sheet, cause obtaining the sufficient transfer printing to substrate, operability reduces, so not preferred.On the other hand, when the weight-average molecular weight of above-mentioned (methyl) acrylic resin surpassed 500,000, the viscosity that contains the resin combination of inorganic powder raise, and the dispersiveness of inorganic powder worsens, so not preferred.
Above-mentioned (methyl) acrylic resin can be acrylic monomer and/or the multipolymer of methacrylic polymer of monomers, above-mentioned monomer and other polymerizable monomer or their mixture.In addition, in the present invention, particularly from the viewpoint of the surface smoothing that improves dielectric layer, preferably by making above-mentioned monomer and carboxylic monomer copolymerization make carboxylic (methyl) acrylic resin.
As the specific examples of above-mentioned (methyl) acrylic monomer, can list (methyl) methyl acrylate, (methyl) ethyl propenoate, (methyl) propyl acrylate, (methyl) isopropyl acrylate, (methyl) butyl acrylate, (methyl) isobutyl acrylate, (methyl) tert-butyl acrylate, (methyl) vinylformic acid pentyl ester, (methyl) vinylformic acid n-pentyl ester, (methyl) vinylformic acid isopentyl ester, (methyl) Ethyl acrylate, (methyl) vinylformic acid heptyl ester, (methyl) Octyl acrylate, (methyl) Isooctyl acrylate monomer, (methyl) EHA, (methyl) vinylformic acid ester in the ninth of the ten Heavenly Stems, (methyl) decyl acrylate, (methyl) isodecyl acrylate, (methyl) vinylformic acid undecyl ester, (methyl) dodecylacrylate, (methyl) lauryl acrylate, (methyl) stearyl acrylate ester, (methyl) alkyl acrylates such as the different stearyl ester of (methyl) vinylformic acid; And (methyl) vinylformic acid aryl ester such as (methyl) phenyl acrylate, (methyl) vinylformic acid tolyl ester etc.
As the above-mentioned specific examples that contains carboxylic monomer, can list (methyl) vinylformic acid, 2-methyl cis (methyl) vinylformic acid, allyl acetic acid, citric acid, toxilic acid, methyl-maleic acid, fumaric acid, methylfumaric acid, dimethyl fumarate, methylene-succinic acid and vinyl acetate etc.In the present invention, particularly, preferably use these to contain the monomer of carboxyl in order to improve the surface smoothing of dielectric layer.
Above-mentioned (methyl) acrylic resin preferably comprises the carboxylic monomer that contains of 0.1～10 mole of %.When above-mentioned 0.1 mole of % of ratio less than that contains carboxylic monomer of being comprised, be formed at the weary cohesive force of film forming material break on the support membrane, intensity difference as the transfer printing sheet, so it is not preferred, on the other hand, when surpassing 10 moles of %, when sintering, be difficult to be decomposed and remove, so the tendency that the optical characteristics reduction that causes dielectric layer is arranged is not preferred.
In addition, the glass transition temperature of above-mentioned (methyl) acrylic resin is preferably 30 ℃ or below it, more preferably 20 ℃ or below it.When above-mentioned glass transition temperature surpassed 30 ℃, formation did not possess flexual thin slice when making the transfer printing sheet, lacks difference absorptivity and transfer printing, and operability reduces, so not preferred.In addition, the glass transition temperature of above-mentioned (methyl) acrylic ester resin can be adjusted to 30 ℃ or below it by the proportion of composing of the employed polymkeric substance of appropriate change.
In the present invention, when manufacturing is applied to the transfer printing sheet that is formed into membrane layers on the support membrane by the resin combination that will contain inorganic powder, preferably in said composition, add solvent so that it can be uniformly applied on the support membrane.
As employed solvent among the present invention, so long as and inorganic powder have affinity and get final product with the good solvent of the solvability of adhesive resin, do not limit especially.Can list for example terpinol, dihydro-α-terpinol, dihydro-α-terpenyl acetic ester, acetate of butyl carbitol, diethylene glycol monobutyl ether, Virahol, phenylcarbinol, turps, diethyl ketone, methyl butyl ketone, two acetone, pimelinketone, Pentyl alcohol, 4-methyl-2-amylalcohol, hexalin, diacetone alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, dihydroxypropane single-ether, n-butyl acetate, amyl acetate-n, methylcellosolve acetate, ethyl cellosolve acetate, propylene glycol methyl ether acetate, ethyl-3-ethoxy-c acid esters, 2,2,4-trimethylammonium-1,3-pentanediol-1-isobutyl ester, 2,2,4-trimethylammonium-1,3-pentanediol-3-isobutyl ester etc.These solvents can use separately, also can two or more be mixed with arbitrary proportion and use.
The addition of employed above-mentioned solvent among the present invention with respect to 100 weight part inorganic powders, is preferably 10 weight parts～100 weight parts, and more preferably 20 weight parts～70 weight parts are preferably 30 weight parts～50 weight parts especially.When addition less than 10 weight parts of solvent, inorganic powder is difficult to disperse, and when making the transfer printing sheet, the film forming material layer becomes fragile, thin slice plasticity variation, thus not preferred, when surpassing 100 weight parts, it is insufficient that the drying of transfer printing sheet can become, on being transferred to substrate and when using sintering oven to carry out sintering, owing to the solvent of evaporation causes the deterioration of operating environment, so not preferred.
In addition, in the resin combination that contains inorganic powder of the present invention, can add softening agent.By adding softening agent, can adjust the resin combination that will contain inorganic powder and be coated on the pliability of the transfer printing sheet that is formed into membrane layers on the support membrane and makes and flexibility, film forming material layer to the transfer printing of substrate etc.
The addition of above-mentioned softening agent of the present invention is 20 weight parts or below it with respect to 100 weight part inorganic powders, is preferably 15 weight parts or below it, more preferably 10 weight parts or below it.When the addition of softening agent surpassed 20 weight parts, the intensity of resulting transfer printing sheet reduced, so not preferred.
In the resin combination that contains inorganic powder of the present invention, except mentioned component, can also add various additives such as silane coupling agent, binding property imparting agent, flow agent, stablizer, defoamer.
Transfer printing sheet of the present invention is by support membrane and the film forming material layer that is formed at least on this support membrane is constituted, and can be used for and will be formed on film forming material layer collective transfer on the support membrane to substrate surface.
Above-mentioned transfer printing sheet can be made by the following method: the above-mentioned resin combination that contains inorganic powder is applied on the support membrane, and dry removing desolvated, and is formed into membrane layers.
The support membrane that constitutes transfer printing sheet of the present invention is preferably to have thermotolerance and solvent resistance and has flexual resin molding.By making support membrane have pliability, can under the state that the film forming material layer is rolled into the cylinder shape, preserve, supply with the resin combination that contains inorganic powder of coating pasty states such as roller coating machine.
As the resin that forms support membrane used in the present invention, for example can list vibrin such as polyethylene terephthalate; Polyolefin resin such as polyethylene, polypropylene; Fluorine resins such as polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride or fluorinated ethylene propylene, nylon, Mierocrystalline cellulose etc.
The thickness of above-mentioned support membrane has no particular limits, and in order stably to keep the shape of transfer printing sheet, is preferably the scope of 25 μ m～100 μ m.
In addition, preferably the demoulding being implemented on the surface of above-mentioned support membrane handles.By such processing, can in the operation that the film forming material layer is transferred on the substrate, easily carry out the strip operation of support membrane.
The method that the resin combination that contains inorganic powder of the present invention is applied on the above-mentioned support membrane can adopt print roll coatings such as intaglio plate, seam formula, funny point type; The coating of mould such as slit, fountain; Extrusion coated; Coating processes such as curtain formula coating, to film uniformly just can be any method as long as can form on support membrane.
The thickness of the formed film forming material layer of resin combination that contains inorganic powder of the present invention is different and different according to the containing ratio of inorganic powder, the kind of substrate that forms dielectric layer and size, is preferably 10 μ m～200 μ m, more preferably 30 μ m～100 μ m.When this thickness less than 10 μ m, the thickness of the final dielectric layer that forms is insufficient, and existence can not be guaranteed the tendency of desirable dielectric characteristics, when surpassing 200 μ m, be difficult to keep the shape of transfer printing sheet, under the state that the film forming material layer is rolled into the cylinder shape, lack storage stability, so not preferred.Usually, if when the thickness of this film forming material layer is 30 μ m～100 μ m, behind sintering, can fully guarantee the desired thickness of dielectric layer among the PDP.And then the thickness of this film forming material layer is even more just preferred more, the tolerance error of thickness is preferably ± 5% or in.
In addition, the transfer printing sheet among the present invention can also be provided with protective membrane on the surface of above-mentioned film forming material layer.As the formation material of protective membrane, can list for example polyester based resin such as polyethylene terephthalate; Polyolefin-based resins such as polyethylene, polypropylene; Fluorine resins such as polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, fluorinated ethylene propylene, nylon, Mierocrystalline cellulose etc.Can under the state that is rolled into the cylinder shape, be preserved, supply by the transfer printing sheet that this protective membrane is covered with.In addition, can also implement the demoulding to the surface of this protective membrane handles.
The manufacture method that dielectric layer of the present invention forms substrate comprises: the film formation material layer of the transfer printing sheet of above-mentioned record is transferred to transfer printing process on the substrate, and for example under 400 ℃～650 ℃ the film forming material layer that is transferred is carried out sintering, forms the sintering circuit of dielectric layer on substrate.
In the present invention, the substrate as forming dielectric layer can list substrates such as pottery or metal, particularly in the situation of making PDP, can use the glass substrate that is fixed with suitable electrode.
Provided the example that film forming material layer of the present invention is transferred to the operation on the above-mentioned glass substrate below, still, formed tacky state on the substrate surface as long as the film forming material layer can be transferred to, this method just has no particular limits.
After the protective membrane of the suitable transfer printing sheet that uses among the present invention peeled off; on the surface of the glass substrate that is fixed with electrode; overlapping transfer printing sheet also makes the AN glass baseplate surface dock with the film forming material laminar surface; by heating the roll-type laminator, peel off from the film forming material layer and remove support membrane after this transfer printing sheet thermocompression bonded.By this processing, the film forming material layer is transferred to and forms tacky state on the glass baseplate surface.
The transfer printing condition of above-mentioned film forming material layer is: for example the surface temperature of laminator is that 25 ℃～100 ℃, roller line pressure 0.5kg/cm～15kg/cm, translational speed are 0.1m/ minute～5m/ minute, but is not limited to these conditions.In addition, can carry out preheating to glass substrate, preheating temperature can be in 60 ℃～100 ℃ scope.
Only provided an example of the sintering circuit of film forming material layer of the present invention below, but, so long as can form the method for dielectric layer by sintering membrane layers under the suitable heating on substrate, its method just is not particularly limited.
Be arranged on by the glass substrate that is formed with the film forming material layer under for example 400 ℃～650 ℃ the atmosphere gas above-mentioned record, organic substance in the film forming material layer (adhesive resin, additive, residual solvent etc.) is decomposed and removes, inorganic powder (glass powder) molten sintering.By this processing, on glass substrate, form by the formed dielectric layer of inorganic sintered body (glass sintering body), form substrate thereby make dielectric layer of the present invention.
The thickness that above-mentioned dielectric layer forms the dielectric layer in the substrate can be the scope of 15 μ m～50 μ m according to the difference of the thickness of employed film forming material layer and different.
Use the resulting dielectric layer of resin combination that contains inorganic powder of the present invention to form substrate, on the dielectric layer surface, can not produce defectives such as shrinkage cavity or pin hole, and there is not muddiness, thereby also good in the optical characteristics of transmittance etc., be particularly suitable for forming the dielectric layer that is arranged on the PDP front panel.
Embodiment
Below, by enumerating embodiment and comparative example further specifies the present invention, but the present invention is not restricted to these embodiment.
(mensuration of weight-average molecular weight)
The polymkeric substance of the manufacturing concentration with 0.1 weight % is dissolved among the THF, uses GPC (gel permeation chromatography) to measure weight-average molecular weight by polystyrene conversion.In addition, " the HLC-8220 GPC " that employed GPC makes for Tosoh company, " TSK gel Super HZM-H, H-RC, the HZ-H " that chromatographic column is made for Tosoh company uses THF as elutriant.The flow of elutriant at this moment is 0.6mL/min, and injection rate is 20 μ L, and column temperature is 40 ℃.
(mensuration of glass transition temperature)
With the forming polymer of manufacturing is that 1mm is thick, bores a hole to be φ 8mm, uses Measurement of Dynamic Viscoelasticity device (manufacturings of レ オ メ ト リ Star Network ス company), the frequency measurement loss resilience modulus G of use 1Hz " temperature dependency.With resulting loss resilience modulus G " curve in peak temperature as glass transition temperature Tg.
(mensuration of the melt viscosity of glass powder)
Use parallel plate distortion/rotational viscosimeter (manufacturing of ア グ ネ technique center, ProductName " WRVM-313 changes ") as determinator, it is the glass viscosity determinator, the viscosity of the glass powder under measuring 600 ℃.To put into platinum tube container then as the glass powder fusion of sample down at 1000 ℃, the above-mentioned sample of refrigerative will be shaped as round shape.This is become columnar this specimen holder on the parallel disk of φ 30mm, be heated to 600 ℃, measuring the disk gap is 1.3mm, and revolution is the viscosity under the 60rpm.
[embodiment 1]
The preparation of＜(methyl) acrylic resin 〉
Having agitating vane, thermometer, nitrogen conduit, condenser, (common prosperity chemical company makes to add 99 weight part methacrylic acid 2-(ethyl hexyl) esters in the four-hole boiling flask of dropping funnel, trade(brand)name " LIGHTESTER EH "), (common prosperity chemical company makes 1 weight part 2-methacryloxyethyl succsinic acid, trade(brand)name " LIGHTESTERHOMS "), polymerization starter and toluene, slowly stir on one side and import nitrogen on one side, liquid temperature in the flask is remained near 75 ℃, carry out about 8 hours polyreaction, the preparation solids component is that the methacrylic of 50 weight % is a resin solution.The weight-average molecular weight of resulting metha crylic resin is 100,000, and glass transition temperature is-10 ℃.
＜contain the preparation of the resin combination of inorganic powder 〉
Mix the PbO-B of 100 weight parts as inorganic powder
2O
3-SiO
2-ZnO-Al
2O
3(glass transition temperature is 420 ℃ at the glass frit end, softening temperature is 480 ℃), the above-mentioned metha crylic resin of 16 weight parts, 40 weight parts be as the α-terpinol (manufacturing of ヤ ス Ha ラ chemical company) of solvent and the 0.5 weight part lithium hydroxide monohydrate (LiOH as alkali metal compound, the manufacturing of キ シ ダ chemical company), 3 weight parts are as trioctyl trimellitate (KAO. Corp. SA's manufacturing of softening agent, trade(brand)name " TRIMECS T-10 "), use the decollator blending dispersion, the resin combination that contains inorganic powder of preparation pasty state.In addition, the viscosity of above-mentioned glass powder under 600 ℃ is 95Pas.
The manufacturing of＜transfer printing sheet 〉
On the support membrane of polyethylene terephthalate (PET) film of thick 50 μ m having been implemented the stripper processing, use the roller coat device to be coated with the resin combination that contains inorganic powder of above-mentioned preparation, desolvate by under 150 ℃, dried coating film being removed in 5 minutes, form the film forming material layer of thick 68 μ m.Then, on this film forming material layer, cover as protective membrane the polyethylene terephthalate thin film of the thick 38 μ m of silicone lift-off processing has been implemented on the surface, be rolled into the cylinder shape and make the transfer printing sheet.
＜dielectric layer forms the manufacturing of glass substrate 〉
Peel off the protective membrane of above-mentioned transfer printing sheet, itself and panel are fitted with glass baseplate surface (fixed face of bus electrode), use heating roll-type laminator to carry out thermocompression bonded.Press stick spare to be: the surface temperature of warming mill is that 80 ℃, the line pressure of roller are that 1kg/cm, roller translational speed are 1m/ minute.After thermocompression bonded is handled, remove support membrane, be formed into membrane layers and be transferred to glass baseplate surface and adherent state if peel off from the film forming material layer.
Then, by with transfer printing the glass substrate of film forming material layer put into sintering oven, with 10 ℃/minute heat-up rates temperature in the stove is elevated to 590 ℃ from room temperature, and be to keep 60 minutes under 590 ℃ the atmosphere gas in temperature, thereby on glass baseplate surface, form by the formed dielectric layer of glass sintering body, make dielectric layer and form glass substrate.The thickness of this dielectric layer is 30 μ m.
[embodiment 2]
The preparation of＜(methyl) acrylic resin 〉
Adopt the method identical to prepare the metha crylic resin with embodiment 1.
＜contain the preparation of the resin combination of inorganic powder 〉
(NaOH, Tokyo changes into industrial and makes) replaces lithium hydroxide monohydrate as outside the alkali metal compound except the sodium hydroxide that mixes 0.1 weight part, adopts the method identical with embodiment 1 to prepare the resin combination that contains inorganic powder.
The manufacturing of＜transfer printing sheet〉and＜dielectric layer forms the manufacturing of glass substrate 〉
Except using the above-mentioned resin combination that contains inorganic powder, make the transfer printing sheet and dielectric layer forms glass substrate by the method identical with embodiment 1.The thickness of this dielectric layer is 30 μ m.
[embodiment 3]
The adjustment of＜(methyl) acrylic resin 〉
Adopt the method identical to prepare the metha crylic resin with embodiment 1.
＜contain the preparation of the resin combination of inorganic powder 〉
Except the potassium hydroxide that mixes 0.2 weight part (the pure pharmaceutical worker's industry of KOH and light company makes) replaces lithium hydroxide monohydrate as outside the alkali metal compound, adopt the method identical to prepare the resin combination that contains inorganic powder with embodiment 1.
The manufacturing of＜transfer printing sheet〉and＜dielectric layer forms the manufacturing of glass substrate 〉
Except using the above-mentioned resin combination that contains inorganic powder, make the transfer printing sheet and dielectric layer forms glass substrate by the method identical with embodiment 1.The thickness of this dielectric layer is 30 μ m.
[embodiment 4]
The adjustment of＜(methyl) acrylic resin 〉
Adopt the method identical to prepare the metha crylic resin with embodiment 1.
＜contain the preparation of the resin combination of inorganic powder 〉
Except mixing the anhydrous sodium phosphate (Na of 0.3 weight part
3PO
4And the pure pharmaceutical worker of light industry company makes) replace lithium hydroxide monohydrate as outside the alkali metal compound, adopt the method identical to prepare the resin combination that contains inorganic powder with embodiment 1.
The manufacturing of＜transfer printing sheet〉and＜dielectric layer forms the manufacturing of glass substrate 〉
Except using the above-mentioned resin combination that contains inorganic powder, make the transfer printing sheet and dielectric layer forms glass substrate by the method identical with embodiment 1.The thickness of this dielectric layer is 30 μ m.
[embodiment 5]
The adjustment of＜(methyl) acrylic resin 〉
Adopt the method identical to prepare the metha crylic resin with embodiment 1.
＜contain the preparation of the resin combination of inorganic powder 〉
Replace outside the lithium hydroxide monohydrate as the magnesium oxide of alkaline earth metal compound (MgO, bank field chemical company makes) except mixing 1 weight part, adopt the method identical to prepare the resin combination that contains inorganic powder with embodiment 1.
The manufacturing of＜transfer printing sheet〉and＜dielectric layer forms the manufacturing of glass substrate 〉
Except using the above-mentioned resin combination that contains inorganic powder, make the transfer printing sheet and dielectric layer forms glass substrate by the method identical with embodiment 1.The thickness of this dielectric layer is 30 μ m.
[embodiment 6]
The adjustment of＜(methyl) acrylic resin 〉
Adopt the method identical to prepare the metha crylic resin with embodiment 1.
＜contain the preparation of the resin combination of inorganic powder 〉
Replace outside the lithium hydroxide monohydrate as the calcium oxide of alkaline earth metal compound (the pure pharmaceutical worker's industry of CaO and light company makes) except mixing 2 weight parts, adopt the method identical to prepare the resin combination that contains inorganic powder with embodiment 1.
The manufacturing of＜transfer printing sheet〉and＜dielectric layer forms the manufacturing of glass substrate 〉
Except using the above-mentioned resin combination that contains inorganic powder, make the transfer printing sheet and dielectric layer forms glass substrate by the method identical with embodiment 1.The thickness of this dielectric layer is 30 μ m.
[embodiment 7]
The adjustment of＜(methyl) acrylic resin 〉
Adopt the method identical to prepare the metha crylic resin with embodiment 1.
＜contain the preparation of the resin combination of inorganic powder 〉
Except to mix 17 weight part aforesaid propylene acid be resin, 30 weight parts as the α-terpinol of solvent and the 0.2 weight part plumbous oxide (PbO as lead compound, company makes with the pure pharmaceutical worker of light industry) outside, adopt the method identical to prepare the resin combination that contains inorganic powder with embodiment 1.
The manufacturing of＜transfer printing sheet 〉
Adopt the method identical to prepare the transfer printing sheet with embodiment 1.
＜dielectric layer forms the manufacturing of glass substrate 〉
By with transfer printing the glass substrate of film forming material layer put into sintering oven, with 10 ℃/minute heat-up rates temperature in the stove is elevated to 600 ℃ from room temperature, and be to keep 60 minutes under 600 ℃ the atmosphere gas in temperature, thereby on glass baseplate surface, form by the formed dielectric layer of glass sintering body, in addition, make dielectric layer by the method identical and form glass substrate with embodiment 1.The thickness of this dielectric layer is 30 μ m.
[embodiment 8]
The adjustment of＜(methyl) acrylic resin 〉
Adopt the method identical to prepare the metha crylic resin with embodiment 1.
＜contain the preparation of the resin combination of inorganic powder 〉
Except mixing the lead bromide (PbBr of 0.4 weight part
2And the pure pharmaceutical worker of light industry company makes) as outside the lead compound, adopt the method identical to prepare the resin combination that contains inorganic powder with embodiment 7.
The manufacturing of＜transfer printing sheet〉and＜dielectric layer forms the manufacturing of glass substrate 〉
Except using the above-mentioned resin combination that contains inorganic powder, make the transfer printing sheet and dielectric layer forms glass substrate by the method identical with embodiment 7.The thickness of this dielectric layer is 30 μ m.
[comparative example 1]
The adjustment of＜(methyl) acrylic resin 〉
Adopt the method identical to prepare the metha crylic resin with embodiment 1.
＜contain the preparation of the resin combination of inorganic powder 〉
Except mixed alkali metal compound not, adopt the method identical to prepare the resin combination that contains inorganic powder with embodiment 1.
The manufacturing of＜transfer printing sheet〉and＜dielectric layer forms the manufacturing of glass substrate 〉
Except using the above-mentioned resin combination that contains inorganic powder, make the transfer printing sheet and dielectric layer forms glass substrate by the method identical with embodiment 1.The thickness of this dielectric layer is 30 μ m.
[comparative example 2]
The adjustment of＜(methyl) acrylic resin 〉
Adopt the method identical to prepare the metha crylic resin with embodiment 1.
＜contain the preparation of the resin combination of inorganic powder 〉
Except mixed lead compound not, adopt the method identical to prepare the resin combination that contains inorganic powder with embodiment 7.
The manufacturing of＜transfer printing sheet〉and＜dielectric layer forms the manufacturing of glass substrate 〉
Except using the above-mentioned resin combination that contains inorganic powder, make the transfer printing sheet and dielectric layer forms glass substrate by the method identical with embodiment 7.The thickness of this dielectric layer is 30 μ m.
" dielectric layer forms the mensuration and the evaluation of the transmittance of substrate "
Measure the transmittance (%) that resulting dielectric layer forms glass substrate.At transmittance, use hazemeter (in the village color institute system make, HM-150), measure full light transmittance and estimate.In addition, in the present invention, be 80% or more than it if dielectric layer forms the transmittance of glass substrate, further, be 81% or it is above, just can fully guarantee the desired transparency of dielectric layer formation glass substrate of PDP.
Table 1
| Additive | Transmittance (%) | |
| Embodiment 1 | LiOH | 80.2 |
| Embodiment 2 | NaOH | 82.0 |
| Embodiment 3 | KOH | 82.1 |
| Embodiment 4 | Na 3PO 4 | 83.0 |
| Embodiment 5 | MgO | 80.1 |
| Embodiment 6 | CaO | 80.4 |
| Embodiment 7 | PbO | 82.5 |
| Embodiment 8 | PbBr 2 | 82.0 |
| Additive | Transmittance (%) | |
| Comparative example 1 | - | 78.4 |
| Comparative example 2 | - | 75.7 |
By last table 1 as can be known, comprise at least a metallic compound that is selected from alkali metal compound, alkaline earth metal compound and the lead compound contains inorganic powder as additive the of the present invention situation of resin combination in use, in all embodiments, the transmittance that dielectric layer forms glass substrate reaches 80% or more than it, has the very high transparency.In contrast, the resin combination that contains inorganic powder of comparative example 1 and comparative example 2 does not contain above-mentioned additive, thereby the deaeration effect can not obtain sintering the time, and bubble remains in the dielectric layer, cause transmittance to reduce, its result can not guarantee the desired transparency of dielectric layer of PDP fully.
As shown in the above, in the present invention, the inorganic powder constituent that in the resin combination that contains inorganic powder, is comprised, by contain at least a metallic compound that is selected from alkali metal compound, alkaline earth metal compound and the lead compound in addition as additive, can in sintering circuit, bring into play very good deaeration, even carry out sintering in the low temperature range below 600 ℃ or 600 ℃, in dielectric layer, can residually not cause defective or muddy bubble behind the sintering yet, can form the high dielectric layer of the transparency.
Industrial applicibility
The resin combination that contains inorganic powder of the present invention has and significantly prevents the residual effect of bubble in the dielectric layer, even thereby carry out sintering in low temperature range, in dielectric layer, can not produce defective or muddiness behind the sintering yet. Therefore, can make the dielectric layer formation substrate of the dielectric layer that is formed with the excellent optical performance with high transmission rate. Particularly, transfer sheet of the present invention is suitable for forming the dielectric layer of the PDP front panel that requires high transparent.
Claims (11)
1. resin combination that contains inorganic powder, it comprises inorganic powder, adhesive resin and is selected from least a metallic compound in alkali metal compound, alkaline earth metal compound and the lead compound, wherein,
Described inorganic powder is a glass powder, and described adhesive resin is (methyl) acrylic resin;
With respect to 100 weight part glass powders, described metallic compound content is 0.01 weight part～10 weight parts, and described (methyl) acrylic resin content is 5 weight parts～50 weight parts.
2. the resin combination that contains inorganic powder according to claim 1, wherein alkali metal compound is to be selected from least a in lithium compound, potassium compound and the sodium compound.
3. the resin combination that contains inorganic powder according to claim 1 and 2, wherein alkaline earth metal compound is magnesium compound and/or calcium cpd.
4. the resin combination that contains inorganic powder according to claim 3, wherein inorganic powder is below the 150Pas 600 ℃ viscosity.
5. the resin combination that contains inorganic powder according to claim 1 and 2, wherein inorganic powder is below the 150Pas 600 ℃ viscosity.
6. form laminar each described resin combination that contains inorganic powder in the claim 1～5 and film forming material layer that obtain.
7. the described film forming material of claim 6 is pressed in the transfer printing sheet that obtains on the support membrane layer by layer.
8. manufacture method that has formed the substrate of dielectric layer, it comprises: be transferred to the film forming material layer of the described transfer printing sheet of claim 7 on the substrate and this film forming material layer carried out the operation of sintering processes.
The formation of making by the described method of claim 8 substrate of dielectric layer.
10. the substrate that forms dielectric layer according to claim 9, its transmittance are more than 80%.
11. use claim 9 or the 10 described plasma display panels that formed the substrate of dielectric layer.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003420341 | 2003-12-18 | ||
| JP420341/2003 | 2003-12-18 | ||
| JP360024/2004 | 2004-12-13 | ||
| JP2004360024A JP3877173B2 (en) | 2003-12-18 | 2004-12-13 | Film forming material layer, transfer sheet, dielectric layer forming substrate manufacturing method, and dielectric layer forming substrate |
| PCT/JP2004/018792 WO2005059034A1 (en) | 2003-12-18 | 2004-12-16 | Inorganic powder-containing resin composition, film-forming material layer, transfer sheet, method for producing substrate provided with dielectric layer, substrate provided with dielectric layer, and plasma display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1894343A CN1894343A (en) | 2007-01-10 |
| CN1894343B true CN1894343B (en) | 2010-04-28 |
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|---|---|---|---|
| CN2004800376103A Expired - Fee Related CN1894343B (en) | 2003-12-18 | 2004-12-16 | Inorganic powder-containing resin composition, film-forming material layer, transfer sheet, method for producing substrate provided with dielectric layer, substrate provided with dielectric layer, and |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3877173B2 (en) |
| KR (1) | KR20060135706A (en) |
| CN (1) | CN1894343B (en) |
| TW (1) | TW200531991A (en) |
| WO (1) | WO2005059034A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0525347A (en) * | 1991-07-23 | 1993-02-02 | Fujikura Ltd | Flame-resistant composition |
| JPH10139922A (en) * | 1996-11-14 | 1998-05-26 | Mizusawa Ind Chem Ltd | Nonmigrating stabilizer and chlorinated polymer and chlorinated polymer composition |
| JP3906881B2 (en) * | 1998-06-17 | 2007-04-18 | 田中貴金属工業株式会社 | Conductor composition |
| JP2000128567A (en) * | 1998-10-22 | 2000-05-09 | Nippon Electric Glass Co Ltd | Material for plasma display panel |
| JP4987184B2 (en) * | 2000-11-10 | 2012-07-25 | 東レ・ダウコーニング株式会社 | Polyolefin resin composition and method for producing the same |
| JP2002249667A (en) * | 2001-02-26 | 2002-09-06 | Jsr Corp | Dielectric layer forming transfer film and plasma display panel |
-
2004
- 2004-12-13 JP JP2004360024A patent/JP3877173B2/en not_active Expired - Fee Related
- 2004-12-16 WO PCT/JP2004/018792 patent/WO2005059034A1/en active Application Filing
- 2004-12-16 CN CN2004800376103A patent/CN1894343B/en not_active Expired - Fee Related
- 2004-12-16 KR KR1020067013986A patent/KR20060135706A/en not_active Application Discontinuation
- 2004-12-17 TW TW093139503A patent/TW200531991A/en unknown
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| TW200531991A (en) | 2005-10-01 |
| JP2005200639A (en) | 2005-07-28 |
| WO2005059034A1 (en) | 2005-06-30 |
| KR20060135706A (en) | 2006-12-29 |
| JP3877173B2 (en) | 2007-02-07 |
| CN1894343A (en) | 2007-01-10 |
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