CN1862329A - Fabricating method of flexible display - Google Patents
Fabricating method of flexible display Download PDFInfo
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- CN1862329A CN1862329A CN 200510132209 CN200510132209A CN1862329A CN 1862329 A CN1862329 A CN 1862329A CN 200510132209 CN200510132209 CN 200510132209 CN 200510132209 A CN200510132209 A CN 200510132209A CN 1862329 A CN1862329 A CN 1862329A
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Abstract
A fabricating method of a flexible display device includes the steps of providing an adhesive layer including a first adhesive material on a first surface of a support film, a second adhesive material on a second surface of the support film such that an adhesive strength of the second adhesive material is lower than an adhesive strength of the first adhesive material, and a third adhesive material encompassing an edge of the second adhesive material such that an adhesive strength of the third adhesive material is higher than the adhesive strength of the second adhesive material; a first passivation film adhered to the first surface of the support film with the first adhesive material therebetween; and a second passivation film adhered to the second surface of the support film with the second adhesive material and the third adhesive material therebetween; peeling the first passivation film from the adhesive layer; adhering a rigid substrate to the first adhesive material; peeling the second passivation film from the adhesive layer; and adhering a flexible substrate onto the second and third adhesive materials.
Description
It is that the application number of submitting in Korea S in P2005-40240 and on July 14th, 2005 is the rights and interests of the application of P2005-63930 that the application requires to enjoy the application number of submitting in Korea S on May 13rd, 2005, quotes its full content as a reference at this.
Technical field
The present invention relates to a kind of flexible display, particularly relate to a kind of manufacture method that substrate comes off that in the flexible display manufacture process, prevents.
Background technology
Recently monitor market variation is very fast, and the center is occupied by flat pannel display (FPD) device.Be easy to this FPD device is fabricated to large scale, thin and light display device.This FPD device comprises LCD (LCD), plasma display (PDP), display of organic electroluminescence (OLED) etc.But existing LCD, plasma display, display of organic electroluminescence constitute by glass substrate, thereby have limited its application owing to it does not have flexibility.
Therefore, adopted the substrate manufacturing that the flexible material that has such as plastics or paper tinsel constitutes can crooked flexible display, and this display have risen to and has substituted the existing display of future generation that does not have flexible glass substrate rapidly.Flexible display is commonly referred to " bendable display " or " but rollable display ".The method that realizes flexible display can be divided into two kinds: adopt the method for existing display and the method for employing Electronic Paper.
The method that adopts existing display device is the method that makes thin film transistor LCD device, organic elctroluminescent device material etc. flexible.By contrast, about adopting the method for Electronic Paper, begun one's study and used cholesterol liquid crystal, used microcapsules, electrophoresis and by the electrophoretic display device (EPD) display device of the hemispherical distortion ball (twistball) of static charge charging.The shortcoming of this Electronic Paper is to be difficult to realize full-colorization and to realize having limitation aspect the moving image because operating rate causes very slowly.
Therefore, the focus of a lot of investigation concentrates on the research of adopting existing display device realization flexible display device recently.For this reason, the theme of research is to make display part and the switch sections that has in the core that flexible existing display device---comprises display part, drive part and switch sections---.
Particularly, give flexibility, should use flexible base, board for display part for flexible display device.But, in the manufacturing process of display device, should form electrode exactly, so substrate should play sufficient supporting role.For this reason, it should be sticked on the rigid substrates.When adhering to rigid substrates, use the bonding agent that promptly can adhere to and can separate, in the manufacture process of flexible display, when rigid substrates and flexible base, board are adhering to each other, have problems owing to therefore bonding agent may separate.
Summary of the invention
Therefore, the present invention relates to a kind of manufacture method of flexible display, can overcome one or more problems of bringing because of the limitation and the shortcoming of prior art basically.
The object of the present invention is to provide a kind of flexible display manufacture method that prevents that in the flexible display manufacture process substrate from coming off.
Attendant advantages of the present invention and feature will be illustrated in the description of back, by following description, will make them apparent to a certain extent for those of ordinary skills, perhaps can be familiar with them by putting into practice the present invention.These and other advantages of the present invention can realize by the structure of specifically noting in written description and claim and the accompanying drawing and obtain.
In order to realize these and other advantage, according to purpose of the present invention, description as concrete and broad sense, the manufacture method of flexible display comprises adhesive linkage is set, first passivation layer and second passivation layer, described adhesive linkage comprises first adhesives on the first surface that is positioned at supporting layer, be positioned at second adhesives of supporting layer second surface and around the adhesive linkage of edge the 3rd adhesives of second adhesives, wherein the bonding strength of second adhesives is lower than the bonding strength of first adhesives, and the bonding strength of the 3rd adhesives is higher than the bonding strength of second adhesives; First passivation layer adheres on the first surface of supporting layer, is provided with first adhesives between the two; And second passivation layer adhere on the second surface of supporting layer, between the two, be provided with second adhesives and the 3rd adhesives; Peel off first passivation layer from adhesive linkage; Rigid substrates is adhered on first adhesives; Peel off second passivation layer from adhesive linkage; And flexible base, board adhered on the second and the 3rd adhesives.
On the other hand, the manufacture method of flexible display comprises that step is for being provided with adhesive linkage, first passivation layer and second passivation layer, described adhesive linkage comprises first adhesives on the first surface that is positioned at supporting layer, be positioned at second adhesives of supporting layer second surface and be positioned at that bonding strength is greater than the adhesive linkage of the 3rd adhesives of second adhesives on second adhesives, and wherein the bonding strength of second adhesives is lower than the bonding strength of first adhesives; First passivation layer adheres on the first surface of supporting layer, is provided with first adhesives between the two; And second passivation layer adhere on the second surface of supporting layer, between the two, be provided with second adhesives and the 3rd adhesives; Peel off first passivation layer from adhesive linkage; Rigid substrates is adhered on first adhesives; Peel off second passivation layer from adhesive linkage; And flexible base, board adhered on the second and the 3rd adhesives.
On the other hand, the manufacture method of flexible display comprises that step is for being provided with adhesive linkage, first passivation layer and second passivation layer, described adhesive linkage comprises first adhesives on the first surface that is positioned at supporting layer, is positioned at the adhesive linkage of second adhesives of supporting layer second surface, and wherein the bonding strength of second adhesives is lower than the bonding strength of first adhesives; First passivation layer adheres on the first surface of supporting layer, is provided with first adhesives between the two; And second passivation layer adheres on the second surface of supporting layer, is provided with second adhesives between the two; Peel off first passivation layer from adhesive linkage; Rigid substrates is adhered on first adhesives; Peel off second passivation layer from adhesive linkage; On second adhesives, form the 3rd adhesives that bonding strength is higher than second adhesives; And flexible base, board adhered on the second and the 3rd adhesives.
On the other hand, the manufacture method of flexible display comprises forming to have first groove and first and second fixture substrates that are formed at second groove of the first recess edge bottom; At the second groove coating adhesive; First and second flexible base, boards are fixed on first groove and the bonding agent; Making array base palte on first flexible base, board and array base palte under making on second flexible base, board; To go up the array substrate bonding to descending on the array base palte and between the two, injecting liquid crystal; Peel off first and second flexible base, boards from the one the second fixture substrates.
Should be appreciated that top generality is described and following detailed all is schematic and indicative, being intended to provides further explanation to claim of the present invention.
Description of drawings
The included accompanying drawing of the application is used to provide to further understanding of the present invention, and is included in this application and as the application's a part, shows embodiments of the present invention and be used to explain principle of the present invention together with the description.In the accompanying drawings:
Figure 1A is depicted as flexible display manufacture method diagrammatic sketch to 1C;
Fig. 2 A is depicted as the bonding process diagrammatic sketch to 2C;
Fig. 3 A is depicted as the manufacturing method of array base plate diagrammatic sketch to 3E;
Fig. 4 A is depicted as down the manufacturing method of array base plate diagrammatic sketch to 4D;
Fig. 5 A and 5B are depicted as the bonded structure figure of first illustrative embodiments according to the present invention;
Figure 6 shows that the bonded structure figure of second illustrative embodiments according to the present invention;
Fig. 7 A and 7B are depicted as the flexible display bonding process diagrammatic sketch of the 3rd illustrative embodiments according to the present invention;
Fig. 8 A is depicted as the flexible display bonding process diagrammatic sketch of the 4th illustrative embodiments according to the present invention to 8C;
Figure 9 shows that flexible display part manufacture method diagrammatic sketch;
Figure 10 A and 10B are depicted as the flexible display stripping process figure of the 4th illustrative embodiments according to the present invention; And
Figure 11 shows that organic elctroluminescent device cross section structure sketch.
Embodiment
Will describe preferred forms of the present invention in detail now, the embodiment of described embodiment is shown in the drawings.In the accompanying drawings, understand the thickness that the present invention has amplified the concrete zone that will show in order to help to organize.Hereinafter with reference to Figure 1A to 11 explanation illustrative embodiments of the present invention.
As Figure 1A to shown in the 1C, according to the manufacturing process of flexible liquid crystal display of the present invention mainly be divided into substrate bonding operation (S1), go up array base palte manufacturing process (S2), array base palte manufacturing process (S3), liquid crystal operation (S4), stripping process (S5) and module operation (S6) down.Substrate bonding operation S1 is the operation that is used for flexible base, board 45 is bonded to rigid substrates 47, thereby wherein this flexible base, board 45 provides pliability and rigid substrates 47 provides support and accurately carries out the electrode forming process to display device.Here, this rigid substrates 47 is formed by glass substrate and flexible base, board 45 is formed by the plastic base with high heat-resistant quality.
Substrate bonding operation (S1) is elaborated to Fig. 2 C with reference to Fig. 2 A.(S2 is S3) for being used to form the operation of R, G, B pixel and central electrode etc. in upper and lower array base palte manufacturing process.Below will (S2 S3) be elaborated to upper and lower array base palte manufacturing process in the 4D at Fig. 3 A.Liquid crystal operation (S4) is will be in upper and lower array base palte manufacturing process (S2, two substrate bondings operation together of making in S3), and liquid crystal injected its liquid crystal layer space 49.Stripping process (S5) for peel off through on liquid crystal operation (S4)/flexible base, board 45 of lower part and the operation of rigid substrates 47.
In order to describe stripping process (S5) in detail, shown in Figure 1B, peel off the flexible base, board 45 that bonds on the gluing of surfaces with low bonding strength.Then, shown in Fig. 1 C, peel off and bond to the rigid substrates 47 that has on the high-adhesive-strength gluing of surfaces.In Figure 1B and 1C, not shown (S2 S3) is formed at electrode and color filter on the flexible base, board 45 afterwards in last/following array base palte operation.Module operation (S6) is for by finishing the operation of module finishing operation that S1 carries out bonding polarizer to the panel of S5 operation and driving circuit is installed.
Below by to 2C the substrate bonding operation being discussed with reference to Fig. 2 A.
Shown in Fig. 2 A-2C, thereby accurately carry out rigid substrates 47 that electrode forms with providing support and bond on the adhesive linkage 1 for display provides flexible flexible base, board 45.
Shown in Fig. 2 A, this adhesive linkage 1 comprises supporting layer 1b and bonds to the first surface of supporting layer 1b and adhesives 1a and 1c on the second surface.This supporting layer 1b is positioned at the centre of supporting layer 1 and is used for supporting adhesives 1a, 1c.This supporting layer 1b is for having splendid stable on heating polymer material, and this material mainly is made of polyimide PI.
Thereby the bonding strength of the second adhesives 1c that can form the first adhesives 1a of bonding rigid substrates 47 and bonding flexible base, board 45 is according to the composition intensity grow of adhesives 1a and 1c or die down.In Fig. 2 A, the second adhesives 1c has the bonding strength that is lower than the first adhesives 1a.Adhesive linkage 1 is covered by the first and second passivation layer 11a and 11b, and this passivation layer blocks and extraneous contacting.
With reference to Fig. 2 B, in substrate bonding operation (S1), peel off the first passivation layer 11a and rigid substrates 47 is bonded on the first adhesives 1a.Shown in Fig. 2 C, in substrate bonding operation (S1), after peeling off the second passivation layer 11b of adhesive linkage 1, flexible base, board 45 is bonded on the second adhesives 1c.Two bonding strengths by the first adhesives 1a and the second adhesives 1c form adhesive linkage 1 purposes and be progressively to peel off flexible base, board 45 and rigid substrates 47 when the stripping processs of carrying out shown in Figure 1B and 1C (S5).
(S2 is S3) for forming the operation of primary electrode in last/following array base palte operation.This time array base palte comprises that many signal line, thin film transistor (TFT) and distribution are used for the oriented layer of directional crystal thereon.Last array base palte comprises and is used to realize colored color filter, prevents the black matrix of light leak and scatters the oriented layer that is used for directional crystal thereon.
Fig. 3 A is depicted as the substep diagrammatic sketch of array base palte manufacturing process (S2) to 3E.
At first, as shown in Figure 3A, afterwards behind the opaque material of deposition such as opaque metal or opaque resin on the first flexible base, board 45a,, thereby form black matrix 3 in aforesaid substrate bonding operation (S1) by photo-mask process and etching work procedure composition organic material.This opaque metal is generally chromium, and opaque resin is generally organic material.Shown in Fig. 3 B, behind deposition mangrove fat on the first flexible base, board 45a that is formed with black matrix 3,, thereby form red color filter R by photo-mask process and this mangrove fat of etching work procedure composition.Shown in Fig. 3 C, after being formed with on the first flexible base, board 45a of red color filter R deposition greenery fat,, thereby form green color filter G by photo-mask process and this greenery fat of etching work procedure composition.Shown in Fig. 3 D, after being formed with on the first flexible base, board 45a of green color filter G the deposition blue resin,, thereby form blue color filter B by photo-mask process and this blue resin of etching work procedure composition.Shown in the last array base palte manufacturing process (S2) of Fig. 3 E,,, thereby form public electrode 35 by photo-mask process and this transparent conductive material of etching work procedure composition being formed with on the first flexible base, board 45a of red, green and blue color filter behind the deposit transparent conductive material.
Below will be by to 4D the following manufacturing method of array base plate (S3) that adopts the four-wheel mask process being described as embodiment with reference to Fig. 4 A.
At first, shown in Fig. 4 A, adopt first mask process to go up and form first conductive pattern group that comprises grid line 2, grid 8 and grid pad bottom electrode 26 at the second flexible base, board 45b through substrate bonding operation (S1).Describe the operation that forms first conductive pattern group in detail, on the second flexible base, board 45b, form the grid metal level by deposition process such as sputter.Subsequently, by photo-mask process and this grid metal level of etching work procedure composition that adopts first mask, thereby form first conductive pattern group that comprises grid line 2, grid 8 and grid pad bottom electrode 26.Here, the grid metal level is made of the aluminium family metal.
Shown in Fig. 4 B, coating gate insulation layer 46 on the second flexible base, board 45b that forms first conductive pattern group.Adopt second mask process on gate insulation layer 46, to form the semiconductor pattern that comprises active layer 48 and ohmic contact layer 50; And second conductive pattern group that comprises data line 4, source electrode 10, drain electrode 12, data pads bottom electrode 32 and storage electrode 22.
To describe the process that forms second conductive pattern group now in detail.By order forms gate insulation layer 46, amorphous silicon layer, n+ amorphous silicon layer and source/leakage metal level on the second flexible base, board 45b of first conductive pattern group being formed with such as the deposition process of PECVD or sputter.Here, gate insulation layer 46 is formed by the inorganic insulating material such as silicon oxide sio x or silicon nitride SiNx.Molybdenum Mo, titanium Ti, tantalum Ta or molybdenum alloy are used as source/leakage metal.
Subsequently, on source/leakage metal level, form the photoresist pattern by the photo-mask process that adopts second mask.Like this, the channel part at thin film transistor (TFT) has the diffraction exposed mask of diffraction exposed portion as second mask.Therefore, the photoresist pattern of channel part is lower than source/leakage pattern part.
Next, by adopting this source of operation composition at wet quarter/the leakages metal level of photoresist pattern, comprise data line 4, source electrode 10, and the drain electrode and the storage electrode 22 of source electrode 10 one thereby form.Then, by adopting this n+ amorphous silicon layer and amorphous silicon layer of operation composition at dried quarter of same photoresist pattern, thereby form ohmic contact layer 50 and active layer 48.
Removing behind the relatively low photoresist pattern of channel part height by the ashing operation, by doing source/leakage metal pattern and the ohmic contact layer 50 of carving operation etch channels part.Therefore, the active layer 48 of this channel part is exposed to separated source 10 and drain electrode 12.Subsequently, remove the photoresist pattern that remains on second conductive pattern group by stripping process.
With reference to Fig. 4 C, on the gate insulation layer 46 that forms second conductive pattern group, form the passivation layer 52 that comprises first to the 4th contact hole 13,21,27,33 by the 3rd mask process.Detailed says, forms passivation layer 52 by the deposition process such as PECVD on the gate insulation layer 46 that is formed with second conductive pattern group.Subsequently, adopt the 3rd mask by photo-mask process and this passivation layer 52 of etching work procedure composition, thereby form first to the 4th contact hole 13,21,27,33.This first contact hole 13 runs through passivation layer 52 to expose drain electrode 12, this second contact hole 21 runs through passivation layer 52 to expose storage electrode 22, the 3rd contact hole 27 runs through passivation layer 52 and gate insulation layer 46 exposing grid pad bottom electrode 26, and the 4th contact hole 33 runs through passivation layer 52 to expose data pads bottom electrode 32.Here, metal such as the molybdenum that has a high etch rates when employing is during as source/leakage metal, this first, second and the 4th contact hole 13,21,33 be through to drain electrode 12, storage electrode 22 and data pads bottom electrode 32 respectively to expose its side.This passivation layer 52 is by constituting such as the inorganic insulation layer of gate insulation layer 46 or as PFCB, BCB or organic insulation with acrylic acid organic compound of low-k.
With reference to Fig. 4 D, on passivation layer 52, form the 3rd conductive pattern group that comprises pixel electrode, grid pad top electrode 28 and data pads top electrode 34 by the 4th mask process.Particularly, on passivation layer 52, be coated with transparency conducting layer by deposition process such as sputter.Subsequently, adopt the 4th mask, thereby form the 3rd conductive pattern group that comprises pixel electrode 14, grid pad top electrode 28 and data pads top electrode 34 by photo-mask process and this transparency conducting layer of etching work procedure composition.This pixel electrode 14 is electrically connected to drain electrode and is electrically connected to storage electrode 22 by second contact hole 21 by first contact hole 13.This grid pad top electrode is electrically connected to grid pad bottom electrode 26 by the 3rd contact hole 37.This data pads top electrode 34 is electrically connected to data pads bottom electrode 32 by the 4th contact hole 33.
Here, one of them constitutes transparency conducting layer by tin indium oxide ITO, tin oxide TO, zinc-tin oxide ITZO and indium zinc oxide IZO.As (S2, S3) deposition process of described each electrode of formation comprises PECVD (plasma-enhanced chemical gas deposition) method, sputtering method etc. in array base palte manufacturing process up and down.When these methods of employing, need be such as conditions such as vacuum state, appointment substrate temperature, reacting gas and reaction pressures.
On the other hand, may produce minute bubbles on flexible base, board 45 surfaces that bond to the second adhesives 1c with rigid substrates 47 surfaces that bond to the first adhesives 1a.(S2, these minute bubbles are combined into air pocket when forming vacuum state in S3) in array base palte manufacturing process up and down.So produce the phenomenon that a plurality of bubble incorporation become air pocket less than the bonding strength on rigid substrates 47 surfaces that bond to the first adhesives 1a at the gluing of surfaces of the flexible base, board 45 and the second adhesives 1c relatively owing to bond to the surperficial bonding strength of the flexible base, board 45 on the second adhesives 1c.Therefore, since bubble increasing in manufacturing process's process this flexible base, board 45 may peel off from adhesives 1.
In addition, and array base palte manufacturing process about on the more unstable relatively flexible base, board 45 than existing LCD glass substrate, carrying out (S2, S3).Therefore, this flexible base, board 45 is subjected to such as the temperature that produces when carrying out deposition or the compressing of pressure condition, thereby the flexible base, board 45 that may cause bonding on the second adhesives 1c shrinks.And, because (S2, low therefore this flexible base, board 45 that bonds to the second adhesives 1c of this second adhesives 1c bonding strength may be peeled off from adhesive linkage 1 in wet quarter of taking place in the time of S3) or the matting carrying out up and down array base palte manufacturing process.
Fig. 5 A is depicted as manufacture method according to flexible display of the present invention to 10B, and the present invention is used for preventing that the manufacture process flexible base, board carrying out above-mentioned flexible display is stripped from.
Fig. 5 A and 5B are depicted as the structural drawing of the adhesive linkage 5 of the flexible base, board manufacture method that is used for first illustrative embodiments according to the present invention.Shown in Fig. 5 A and 5B, the adhesive linkage 5 of first illustrative embodiments comprises the first adhesives 5a, the supporting layer 5b second adhesives 5c and the 3rd adhesives 55 according to the present invention.Form the second adhesives 5c that bonding strength is lower than the first adhesives 5a, and form the 3rd adhesives 55 that bonding strength is higher than the second adhesives 5c.Can form the 3rd adhesives 55 that has same bonding strength with the first adhesives 5a.This supporting layer 5b provides support power to first to the 3rd adhesives 5a, 5c, 55.In the manufacturing process of flexible display,, the bonding strength of the prior art second adhesives 1c shown in Fig. 2 A peels off phenomenon because hanging down therefore can produce.In order to prevent this situation, the edge at the second adhesives 5c in first embodiment of the invention forms the 3rd adhesives 55 with proper width.Fig. 5 B is depicted as the planimetric map of the 3rd adhesives 55 that is formed at the second adhesives 5c edge.The protection that adhesive linkage 5 with this structure is subjected to the first and second passivation layer 11a, 11b does not contact it with the external world.With comprise by employing that the bonding agent of adhesive linkage 5 and first, second passivation layer 11a, 11b is carried out as described the same first illustrative embodiments according to the present invention of Fig. 2 B and 2C and will provide flexible flexible base, board 45 to bond to operation on the rigid substrates 47 to flexible display.
Figure 6 shows that adhesive linkage structure in the flexible display manufacture method of second illustrative embodiments according to the present invention.
The adhesive linkage 6 of second illustrative embodiments comprises the first adhesives 6a, supporting layer 6b, the second adhesives 6c and the 3rd adhesives 66 according to the present invention.Form the second adhesives 6c that bonding strength is lower than the first adhesives 6a, and form the 3rd adhesives 66 that bonding strength is higher than the second adhesives 6c.Also can form the 3rd adhesives 66 that has same bonding strength with the first adhesives 6a.This supporting layer 6b provides support power to the first and second adhesives 6a, 6c.Form the 3rd adhesive linkage 66 and prevent that the flexible base, board that produces from peeling off phenomenon in the manufacturing process of flexible display.Coboundary at this second adhesives 6c after forming the second adhesives 6c forms the 3rd adhesive linkage 66.Do not contact with the 3rd adhesive linkage 66 by the first and second passivation layer 11a, 11b protection adhesive linkage 6 with the external world.And, and comprise by employing that the bonding agent of adhesive linkage 6 and first, second passivation layer 11a, 11b is carried out as described the same second illustrative embodiments according to the present invention of Fig. 2 B and 2C and will provide flexible flexible base, board 45 to bond to operation on the rigid substrates 47 to flexible display.
Fig. 7 A and 7B are depicted as the flexible display manufacture method diagrammatic sketch of the 3rd illustrative embodiments according to the present invention.
According to the present invention the substrate bonding operation (S1) of the 3rd illustrative embodiments and above-mentioned Fig. 2 A to shown in the 2C to peel off the step of the first passivation layer 11a and bonding rigid substrates 47 thereon from adhesive linkage 1 the same with the step of peeling off the second passivation layer 11b from the adhesive linkage 1 of bonding rigid substrates 47.Then, the coboundary printing that is included in the second adhesives 1c that peels off the second passivation layer 11b of the present invention's the 3rd illustrative embodiments has the step of the 3rd adhesives 77 of suitable width.In forming the method for the 3rd adhesives 77, exist a kind of to form the method for the 3rd adhesives 77 with the same mode of processing sealant except the part printing process.Forming the step that the 77 back execution of the 3rd adhesives bond to flexible base, board 45 the 3rd adhesives 77 of the second adhesives 1c and this printing.Here, form the 3rd adhesives 77 that bonding strength is relatively higher than the second adhesives 1c.Also can form bonding strength three adhesives 77 the same with the first adhesives 1a.
In first to the 3rd embodiment of the present invention, preferred, the width at the second adhesives 5c, 6c and 7c edge and the 3rd adhesives 55,66 that forms at the second adhesives 5c, 6c and 7c coboundary and 77 width are 2～8mm.Be less than 2mm if it forms, then can't avoid the phenomenon of peeling off that in carrying out flexible display device manufacturing process process, occurs.Surpass 8mm if form width, then can not in stripping process, progressively peel off this flexible base, board 45 and rigid substrates 47.
Fig. 8 A is depicted as the flexible display bonding process diagrammatic sketch of the 4th illustrative embodiments according to the present invention to 8C.To 8C, shown in Fig. 8 A and 8B, provide a kind of fixture substrate 100 that comprises first groove 113 and second groove 111 with reference to Fig. 8 A by etching work procedure.Next, shown in Fig. 8 C, coating adhesive 101 on second groove 111 of fixture substrate 100, then that first groove 113 on flexibility basic 103 and the top of fixture substrate 100 and the bonding agent 101 that is coated on second groove 111 is bonding.
This fixture substrate 100 comprises first groove 113 of placing flexible base, board 101 and second groove 111 of filling bonding agent 101.Form this first groove 113 and second groove 111 by on the glass substrate of rigid substrates, carrying out etching work procedure.Adopt glass substrate to be when adopting metal substrate owing to need independent coating to handle to prevent that therefore chemical damage from can cause fixture substrate 100 manufacturing processes complicated as the rigid substrates reason.
Thereby form the thickness and thickness with width the same fix this flexible base, board 103 of width of this first groove with this flexible base, board 103.This first groove 113 is fixed this flexible base, board 103 in the manufacturing process of flexible display, thereby flexible base, board 103 is supported.In addition, form second groove 111 so that the space of coating adhesive 101 to be provided in first groove, 113 edge lower part.The width of this second groove (x) is 5mm～100mm.If this second recess width (x) then can not fully provide bonding force less than 5mm, therefore this flexible base, board can be peeled off in this flexible display manufacture process, and therefore is no less than 5mm for preferred.In addition, this second recess width (x) surpasses 100mm, then is difficult to carry out follow-up stripping process, and therefore no more than 100mm is preferred.And the thickness (y) that forms this second groove is the same with bonding agent 101.Forming the thickness (y) of second groove and bonding agent 101 is of uniform thickness can improves the step difference that produces when bonding on the adhesives 66,77 with step difference in the of the present invention second and the 3rd illustrative embodiments between flexible base, board 45 and rigid substrates 47.
Fig. 9 and Figure 10 A-10B are depicted as the operation sketch behind the bonding process (S1) of carrying out the flexible display of the 4th illustrative embodiments according to the present invention.Particularly, Figure 10 A and 10B are depicted as the flexible display stripping process figure that is used to illustrate the 4th illustrative embodiments according to the present invention, the electrode and the color filter that are not illustrated in here/form after the following array base palte operation.At the first fixture substrate 100a that is about to array base palte manufacturing process (S2) on the experience and the first flexible base, board 103a and second fixture substrate 100b that is about to array base palte manufacturing process (S3) under the experience and the bonding process (S1) that the second flexible base, board 103b carries out flexible base, board 103 and fixture substrate 100 respectively.
Then, as shown in Figure 9, the flexible base, board top that is bonded at fixture substrate carry out should on/following array base palte manufacturing process (S2, S3).Since Fig. 3 A carried out in the 4D explanation therefore will omit here on/following array base palte manufacturing process (S2, detailed description S3).
Next, the two substrates that will make in last array base palte manufacturing process (S2) and following array base palte manufacturing process (S3) bonds together, and carries out liquid crystal operation (S4) from liquid crystal 149 to liquid crystal 140 spaces that inject.For through on the liquid crystal operation (S4)/following array base palte carries out and peels off from bonding agent/stripping process (5) of following array base palte.
Describe this stripping process (S5) in detail with reference to Figure 10 A and 10B, this stripping process (S5) is along with interspersing among bonding agent kind on second groove 111 and difference.Ultraviolet light UV type and hot type bonding agent and the polyimide splicing tape with high-fire resistance all can be used for being coated on the bonding agent 101 of second groove.
When adopting ultraviolet light type bonding agent, if UV-irradiation is on bonding agent 101 when carrying out stripping process (S5), then bonding agent 101 loses bonding force.Therefore, this first and second flexible base, board 103a, 103b peel off from the first and second fixture substrate 100a, 100b.
Be lower than the bonding agent that loses bonding force under the temperature of normal temperature and can be used as the hot type bonding agent at the bonding agent that loses bonding force between 20 ℃～200 ℃ of the temperature.When adopting this being lower than normal temperature and losing the bonding agent of bonding force, make it lose bonding force execution stripping process (S5) by apply the cooling means that is lower than normal temperature for bonding agent 101, when adopting when losing the bonding agent of bonding force between 20 ℃～200 ℃ of the temperature, make it lose bonding force by the heating means that apply temperature between 20 ℃～200 ℃ for bonding agent 101 and carry out stripping process (S5).When adopting the polyimide splicing tape, the first and second flexible base, board 103a, 103b edge by the laser ablation bonding polyimide splicing tape that is used to peel off in stripping process (S5) process.
Like this, can be easily the manufacture method of flexible display be applied to ECB (electrically conerolled birefringence) display panels, VA (vertical orientation) pattern and IPS pattern and TN mode liquid crystal display panel.In addition, and can be used in the manufacture method of organic elctroluminescent device.
With reference to Figure 11, sketched by using illustrative embodiments of the present invention and made the cross section structure of organic elctroluminescent device.The brief configuration of this flexible organic electro-luminescence display device comprises anode electrode 84, the cathode electrode 86 that is positioned at flexible base, board 82 tops, and the organic luminous layer 80 that is formed at anode electrode 84, cathode electrode 86 each cross section.If drive signal is imposed on anode electrode 84, the cathode electrode 86 of organic elctroluminescent device with this structure, send electronics and hole, thereby and the electronics that sends from this anode electrode 84, cathode electrode 86 and hole at organic luminous layer 80 compound generation visible lights.At this moment, the visible light of this generation is launched to the external world by anode electrode 84, thereby shows designated pictures and image.
As mentioned above, manufacture method of the present invention comprises the 3rd adhesives that is positioned at the second adhesives top edge that is used for the substrate bonding operation and the edge that is positioned at adhesive linkage second adhesives, the perhaps step of printing the 3rd adhesives in the second adhesives top edge at bonding process.Therefore, can be reduced in the manufacturing flexible display device process because the second adhesives bonding force hangs down the danger of peeling off that produces.In addition, the protection of this first adhesives is as bonding to the side of the flexible base, board thin spot on second adhesives, thereby prevents the flexible base, board shrinkage phenomenon that caused by the sedimentary deposit stress that produces in each operation.Therefore, can realize the raising of the stability and the throughput rate of flexible display device manufacturing process.
And, have the groove of fixing flexible substrate and the fixture substrate of coating adhesive groove, the manufacturing process of execution flexible display that can be more stable by formation.This anchor clamps manufacturing is simple, thereby simplifies working process and improve throughput rate, improve process stability.
Can be expressly understood that for being familiar with those of ordinary skill in the art, the present invention has various modification and improvement.Thereby, this invention is intended to cover all and fall into claims and interior modification and the improvement of equivalent institute restricted portion.
Claims (17)
1, a kind of manufacture method of flexible display comprises step:
Adhesive linkage is set, first passivation layer and second passivation layer, described adhesive linkage comprises first adhesives on the first surface that is positioned at supporting layer, be positioned at second adhesives of supporting layer second surface and around the adhesive linkage of edge the 3rd adhesives of second adhesives, wherein the bonding strength of second adhesives is lower than the bonding strength of first adhesives, the bonding strength of the 3rd adhesives is higher than the bonding strength of second adhesives, first passivation layer adheres on the first surface of supporting layer, between the two, be provided with first adhesives, and adhere on the second surface of supporting layer, between the two, be provided with second adhesives and the 3rd adhesives;
Peel off first passivation layer from adhesive linkage;
Rigid substrates is adhered on first adhesives;
Peel off second passivation layer from adhesive linkage; And
Flexible base, board is adhered on the second and the 3rd adhesives.
2, manufacture method according to claim 1 is characterized in that, the described first and the 3rd adhesives is formed by same material.
3, manufacture method according to claim 1 is characterized in that, the width of described the 3rd adhesives is between 2mm and 8mm.
4, a kind of manufacture method of flexible display comprises step:
Adhesive linkage is set, first passivation layer and second passivation layer, described adhesive linkage comprises first adhesives on the first surface that is positioned at supporting layer, be positioned at second adhesives of supporting layer second surface and be positioned on second adhesives bonding strength greater than the adhesive linkage of the 3rd adhesives of second adhesives, wherein the bonding strength of second adhesives is lower than the bonding strength of first adhesives, first passivation layer adheres on the first surface of supporting layer, between the two, be provided with first adhesives, and second passivation layer adhere on the second surface of supporting layer, between the two, be provided with second adhesives and the 3rd adhesives;
Peel off first passivation layer from adhesive linkage;
Rigid substrates is adhered on first adhesives;
Peel off second passivation layer from adhesive linkage; And
Flexible base, board is adhered on the second and the 3rd adhesives.
5, manufacture method according to claim 4 is characterized in that, the described first and the 3rd adhesives is formed by same material.
6, manufacture method according to claim 4 is characterized in that, described the 3rd adhesives is formed in the edge of described second adhesives with strip-like-shaped.
7, manufacture method according to claim 6 is characterized in that, the width of described the 3rd adhesives is between 2mm and 8mm.
8, a kind of manufacture method of flexible display comprises step:
Adhesive linkage, first passivation layer and second passivation layer are set, described adhesive linkage comprises first adhesives on the first surface that is positioned at supporting layer, is positioned at the adhesive linkage of second adhesives of supporting layer second surface, wherein the bonding strength of second adhesives is lower than the bonding strength of first adhesives, first passivation layer adheres on the first surface of supporting layer, between the two, be provided with first adhesives, and second passivation layer adhere on the second surface of supporting layer, between the two, be provided with second adhesives;
Peel off first passivation layer from adhesive linkage;
Rigid substrates is adhered on first adhesives;
Peel off second passivation layer from adhesive linkage;
On second adhesives, form the 3rd adhesives that bonding strength is higher than second adhesives; And
Flexible base, board is adhered on the second and the 3rd adhesives.
9, manufacture method according to claim 8 is characterized in that, the described first and the 3rd adhesives is formed by same material.
10, manufacture method according to claim 8 is characterized in that, described the 3rd adhesives is formed in the edge of described second adhesives with strip-like-shaped.
11, manufacture method according to claim 10 is characterized in that, the width of described the 3rd adhesives is between 2mm and 8mm.
12, a kind of manufacture method of flexible display comprises step:
Formation has first groove and is formed at first and second fixture substrates of second groove of the first recess edge bottom;
Coating adhesive on second groove;
First and second flexible base, boards are fixed on first groove and the bonding agent;
Making array base palte on first flexible base, board and array base palte under making on second flexible base, board;
To go up the array substrate bonding to descending on the array base palte and between the two, injecting liquid crystal;
Peel off first and second flexible base, boards from the one the second fixture substrates.
13, manufacture method according to claim 12 is characterized in that, the width of described first groove is between 5mm and the 100mm, and forms described first groove that has with the same thickness of described bonding agent.
14, manufacture method according to claim 12 is characterized in that, forms described second groove with the same width with described flexible base, board and thickness.
15, manufacture method according to claim 12, it is characterized in that, the bonding agent of coating on described first groove comprises Kapton Tape, and the described step of peeling off first and second flexible base, boards from first and second fixture substrates is carried out at the first and second flexible base, board edges that adopt laser ablation to be bonded in Kapton Tape.
16, manufacture method according to claim 12, it is characterized in that, the bonding agent of coating on described first groove is included in the bonding agent that loses bonding force under the UV-irradiation, and carries out the described step of peeling off first and second flexible base, boards from first and second fixture substrates by bonding agent being carried out UV-irradiation.
17, manufacture method according to claim 12, it is characterized in that, the bonding agent of coating on described first groove comprises the bonding agent that loses bonding force in response to temperature, and carries out the described step of peeling off first and second flexible base, boards from first and second fixture substrates by bonding agent being applied temperature.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
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| KR1020050040240 | 2005-05-13 | ||
| KR20050040240 | 2005-05-13 | ||
| KR10-2005-0040240 | 2005-05-13 | ||
| KR1020050063930 | 2005-07-14 | ||
| KR10-2005-0063930 | 2005-07-14 |
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| CN1862329A true CN1862329A (en) | 2006-11-15 |
| CN100428010C CN100428010C (en) | 2008-10-22 |
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| CNB2005101322094A Expired - Fee Related CN100428010C (en) | 2005-05-13 | 2005-12-22 | Fabricating method of flexible display |
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| CN (1) | CN100428010C (en) |
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