CN1777990A - 热互连系统、其制备方法及其应用 - Google Patents

热互连系统、其制备方法及其应用 Download PDF

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CN1777990A
CN1777990A CNA2004800105309A CN200480010530A CN1777990A CN 1777990 A CN1777990 A CN 1777990A CN A2004800105309 A CNA2004800105309 A CN A2004800105309A CN 200480010530 A CN200480010530 A CN 200480010530A CN 1777990 A CN1777990 A CN 1777990A
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layered
heat
layered material
component
interface
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M·费里
J·苏布拉马里安
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Honeywell International Inc
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Honeywell International Inc
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Abstract

本发明涉及的分层界面材料包含至少一种脉冲电镀导热材料，比如互连材料，及至少一种与至少一种脉冲电镀导热材料连接的散热片组分。具有迁移组分的电镀分层界面材料在此也得到描述，其包含至少一种脉冲电镀导热材料；与至少一种散热片组分，其中电镀分层界面材料的迁移组分与参照分层界面材料的迁移组分相比至少减少51％。在此所述的另一分层界面材料包含：a)导热体；b)保护层；c)接受焊料及防止氧化物形成的材料层；及d)焊料材料层。形成分层界面材料的方法在此述及，包括：a)提供一种脉冲电镀的导热界面材料；b)提供一种散热片组分；和c)物理连接导热界面材料与散热片组分。另外有至少一个附加层能与分层的界面材料连接，该附加层包括衬底层，表面，粘合剂，适合性纤维组分或任何其它适合的层或者热界面材料。

Description

热互连系统、其制备方法及其应用
本申请主张对2003年2月19日提出申请的美国临时申请序列号60/448722具有优先权，该申请与本申请共有并在此全文引用。
发明领域
本发明的领域为电子元件、半导体元件以及其它涉及分层材料应用中的热互连系统。
技术背景
电子元件应用于数量持续增长的消费类和商用电子产品中。例如电视、个人电脑、互联网服务器、蜂窝电话、寻呼机、掌上电脑、便携式无线电装置、汽车立体声音响，或遥控装置。随着对这些消费类与商用电子产品需求的增长，也有希望同样的产品变得更小，功能更强，对消费者和商业更便于携带的要求。
作为这些产品尺寸减少的结果，组成该产品的元件也必须变得更小，并更加易于制造和设计。一些元件需要减少尺寸或者按比例缩小，例如，印刷电路或布线板，电阻，连线，键盘，触摸板以及芯片封装。许多产品及元件也需要预封装，以便使产品和/或元件更易于行使各种相关或不相关的功能和任务。例如，一些这样的“整体解决方案”的元件和产品包括分层材料、母板、蜂窝及无线电话以及无线电通讯装置与其它的元件及产品，例如可见于美国专利及PCT申请序列号：于2002年7月15日申请的60/396294，于2001年5月30日申请的60/294433，以及于2002年5月30日申请的PCT/US02/17331的元件和产品，以上申请与本申请共有并在此全文引用。
因此，元件被分解和研究以确定是否有更好的构成材料和方法能够使元件按比例缩小及/或被合并以适应对更小电子元件的需求。在分层元件中，看起来有两个目标，a)减少层数和/或b)减少层的厚度，同时在两种情况下，增强其它层的功能及耐久性。然而，如果层数不易于减少或者减薄而又不牺牲功能的化，这个任务将很困难。
同样，随着电子装置变得更小和运行速度更高，以热的方式散发的能量急剧增加。在工业上通行的做法是，单独或者在此类装置中的载体上使用热润滑脂，或者润滑脂类材料，以传导通过物理界面消散的多余热量。最为通用的热界面材料是热润滑脂、相变材料、弹性胶带。由于热润滑脂或相变材料能够在极薄层里铺展及为相邻表面间提供紧密的接触，因而具有比弹性胶带低的热阻。典型的热阻抗值的范围在0.2-1.6℃cm2/W。但是，热润滑脂的一个严重的缺点是当用于VLSI芯片时在热循环之后，例如从65℃到150℃，或者在能量循环之后其热性能严重恶化。另外还发现，当表面平面度产生较大偏差引起在电子装置的啮合表面间形成间隙，或者由于如制造误差等其它原因在啮合表面出现较大间隙时，这些材料的性能劣化。当这些材料的传导性破坏时，其中使用了这些材料的电子装置的性能受到不利影响。
这样就有持续的需求：a)设计并制备满足顾客要求并使装置的尺寸和层数最小(少)化的热互连及热界面材料，分层材料，元件及产品；b)相对于材料、元件或者完成品的兼容性需求制备更有效率的及便于设计的材料，产品和/或元件；c)开发可靠的方法制备期望的热互连材料、热界面材料和分层材料及包含预期的热界面与分层材料的元件/产品；d)有效减少组装结构所需的制备步骤，从而比其它常用的分层材料和工艺降低了所有者的成本。
发明概述
此处所述的分层的界面材料包含至少一种脉冲电镀(pulse-plated)导热材料，比如一种互连材料，及至少一种热传导组分与至少一种脉冲电镀导热材料联接的散热片组分。
具有迁移组分(migration component)的电镀分层界面材料在此也描述，其包含至少一种脉冲电镀导热材料；及至少一种散热片组分，电镀分层界面材料的迁移组分与参照分层界面材料的迁移组分相比至少减少51％。
此处述及的另一种分层的界面材料包含：a)导热体；b)保护层；c)接受焊料并防止氧化物形成的材料层；d)焊料层。
形成分层的界面材料的方法将在此述及，它包括：a)提供脉冲电镀的导热界面材料；b)提供一种散热片组分；c)物理联接导热界面材料与散热片组分。另外有至少一附加层能与分层的界面材料联接，包括衬底层，表面，粘合剂，适合性纤维组分或任何其它适合的层或者热界面材料。
详细说明
一种适合的界面材料或元件应与啮合表面吻合(“弄湿”表面)，具有较低的体热阻和较低的接触热阻。体热阻可表示为材料或元件厚度，热传导率和面积的函数。接触热阻是用来衡量材料或元件能够与啮合表面，层或衬底接触的良好程度。界面材料或元件的热阻可表示为如下：
         θ界面＝t/kA+2θ接触       等式1
其中θ为热阻
t为材料厚度
k为材料的热传导率
A为界面的面积
表达式“t/kA”表示材料的体热阻，“2θ接触”表示二表面的接触热阻。适合的界面材料或元件应具有较低的体热阻和较低的接触热阻，即在啮合表面。
许多电子和半导体应用要求界面材料或元件容许因制造造成的表面平面度偏移和/或由热膨胀系数(CTE)不匹配导致的元件变形。
低K值的材料，如热润滑脂，在界面薄，即“t”值低时，性能良好。如果界面厚度仅增加0.002英寸，则热性能急剧下降。另外，对于这样的应用，啮合元件的热膨胀系数CTE的差异使得间隙随着各温度或能量周期膨胀和收缩。界面厚度的这种变化会导致流体界面材料(如润滑脂)的抽吸远离界面。
大面积的界面在制造时更易于在表面平面度上出现偏差。为了优化热性能，界面材料要能够吻合不平整的表面并从而降低接触热阻。在此使用的术语“界面”指形成两部分物质或空间的共有边界的连接或接合，如两个分子间，两个主体成分间，主体成分与网络间、网络与网络间，等等。界面可以包含两部分物质或元件的物理连接或者两部分物质或元件的物理吸引，包括如共价键和离子键的键结力，以及非键力，如Van der Waals力，静电力，库仑力，氢键和/或磁引力。预期的界面包含由键力如共价键形成的界面；但是应该理解的是任何适合的两部分物质或元件间的粘结吸引或者附着都是被优选的。
理想的界面材料和互连材料及/或元件具有高热导率及高机械韧度，例如，当受力时会弹性弯曲。高热导率减少了等式1的第一项而高机械韧度减少了第二项。在此所述的分层的界面材料及分层界面材料的单个元件用来实现这个目标。当正确制备时，此述的散热片组分将横跨热界面材料的啮合表面与散热片组分之间的距离，从而获得一个表面与另一表面间的连续的高热导率通路。
热界面材料与热互连材料及层，如上所述，可包含由HoneywellInternational Inc.制备的高热导率相变材料PCMTM45，和/或同样由Honeywell International Inc.制备的金属及金属基材料，如Ni，Cu，Al及AlSiC，它们被归类为散热材料，即用于散播热量的材料。热互连材料及层亦可包含金属，金属合金及合适的符合以下设计目标的复合材料：a)能够以薄或超薄的层或图案敷设；b)比常规的热粘合剂能够更好地传导热能；c)具有相当高的沉积速率；d)在沉积层上无需开孔即可以被沉积到表面或者其它层上；e)可以控制材料下层的迁移；和f)可作为涂层被敷设防止表面被氧化及容易接受焊料。这些热界面材料，热互连材料，包含这些材料的元件及产品可以有利地是预附着/预组装温控解决方案和/或IC(互连)封装。
此述的分层的界面材料包含至少一种脉冲电镀导热材料，如互连材料，及与至少一种脉冲电镀导热材料联接的至少一种散热片组分。该至少一种的脉冲电镀导热材料可以用作：a)扩散或迁移屏障，防止附加层或元件如晶片在脉冲电镀材料和/或层下的元件迁移；b)保持表面没有氧化物并易于接受焊料的涂层，如为金的时候；和/或c)焊料自身的涂层，如为锡，铟，银，铅及有关合金及其组合的时候。
有迁移组分的电镀分层界面材料在此亦进行说明，包含至少一种脉冲电镀导热材料，及至少一种散热片组分，其中电镀分层界面材料的迁移组分与参照分层界面材料的迁移组分相比至少减少51％。
另一种在此述及的分层界面材料包含：a)导热体；b)保护层；c)接受焊料并防止氧化物形成的材料层；和d)焊料材料层。
形成预期的分层界面材料的方法包括：a)提供一种脉冲电镀导热界面材料；b)提供一种散热片组分；和c)物理连接导热界面材料与散热片组分。至少一个附加层可以与分层界面材料联接，包括衬底层，表面，粘合剂，适合性纤维组分或者其它任何适合层或者热界面材料。
包括至少两层的用于电子和半导体应用的常规分层材料可以在这里用来作为所述的分层界面材料的制备起点。这些常规分层材料一般包含一种散热片组分，该组分通过热润滑脂或常规粘合材料与附加电子元件联接。该常规分层材料在此被称作“参照分层材料”或“参照分层界面材料”。除热润滑脂或常规粘合材料被脉冲电镀导热无孔材料代替或者与散热片组分及/或附加组分隔离之外，此述的分层材料与参照分层材料相似。这些分层材料在此被称作“电镀分层材料”或者“电镀封层界面材料”。此处所用的术语“参照”意指一种控制，一种标准和/或一种通常被排除在外的常规产品或材料。例如，参照材料指的是电镀材料或者电镀分层材料与之比较的“控制”。参照是同一构成的样品并在同一条件下制作，此条件下所有实验的，工艺的，制造的，化学的和/或物理的变化均被忽略。用化学术语来说，“参照”与“空白样”相类似，因为所有变化或样品材料的属性都相对于参照进行测量和计算，如同参照的属性在效果上等于零。因此，当比较参照材料与电镀材料的相关属性时，重要的是，参照材料和电镀材料在对电镀材料、电镀分层材料或者其制造方法加入变化之前起始于同样的基础元件。
在一些预期的实施方案中，脉冲电镀导热材料(迁移阻塞材料)造成与参照分层材料的迁移组分相比迁移原子和/或分子(在此称作“迁移组分”)的显著减少。迁移原子和/或分子的显著减少可以理解为与参照分层材料相比迁移原子和/或分子至少减少了约51％。在其它预期的实施方案中，迁移阻塞材料造成与参照分层材料相比迁移原子和/或分子减少至少约60％。而在其它预期的实施方案中，迁移阻塞材料造成与参照分层材料相比迁移原子和/或分子减少至少约75％。在优选实施方案中，迁移阻塞材料造成与参照分层材料相比迁移原子和/或分子减少至少约90％。在更为优选的实施方案中，迁移阻塞材料造成与参照分层材料相比迁移原子和/或分子减少至少约95％。
另外值得重视的是迁移阻塞材料或元件可以被设计成阻挡气体，液体，金属及附加的多余材料的扩散和/或迁移，防止其扩散进入下面的层或材料。气体，液体，金属及其它/附加的多余材料可以通过任何常用的电子材料制备和加工的工艺进行沉积，包括CVD/ALD(原子层沉积)沉积，绝缘材料的液态清洗和蚀刻，气态热处理和气体蚀刻。
如上所述，热互连和/或界面材料、热传导互连系统及层也可以包含金属，金属合金及至少符合以下设计目标之一的适合的复合材料：a)能够以薄或超薄的层或图案敷设；b)相比常规的热粘合剂能够更好地传导热能；c)具有相当高的沉积速率；d)在沉积层上无需开孔即可以被沉积到表面或者其他层；e)可以控制下层材料的迁移；f)可以涂层形式敷设防止表面被氧化及容易接受焊料。
适合用于本发明主题的热互连及/或界面材料和层首先要能够以薄或超薄的连续层或图案进行敷设。该图案可以通过使用掩模来制备或者该图案可以通过一种能够敷设希望的图案的装置来制备。预期的图案包括任何点或位点的排列，无论是离散的或者是合并形成线，及填入空区域等等。这样，预期的图案包括直线和曲线，线的交叉，具有加宽或变窄区域的线，带状，重叠线。预期的薄层或超薄层的范围可以从小于约1μm向下至约1埃或者更向下至材料的单原子层的尺寸。尤其是，一些预期的薄层小于约1μm厚。在其它的实施方案中，预期的薄层小于约500nm厚。在某些实施方案中，预期的超薄层小于约100nm厚。而在其它的实施方案中，预期的超薄层小于约10nm厚。
这些层一般以能够产生均匀的具有最少孔或空隙的层的方法进行敷设，并能够进一步以相当快的沉积速率敷设该层。有许多敷设这类层或超薄层的适合的方法和装置，但是，获得高质量材料层的最好的装置和方法之一为脉冲电镀。脉冲电镀(与直流电镀相对为间断电镀)能够敷设薄层，令其没有或几乎没有气孔和/或空隙。已经发现，缺少气孔有助于控制其它层的组分迁移穿过电镀层。例如，当把金层脉冲电镀至镍基的散热片，相对无孔的金层有效控制着镍原子穿过金层迁移到相邻层。反之，适合于许多应用，包括装饰珠宝，连接及其它较厚应用(大于约1μm)的直流电镀不能够提供此述的应用所需的基本无孔层。
另一种敷设薄层或超薄层的方法为脉冲周期转向电镀法或称“PPR”。脉冲周期转向法通过实际“逆转”或耗尽阴极表面的膜比脉冲电镀法更进了一步。脉冲周期转向的典型周期可以为10ms的5A阴极电流后接0.5ms的10A阳极电流后接2ms的间歇时间。PPR有许多优点。首先通过在每个周期“剥离”或者耗尽少量的薄膜，PPR使每个连续的周期形成新的形核点，导致气孔率进一步减少。第二，周期可以定制以通过在周期的“耗尽”或者阳极部分选择性剥离厚膜区域来提供非常均匀的薄膜。PPR对某些金属沉积，如金沉积，效果不佳，原因是金的电镀通常是在没有游离氰化物的系统中进行。所以金可以在电镀周期通过氰化化合成物(螯合物)进行电镀但是在耗尽周期不能“剥离”，因为没有氰化物使金重新溶解。脉冲电镀与脉冲周期转向系统可以从任何适合的来源购买，例如象DynatronixTM的公司或者在现场建成(整体或部分地)。
此处所用的术语“金属”指元素周期表中d区和f区的元素，还有具有类金属属性的元素，如硅和锗。术语“金属”包含通常被称为过渡金属的金属族。此处的用语“d区”指具有填充围绕原子核的3d，4d，5d及6d电子轨道的电子的元素。此处的用语“f区”指具有填充围绕原子核的4f及5f电子轨道的电子的元素，包括镧系和锕系元素。优选的金属为铟，铅，金，银，铜，锡，铋，镓及其合金，镀银铜，及镀银铝。术语“金属”还包括合金，金属/金属复合物，金属陶瓷复合物，金属聚合物复合物以及其它金属复合物。
如前所述，预期的实施方案之一包括使用脉冲电镀法和/或装置形成焊料自身的涂层。例如，预期的分层材料可以包含：a)导热体，如铜；b)保护层，如镍，对导热体进行保护；c)接受焊料并防止氧化物形成的材料层，例如镍氧化物；和d)附着于例如晶片的电子元件的焊料层。接受焊料的材料层及焊料层可以在去除任何镍氧化物层的合适的准备步骤之后通过在电子元件和/或散热片(heat spreader)上直接电镀焊料进行组合。另外，接受焊料的材料层可以电镀而焊料层可以丝网印刷，以预制体的形式附着形成，等。上述所有层将得益于脉冲电镀或者脉冲周期转向电镀，原因是这种方法宜于加强颗粒结构并去除气孔，而无任何真正的不利之处。
一旦热互连层被沉积，可以看到它将比常规的热粘合剂及体它导热层具有相对更高的热传导率。附加层如金属化硅片可以直接焊接至热互连层，而无需使用这种破坏性材料，如可能需要用来去除制备散热片的材料如镍的氧化物的腐蚀性助焊剂。
散热片组分(heat spreader component)或者散热组分(heatspreading component)(在此散热片组分和散热组分可互换使用并有共同的含义)一般包含金属或金属基基材，如镍，铝，铜，或AlSiC。在此任何适合的金属或金属基基材只要其能够散播电子元件产生的一部分或全部热量，均可用作散热片。
只要散热片组分能够充分地散播周围的电子元件产生的一部分或全部热量，散热片组分可根据电子元件及卖商的需要以任意适合的厚度敷设。预期的厚度范围包括从约0.25mm至约6mm。特别优选的散热片组分厚度范围为约1mm至约5mm。
然后，分层界面材料和/或互连材料可应用于衬底，另一表面，或另一分层材料。此处预期的衬底可包含任何希望的基本是固体材料。尤其希望的衬底层会包括薄膜，玻璃，陶瓷，塑料，金属或镀层金属，或者复合材料。在优选实施方案中，衬底包括硅或锗砷化物的晶片或者晶片表面，封装表面如镀铜，镀银，镀镍或镀金的引线架，如电路板或者封装互连轨迹中的铜表面，穿墙或者加强肋界面(“铜”包括考虑裸铜和其氧化物)，可见于基于聚酰亚胺的挠性封装内的基于聚合物的封装界面或者板界面，铅或者其它金属合金的焊料球面，玻璃及聚合物如聚酰亚胺。若考虑粘着界面时“衬底”甚至可定义为另一聚合物材料。在更为优选的实施方案中，衬底包括封装业及电路板业共通的材料如硅，铜，玻璃，及另一聚合物。
附加的材料层可以与分层界面材料连接以便继续构建分层元件。预期附加层包含此述的类似的材料，包括金属，金属合金，复合材料，聚合物，单体，有机化合物，无机化合物，有机金属化合物，树脂，粘合剂及光学波导材料。
根据元件规格的要求可以令叠层材料或包层材料与分层界面材料连接。叠层材料一般考虑为纤维强化树脂绝缘材料。包层材料为当金属与其它材料(如铜)被结合进薄层材料时产生的叠层材料的子集。(Harper，Charles A.，Electronic Packaging and InterconnectionHandbook，Second Edition，McGraw-Hill(New York)，1997)
旋装(spin-on)层和材料亦可加至分层界面材料或后续层上。关于旋装叠层薄膜已由Michael E.Thomas，在“Spin-On Stacked Filmsfor Low Keff Dielectrics”， Solid State Technology(2001年7月)中讲述，在此全文引入作为参考。
预期的在此述及的温控解决方案，IC封装，热界面元件，分层的界面材料及散热片组分的应用包括将该材料和/或元件接合至另一分层材料、电子元件或完成的电子产品。电子元件，如此处所预期的，一般被认为包含可以应用于电子类产品的任何分层元件。预期的电子元件包括电路板，芯片封装，隔离片，电路板的绝缘器件，印刷布线板，及其它的电路板元件，如电容，电感及电阻。
电子类产品的“完成”是指能够在工业上或被消费者使用。完成的消费产品如电视，计算机，蜂窝电话，寻呼机，掌上电脑，便携式无线电装置，汽车立体声音响，或遥控装置。另外预期的“中间”产品是可潜在地应用于完成产品如电路板，芯片封装，及键盘。
电子产品也可包括处于任何开发阶段从概念模型到比例模型/实物模型的原型元件。原型可以包括也可不包括完成产品中计划的所有实际元件，而且为了在初始测试时不会对其它器件有初始影响，原型可以含有一些由复合材料构成的元件。
实施例
散热片通过使用现有的掩模技术进行制备和镀金。用直流电流及0.25μm/10s的沉积速率制备的初始样品会留下红色沉积物。该红颜色表示有气孔存在，因为它意味着沉积速率超过了在作业表面补充金的电解能力。降低沉积速率至0.25μm/20s有助于使金回到更悦目的柠檬黄色。然而，该沉积速率对于预期的应用来说是不可接受的。
具有1.0ms开9.0ms关(10％的占空比(duty))的脉冲周期的脉冲电镀系统已经产生。使用该周期，使在约8秒钟内沉积0.25μm的柠檬黄色的金成为可能。
进而使用0.1ms开3.0ms关(占空比3.3％)的脉冲周期，在保持柠檬黄色的同时，获得了5秒的周期时间。
另外一种预期的脉冲周期已在脉冲电镀占空比周期为0.3ms开0.3ms关，持续约15秒的2.1A平均电流的条件下测试。该周期足够在32个工件上均匀沉积0.14μm的金。
这样，温控解决方案，IC封装，热互连及界面材料的特定实施方案和应用揭示完毕。但很显然，对本领域的技术人员而言，除上述方案外在不背离本发明思想的情况下，很多修改都是可行的。因此本发明的主题除了本公开的精神以外不受限制。而且，在解释本公开内容时，所有术语均应以与上下一致的最广泛的可能的方式来进行解释。特别是，术语“包含”与“构成”应被解释为，以非排他的方式指元素、元件、或步骤，表示提及的元素、元件、或步骤可以出现、或被使用、或者与其它未明确提及的元素、元件、或步骤结合。

Claims (45)

1.一种分层界面材料，包含至少一种脉冲电镀导热材料；以及至少一种散热片组分。
2.权利要求1的分层材料，其中导热材料包含金属基材料。
3.权利要求2的分层材料，其中金属基材料包含过渡金属。
4.权利要求3的分层材料，其中过渡金属包括金。
5.权利要求1的分层材料，其中导热材料基本无孔。
6.权利要求1的分层材料，其中散热片组分包含金属基基材。
7.权利要求6的分层材料，其中金属基基材包含镍，铝，铜或其组合。
8.权利要求1的分层材料，其中散热片组分包含硅，碳或者其组合。
9.权利要求1的分层材料，其中该分层材料包含至少一个附加材料层。
10.权利要求1的分层材料，其中导热层厚度小于约1μm。
11.权利要求10的分层材料，其中导热层厚度小于约500nm。
12.权利要求11的分层材料，其中导热层厚度小于约100nm。
13.权利要求12的分层材料，其中导热层小于约10nm。
14.权利要求1的分层材料，其中导热层以图案敷设。
15.权利要求1的分层材料，其中导热层由脉冲电镀装置形成。
16.权利要求1的分层材料，其中导热层以脉冲周期转向法形成。
17.权利要求1或9之一的分层材料，还包含衬底。
18.一种具有迁移组分的电镀分层界面材料，包含：
至少一种脉冲电镀导热材料；及至少一种散热片组分，其中电镀分层界面材料的迁移组分与参照分层界面材料的迁移组分相比至少减少51％。
19.权利要求18的分层材料，其中电镀分层界面材料的迁移组分至少减少60％。
20.权利要求19的分层材料，其中电镀分层界面材料的迁移组分至少减少75％。
21.权利要求20的分层材料，其中电镀分层界面材料的迁移组分至少减少90％。
22.权利要求21的分层材料，其中电镀分层界面材料的迁移组分至少减少95％。
23.权利要求18的分层材料，其中导热材料包含金属基材料。
24.权利要求23的分层材料，其中金属基材料包含过渡金属。
25.权利要求24的分层材料，其中过渡金属包括金。
26.权利要求18的分层材料，其中导热材料基本无孔。
27.权利要求18的分层材料，其中散热片组分包含金属基基材。
28.权利要求27的分层材料，其中金属基基材包含镍，铝，铜或其组合。
29.权利要求18的分层材料，其中散热片组分包含硅，碳或者其组合。
30.权利要求18的分层材料，其中分层材料包含至少一个附加材料层。
31.权利要求18的分层材料，其中导热层厚度小于约1μm。
32.权利要求31的分层材料，其中导热层厚度小于约500nm。
33.权利要求32的分层材料，其中导热层厚度小于约100nm。
34.权利要求33的分层材料，其中导热层厚度小于约10nm。
35.权利要求18的分层材料，其中导热层以图案敷设。
36.权利要求18的分层材料，其中导热层由脉冲电镀装置形成。
37.权利要求18的分层材料，其中导热层以脉冲周期转向法形成。
38.权利要求18或26之一的分层材料，还包含衬底。
39.一种形成分层界面材料的方法，包括：提供一种脉冲电镀导热界面材料；提供一种散热片组分；物理连接导热界面材料与散热片组分。
40.权利要求39的方法，还包括连接附加层至分层界面材料。
41.一种分层界面材料，包含：
导热体；
保护层；
接受焊料及防止氧化物形成的材料层；和
焊料材料层。
42.权利要求41的分层材料，其中导热体包含铜。
43.权利要求41的分层材料，其中保护层包含镍。
44.权利要求41的分层材料，还包含电子元件。
45.权利要求44的分层材料，其中该电子元件包括晶片。
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CN102234187B (zh) * 2010-04-29 2013-10-30 比亚迪股份有限公司 一种陶瓷复合材料及其制备方法

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KR100893974B1 (ko) 2009-04-20
WO2004075261A3 (en) 2005-02-03
JP2006518553A (ja) 2006-08-10
WO2004075261A2 (en) 2004-09-02
EP1595289A2 (en) 2005-11-16
US7897437B2 (en) 2011-03-01
US20060237838A1 (en) 2006-10-26
TW200428534A (en) 2004-12-16
EP1595289A4 (en) 2009-04-15
US20080176095A1 (en) 2008-07-24
US7378730B2 (en) 2008-05-27
KR20050102654A (ko) 2005-10-26

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