CN1759638A - Display panel and method of manufacturing the same - Google Patents
Display panel and method of manufacturing the same Download PDFInfo
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- CN1759638A CN1759638A CN 200480006665 CN200480006665A CN1759638A CN 1759638 A CN1759638 A CN 1759638A CN 200480006665 CN200480006665 CN 200480006665 CN 200480006665 A CN200480006665 A CN 200480006665A CN 1759638 A CN1759638 A CN 1759638A
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Abstract
The present invention provides a display panel of enhanced antiweatherability which during the production thereof can avoid exposure to high temperature. In particular, organic EL device (100) as a display panel, comprising non-alkali glass base plate (10), organic EL laminate (20) superimposed on the base plate (10) and sealing plate (30) provided so as to cover the organic EL laminate (20). The sealing plate (30) has 2.0 mm wide peripheral protrusion (31) provided around central depressed part (32). The organic EL laminate (20) is superimposed on the base plate (10) and comprises conductive film (21) consisting of ITO film, organic EL laminated film (22) superimposed on an upper surface of the conductive film (21), upper transparent electrode (23) superimposed on an upper surface of the organic EL laminated film (22) and extraction electrode (24) connected to the upper transparent electrode (23). The base plate (10) and the peripheral protrusion (31) of the sealing plate (30) are joined in sealed relationship to each other through weld layer (40) consisting of a solder disposed in a sealing zone provided therebetween.
Description
Technical field
The present invention relates to a kind of display floater and manufacture method thereof.
Background technology
In existing display floater, especially as the EL element of electroluminescence (hereinafter referred to as EL) display floater, known has 2 kinds, a kind of is passive, it can be by optionally to applying voltage by opposed electrode of luminescent layer and back electrode (back electrodes), make this luminescent layer optionally luminous, it is suitable for matrix and shows (matrix display); A kind of is active type, and it can carry out high speed with the high-speed transitions function and switch demonstration, is suitable for animation and shows.
The EL element of described passive, adopt simple matrix structure, its by substrate, be configured in electrode on this substrate, have luminescent layer and at this EL duplexer stacked above electrode, constitute at this back electrode stacked above EL duplexer, glass sealing plate, wherein the glass sealing plate is on the substrate that is laminated with this EL duplexer, central portion is processed as concavity so that the peripheral projection portion of bonding end face is defined in peripheral part, and the sealing of the end face by peripheral projection portion is bonded in and forms on the substrate.
In addition, the EL element of described active type, adopt active matrix structure, its structure with the TFT liquid crystal cell is the same, by substrate, each pixel forms on this substrate thin-film transistor circuit or diode, contain luminescent layer and constitute at this thin-film transistor circuit or this EL duplexer stacked above diode and glass sealing plate, described glass sealing plate is central portion to be processed as concavity on the substrate that is laminated with this EL duplexer to be defined in peripheral part with the peripheral projection portion with bonding end face and to form.
In the EL element of the EL element of described passive and described active type, the EL element of top emission structure is meant that by constituting with transparent material to described sealing plate side from described luminescent layer, the light of spontaneous photosphere obtains from the sealing plate side in the future.
In these EL element, by long-time use, sealing plate sealing reduce, and moisture etc. sneaks in the EL element, its result can cause EL stacked film deterioration.For preventing these, will cut off with water and oxygen in the EL element, by by substrate and sealing plate the adhesive linkage that constitutes of the bonding agent of the seal portion configurations between the peripheral projection portion substrate and sealing plate is bonding.Material as the bonding agent that constitutes this adhesive linkage generally adopts resin or low-melting glass etc.(for example, the spy opens the 2002-231442 communique).
But, in display floater, especially as the EL element of EL display floater, adopt the conduct of resin system bonding agent substrate and sealing plate during the adhesive linkage material that sealing disposed between the peripheral projection portion, because resin has poisture-penetrability, therefore existence is owing to immerse the inner problem that causes the deterioration in characteristics of EL element, especially organic EL, weatherability reduction simultaneously of EL element by resin moisture.In addition, when adopting low-melting glass as the material of adhesive linkage, because EL element is heated to high temperature when sticking bonding step, therefore the deterioration in characteristics of EL element, especially organic EL can take place, the problem of the substrate generation warpage in EL element.
Summary of the invention
The objective of the invention is to, can prevent the exposure under the high temperature when a kind of the manufacturing is provided, and can also improve the display floater of weatherability.
In order to realize described purpose, according to first scheme of the present invention, provide a kind of display floater, it is characterized in that, the sealing plate that it possesses substrate and sealing is glued on described substrate, described substrate and described sealing plate are sticking by the overlay sealing that is made of metal material.
According to first scheme of the present invention, because substrate and sealing plate are bonding by the overlay sealing that is made of metal material, therefore, can prevent from high temperature to expose display floater during manufacturing, and improve sealing plate the air-tightness of recess, reduce the poisture-penetrability of recess simultaneously.And can improve the weatherability of display floater.
Preferably, described metal material constitutes by containing the scolding tin that is selected from least a material among Sn, Cu, In, Bi, Zn, Pb, Sb, Ga and the Ag.
Preferably, described scolding tin further contains at least a material that is selected among Ti, Al and the Cr.
Constitute according to this,, therefore can improve the cementability of the glass ingredient of overlay and substrate because scolding tin further contains at least a material that is selected among Ti, Al and the Cr.
More preferably, the eutectic temperature of described metal material or fusing point are 250 ℃ or following.
Constitute according to this,, therefore, can guarantee to prevent the display floater deterioration that the thermal conductance when deposited causes reliably because the eutectic temperature or the fusing point of metal material are 250 ℃ or following, or the substrate warp that causes by thermal conductance.
More preferably, described scolding tin is made of In and Sn in fact, and liquidus temperature is 150 ℃ or following.
According to this formation, because scolding tin is made of In and Sn in fact, and liquidus temperature is 150 ℃ or following, therefore, more can improve the cementability with substrate, and can realize that sealing at a lower temperature is bonding.
More preferably, described scolding tin is made of In, Sn in fact, and the weight proportion of In/ (In+Sn) is in 50～65% scope, and its liquidus temperature is 125 ℃ or following.
According to this formation, because scolding tin is made of In, Sn in fact, the weight proportion of In/ (In+Sn) is in 50～65% scope, and its liquidus temperature is 125 ℃ or following, therefore, can further improve the cementability with substrate, after solidifying simultaneously organize fine and be rich in flexibility, mechanical property is good, and the sealing that is implemented under the lower temperature is bonding.
More preferably, described scolding tin is made of In, Sn, Zn, Ti in fact, and the weight proportion of In/ (In+Sn) is in 50～65% scope, and Zn is 0.1～7.0%, and Ti is 0.0001～0.1%, and liquidus temperature is 150 ℃ or following.
According to this formation, because scolding tin is made of In, Sn, Zn, Ti in fact, the weight proportion of its In/ (In+Sn) is in 50～65% scope, and Zn is 0.1～7.0%, and Ti is 0.0001～0.1%, and liquidus temperature is 150 ℃ or following, therefore, when can further improve the cementability with substrate, by making Ti and Zn coexistence, Ti can be contained more equably, and the weatherability of scolding tin and substrate interface can be improved.
More preferably, described scolding tin is made of In, Sn, Zn, Ti in fact, and the weight proportion of In/ (In+Sn) is in 50～65% scope, and Zn is 0.1～5.0%, and Ti is 0.0001～0.05%, and liquidus temperature is 125 ℃ or following.
According to this formation, because scolding tin is made of In, Sn, Zn, Ti in fact, the weight proportion of In/ (In+Sn) is in 50～65% scope, and Zn is 0.1～5.0%, and Ti is 0.0001～0.05%, and liquidus temperature is 125 ℃ or following, therefore, when can further improve the cementability with substrate, by making Ti and Zn coexistence, Ti can be contained more equably, and the weatherability at the interface of scolding tin and substrate can be further improved.
More preferably, aforementioned display floater is an organic EL display panel.
In order to realize described purpose, according to alternative plan of the present invention, a kind of manufacture method of display floater is provided, it is characterized in that, described display floater has substrate and bonding with base plate seals, it is characterized in that, use the melt metal material described substrate and the sealing of described sealing plate is bonding by the friction bonding method.
According to alternative plan of the present invention,, therefore, can realize improving to the sealing of the tack of the substrate of metal material bonding because it is bonding to use the melt metal material by the friction bonding method described substrate and described sealing plate to be sealed.
In order to realize described purpose, according to third party's case of the present invention, a kind of manufacture method of display floater is provided, described display floater has substrate and the sealing plate bonding with base plate seals, it is characterized in that, this method comprise the steps: interarea of described substrate and sealing plate in the peripheral edge portion of an interarea one of at least on the applying step of metal material of coated with melted; With interarea of described substrate and described sealing plate the mutual involutory involutory step of an interarea; By deposited coated described metal material described substrate and described sealing plate are sealed bonding sealing bonding step.
According to third party's case of the present invention, since interarea of described substrate and sealing plate in the peripheral edge portion of an interarea one of at least on the metal material of coated with melted, with interarea of described substrate and described sealing plate an interarea involutory mutually, by deposited coated described metal material that described substrate and the sealing of described sealing plate is bonding, therefore, can be with desirable width and thickness plating material, and can further improve the weatherability of display floater.
Preferably, described applying step be make interarea of described substrate and described sealing plate one of at least and after the interfacial activityization between the melt metal material of the neighboring in interarea, coating aforementioned metal material.
Thus, since make interarea of substrate and sealing plate in the peripheral edge portion of an interarea one of at least and behind the interface activation between the melt metal material, therefore the plating material can improve the adhesive strength of substrate and metal material or the adhesive strength of sealing plate and metal material.
More preferably, described applying step and described sealing bonding step carries out in inert atmosphere one of at least.
Thus, because coating and sealing bonding carries out one of at least, therefore can suppress the generation of oxide on the surface of metal material in inert atmosphere.
Description of drawings
Fig. 1 is the profile as the EL display floater of the display floater of embodiment of the present invention.
Fig. 2 be with substrate among Fig. 1 and sealing plate peripheral projection portion carry out the profile of deposited deposition apparatus.
Fig. 3 is the figure of variation of the importing plate of presentation graphs 2.
Fig. 4 A, Fig. 4 B and Fig. 4 C are the part sectioned views of variation of the organic EL of presentation graphs 1, Fig. 4 A be illustrated in substrate and sealing plate peripheral edge portion portion implement the figure that ladder adds man-hour; Fig. 4 B be illustrated in substrate and sealing plate peripheral edge portion implement to add the figure in man-hour; Fig. 4 C be illustrated in substrate and sealing plate outer circumference end use scolding tin and figure during the welding housing.
Fig. 5 A, Fig. 5 B and Fig. 5 C are the figure of variation of manufacture method that is used to illustrate the display floater of embodiment of the present invention.
Fig. 6 is the figure of variation of manufacture method that is used to illustrate the display floater of embodiment of the present invention.
Embodiment
Below, with reference to figure embodiment of the present invention are described.
Fig. 1 is the profile as the EL display floater of the employed display floater of embodiment of the present invention.
In Fig. 1, top emission type organic EL 100 as the EL display floater, it has passive structures, by size be square, the thickness of 7.0cm be the tabular transparent alkali-free glass system of 1.0mm substrate 10, the folded body 20 of organic EL layer that on substrate 10, forms, be used to cover the sealing plate 30 that the folded body 20 of this organic EL layer forms and constitute.
The formation of the recess 32 of sealing plate 30 is undertaken by the glass blanket is formed concavity with wet etching described later.Measure the etch depth by the etched glass blanket of this wet etching, its result is 300 μ m.In addition, corner portion has crooked position in the bottom surface of recess 32, and its radius of curvature is about 300 μ m.The thickness of recess 32 bottoms of sealing plate 30 is preferably 0.3～1.1mm.During thickness is not enough 0.3mm, the intensity of sealing plate 30 is insufficient, can fully obtain the intensity of sealing plate 30 during for 1.1mm at thickness.
Described wet etching is meant; for the square middle body of 4.5cm that makes the glass blanket exposes; with the acid resistance band, promptly cover with protective layer after; this glass blanket that covers is flooded in remaining in 25 ℃ etching solution, and etching solution is that the mixed liquor by the sodium dodecylbenzene of the hydrofluoric acid of for example 20 quality %, 1 quality % constitutes.
Being constructed as follows of the folded body 20 of organic EL layer: the conducting film 21 that constitutes by the ITO film that is formed on the substrate 10, thickness is 300nm, comprise luminescent layer described later and the folded body 22 of this organic EL layer stacked above conducting film 21, by the thickness that on the folded body 22 of organic EL layer, forms be the upper transparent electrode 23 that constitutes of the ITO film of 500nm and by with the bonding thickness of upper transparent electrode 23 be the extraction electrode 24 that the ITO film of 300nm constitutes.
The folded body 22 of organic EL layer is made of following: be configured in height that the triphen diamine of conducting film 21 sides constitutes and be the hole transporting layer of 70nm and the height that constitutes at this oxyquinoline aluminium complex that forms above hole transporting layer is the luminescent layer of 70nm.And can constitute by between described transparency electrode 23 and luminescent layer, further disposing the transparent electron supplying layer that constitutes by triazole or oxadiazole (oxadiazole).
The peripheral projection portion 31 of so-called substrate 10 and sealing plate 30 is meant, by the overlay 40 that the scolding tin that sealing disposed that forms between them constitutes, utilizes the device sealing of Fig. 2 described later bonding.Specifically, sealing plate 30 relative substrates 10 are configured in after the position of regulation, use and consist of the fusion scolding tin of 91.2Sn-8.8Zn (eutectic temperature is 198 ℃), and the peripheral projection portion 31 of sealing plate 30 is deposited on the substrate 10.
Fig. 2 is the profile of deposition apparatus of implementing the display floater manufacture method of embodiment of the present invention.
In Fig. 2, for the bonding deposition apparatus A of sealing of the peripheral projection portion 31 that carries out substrate 10 among Fig. 1 and sealing plate 30 has following formation.
That is, deposition apparatus A keeps the substrate 10 and the sealing plate 30 of organic EL 100 in high portion by mounting table 50, has the fixed disk 52 of the band ladder that keeps supplying with tower 51 simultaneously at lower curtate.Bottom at the fixed disk 52 of being with ladder along described organic EL display element 100, disposes 2 guide rails 53, and described supply tower 51 is positioned in the travel mechanism 54 that walks on the track segment 53.
Supplying with tower 51 has: the cross section of the scolding tin a of storage liquid phase or solid phase is a rectangular crucible portion 55, be built in the side wall portion of crucible portion 55 and the electric heater 56 that heating is stored in the scolding tin a in the crucible portion 55, be communicated with the bottom of crucible portion 55 and be elongated introduction part 58, at the importing plate 59 of the centre position of introduction part 58 horizontal arrangement towards the section of the substrate 10 of organic EL 100 and the sealing of sealing plate 30 (clearance portion 57) opening.Import plate 59 from introduction part 58 extensions and embedding clearance portion 57, thus, scolding tin a combines with its surface tension, immerses clearance portion 57.In addition, in crucible portion 55, the gravity that is positioned at the scolding tin a of liquid level Δ H imposes on scolding tin a at the position that imports plate 59, thus, impels the immersion of scolding tin a in clearance portion 57.
On the other hand, travel mechanism 54 moves on track segment 53 with certain speed along clearance portion 57.Thus, scolding tin a is immersed in the total length of whole clearance portion 57 by introduction part 58.
According to the present embodiment, because substrate 10 can be bonding by overlay 40 sealings that are made of scolding tin a with the peripheral projection portion 31 of sealing plate 30, therefore improved the air-tightness of the recess 32 of sealing plate 30, reduce the poisture-penetrability of recess 32 simultaneously, and can improve the weatherability of organic EL 100.In addition, thus,, therefore manufacturing cost can be reduced, the number of manufacturing step can be reduced simultaneously owing to do not need to be configured at present the dehumidizers such as silica gel of the recess 32 of sealing plate 30.In addition, owing to the temperature of organic EL 100 is not risen, and sealing plate 30 is deposited on the substrate 10, therefore can prevents the deterioration of the organic EL 100 that the thermal conductance when deposited causes or the warpage of the substrate 10 that causes by thermal conductance.
According to the present embodiment,, therefore can improve the tack of scolding tin a, thereby realize that sealing is bonding substrate 10 owing to use the scolding tin a of fusion substrate 10 is bonding with sealing plate 30 sealings by the friction bonding method.
In the present embodiment, overlay 40 is to use deposition apparatus A to form, but is not limited thereto, and also can adopt adhering method formation overlaies 40 such as anodically-bonded, bonding with ultrasonic wave, that multistage is bonding, crimping is bonding.
In the present embodiment, by using the overlay 40 that constitutes by scolding tin a to seal the peripheral projection portion 31 of adhesive base plate 10 and sealing plate 30, but be not limited thereto, as shown in Figure 4, the peripheral edge portion of substrate 10 and sealing plate 30, can be (Fig. 4 A) of ladder processing, also can be (Fig. 4 B) that tilts to process in addition.And at the peripheral edge portion of substrate 10 and sealing plate 30, shown in Fig. 4 C, in substrate 10 and sealing plate 30 outer circumference end separately, also can be by using the overlay 40 that forms by scolding tin a, deposited housing 70 and sealing adhesive base plate 10 and sealing plate 30.
Fig. 5 and Fig. 6 are the figure of variation of manufacture method that is used to illustrate the display floater of embodiment of the present invention.
Variation for the manufacture method of the display floater of embodiment of the present invention, at first, prepare size for the substrate 10 of the tabular transparent alkali-free glass system that 7.0cm is square, thickness is 1.0mm, with the sealing plate 30 of substrate 10 for same shape and same size, next as shown in Figure 6, at N
2In the inert atmospheres such as Ar, the peripheral edge portion of an interarea in substrate 10, the internal diameter that employing is positioned at the tube-shaped sputtering mouth 91 of its front end is 1.5mm, external diameter is the distributor 90 of 2.0mm, slide on substrate 10 1 sides' interarea by front end distributor 90, make the interface activation of substrate 10 and scolding tin a by friction, coating of scolding tin a wire and curing (applying step) with fusion, entire scope at the peripheral edge portion of substrate 10 forms solder sections 81 (Fig. 5 C), and at the edge part of sealing plate 30 1 sides' interarea, with distributor 90 sealing plate 30 and the interface of scolding tin a are activated by friction, and with the coating of the scolding tin a wire of fusion and solidify, form solder sections 82 in the entire scope of the peripheral edge portion of sealing plate 30.
The amount of the scolding tin a that distributor 90 ejects from distributor 90 by control, at the friction width of substrate 10 with the interface of scolding tin a, be the handover speed of the external diameter and the distributor 90 of jet exit 91, can form the solder sections 81 and the solder sections 82 of desirable width and thickness.
This method further can form solder sections 81 substrate 10 an interarea and can form the interarea involutory mutually (involutory step) (Fig. 5 B) of the sealing plate 30 of solder sections 82, further with substrate 10 and sealing plate 30, at N
2In the inert atmospheres such as Ar, be heated near the eutectic temperature of scolding tin a, for example be heated to 200 ℃, make solder sections 81 form overlay 83 (Fig. 5 C) with solder sections 82 mutual fusions, make deposited substrate 10 and sealing plate 30 deposited by overlay 83, with substrate 10 and sealing plate 30 sealings bonding (sealing bonding step).
According to the present embodiment, the scolding tin a of fusion is coated in the peripheral edge portion of an interarea in the substrate 10, further the scolding tin a of fusion is coated in the peripheral edge portion of an interarea in the sealing plate 30, make an interarea of substrate 10 reach involutory mutually at an interarea of sealing plate 30, seal substrate 10 and sealing plate 30 bonding by deposited solder sections 81 with solder sections 82, therefore, can make solder sections 81 and solder sections 82 form desirable width and thickness, and can further improve the weatherability of organic EL 100.
According to the present embodiment, behind the interface activation owing to the interface that makes substrate 10 and scolding tin a and sealing plate 30 and scolding tin a, therefore the scolding tin a of coated with melted can improve substrate 10 and the adhesive strength of scolding tin a and the adhesive strength of sealing plate 30 and scolding tin a.
According to the present embodiment, because coating and to seal bonding be at N one of at least
2, carry out in the inert atmospheres such as Ar, therefore can be suppressed at the generation of solder sections 81 and the oxide on the surface of solder sections 82.
According to the present embodiment, slide on an interarea of substrate 10 by front end distributor 90, after making substrate 10 and the interface of scolding tin a pass through the friction activation, the scolding tin a of coated with melted, but be not limited thereto, also can be in bonding distributor 90, by the illustrated vibration generating arrangement that do not have with the generation microvibration, vibration is imposed on scolding tin a, make interarea of substrate 10 and the interface activation of scolding tin a, also can be at an interarea coating scolding tin a of substrate 10.
In the present embodiment, after being coated to the peripheral edge portion of an interarea in the substrate 10, scolding tin a with fusion makes its curing although be, make its curing after further the scolding tin a of fusion being coated to the peripheral edge portion of an interarea in the sealing plate 30, but be not limited thereto, also can the peripheral edge portion of an interarea of substrate 10 and an interarea in the sealing plate 30 one of at least, the scolding tin a of coated with melted also makes its curing, specifically, when only the peripheral edge portion of an interarea in substrate 10 applies scolding tin, there is not illustrated vibration machine that sealing plate 30 is applied vibration by employing, make the interarea of sealing plate 30 and the interface activation of solder sections 81, and an interarea that makes the substrate 10 that has formed solder sections 81 is with involutory mutually at an interarea of sealing plate 30.Equally, when only the peripheral edge portion of an interarea in sealing plate 30 applies scolding tin a, can there be illustrated vibration machine that substrate 10 is applied vibration by employing yet, make the interarea of substrate 10 and the interface activation of solder sections 82, and make an interarea of interarea of the sealing plate 30 that formed solder sections 82 and substrate 10 involutory mutually.
In each embodiment of the present invention, the employing component is the scolding tin a of 91.2Sn-8.8Zn (198 ℃ of eutectic temperatures), but be not limited thereto, also can be to contain alloy or the metal that is selected from least a material among Sn, Cu, In, Bi, Zn, Pb, Sb, Ga and the Ag, eutectic temperature or fusing point be 250 ℃ or following scolding tin.
And described metal material also can further contain at least a material that is selected among Ti, Al and the Cr.Thus, can improve the cementability of the glass ingredient of overlay 40 and substrate 10.
In addition, preferred described scolding tin is made of In and Sn in fact, and liquidus temperature is 150 ℃ or following.Thus, can further improve the cementability with substrate 10, and can realize that the sealing under the lower temperature is bonding.
More more preferably scolding tin is made of In and Sn in fact, and the weight proportion of In/ (In+Sn) is in 50～65% scope, and its liquidus temperature is 125 ℃ or following.Thus, can be further enough cementabilities that improves with substrate 10, organizing fine and be rich in flexibility after solidifying simultaneously, mechanical property is good, and can realize that more the sealing of low temperature is bonding.
In addition, preferred scolding tin is made of In, Sn, Zn, Ti in fact, the weight proportion of In/ (In+Sn) is in 50～65% scope, Zn is 0.1～7.0%, and Ti is 0.0001～0.1%, and its liquidus temperature is 150 ℃ or following, and, more preferably: Zn is 0.1～5.0%, and Ti is 0.0001～0.05%, and its liquidus temperature is 125 ℃ or following.Thus, can further improve the cementability with substrate 10, by making Ti and Zn coexistence, can contain Ti more equably, and can improve the weatherability at the interface of scolding tin and substrate 10 simultaneously.
At this, Zn can not improve the cementability with substrate 10 than the amount of described scope after a little while, can not contain Ti equably simultaneously, on the other hand, Zn than the amount of described scope for a long time, the liquidus temperature of scolding tin increases, therefore bonding required increase in temperature is inappropriate.
Ti can not improve the cementability with substrate 10 than the amount of described scope after a little while, on the other hand, Ti than the amount of described scope for a long time, the liquidus temperature of scolding tin increases, therefore bonding required increase in temperature is inappropriate.Particularly in the molten condition of scolding tin, separating out the compound of Ti and other compositions easily, is not preferred.
In addition, more preferably the eutectic composition of In-Sn binary system approaches that In accounts for 52%, Sn accounts for 48% scolding tin for well, particularly owing to be that In accounts for 52%, Sn accounts for the scolding tin that 48% (117 ℃ of eutectic temperatures) constitutes by the eutectic composition of In-Sn binary system, organizing after solidifying is very trickle, and is rich in flexibility, mechanical property is good, is preferred therefore.
More preferably, the eutectic composition of In-Sn binary system is that In accounts for 52%, Sn accounts in the scolding tin that 48% (117 ℃ of eutectic temperatures) form and adds Zn and Ti, and is for example better by the scolding tin that In51%, Sn47%, Zn2.0%, Ti0.002% form.Thus, very good with the cementability of substrate 10, the weatherability at the interface of scolding tin and substrate 10 is also very good.
As described scolding tin, specifically have: scolding tin such as Sn-Ag system, Sn-Cu system, Sn-Ag-Cu system, Sn-Ag-Bi system, Sn-Ag-Cu-Bi system, also can adopt 250 ℃ of its eutectic temperatures or following scolding tin.
In the present embodiment, the method at glass blanket formation recess 32 adopts wet etching, but also can adopt the dry-etching method, also can be used in combination dry-etching method and wet etching.
In the present embodiment, as the material of sealing plate 30, adopt alkali-free glass, but can adopt glass with lower alkali content or after etching, implement the soda lime glass or the quartz glass that prevent that the alkali stripping from handling according to the structure of organic EL 100.In addition,, also can adopt metal material, as this metal material, preferably adopt Al, Cu, Fe, and can adopt SUS, pottery, Pt, Au as the material of sealing plate 30.
In addition, the shape of sealing plate 30 is not limited to the shape that Fig. 1 puts down in writing, and folds body 20 in order to protect organic EL layer, so long as the shape of utilizing substrate 10 and overlay 40 to seal is just passable.
In the present embodiment, the folded film 22 of organic EL layer has passive structures, but also can have active structure.In the present embodiment, organic EL 100 has top emission structure in addition, but also can have the bottom emission structure.
In addition, the EL stacked film can replace organic EL layer to fold film 22, also can inorganic EL stacked film.At this moment, can adopt: from the nesa coating side, be followed successively by the film that constitutes by insulating barrier, luminescent layer, insulating barrier, perhaps the film that constitutes by electronic barrier layer, luminescent layer, current-limiting layer.
In addition, in the present embodiment, use organic EL 100 as the EL display floater, but be not limited thereto, also can adopt display floaters such as CRT, PDP.
According to display floater of the present invention, because substrate and sealing plate are bonding by the overlay sealing that is made of metal material, therefore, can prevent from high temperature to expose display floater during manufacturing, and can improve sealing plate the air-tightness of recess, reduce the poisture-penetrability of recess simultaneously, and can improve the weatherability of display floater.
According to display floater of the present invention,, therefore can improve the cementability between the glass ingredient of overlay and substrate because scolding tin further contains at least a material that is selected among Ti, Al and the Cr.
According to display floater of the present invention,, therefore, can prevent display floater deterioration that the heat when deposited causes or the curved substrate that causes by heat reliably because the eutectic temperature or the fusing point of metal material is 250 ℃ or following.
According to display floater of the present invention, because scolding tin is made of In and Sn in fact, its liquidus temperature is 150 ℃ or following, therefore more can improve the cementability with substrate, and can realize that the sealing under the lower temperature is bonding.
According to display floater of the present invention, because scolding tin is made of In and Sn in fact, the weight proportion of In/ (In+Sn) is in 50～65% scope, and its liquidus temperature is 125 ℃ or following, therefore can further improve the cementability with substrate, organizing after solidifying simultaneously is fine, and is rich in flexibility, mechanical property is good, and can realize that the sealing under the low temperature more is bonding.
According to display floater of the present invention, because scolding tin is made of In, Sn, Zn, Ti in fact, the weight proportion of In/ (In+Sn) is in 50～65% scope, Zn is 0.1～7.0%, and Ti is 0.0001～0.1%, and its liquidus temperature is 150 ℃ or following, therefore can further improve cementability with substrate, by making Ti and Zn coexistence, can contain Ti more equably, and can improve the weatherability at the interface of scolding tin and substrate simultaneously.
According to display floater of the present invention, because scolding tin is made of In, Sn, Zn, Ti in fact, the weight proportion of In/ (In+Sn) is in 50～65% scope, Zn is 0.1～5.0%, and Ti is 0.0001～0.05%, and its liquidus temperature is 125 ℃ or following, therefore can further improve cementability with substrate, by making Ti and Zn coexistence, can contain Ti more equably, and can improve the weatherability at the interface of scolding tin and substrate simultaneously.
According to the manufacture method of display floater of the present invention, owing to use the melt metal material by the friction bonding method described substrate and described sealing plate to be carried out sealing bonding, therefore, it is bonding to the sealing of the tack of substrate to realize improving metal material.
Manufacture method according to display floater of the present invention, by interarea of described substrate and described sealing plate in the peripheral edge portion of an interarea one of at least on the metal material of coated with melted, with interarea of described substrate and described sealing plate an interarea involutory mutually, the sealing that coated metal material is deposited is bonding because described substrate and described sealing plate, therefore, can be with desirable width and thickness plating material, and can improve the weatherability of display floater.
Manufacture method according to display floater of the present invention, since make an interarea of substrate and sealing plate one of at least and behind the interface activation between the melt metal material of the peripheral edge portion in interarea, the plating material, therefore can improve the adhesive strength of substrate and metal material, or the adhesive strength of sealing plate and metal material.
According to the manufacture method of display floater of the present invention,, therefore can suppress the generation of the oxide of metal material surface in inert atmosphere because coating and sealing bonding is carried out one of at least.
Claims (13)
1, a kind of display floater is characterized in that, it possesses substrate and the sealing plate bonding with described base plate seals, and described substrate and described sealing plate are bonding by the overlay sealing that is made of metal material.
2, the display floater of putting down in writing according to claim 1 is characterized in that, described metal material constitutes by containing the scolding tin that is selected from least a material among Sn, Cu, In, Bi, Zn, Pb, Sb, Ga and the Ag.
3, the display floater of putting down in writing according to claim 2 is characterized in that, described scolding tin also contains at least a material that is selected among Ti, Al and the Cr.
4, the display floater of putting down in writing according to claim 1 is characterized in that, the eutectic temperature of described metal material or fusing point are 250 ℃ or following.
5, the display floater of putting down in writing according to claim 2 is characterized in that, described scolding tin is made of In and Sn in fact, and liquidus temperature is 150 ℃ or following.
6, the display floater of putting down in writing according to claim 2 is characterized in that, described scolding tin is made of In and Sn in fact, and the weight proportion of In/ (In+Sn) is in 50～65% scope, and liquidus temperature is 125 ℃ or following.
7, the display floater of putting down in writing according to claim 3 is characterized in that, described scolding tin is made of In, Sn, Zn, Ti in fact, the weight proportion of In/ (In+Sn) is in 50～65% scope, Zn is 0.1～7.0%, and Ti is 0.0001～0.1%, and liquidus temperature is 150 ℃ or following.
8, the display floater of putting down in writing according to claim 3 is characterized in that, described scolding tin is made of In, Sn, Zn, Ti in fact, the weight proportion of In/ (In+Sn) is in 50～65% scope, Zn is 0.1～5.0%, and Ti is 0.0001～0.05%, and liquidus temperature is 125 ℃ or following.
9, the display floater of putting down in writing according to claim 1 is characterized in that, described display floater is an organic EL display panel.
10, a kind of manufacture method of display floater, wherein said display floater possess substrate and the sealing plate bonding with described base plate seals, it is characterized in that, use the melt metal material by the friction bonding method that described substrate and the sealing of described sealing plate is bonding.
11, a kind of manufacture method of display floater, described display floater possesses substrate and the sealing plate bonding with described base plate seals, and this method has following step: interarea of described substrate and described sealing plate in the peripheral edge portion of an interarea one of at least on the applying step of metal material of coated with melted; With interarea of described substrate and described sealing plate the mutual involutory involutory step of an interarea; By making coated described metal material deposited and with the bonding sealing bonding step of described substrate and described sealing plate sealing.
12, the manufacture method of the display floater of putting down in writing according to claim 11, it is characterized in that, described applying step make interarea of described substrate and described sealing plate in the peripheral edge portion of an interarea one of at least and behind the interface activation between the melt metal material, apply described metal material.
13, the manufacture method of the display floater of putting down in writing according to claim 11 is characterized in that, the carrying out in inert atmosphere one of at least of described applying step and described sealing bonding step.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003063220 | 2003-03-10 | ||
| JP063220/2003 | 2003-03-10 | ||
| JP317114/2003 | 2003-09-09 | ||
| JP328805/2003 | 2003-09-19 | ||
| JP422679/2003 | 2003-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1759638A true CN1759638A (en) | 2006-04-12 |
Family
ID=36704066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200480006665 Pending CN1759638A (en) | 2003-03-10 | 2004-03-10 | Display panel and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1759638A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102007524B (en) * | 2008-04-17 | 2013-07-31 | 旭硝子株式会社 | Glass laminate, display panel with support, method for producing glass laminate and method for manufacturing display panel with support |
| CN104360546A (en) * | 2014-12-03 | 2015-02-18 | 京东方科技集团股份有限公司 | Frameless display device and manufacturing method thereof |
| CN104466029A (en) * | 2013-09-24 | 2015-03-25 | 胜华科技股份有限公司 | Organic light emitting package structure and manufacturing method thereof |
| CN107863453A (en) * | 2017-11-08 | 2018-03-30 | 固安翌光科技有限公司 | A kind of OLED based on end face encapsulation and preparation method thereof |
| CN110277511A (en) * | 2018-01-19 | 2019-09-24 | 武汉华美晨曦光电有限责任公司 | A kind of OLED device and its processing method of included external cabling |
-
2004
- 2004-03-10 CN CN 200480006665 patent/CN1759638A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102007524B (en) * | 2008-04-17 | 2013-07-31 | 旭硝子株式会社 | Glass laminate, display panel with support, method for producing glass laminate and method for manufacturing display panel with support |
| CN104466029A (en) * | 2013-09-24 | 2015-03-25 | 胜华科技股份有限公司 | Organic light emitting package structure and manufacturing method thereof |
| CN104360546A (en) * | 2014-12-03 | 2015-02-18 | 京东方科技集团股份有限公司 | Frameless display device and manufacturing method thereof |
| US9772526B2 (en) | 2014-12-03 | 2017-09-26 | Boe Technology Group Co., Ltd. | Frameless display device and method of fabricating the same |
| CN104360546B (en) * | 2014-12-03 | 2017-10-03 | 京东方科技集团股份有限公司 | Frame-free displaying device and its manufacture method |
| CN107863453A (en) * | 2017-11-08 | 2018-03-30 | 固安翌光科技有限公司 | A kind of OLED based on end face encapsulation and preparation method thereof |
| CN107863453B (en) * | 2017-11-08 | 2020-09-29 | 固安翌光科技有限公司 | OLED device based on end face packaging and preparation method thereof |
| CN110277511A (en) * | 2018-01-19 | 2019-09-24 | 武汉华美晨曦光电有限责任公司 | A kind of OLED device and its processing method of included external cabling |
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