CN1708212A - Heat conductive substrate apparatus - Google Patents
Heat conductive substrate apparatus Download PDFInfo
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- CN1708212A CN1708212A CN 200410046587 CN200410046587A CN1708212A CN 1708212 A CN1708212 A CN 1708212A CN 200410046587 CN200410046587 CN 200410046587 CN 200410046587 A CN200410046587 A CN 200410046587A CN 1708212 A CN1708212 A CN 1708212A
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- heat
- metallic plate
- circuit layer
- conducting substrate
- substrate device
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Abstract
The present invention relates to one kind of heat conducting base board device, which has the main structure comprising circuit layer, insulating layer and metal board. The metal board with high heat conductance and with embedding slots on one surface can lower thermal resistance and increase heat dissipating area, and is combined with one insulating layer and set in the bottom of the circuit layer. The heat the electronic modules generate may be transferred to the bottom of the metal board for rapid dissipation. While matching with traditional heat sink to increase overall heat dissipating capacity, the metal board with embedding slots has reduced deformation caused by assembling stress and decreased nonhomogeneity of overall heat resistance and contact heat resistance. The heat conducting base board may be in different shapes, and has powerful heat dissipating capacity and fast forming.
Description
Technical field
The present invention relates to a kind of heat-conducting substrate device, especially a kind of heat-conducting substrate device that is applied to power module.
Background technology
Along with modernized sci-tech product use more prevalent, especially use more extensive in industries such as computer, information and communications, owing to have many precise electronic assemblies in the sci-tech product, after each element energising, its thermal resistance comes into operation and can produce high temperature, and high temperature causes component wear easily, when serious even influence overall structure, therefore its running stability is extremely important, and particularly radiating effect is even more important.
The common heat abstractor that is installed on the various power modules has following two kinds at present:
As shown in figure 21; it is the partial sectional view of first kind of heat abstractor commonly used; it is power module with general heat abstractor 70; it is by circuit layer 71; insulating barrier 72 and metallic plate 73 are formed; these circuit layer 71 upper set are provided with several electronic building bricks 711; can reach the effect of the various electrical equipment of running control; these circuit layer 71 bottom group are provided with an insulating barrier 72 with heat-transfer effect; but make these insulating barrier 72 protective circuit layers 71 avoid being subjected to the interference of current lead-through; be provided with a metallic plate 73 with high-termal conductivity in insulating barrier 72 bottom group again; because electronic building brick 711 is after current lead-through; the heat of its generation conducts to this metallic plate 73 through insulating barrier 72; heat transferred is gone out, reach the effect of heat radiation.
As shown in figure 22, it is the enforcement illustration of first kind of heat abstractor commonly used, in order to increase radiating effect, its power module can be added a radiator 75,75 of this power module and heat sinks are covered with heat conduction inserts 74, be generally the silica gel material, its soft whippy characteristic, can fill up 75 irregular surfaces of power module and radiator and have the effect of buffering, power module locks by bolt or is fixed on the heat sink 75 with mosaic mode, the lower thermal resistance of utilizing this radiator 75 to be had is gone out the power module heat transferred, increases radiating effect.
The metallic plate of this heat abstractor is the plane plate shape, and the heat hot-fluid that power module produced only can be derived by these metallic plate four sides; And the key of employing more than between this power module and metallic plate screws fix or mosaic mode is fixed, power module underlying metal plate is a plane plate, when assembling fixedly in both sides, because layer of silica gel is soft material, strong extrusion silica gel during assembling, can make silica gel compression, and the extruded deflection of an end of this silica gel can hold surplus place to both sides and moves, and form a deformation projections end, produce a strength of upwards pushing, support power module bottom causes distortion, makes the power module two bottom sides form extrusion locking shape, central authorities are formed with a gap, cause thermo-contact bad and reduce heat dispersion, as shown in figure 23, figure is the heat group schematic diagram of each position of heat abstractor commonly used, as seen when power module energising running, the thermal resistance of this gap location is than both sides height, thereby generation high temperature gently then causes electronic building brick to damage, when serious even can cause the damage of this power module, influence integrally-built running.
As shown in figure 24, be second kind of power module commonly used, it is a kind of multilayer circuit layer 80 that is furnished with copper conductor, and be covered with insulating barrier 81 in 80 on this multilayer circuit layer, both sides at this circuit layer 80 can be assembled with electronic building brick 82 respectively, make heat see through its surface and borrow cross-ventilation, reach the effect of heat radiation.
It also can cover a heat conduction inserts 83 in this power module bottom, for establishing with metallic plate 84 overlap joint groups, as shown in figure 25, the heat that electronic building brick 82 produces sees through insulating barrier 81 and reaches metallic plate 84 bottoms, by the high-termal conductivity of this metallic plate 84, reach the effect of heat radiation.
In this heat abstractor, can lower the temperature by cross-ventilation on its surface though both sides are provided with the circuit layer of electronic building brick, yet when the power module power consumption is high, can produce high temperature, depend cross-ventilation alone and can't reach cooling-down effect; And the mode of establishing a metallic plate in its bottom group, though can promote radiating effect, yet by as can be known shown in Figure 25, though the thermal resistance difference of this each position of circuit layer bottom changes little, but more toward the upper strata, its thermal resistance is higher, and it is the highest not organize the other end thermal resistance that is provided with metallic plate.And, adding heat sink to promote radiating effect if be equipped with one in this circuit layer bottom group, it still can run into the problem of the circuit layer distortion that causes because of assembling stress, the drawback that causes thermal resistance to improve, and the integral heat sink effect is restricted.
Summary of the invention
Technical problem to be solved by this invention is at the deficiencies in the prior art, a kind of heat-conducting substrate device is provided, the default geometry of the circuit layer bottom metal of this heat-conducting substrate device and the design of its caulking groove, can effectively reduce the stress that is produced because of assembling, make thermo-contact more even, can effectively reduce thermal resistance, have good thermal conductivity, good heat dissipation effect air; And can add heat sink, increase radiating effect.
Technical problem to be solved by this invention is achieved by the following technical solution:
A kind of heat-conducting substrate device, its main composition comprises circuit layer, insulating barrier and metallic plate, establish the electronic building brick that can carry out the electronic circuit control action more than in group on this circuit layer, group is established insulating barrier and the metallic plate with high-termal conductivity respectively below circuit layer, the metallic plate bottom has caulking groove, increase cross-ventilation by this caulking groove, thereby increase its surface area to reduce thermal resistance.
This heat-conducting substrate device and another heat sink connect to be established, and covers the heat conduction inserts between metallic plate and heat sink, and bottom is arranged with a metallic plate with upper embedded groove and evenly is overlapped on this heat sink.
The set caulking groove of this metallic plate bottom be vertically to or intersect vertically in length and breadth or oblique intersecting, this intersects more than one the multidirectional circulation path that reduces flow-disturbing in the caulking groove of arranging.
This metallic plate bottom is made as and is the above cylinder that group is arranged, and the multidirectional circulation path that reduces flow-disturbing is arranged within it.
This metallic plate bottom is made as and is the king-post shape that encircles bead storehouse shape more than that group is arranged, and the multidirectional circulation path that reduces flow-disturbing is arranged within it.
This metallic plate is made as the prominent king-post shape that several fins are arranged that has.
Make sheet metal by the drawing mode, be shaped as metal column kenel with multidirectional Openworks shape with caulking groove shape arrangement profile.
This metallic plate and insulating barrier, the fastening group of sticking together of circuit layer are set as one.
This circuit layer is provided with the ceramic base material of insulating heat-conductive effect in its bottom group, and this ceramic base material one face down bonding has an above electronic building brick, and opposite side and described metallic plate weldering knot are fixing.
This circuit layer is the multilayer circuit layer with bottom, and group is provided with insulating barrier below this bottom, utilizes scolder and metallic plate weldering knot fixing.
This circuit layer is not for having the multilayer circuit layer of bottom, and sticking below this multilayer circuit layer has medium and insulating material, and medium and metallic plate stick fixing.
The present invention is prior art relatively, can produce following technique effect:
1, promotes heat dissipation: because the present invention has the metal plate structure modern design of geometry caulking groove, can increase the air contact area, reduce thermal resistance, heat is passed to the other end by heat source side rapidly and is distributed by metallic plate, and then promotes the integral heat sink effect.
2, can add heat sink: metallic plate shape of the present invention is various, can distinguish coupled system fan or radiator or heat pipe and beyond the metallic plate bottom, increase heat sink, this metallic plate can evenly be arranged on the heat sink by means of the caulking groove shape of its bottom, can effectively reduce assembling stress, add with heat sink and combine, can reduce thermal resistance, and then promote radiating effect.
3, area of dissipation strengthens: the metallic plate shape design of tool caulking groove shape of the present invention is various, and its shape can have the characteristics that the gap is less and the heat-dissipating metal sheet arrangement is more simultaneously, and area of dissipation is strengthened, thereby promotes radiating effect.
4, production and processing is easy and quick: the present invention has the sheet metal of caulking groove and default geometry thereof, metal aluminium or the existing rapid one of machining machine and tool of copper material utilization can be shaped, and very easily realizes.
Description of drawings
Fig. 1 is a combination of side view of the present invention;
Fig. 2 is the upward view of metallic plate of the present invention;
Fig. 3 is the present invention and the combination of side view that adds heat sink;
Fig. 4 is a thermal resistance distribution schematic diagram of the present invention;
Fig. 5 is first embodiment of the present invention figure;
Fig. 6 is second embodiment of the present invention figure;
Fig. 7 is third embodiment of the present invention figure;
Fig. 8 is fourth embodiment of the present invention figure;
Fig. 9 is fifth embodiment of the present invention figure;
Figure 10 is sixth embodiment of the present invention figure;
Figure 11 is seventh embodiment of the present invention figure;
Figure 12 is eighth embodiment of the present invention figure;
Figure 13 is ninth embodiment of the present invention figure;
Figure 14 is tenth embodiment of the present invention figure;
Figure 15 is 11st embodiment of the present invention figure;
Figure 16 is 12nd embodiment of the present invention figure;
Figure 17 is 13rd embodiment of the present invention figure;
Figure 18 is the of the present invention the 14 real illustration that drags;
Figure 19 is 15th embodiment of the present invention figure;
Figure 20 is 16th embodiment of the present invention figure;
Figure 21 is the combination of side view of first kind of heat abstractor commonly used;
Figure 22 is first kind of heat abstractor commonly used and the combination of side view that adds heat sink;
Figure 23 is the thermal resistance distribution schematic diagram of first kind of heat abstractor commonly used;
Figure 24 is the combination of side view of second kind of heat abstractor commonly used;
Figure 25 is the thermal resistance distribution schematic diagram of second kind of heat abstractor commonly used.
The figure number explanation:
A-power supply module B heat-transfer device
10 circuit layers, 11 electronic building bricks
12 ceramic base materials, 13 scolders
14 multilayer circuit layers
20 insulating barriers
30 metallic plates, 31 caulking grooves
32 trepannings, 33 cylinders
34 latches, 35 king-posts
The prominent circle of 351 rings 36 fin king-posts
37 sheet metals, 38 groove shape sheet metals
40 silica gel, 41 medium
50 heat sinks
60 heat-conducting plates 61 are worn groove
70 heat abstractors, 71 circuit layers
711 electronic building bricks, 72 insulating barriers
73 metal levels, 74 heat conduction inserts
75 radiators
80 multilayer circuit layers, 81 insulating barrier
82 electronic building bricks, 83 heat conduction inserts
84 metal levels
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the present invention is elaborated:
As shown in Figure 1; be heat-conducting substrate device B of the present invention; its formation mainly comprises a circuit layer 10; the power module A that one insulating barrier 20 and a metallic plate 30 are formed; be assembled with several electronic building bricks 11 on this circuit layer 10; and organize respectively in circuit layer 10 bottoms and to be provided with an insulating barrier 20 and a metallic plate 30; avoid the disturbance regime of current lead-through to produce by this insulating barrier 20 with protective circuit layer 10 with heat-transfer effect; owing to can produce heat during electronic building brick 11 runnings; it reaches this metallic plate with high-termal conductivity 30 by insulating barrier 20 with heat, and heat transferred is gone out.
This has the heat abstractor B of circuit layer radiating effect, and main improved characteristics is:
As shown in Figure 2, upward view for metallic plate 30 of the present invention, these metallic plate 30 bottoms have been made several caulking grooves 31 and have been arranged in parallel, can reduce thermal resistance, and appropriate location is provided with trepanning 32 around it, the heat that the thermal source place is produced sees through insulating barrier 20 and reaches metallic plate 30, make itself and air produce convection current, rapidly that heat transferred is extremely outside, reach rapid cool effect, and improve the whole electrically effect of this power module A with this;
As Fig. 2, shown in Figure 3, power module A can connect in addition again and establish a heat sink 50, this heat sink 50 is generally radiator, device such as casing or heat pipe, can increase cross-ventilation to promote heat radiation function, it can and add 50 of heat sinks in metallic plate 30 bottoms and be covered with a heat conduction inserts 40, this heat conduction inserts 40 generally can be the silica gel material, it can fill up out-of-flatness place of 50 of metallic plate 30 and heat sinks, play the effect of buffering, and utilize screw lock or mosaic mode by trepanning 32 with circuit layer 30 with add heat sink 50 and fixedly connect and establish, these metallic plate 30 equilibriums that are arranged with several caulking grooves 31 are arranged on the silica gel 40, because silica gel 40 is soft material, it is through the extrusion of metallic plate 30, make in silica gel 40 distortion and the embedding caulking groove 31, can on average disperse the fixing stress that is produced of its assembling, be illustrated in figure 4 as the thermal resistance distribution schematic diagram of each position of heat abstractor B of the present invention, because the design of the caulking groove 31 of these metallic plate 30 bottoms, making itself and 40 in silica gel form equidistant arrangement subsides pays, effectively and fifty-fifty disperse because of the stress that produced of assembling, its thermal resistance can be evenly distributed, the thermal resistance difference in change that makes 40 in metallic plate 30 bottom surfaces and silica gel 40 and caulking groove 31 places and silica gel is apart from minimizing, can effectively promote its heat dissipation, can avoid as in the existing structure commonly used, because of the metallic plate distortion that assembling stress caused forms the drawback that the gap produces very big thermal resistance.
To shown in Figure 7, is that the present invention first to the 3rd implements illustration as Fig. 5, forms the number caulking groove 31 arrangement shape that intersects vertically in length and breadth in metallic plate 30 bottoms, or form number caulking groove 31 oblique intersect to be to intersect arrange shapes, maybe can form number cylinder 33 array shapes.By above geometric arrangements, the caulking groove 31 that can make 40 formation of metallic plate 30 and silica gel have geometry makes assembling stress establish by the group of 40 in this metallic plate caulking groove 31 and silica gel and average mark dissipates, thus the thermal stress of 40 in reduction metallic plate 30 and silica gel.Because this geometry caulking groove 30 can make hot-fluid become a plurality of directions to flow out, and increases the cross-ventilation space according to this, thereby make flow-disturbing reduce to minimum, effectively promote radiating effect.
As shown in Figs. 8 to 11, for the present invention the 4th to the 7th implements illustration, foregoing geometry metallic plate 30 bottom thickness are increased, form darker caulking groove 31; As shown in figure 11, make this cylindric array form the metallic plate 30 of latch shape 34 array shapes, though this metallic plate 30 with dark caulking groove is compared with the metallic plate 30 of the shallow caulking groove of tool high slightly thermal resistance is arranged, but because this dark caulking groove 31 has more space can supply cross-ventilation, maybe can produce bigger space convection effects, therefore can effectively significantly reduce thermal resistance for adding heat sink 50; And because the degree of depth of this caulking groove 31 increases, can make metallic plate 30 and silica gel 40 connect the deflection that holds bigger silica gel 40 when establishing, and reduce lock according to this if inlay the assembling stress that is caused; In addition, because the amount of variability of 40 in metallic plate 30 and silica gel reduces the increase with caulking groove 31 degree of depth, can be with power module B and the moment of torsion reduction that adds 50 assemblings of heat sink, make it and to add contacting of 50 of heat sinks more identical, thus the increase radiating effect.
As shown in figure 12, be eighth embodiment of the invention figure, metallic plate 30 bottoms can be made as the king-post 35 of the prominent circle 351 prominent tools of several rings; Or as shown in figure 13, be ninth embodiment of the present invention figure, and metallic plate of the present invention can be made as prominent king-post 36 shapes that several fins are arranged that have, and it has the advantage that the maximum heat convective surface area contacts conduction surface and deposits with maximum heat.
As shown in figure 14, be tenth embodiment of the present invention figure, it can be organized in metallic plate of the present invention 30 bottoms again and be provided with a heat-conducting plate 60, and it is for sheet and have number and wear high conductivity material such as the copper sheet of groove 61 or aluminium flake and make, with increase rigidity and heat-conducting area, thereby increase heat conduction and radiating effect.
As shown in figure 15, be 11st embodiment of the present invention figure, it can be made the present invention by the drawing mode and have sheet metal 37 profiles that the caulking groove shape is arranged, again it is mounted on metallic plate 30 bottoms and is fixed into one, or as shown in figure 16, be 12nd embodiment of the present invention figure, have caulking groove and laterally cut open sheet metal 38 profiles of colluding the groove shape but its punching press is made, the metal column kenel that makes it form diversified shape and have multidirectional Openworks shape, can increase the effect of heat radiation, it not only is shaped easy and cheap, tool higher cost benefit.
As shown in figure 17, be 13rd embodiment of the present invention figure, it utilizes fastening mount technology group to be set as one with insulating barrier 20, circuit layer 10 metallic plate 30 that the present invention has the geometry caulking groove; Or as shown in figure 18, bottom group at this circuit layer 10 is provided with a ceramic base material 12, make these ceramic base material 12 1 face down bondings have several electronic building bricks, can reach the effect of insulating heat-conductive by this ceramic base material 12, its opposite side is fixing with the metallic plate 30 weldering knots of tool geometry of the present invention by scolder 13, the geometry that assembles by its bottom has the heat-conducting effect of the metallic plate 30 of caulking groove 31, thereby reaches the effect of heat radiation.
As Figure 19 and shown in Figure 20, be applied to the 15 and the 16 enforcement illustration of multilayer circuit layer 14 for the metallic plate of tool geometry of the present invention, as shown in figure 19 for having the circuit layer 14 of bottom, it can be provided with an insulating barrier 40 in this bottom below group, and utilizes scolder 13 fixing with metallic plate 30 weldering knots of the present invention; Or as shown in figure 20, this multilayer circuit layer 14 does not have bottom, then it can stick in multilayer circuit layer 14 below has a sticky stuff to become a medium 41, and pasting to pay in these medium 41 belows has an insulating barrier 40, sticks medium 41 and metallic plate 30 of the present invention fixing again.
Because geometry metallic plate 30 of the present invention not only is shaped fast, pattern is changeable, and heat radiation caulking groove 31 gaps with more arrangements, area of dissipation is increased and the multi-directionally heat radiation, and can add a heat sink to reduce thermal resistance, make heat be passed to the external world rapidly from thermal source, effectively promote radiating effect, have higher industry applications and cost benefit.
In sum, heat-conducting substrate device of the present invention provides a kind of thermal conductive metal plate that has default geometry and caulking groove is arranged, and it can effectively reduce thermal resistance, makes heat be passed to metallic plate rapidly by the thermal source place, it also can reduce thermal resistance by external heat sink, reaches radiating effect.The heat-transfer device that shaping provided by the invention is quick and but Suresh Kumar is shaped, dark tool industrial applicability and cost benefit.
It should be noted last that: above embodiment is the unrestricted technical scheme of the present invention in order to explanation only, although the present invention is had been described in detail with reference to the foregoing description, those of ordinary skill in the art is to be understood that: still can make amendment or be equal to replacement the present invention, and not breaking away from any modification or partial replacement of the spirit and scope of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (11)
1, a kind of heat-conducting substrate device, its main composition comprises circuit layer, insulating barrier and metallic plate, establish the electronic building brick that can carry out the electronic circuit control action more than in group on this circuit layer, group is established insulating barrier and the metallic plate with high-termal conductivity respectively below circuit layer, it is characterized in that:
Above-mentioned metallic plate bottom has caulking groove, increases cross-ventilation by this caulking groove, thereby increases its surface area to reduce thermal resistance.
2, heat-conducting substrate device according to claim 1, it is characterized in that: this heat-conducting substrate device and another heat sink connect to be established, cover the heat conduction inserts between metallic plate and heat sink, bottom is arranged with a metallic plate with upper embedded groove and evenly is overlapped on this heat sink.
3, heat-conducting substrate device according to claim 1 is characterized in that: the set caulking groove of this metallic plate bottom be vertically to or intersect vertically in length and breadth or oblique intersecting, this intersects more than one the multidirectional circulation path that reduces flow-disturbing in the caulking groove of arranging.
4, heat-conducting substrate device according to claim 1 is characterized in that: this metallic plate bottom is to be the above cylinder that group is arranged, and the multidirectional circulation path that reduces flow-disturbing is arranged within it.
5, heat-conducting substrate device according to claim 1 is characterized in that: this metallic plate bottom is to be the king-post shape that the prominent circle of ring storehouse forms more than that group is arranged, and the multidirectional circulation path that reduces flow-disturbing is arranged within it.
6, heat-conducting substrate device according to claim 1 is characterized in that: this metallic plate is outstanding king-post shape with an above fin arrangement.
7, heat-conducting substrate device according to claim 1 is characterized in that: make the sheet metal with caulking groove shape arrangement profile by the drawing mode, be shaped as the metal column kenel with multidirectional Openworks shape.
8, heat-conducting substrate device according to claim 1 is characterized in that: this metallic plate and insulating barrier, the fastening group of sticking together of circuit layer are set as one.
9, heat-conducting substrate device according to claim 1 is characterized in that: this circuit layer is provided with the ceramic base material of insulating heat-conductive effect in its bottom group, and this ceramic base material one face down bonding has an above electronic building brick, and opposite side and described metallic plate weldering knot are fixing.
10, heat-conducting substrate device according to claim 1 is characterized in that: this circuit layer is the multilayer circuit layer with bottom, and group is provided with insulating barrier below this bottom, utilizes scolder and metallic plate weldering knot fixing.
11, heat-conducting substrate device according to claim 1 is characterized in that: this circuit layer is not for having the multilayer circuit layer of bottom, and sticking below this multilayer circuit layer has medium and insulating material, and medium and metallic plate stick fixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410046587 CN1708212A (en) | 2004-06-11 | 2004-06-11 | Heat conductive substrate apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410046587 CN1708212A (en) | 2004-06-11 | 2004-06-11 | Heat conductive substrate apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1708212A true CN1708212A (en) | 2005-12-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410046587 Pending CN1708212A (en) | 2004-06-11 | 2004-06-11 | Heat conductive substrate apparatus |
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| Country | Link |
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| CN (1) | CN1708212A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101677488B (en) * | 2008-09-18 | 2010-12-08 | 王俣韡 | High thermal conductive substrate structure and production method thereof |
| US8212274B2 (en) | 2006-03-03 | 2012-07-03 | Lg Innotek Co., Ltd. | Light-emitting diode package and manufacturing method thereof |
| WO2014134929A1 (en) * | 2013-03-07 | 2014-09-12 | Hangzhou H3C Technologies Co., Ltd. | A printed circuit board (pcb) structure |
| CN104902154B (en) * | 2015-05-27 | 2019-02-12 | 南昌欧菲光电技术有限公司 | Circuit board assemblies, the camera module with circuit board assemblies and picture pick-up device |
| CN110546447A (en) * | 2017-04-28 | 2019-12-06 | 株式会社村田制作所 | Vapor chamber |
| CN114388673A (en) * | 2021-12-08 | 2022-04-22 | 华灿光电（浙江）有限公司 | Micro light-emitting diode chip and preparation method thereof |
-
2004
- 2004-06-11 CN CN 200410046587 patent/CN1708212A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8212274B2 (en) | 2006-03-03 | 2012-07-03 | Lg Innotek Co., Ltd. | Light-emitting diode package and manufacturing method thereof |
| CN101213892B (en) * | 2006-03-03 | 2012-09-05 | Lg伊诺特有限公司 | Light-emitting diode package and manufacturing method thereof |
| US8796717B2 (en) | 2006-03-03 | 2014-08-05 | Lg Innotek Co., Ltd. | Light-emitting diode package and manufacturing method thereof |
| CN101677488B (en) * | 2008-09-18 | 2010-12-08 | 王俣韡 | High thermal conductive substrate structure and production method thereof |
| WO2014134929A1 (en) * | 2013-03-07 | 2014-09-12 | Hangzhou H3C Technologies Co., Ltd. | A printed circuit board (pcb) structure |
| CN104902154B (en) * | 2015-05-27 | 2019-02-12 | 南昌欧菲光电技术有限公司 | Circuit board assemblies, the camera module with circuit board assemblies and picture pick-up device |
| CN110546447A (en) * | 2017-04-28 | 2019-12-06 | 株式会社村田制作所 | Vapor chamber |
| CN114388673A (en) * | 2021-12-08 | 2022-04-22 | 华灿光电（浙江）有限公司 | Micro light-emitting diode chip and preparation method thereof |
| CN114388673B (en) * | 2021-12-08 | 2023-11-14 | 华灿光电（浙江）有限公司 | Micro light-emitting diode chip and preparation method thereof |
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