CN1574272A - Substrate delivery device and method, and vacuum processing device - Google Patents
Substrate delivery device and method, and vacuum processing device Download PDFInfo
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- CN1574272A CN1574272A CNA2004100455287A CN200410045528A CN1574272A CN 1574272 A CN1574272 A CN 1574272A CN A2004100455287 A CNA2004100455287 A CN A2004100455287A CN 200410045528 A CN200410045528 A CN 200410045528A CN 1574272 A CN1574272 A CN 1574272A
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- substrate
- conveying mechanism
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G60/00—Simultaneously or alternatively stacking and de-stacking of articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Robotics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
To transfer a relatively large substrate via a vacuum preliminary chamber without increasing the volume of the vacuum preliminary chamber. There are provided within a load-lock chamber (20) connected to a vacuum processing chamber, a substrate transfer mechanism (70) having a structure for carrying out multi-stage slide type transfer operation fot a base plate (71) and a plurality of slide plates (72-74) which are laminated, and a substrate delivery mechanism (80) provided with buffer plates (81, 82) for supporting the peripheral part of the substrate G and a support pin (85) for supporting the central part of the substrate G. Delivery operation for the substrate G between a transfer arm (51) of an atmosphere side transfer mechanism (50) and the substrate transfer mechanism (70) is performed without deflecting the substrate G.
Description
Technical field
The present invention relates to substrate conveying technology and vacuum treatment technology, the effective technology that the substrate that particularly relates to glass substrate that flat-panel screens such as liquid crystal indicator (LCD) and plasma scope use etc. is carried operation and used in above-mentioned glass substrate being carried out the vacuum treatment installation that the dry ecthing equal vacuum handles.
Background technology
For example, in the LCD manufacture process, use mostly the LCD glass substrate as processed substrate is carried out the vacuum treatment of dry ecthing or splash, CVD (chemical vapor deposition) etc.
In carrying out this vacuum treated vacuum treatment installation, be provided with and the contiguous loadlock may of vacuum processing chamber that keeps vacuum, carries out above-mentioned processing.Move into when taking out of when processed substrate, should do one's utmost to reduce the indoor environmental variations of vacuum treatment.
Concrete is, the chamber in being disposed at atmosphere and carrying out between the vacuum treatment of etch processes etc., and the load locking room of interface effect that has been provided with atmosphere and vacuum is as loadlock may.Because in this load locking room, when each processed substrate passes through, all carry out to atmosphere opening repeatedly and reach the exhaust of the equal condition of high vacuum degree of vacuum processing chamber, therefore, can in possible limit, reduce volume, shortening being vented to the desired time of high vacuum, is important key element aspect boosting productivity.
On the other hand, in this vacuum treatment installation, for between the outdoor conveying mechanism of the conveying mechanism that is installed in the load-lock chamber interior and load-lock, join processed substrate, carry out following action: be located in encirclement on the position of the indoor conveying mechanism of load-lock, the buffer board of lifting is set, make the processed substrate floating that is placed on the indoor conveying mechanism of load-lock, be placed on the outdoor conveying mechanism of load-lock, under float state, acceptance is placed on the processed substrate that arrives on the outdoor conveying mechanism of load-lock, drops to action (for example, patent documentation 1) such as to join on the indoor conveying mechanism of load-lock again
Yet, strong to the maximization requirement of LCD glass substrate recently, even can use a limit to surpass the huge substrate of 1m.On this huge substrate, when utilizing above-mentioned buffer board to support periphery, when floating action, the deflection deformation amount that deadweight produces is big, leaves for substrate is floated fully from conveying mechanism, increase necessary lifting travel length.Yet corresponding with the increase of lifting travel length, the height dimension that the load locking room of buffer board is set uprises, and the volume of load locking room increases to and surpasses necessity, and the desired time of vacuum exhaust increases, and productivity ratio reduces.In addition, conveying mechanism also increases to above necessary originally in the space that is provided with of short transverse, and this all is a problem.
Patent Document 1: the spy opens the 2001-148410 communique.
Summary of the invention
Consider the problems referred to above, the objective of the invention is to provide a kind of substrate conveying technology that height dimension promptly can prolong fed distance that do not increase.
In addition, another object of the present invention is that a kind of volume that does not increase the loadlock may that object is set will be provided, and can carry the substrate conveying technology of relatively large substrate via loadlock may.
A further object of the present invention provides the vacuum treatment installation of the vacuum treated productivity ratio that can improve relatively large substrate,
A further object of the present invention be to provide a kind of not need the short transverse setting surpass necessary space, can carry out relatively large substrate substrate conveying conveying technology.
In order to address the above problem, according to first viewpoint of the present invention, provide a kind of base board delivery device, it is characterized by, it has:
The substrate that will join on primary importance is delivered to the second place, and the substrate that will receive on said second position is delivered to the conveying mechanism of primary importance; With
Substrate delivery/reception mechanism has on above-mentioned primary importance, support aforesaid substrate periphery first support portion and support than second support portion of part more in the inner part, above-mentioned first support portion of aforesaid substrate; Can on above-mentioned primary importance, between above-mentioned conveying mechanism and other conveying mechanisms, carry out the handing-over action of substrate.
According to second viewpoint of the present invention, a kind of base board delivery device is provided, it is arranged in the loadlock may in the vacuum treatment installation, and this vacuum treatment installation has the vacuum processing chamber of in a vacuum substrate being handled; With move at aforesaid substrate in the process of taking out of above-mentioned vacuum processing chamber, temporarily accommodate this substrate, its inner loadlock may that keeps vacuum; It is characterized by, this base board delivery device has:
Conveying mechanism, the substrate that it will join on the primary importance in the above-mentioned loadlock may is delivered to the second place of above-mentioned vacuum processing chamber, and the substrate that will receive on the indoor second place of above-mentioned vacuum treatment is delivered on the primary importance of loadlock may;
Substrate delivery/reception mechanism, this mechanism is located in the above-mentioned loadlock may, first support portion that has the periphery that supports aforesaid substrate on the above-mentioned primary importance therein, with support than second support portion of part more in the inner part, above-mentioned first support portion of aforesaid substrate, can be in above-mentioned loadlock may, between above-mentioned conveying mechanism and other conveying mechanisms, carry out the handing-over action of substrate.
According to the 3rd viewpoint of the present invention, a kind of substrate carrying method is provided, the substrate that the substrate that it can join on primary importance receives on carrying in the second place, with the second place is delivered to first conveying mechanism of primary importance, and between second conveying mechanism that substrate is joined to above-mentioned first conveying mechanism that is in above-mentioned primary importance, carry out the handing-over of substrate;
Use is by first support portion of the periphery of supporting substrate, with support than above-mentioned first support portion of the substrate substrate delivery/reception mechanism that constitutes of second support portion of part more in the inner part, between first and second conveying mechanisms that carry out aforesaid substrate conveying action, carry out the handing-over action of aforesaid substrate.
According to the 4th viewpoint of the present invention, a kind of substrate carrying method is provided, has the vacuum processing chamber of in a vacuum substrate being handled, in the vacuum treatment installation of moving into the loadlock may of temporarily accommodating this substrate, its inner maintenance vacuum in the process of taking out of above-mentioned vacuum processing chamber at aforesaid substrate
Between first conveying mechanism and second conveying mechanism, carry out the handing-over action of substrate, wherein, first conveying mechanism is arranged in the above-mentioned loadlock may, the substrate that will on the primary importance in the above-mentioned loadlock may, join, be delivered to the second place of above-mentioned vacuum processing chamber, the substrate that will receive on the indoor second place of above-mentioned vacuum treatment is delivered on the primary importance of loadlock may; Second conveying mechanism joins above-mentioned first conveying mechanism of substrate to the above-mentioned primary importance that is positioned at above-mentioned loadlock may from atmosphere, it is characterized in that,
Use is by first support portion of the periphery of supporting substrate, with support than above-mentioned first support portion of the substrate substrate delivery/reception mechanism that constitutes of second support portion of part more in the inner part, between first and second conveying mechanisms that carry out aforesaid substrate conveying action, carry out the handing-over action of aforesaid substrate.
According to the 5th viewpoint of the present invention, a kind of vacuum treatment installation is provided, this vacuum treatment installation has
Vacuum processing chamber, the processing that substrate is scheduled in a vacuum;
Loadlock may is moved in the process of taking out of above-mentioned vacuum processing chamber at aforesaid substrate, temporarily accommodates this substrate, its inner vacuum that keeps;
First conveying mechanism is arranged in the above-mentioned loadlock may, conveying substrate between the indoor second place of primary importance therein and above-mentioned vacuum treatment, simultaneously and be located at the handing-over of carrying out aforesaid substrate between the second outside conveying mechanism; With
Substrate delivery/reception mechanism, this mechanism is located in the above-mentioned loadlock may, have first support portion of the periphery that supports aforesaid substrate and support, can between above-mentioned second conveying mechanism and above-mentioned first conveying mechanism, carry out the handing-over action of aforesaid substrate than second support portion of part more in the inner part, above-mentioned first support portion of aforesaid substrate.
The effect of invention
According to the present invention, when the conveying mechanism that is delivered to primary importance at the substrate that will be delivered on the second place at the substrate that joins on the primary importance, will on said second position, receive, and handing-over during substrate between other conveying mechanisms, because peripheral part with the first support portion supporting substrate, support than above-mentioned first support portion of this substrate part more in the inner part with second support portion simultaneously, therefore substrate will be floated and not deflection from other conveying mechanisms, and move on the conveying mechanism, carry out the handing-over of substrate.Therefore, even, do not need to increase the lifting action stroke of first support portion being under large-scale, that amount of flexibility the is big substrate situation yet.Therefore, do not need to guarantee the big space of short transverse, the conveying that contrasts relatively large substrate is effective.For example, for the relatively large substrate of delivery ratio, in loadlock may, be provided with in the vacuum treatment installation of conveying mechanism of the present invention, in order to ensure the stroke of the parts of supporting substrate, can not need to increase the height dimension of loadlock may, thereby prevent the increase of loadlock may volume.
As a result, the increase of this desired time of loadlock may exhaust of causing can be suppressed to increase, productivity ratio can be improved along with the substrate vacuum treatment operation of moving by the conveying of loadlock may by the loadlock may volume.In addition, also can reduce the transportation large-scale substrate conveying mechanism itself the space is set.
Description of drawings
Fig. 1 is the longitudinal section of loadlock may of vacuum treatment installation with base board delivery device of the first embodiment of the present invention;
Fig. 2 is the longitudinal section of loadlock may of vacuum treatment installation with base board delivery device of the first embodiment of the present invention;
Fig. 3 is the horizontal sectional view of loadlock may of vacuum treatment installation with base board delivery device of the first embodiment of the present invention;
Fig. 4 is the stereogram of an example of the structure of the substrate carrying mechanism of the base board delivery device of the expression first embodiment of the present invention;
Fig. 5 has the stereogram of outward appearance of vacuum treatment installation of the base board delivery device of the first embodiment of the present invention for expression;
Fig. 6 is the key diagram of an example of the action of the base board delivery device of expression reference technique of the present invention;
Fig. 7 is the longitudinal section of loadlock may of vacuum treatment installation with base board delivery device of the second embodiment of the present invention;
Fig. 8 is the longitudinal section of loadlock may of vacuum treatment installation with base board delivery device of the second embodiment of the present invention;
Fig. 9 is the horizontal sectional view of the configuration relation of the substrate carrying mechanism of base board delivery device of expression second embodiment of the invention and first buffer board and two buffer boards;
Symbol description: 10-vacuum processing chamber; The 20-load locking room; The 30-gate valve; The 40-gate valve; 50-atmospheric side conveying mechanism; The 51-conveying arm; The 52-notch; 55-substrate stand; The 60-vacuum pump; 70,70 '-substrate carrying mechanism; The 70a-sliding motor; 71,71 '-base plate; 71c-sells through hole; 72-74,72 '-74 '-the first-Di, three sliding panels; 72c-74c-sells through hole; 80, the 90-substrate delivery/reception mechanism; 81, the 82-buffer board; 83,84-buffer elevating mechanism; The 85-supporting pin; 86-sells elevating mechanism; 91,92-first buffer board; 93, the 94-first buffer elevating mechanism; 95,96-second buffer board; 97, the 98-second buffer elevating mechanism; The 100-vacuum treatment installation.
Embodiment
Below, with reference to accompanying drawing, specifically describe embodiments of the invention.
(first embodiment)
Fig. 1 and Fig. 2 are the longitudinal section of loadlock may of vacuum treatment installation with base board delivery device of the first embodiment of the present invention; Fig. 3 has the horizontal sectional view of vacuum treatment installation of the base board delivery device of the first embodiment of the present invention for expression; Fig. 4 is the stereogram of an example of the structure of the substrate carrying mechanism of the base board delivery device of the expression first embodiment of the present invention; Fig. 5 has the stereogram of outward appearance of vacuum treatment installation of the base board delivery device of the first embodiment of the present invention for expression.
The vacuum treatment installation 100 of present embodiment has: in vacuum environment, substrate G such as LCD glass substrate are carried out desirable vacuum treated vacuum processing chambers 10 such as plasma etch process and film formation processing; Be connected with vacuum treatment outdoor 10, can play the load locking room 20 of loadlock may function; Be located at the gate valve 30 between vacuum processing chamber 10 and the load locking room 20; With the gate valve 40 that load locking room 20 and atmosphere outside side conveying mechanism 50 are separated.
Vacuum pump 60 is connected with vacuum processing chamber 10 by gas exhausting valve 61, can be when substrate G specified vacuum be handled, and vacuum exhaust is to the vacuum necessary degree.In addition, handle gas supply part 12 and be connected with vacuum processing chamber 10, at the vacuum processing chamber 10 inner processing gaseous environments that form authorized pressure by gas control valve 11.At the inside of vacuum processing chamber 10 set handling platform 13, be used to place the substrate G of process object.
Vacuum pump 60 is connected with load locking room 20 by gas exhausting valve 62, can vacuum exhaust extremely with the equal vacuum degree of vacuum processing chamber 10.
In gate valve 30, the valve body 32 make vacuum processing chamber 10 and load locking room 20 be communicated with, be supported on the peristome 31 of the size that the substrate G on the substrate carrying mechanism 70 described later can pass through and to carry out the on-off action of this opening 31 is set.
In gate valve 40, be provided with and make that load locking room 20 and outside atmosphere are communicated with, size is the valve body 42 that is supported on peristome 41 that the substrate G on the conveying mechanism 50 of above-mentioned atmospheric side can pass through and the on-off action that carries out this opening 41.
The substrate carrying mechanism 70 of Direct Action Type is installed in the inside of load locking room 20.This substrate carrying mechanism 70 has the base plate 71 on the bottom that is fixed on load locking room 20, the 3rd sliding panel 74 of multilayer laminated first sliding panel 72, second sliding panel 73 and double as substrate support pedestal on this base plate 71.Constitute the substrate carrying mechanism main body by these base plates 71 and first-Di, three sliding panels 74.
The a pair of sliding rail 71a that supporting first sliding panel 72 in the above and can be free to slide guiding in the horizontal direction is being set on the base plate 71 and is giving the thrust of horizontal direction with sliding panel 72 and make its reciprocating sliding drive mechanism 71b on sliding rail 71a.
The a pair of sliding rail 72a that supporting second sliding panel 73 in the above and can be free to slide guiding in the horizontal direction is set on first sliding panel 72 and gives the thrust of horizontal direction with sliding panel 73 and make its reciprocating sliding drive mechanism 72b on sliding rail 72a.
The a pair of sliding rail 73a that supporting the 3rd sliding panel 74 in the above and can be free to slide guiding in the horizontal direction is set on second sliding panel 73 and gives the thrust of horizontal direction with sliding panel 74 and make its reciprocating sliding drive mechanism 73b on sliding rail 73a.
Setting is roughly the コ font on the 3rd sliding panel 74 of topmost, works the slip pick-up part 74a that supports by the effect of the base plate supports portion of the lower surface of the substrate G of mounting.
Sliding drive mechanism 71b-73b is made of belt, and the two ends of this belt are erected at and are located on the belt pulley on base plate 71 and the sliding panel 72-73, that do not illustrate among the figure.The part separately of this belt is engaged with the bottom of superposed sliding panel 72-74, by making the sliding motor 70a of the bottom that is configured in base plate 71, just/opposite spin drives, and can produce the thrust of extending/shrinking back moving direction on first-Di, three sliding panel 72-74.In addition, substrate carrying mechanism 70 can make 72, the 74 multistage in the horizontal direction elongations of first-Di, three sliding panels, and clamping is supported on the substrate G on the 3rd sliding panel 74, moves into the action in the vacuum processing chamber 10; With make that first-Di, three sliding panel 72-74 are multistage in the horizontal direction to shrink back and in vacuum processing chamber 10, make the substrate G that on the 3rd sliding panel 74, receives be taken out to output action in the load locking room 20.
In the inside of load locking room 20, be located at substrate delivery/reception mechanism 80.Substrate delivery/reception mechanism 80 has: the locational buffer board 81 and 82 that is installed in chucking substrate conveying mechanism 70; Make the buffer elevating mechanism 83 and 84 of this buffer board 81 and 82 liftings; Be located at the supporting pin 85 of the bottom centre of base plate 71; With the pin elevating mechanism 86 that makes these supporting pin 85 liftings.In addition, first support portion by buffer board 81 and 82 and buffer elevating mechanism 83 and 84 constitute; Second support portion then is made of supporting pin 85 and pin elevating mechanism 86.
Substrate delivery/reception mechanism 80, utilize buffer board 81 and 82, be supported on the peripheral part of the substrate G on the slip pick-up part 74a on the 3rd sliding panel 74 of substrate carrying mechanism 70 from supported underneath, make the action that substrate G floats from this slip pick-up part 74a and make the substrate G that receives from atmospheric side conveying mechanism 50 fall the substrate delivery/reception action of action to the slip pick-up part 74a etc.At this moment, utilize the center of supporting pin 85 supporting substrate G.
On the core of base plate 71, the first-Di three sliding panel 72-74 that constitute aforesaid substrate conveying mechanism 70, make the pin through hole 71c that above-mentioned supporting pin 85 is passed through respectively, pin through hole 72c, pin through hole 73c and pin through hole 74c.Under first-Di, three sliding panel 72-74 entered stacked state (state of shrinking back) in the load locking room 20, pin through hole 71c and pin through hole 72c-74c became the state that is communicated with in vertical direction.By this pin through hole 71c, 72c-74c, supporting pin 85 highlights on the sliding panel 74 of topmost, can with the bottom centre that is placed on the substrate G on this sliding panel 74 (under the situation of present embodiment, as an example, be the roughly position of centre of gravity of substrate G) contact.
That is: above-mentioned in supporting pin 85 and load locking room 20 carry out substrate delivery/reception move in buffer board 81 and 82 synchronization liftings; Support the action of peripheral part in the horizontal direction, making can be because of deadweight deflection downwards by the center of buffer board 81 and 82 substrate supported G.
The conveying mechanism 50 of atmospheric side has the conveying arm 51 that can rotate and stretch.It can carry out taking out a untreated substrate G by conveying arm 51 from the substrate stand 55 that holds polylith substrate G, by gate valve 40, gives the action of the substrate carrying mechanism 70 in the load locking room 20; Substrate G with substrate carrying mechanism 70 acceptance in load locking room 20 are handled by gate valve 40, is taken out to atmospheric side, is stored in the action in the substrate stand 55.Be provided with notch 52 at conveying arm 51, make when in load locking room 20, carrying out joining in the substrate G, do not disturb with supporting pin 85.
Next illustrates action.
At first, substrate carrying mechanism 70 is in the state that is held back in the load locking room 20, and the valve body 32 of gate valve 30 is closed, utilize vacuum pump 60 with the exhaust gas inside of vacuum processing chamber 10 to the vacuum necessary degree.
The conveying mechanism 50 of atmospheric side utilizes conveying arm 51 that untreated substrate G is taken out from substrate stand 55, by the peristome 41 of gate valve 40, in the input load lock chamber 20, in the location, top of the 3rd sliding panel 74 of substrate carrying mechanism 70.
Secondly, buffer board 81 and 82 rises, and lifts the peripheral part of substrate G from both sides, and simultaneously, supporting pin 85 rises by pin through hole 71c-74c, passes through the notch part 52 of conveying arm 51 again, contacts with the bottom centre of substrate G and lifts.As shown in Figure 1, substrate G floats from conveying arm 51 with the posture of non-deflecting approximate horizontal.
Then, conveying arm 51 is extracted on atmospheric side, kept out of the way behind the outside of load locking room 20, by making buffer board 81 and 82, and supporting pin 85 declines, as shown in Figure 2, substrate G moves on the slip pick-up part 74a that is placed on the 3rd sliding panel 74 in the substrate carrying mechanism 70.
In addition, the valve body 42 of valve-off 40 makes load locking room 20 be in air-tight state, opens gas exhausting valve 62, after being vented to the vacuum degree identical with vacuum processing chamber 10, opens the valve body 32 of gate valve 30.At this moment, because load locking room 20 vacuum exhausts, the vacuum degree of vacuum processing chamber 10 and environment are not impaired.Pass through the peristome 31 of gate valve 30 again, first-Di, the three sliding panel 72-74 that make substrate carrying mechanism 70 are towards the multistage elongation in the inside of vacuum processing chamber 10, substrate G is sent into the top of the treatment bench 13 of vacuum processing chamber 10, by being located at protrusion pin that does not illustrate among the figure on the treatment bench 13 etc., be placed on the treatment bench 13.Then, first-Di, three sliding panel 72-74 shrink back and keep out of the way to load locking room 20, and the valve body 32 of closing gate valve 30 is airtight with vacuum processing chamber 10.
Then, the gas of necessity is imported in the airtight vacuum process chambers 10 from handling gas supply part 12, form the environment of handling gas, substrate G is carried out necessary processing.
Through after the stipulated time, stop to import processing gas, open the valve body 32 of gate valve 30, make first-Di, the three sliding panel 72-74 of the substrate carrying mechanism 70 in the load locking room 20, in vacuum processing chamber 10 inner multistage elongations, according to the above-mentioned opposite order of action of moving into, with the substrate G that handles in the vacuum processing chamber 10, move to from treatment bench 13 on the slip pick-up part 74a of the 3rd sliding panel 74, sliding panel 72-74 is shunk back; After taking out of in the load locking room 20, the valve body 32 of closing gate valve 30, vacuum processing chamber 10 is airtight.At this moment, the substrate carrying mechanism 70 in the load locking room 20 is the state of Fig. 2.
Then, stop the exhaust of load locking room 20, simultaneously, import N
2Gas etc. make pressure near atmospheric pressure, and buffer board 81,82 and supporting pin 85 are risen, and also float under the posture of approximate horizontal at the peripheral part of supporting substrate G and center.In addition, open the valve body 42 of gate valve 40, make the conveying arm 51 of the conveying mechanism 50 of atmospheric side insert the downside of the substrate G that floats, in this state, buffer board 81,82 and supporting pin 85 are descended, substrate G is moved on the conveying arm 51.
In addition,, export the pedestal G that handles to atmospheric side from load locking room 20, put into substrate stand 55 by conveying arm 51 is withdrawed to atmospheric side.
Before, as shown in Figure 6, when the substrate G via above such load locking room 20 comes in and goes out vacuum processing chamber 10, when substrate G size big, utilize buffer board to float the amount of flexibility B in when operation when big, be used to guarantee that the stroke S of buffer board in the insertion gap (clearance C) of conveying arm 51 increases.In order to ensure the movable range of the trip S, the essential height dimension that increases load locking room 20.
Relative therewith, in the present embodiment, as above-mentioned Fig. 1, the co-operating of the buffer board 81,82 of the peripheral part by supporting substrate G and the supporting pin 85 of centre of support part can make substrate G not produce deflection.Owing to can join action by floating of substrate G, so the stroke S1 of buffer board 81,82 significantly shortens than previous stroke S shown in Figure 6, and the height dimension H of load locking room 20 also can reduce this amount.As a result, can reduce the volume of load locking room 20, shorten the desired time of vacuum exhaust of this load locking room 20, improve the productivity ratio of the vacuum treatment operation of the substrate G that the exhaust include load locking room 20 wants the time.
Particularly, in accommodating the load locking room 20 of 1 limit above the large-scale substrate G of 1m, it is big that horizontal sectional area becomes, and cuts down the height dimension of load locking room 20, and the effect that volume is cut down is big, and the desired time of exhaust can shorten greatly.
(second embodiment)
Secondly, the second embodiment of the present invention is described.
Fig. 7 and Fig. 8 are the longitudinal section of loadlock may of vacuum treatment installation with base board delivery device of the second embodiment of the present invention; Fig. 9 is the horizontal sectional view of the configuration relation of the substrate carrying mechanism of base board delivery device of the expression second embodiment of the present invention and first buffer board and second buffer board.In these figure, the part identical with first embodiment omits its explanation with identical symbolic representation.In addition, except that loadlock may, identical with first example structure.
In the present embodiment, in load locking room 20 inside, has the substrate carrying mechanism 70 ' of the Direct Action Type identical with the substrate carrying mechanism 70 of first embodiment.This substrate carrying mechanism 70 ' has identical with the first and the 3rd sliding panel 72-74 function with the base plate 71 of substrate carrying mechanism 70 respectively base plate 71 ' and first-Di, three sliding panels 72 '-74 '.Constitute the substrate carrying mechanism main body by these substrate seat boards 71 ' and first-Di, three sliding panels 72 '-74 '.
Pick-up part 75 is installed on the 3rd sliding panel 74 ', and it stretches out to the side, has the function of base plate supports portion.This pick-up part 75 has certain intervals with the substrate carrying mechanism main body.
Be provided with substrate delivery/reception mechanism 90 in load locking room 20 inside.Substrate delivery/reception mechanism 90 has: be located at and contact a pair of first buffer board 91 and 92 that supports on the position of chucking substrate conveying mechanism 70 ', with substrate periphery; Make the first buffer elevating mechanism 93 and 94 of this first buffer board 91 and 92 liftings; Be arranged on the inboard of first buffer board 91 and 92, chucking substrate conveying mechanism 70 ', as than the substrate carrying mechanism main body part more in the outer part of substrate G, contact a pair of second buffer board 95 and 96 that supports with the inside part of pick-up part 75; With the second buffer elevating mechanism 97 and 98 that makes this second buffer board 95 and 96 liftings.In addition, first support portion is made of first buffer board 91 and the 92 and first buffering elevating mechanism 93 and 94; Second support portion is made of second buffer board 95 and the 96 and second buffer elevating mechanism 97 and 98.First buffer board 91 and 92 and second buffer board 95 and 96 are driven individually mutually independently by the first buffer elevating mechanism 93 and the 94 and second buffer elevating mechanism 97 and 98.
Substrate delivery/reception mechanism 90 carries out following action; Utilize first buffer board 91 and 92, be supported on the peripheral part of the substrate G on the pick-up part 75 of substrate carrying mechanism 70 ' from supported underneath; And, utilize second buffer board 95 and 96, from inside part substrate carrying mechanism main body more in the outer part part, pick-up part 75 of supported underneath conduct than substrate G, the action that substrate G is floated from pick-up part 75; With the substrate G that will accept from atmospheric side conveying mechanism 50, drop to the substrate delivery/reception action of action on the pick-up part 75 etc.
Secondly, action is described.
At first, substrate carrying mechanism 70 ' is in the state that is held back in the load locking room 20, and the valve body 32 of gate valve 30 is closed, utilize vacuum pump 60 with the exhaust gas inside of vacuum processing chamber 10 to the vacuum necessary degree.
The conveying mechanism 50 of atmospheric side utilizes conveying arm 51 that untreated substrate G is taken out from substrate stand 55, by the peristome 41 of gate valve 40, in the input load lock chamber 20, in the location, top of the 3rd sliding panel 74 ' of substrate carrying mechanism 70 '.
Secondly, first buffer board 91 and 92 rises, and lifts the peripheral part of substrate G from both sides, simultaneously, lifts conduct than part, pick-up part 75 the more in the outer part inside part of the substrate carrying mechanism main body of substrate G, as shown in Figure 7 by second buffer board 95 and 96; Substrate G floats from conveying arm 51 with the posture of non-deflecting approximate horizontal.
Then, conveying arm 51 is extracted on atmospheric side, kept out of the way behind the outside of load locking room 20, by making first buffer board 91 and 92, and second buffer board 95 and 96 declines, as shown in Figure 8, substrate G moves on the pick-up part 75 that is placed on substrate carrying mechanism 70 '.
In addition, below according to the order identical with first embodiment, carry out the conveying action of substrate.That is: the valve body 42 of closed shutter 40 makes load locking room 20 be in air-tight state, opens gas exhausting valve 62, after being vented to the vacuum degree identical with vacuum processing chamber 10, opens the valve body 32 of gate valve 30.Peristome 31 by gate valve 30, first-Di, three sliding panels 72 '-74 ' that make substrate carrying mechanism 70 ' are towards the multistage elongation in the inside of vacuum processing chamber 10, substrate G is sent into the top of the treatment bench 13 of vacuum processing chamber 10, by being located at protrusion pin that does not illustrate among the figure on the treatment bench 13 etc., be placed on the treatment bench 13.Then, first-Di, three sliding panels 72 '-74 ' are shunk back and are kept out of the way to load locking room 20, and the valve body 32 of closing gate valve 30 is airtight with vacuum processing chamber 10.
Then, the gas of necessity is imported in the airtight vacuum process chambers 10 from handling gas supply part 12, form the environment of handling gas, substrate G is carried out necessary processing.
Through after the stipulated time, stop to import processing gas, open the valve body 32 of gate valve 30, make the substrate in the load locking room 20 do first-Di, three sliding panels 72 '-74 ' that send mechanism 70 ', in vacuum processing chamber 10 inner multistage elongations, according to the above-mentioned opposite order of action of moving into, the substrate G that process chamber in the vacuum processing chamber 10 is intact, move on the pick-up part 75 from treatment bench 13, sliding panel 72-74 ' is shunk back; After taking out of to the load locking room 20, the valve body 32 of closing gate valve 30, vacuum processing chamber 10 is airtight.At this moment, the substrate carrying mechanism 70 ' in the load locking room 20 is the state of Fig. 8.
Then, stop the exhaust of load locking room 20, simultaneously, import N
2Gas etc., make pressure near atmospheric pressure, make first buffer board 91,92 and second buffer board 95,96 rise, part between the peripheral part of supporting substrate G and substrate carrying mechanism main body and the pick-up part 75, and it is floated under the posture of approximate horizontal,, open a sluice gate the valve body 42 of valve 40 therebetween, make the conveying arm 51 of the conveying mechanism 50 of atmospheric side insert the downside of the substrate G that floats, in this state, make first buffer board 91,92 and second buffer board 95,96 descend, and substrate G is moved on the conveying arm 51.
In addition,, export the pedestal G that handles to atmospheric side from load locking room 20, put into substrate stand 55 by conveying arm 51 is withdrawed to atmospheric side.
In the present embodiment, as above-mentioned Fig. 7, first buffer board 91 of the peripheral part by supporting substrate G, 92 and the substrate carrying mechanism main body of supporting substrate G and second buffer board 95 of the part between the pick-up part 75,96 co-operating, can be same with first embodiment, can make substrate G not produce deflection, join action by floating of substrate G, so first buffer board 91, the significantly shortening in the past of the stroke ratio of 92 and second buffer board 95,96, the height dimension of load locking room 20 also can reduce this amount.As a result, can reduce the volume of the negative lock chamber 20 of load, shorten the desired time of vacuum exhaust of this load locking room 20, improve the productivity ratio of the vacuum treatment operation of the substrate G that the exhaust that comprises load locking room 20 wants the time.Particularly, under the situation of large substrate, this effect of boosting productivity is big.
The present invention only limits to the foregoing description, in thought range of the present invention, can do various distortion.For example, as the substrate carrying mechanism in the loadlock may that is located at load locking room etc., not the conveying mechanism that only limits to carry out the conveying movement structure of the linearity that sliding panel is stacked, articulated robot with rotating a plurality of robotic arms etc. is also passable.In this case, in order to carry out the handing-over of substrate, can be under articulated robot be shunk back state to loadlock may, supporting pin is configured in not the position of disturbing mutually with mechanical arm, or connects on the position of mechanical arm.
In addition,, neither only limit to the substrate of the flat-panel screens of LCD and plasma scope etc., in other substrate, also can adopt as substrate.
The possibility of utilizing on the industry
Because the substrate amount of deflection in the time of can suppressing to join substrate, so the present invention is especially at large-scale base Effective in the conveying of plate.
Claims (23)
1. a base board delivery device is characterized by, and it has:
The substrate that will join on primary importance is delivered to the second place, and the substrate that will receive on the described second place is delivered to the conveying mechanism of primary importance; With
Substrate delivery/reception mechanism, this mechanism has first support portion of the peripheral part that supports described substrate on described primary importance, with second support portion of part more in the inner part, described first support portion of supporting more described substrate, can on described primary importance, between described conveying mechanism and other conveying mechanisms, carry out the handing-over action of substrate.
2. a base board delivery device is arranged in the loadlock may in the vacuum treatment installation, and this vacuum treatment installation has the vacuum processing chamber of in a vacuum substrate being handled; With move in the process of taking out of described vacuum processing chamber at described substrate, temporarily accommodate this substrate, its inner loadlock may that keeps vacuum is characterized by, this base board delivery device has:
The substrate that will join on the primary importance in the described loadlock may is delivered to the indoor second place of described vacuum treatment, and the substrate that will receive on the indoor second place of described vacuum treatment is delivered to the conveying mechanism on the primary importance of loadlock may; With
Substrate delivery/reception mechanism, this mechanism is located in the described loadlock may, on the described primary importance therein, first support portion with the peripheral part that supports described substrate, with second support portion of part more in the inner part, described first support portion of supporting more described substrate, can in described loadlock may, between described conveying mechanism and other conveying mechanisms, carry out the handing-over action of substrate.
3. base board delivery device as claimed in claim 1 or 2 is characterized by, and described conveying mechanism has the base plate supports portion of conveying mechanism main body, supporting substrate and drives described conveying mechanism main body and the driving mechanism of described base plate supports portion,
In described substrate delivery/reception mechanism, described first support portion have be configured in around the described transport sector, contact with the peripheral bottom of described substrate dull and stereotyped and make the plate elevating mechanism of flat this plate lifting; Described second support portion has: when remaining on described substrate on the described primary importance in the described base plate supports portion of described conveying mechanism, connect described conveying mechanism main body, supporting pin that contacts with the central authorities of described substrate and the pin elevating mechanism that makes this supporting pin lifting.
4. base board delivery device as claimed in claim 3 is characterized by, and the described supporting pin of described second support portion is configured on the position of centre of gravity position contacting with described substrate.
5. base board delivery device as claimed in claim 1 or 2 is characterized by,
Described conveying mechanism has the base plate supports portion of conveying mechanism main body, supporting substrate and drives described conveying mechanism main body and the driving mechanism of described base plate supports portion;
Described first support portion have be configured in around the described transport sector, contact with the peripheral bottom of described substrate first dull and stereotyped and make the first flat elevator structure of this first dull and stereotyped lifting; Described second support portion has: with the described conveying mechanism main body of more described substrate second flat board that partly contacts and second elevating mechanism that makes this second dull and stereotyped lifting.
6. base board delivery device as claimed in claim 5, it is characterized by, described base plate supports portion, at certain intervals, stretch out to the side from described conveying mechanism main body, the part between the described conveying mechanism main body of described second dull and stereotyped and the described substrate and the described base plate supports portion contacts.
7. as each described base board delivery device among the claim 3-6, it is characterized by, described conveying mechanism main body has the stacked a plurality of plate-like arms in bottom in described base plate supports portion, described driving mechanism makes described base plate supports portion and a plurality of described plate-like arms slide on Width multistage ground and carries out telescopic drive, described a plurality of plate-like arms can be under the state of shrinking back, substrate is remained on the described primary importance, described a plurality of plate-like arms can remain on substrate on the described second place under elongation state.
8. as each described base board delivery device among the claim 1-7, it is characterized by, described substrate is a planar display substrates.
9. substrate carrying method, the substrate that the substrate that joins on primary importance is delivered to the second place, receive on the second place is delivered to first conveying mechanism of primary importance, and between second conveying mechanism that substrate is joined to described first conveying mechanism that is in described primary importance, carry out the handing-over of substrate, it is characterized by
Use is by first support portion of the peripheral part of supporting substrate, with support than described first support portion of the substrate substrate delivery/reception mechanism that constitutes of second support portion of part more in the inner part, between first and second conveying mechanisms that carry out described substrate conveying action, carry out the handing-over action of described substrate.
10. substrate carrying method, has the vacuum processing chamber of in a vacuum substrate being handled, in the vacuum treatment installation of moving into the loadlock may of temporarily accommodating this substrate, its inner maintenance vacuum in the process of taking out of described vacuum processing chamber at described substrate
Between first conveying mechanism and second conveying mechanism, carry out the handing-over action of substrate, wherein, first conveying mechanism is arranged in the described loadlock may, the substrate that will on the primary importance in the described loadlock may, join, be delivered to the second place of described vacuum processing chamber, the substrate that will receive on the indoor second place of described vacuum treatment is delivered on the primary importance of loadlock may; Second conveying mechanism joins described first conveying mechanism of substrate to the described primary importance that is positioned at described loadlock may from atmosphere, it is characterized in that,
Use is by first support portion of the peripheral part of supporting substrate, with support than described first support portion of the substrate substrate delivery/reception mechanism that constitutes of second support portion of part more in the inner part, between first and second conveying mechanisms that carry out described substrate conveying action, carry out the handing-over action of described substrate.
11. as claim 9 or 10 described substrate carrying methods, it is characterized by, it has following operation:
With the substrate that is placed on described second conveying mechanism, move to the operation on the top of described first conveying mechanism;
Make on described first and second support portions of described substrate delivery/reception mechanism to rise the operation that described substrate is floated from described second conveying mechanism;
The operation that described second conveying mechanism is kept out of the way from the top of described first conveying mechanism; With
Described first and second support portions are descended, described substrate is moved to operation on described first conveying mechanism.
12. as claim 9 or 10 described substrate carrying methods, it is characterized by, it has following operation;
Utilize described first support portion and described second support portion, the operation that makes the described substrate that is placed on described first conveying mechanism rise, float from this first conveying mechanism;
Described second conveying mechanism is inserted into operation between described substrate and described first conveying mechanism; With
Described first and second support portions are descended, described substrate is moved to the operation of described second conveying mechanism.
13. as each described substrate carrying method in the claim 9～12, it is characterized by,
Described first conveying mechanism has the base plate supports portion of conveying mechanism main body, supporting substrate and drives described conveying mechanism main body and the driving mechanism of described base plate supports portion;
In described substrate delivery/reception mechanism, described first support portion have be configured in around described first conveying mechanism, contact with the peripheral bottom of described substrate dull and stereotyped and make the flat elevator structure of this flat board lifting; Described second support portion has: when remaining on described substrate on the described primary importance in the described base plate supports portion of described first conveying mechanism, connect described conveying mechanism main body, supporting pin that contacts with the central portion of described substrate and the pin elevating mechanism that makes this supporting pin lifting.
14. substrate carrying method as claimed in claim 13 is characterized by, the described supporting pin of described second support portion is configured on the position of centre of gravity position contacting with described substrate.
15. as each described substrate carrying method in the claim 9～12, it is characterized by,
Described first conveying mechanism has the base plate supports portion of conveying mechanism main body, supporting substrate and drives described conveying mechanism main body and the driving mechanism of described base plate supports portion;
Described first support portion have be configured in around described first transport sector, contact with the peripheral bottom of described substrate first dull and stereotyped and make the first flat elevator structure of this first dull and stereotyped lifting; Described second support portion has: with the described conveying mechanism main body of more described substrate second flat board that partly contacts and second elevating mechanism that makes this second dull and stereotyped lifting.
16. substrate carrying method as claimed in claim 15, it is characterized by, described base plate supports portion stretches out to the side from described conveying mechanism main body with certain interval, and the part between the described conveying mechanism main body of described second dull and stereotyped and the described substrate and the described base plate supports portion contacts.
17. as each described substrate carrying method in the claim 13～16, it is characterized by, described conveying mechanism main body has the stacked a plurality of plate-like arms in bottom in described base plate supports portion, described driving mechanism can make described base plate supports portion and a plurality of described plate-like arms in the ground slip of Width multistage, telescopic drive, in described a plurality of plate-like arms under the state of shrinking back, substrate can be remained on the described primary importance, and under the state of described a plurality of plate-like arms elongations, substrate can be remained on the described second place.
18. a vacuum treatment installation is characterized by, this vacuum treatment installation has
The vacuum processing chamber that substrate is handled in a vacuum;
Move in the process of taking out of described vacuum processing chamber at described substrate, temporarily accommodate this substrate, its inner loadlock may that keeps vacuum;
Be arranged in the described loadlock may, conveying substrate between the indoor second place of primary importance therein and described vacuum treatment, simultaneously and be located at first conveying mechanism that carries out the handing-over of described substrate between the second outside conveying mechanism; With
Substrate delivery/reception mechanism, this mechanism is located in the described loadlock may, described first support portion that has first support portion of the peripheral part that supports described substrate and support more described substrate is second support portion of part more in the inner part, carries out the handing-over action of substrate between described second conveying mechanism and described first conveying mechanism.
19. vacuum treatment installation as claimed in claim 18 is characterized by,
Described first conveying mechanism has the base plate supports portion of conveying mechanism main body, supporting substrate and drives described conveying mechanism main body and the driving mechanism of described base plate supports portion;
In described substrate delivery/reception mechanism, described first support portion have be configured in around described first transport sector, contact with the peripheral bottom of described substrate dull and stereotyped and make the flat elevator structure of this flat board lifting; Described second support portion has: when remaining on described substrate on the described primary importance in the described base plate supports portion of described first conveying mechanism, connect described conveying mechanism main body, supporting pin that contacts with the central portion of described substrate and the pin elevating mechanism that makes this supporting pin lifting.
20. vacuum treatment installation as claimed in claim 19 is characterized by, the described supporting pin of described second support portion is configured on the position of centre of gravity position contacting with described substrate.
21. vacuum treatment installation as claimed in claim 18 is characterized by,
Described first conveying mechanism has the base plate supports portion of conveying mechanism main body, supporting substrate and drives described conveying mechanism main body and the driving mechanism of described base plate supports portion;
Described first support portion have be configured in around described first transport sector, contact with the peripheral bottom of described substrate first dull and stereotyped and make the first flat elevator structure of this first dull and stereotyped lifting; Described second support portion has: with the described conveying mechanism main body of more described substrate second flat board that partly contacts and second elevating mechanism that makes this second dull and stereotyped lifting.
22. vacuum treatment installation as claimed in claim 21, it is characterized by, described base plate supports portion stretches out to the side from described conveying mechanism main body at certain intervals, and the part between the described conveying mechanism main body of described second dull and stereotyped and the described substrate and the described base plate supports portion contacts.
23. as each described vacuum treatment installation in the claim 19～22, it is characterized by, described conveying mechanism main body has the stacked a plurality of plate-like arms in bottom in described base plate supports portion, described driving mechanism can make described base plate supports portion and a plurality of described plate-like arms in the ground slip of Width multistage, telescopic drive, described a plurality of plate-like arms can be under the state of shrinking back, substrate is remained on the described primary importance, described a plurality of plate-like arms can remain on substrate on the described second place under elongation state.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003152813 | 2003-05-29 | ||
| JP2003152813 | 2003-05-29 | ||
| JP2004137424 | 2004-05-06 | ||
| JP2004137424A JP4023543B2 (en) | 2003-05-29 | 2004-05-06 | Substrate transfer apparatus, substrate transfer method, and vacuum processing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1574272A true CN1574272A (en) | 2005-02-02 |
| CN1326228C CN1326228C (en) | 2007-07-11 |
Family
ID=34106781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100455287A Expired - Fee Related CN1326228C (en) | 2003-05-29 | 2004-05-28 | Substrate delivery device and method, and vacuum processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4023543B2 (en) |
| KR (2) | KR100715067B1 (en) |
| CN (1) | CN1326228C (en) |
| TW (1) | TWI265135B (en) |
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| CN101857126A (en) * | 2009-04-06 | 2010-10-13 | 株式会社Ihi | Substrate classifying device |
| CN102194731A (en) * | 2010-03-12 | 2011-09-21 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Position calibration system and plasma processing device |
| CN102446792A (en) * | 2010-10-13 | 2012-05-09 | 东京毅力科创株式会社 | Substrate processing system and substrate transferring method |
| CN102529424A (en) * | 2010-12-25 | 2012-07-04 | 富葵精密组件(深圳)有限公司 | Automatic spray printing machine |
| CN102725110A (en) * | 2009-11-20 | 2012-10-10 | 株式会社爱发科 | Conveying device and vacuum apparatus |
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| CN106486403A (en) * | 2015-09-01 | 2017-03-08 | 东京毅力科创株式会社 | Substrate board treatment and substrate carrying method |
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| KR100613265B1 (en) * | 2004-09-06 | 2006-08-21 | (주)아이씨디 | Vacuum treatment system and subject transfering method using the same |
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| JPH05106039A (en) * | 1991-10-11 | 1993-04-27 | Nissin Electric Co Ltd | Substrate treating equipment |
| JP3881062B2 (en) * | 1996-08-14 | 2007-02-14 | 大日本スクリーン製造株式会社 | Substrate holding mechanism and substrate processing apparatus |
| JPH1116981A (en) * | 1997-06-20 | 1999-01-22 | Dainippon Screen Mfg Co Ltd | Substrate treatment equipment |
| JP4328496B2 (en) * | 2001-06-26 | 2009-09-09 | 株式会社日立プラントテクノロジー | Single substrate transfer equipment |
| JP2003100837A (en) * | 2001-09-21 | 2003-04-04 | Toyota Industries Corp | Transfer system |
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- 2004-05-20 TW TW093114303A patent/TWI265135B/en not_active IP Right Cessation
- 2004-05-27 KR KR1020040037940A patent/KR100715067B1/en not_active IP Right Cessation
- 2004-05-28 CN CNB2004100455287A patent/CN1326228C/en not_active Expired - Fee Related
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- 2006-05-22 KR KR1020060045519A patent/KR100705846B1/en not_active IP Right Cessation
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| CN102446792B (en) * | 2010-10-13 | 2014-09-17 | 东京毅力科创株式会社 | Substrate processing system and substrate transferring method |
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| CN106486403A (en) * | 2015-09-01 | 2017-03-08 | 东京毅力科创株式会社 | Substrate board treatment and substrate carrying method |
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| CN112786503A (en) * | 2019-11-01 | 2021-05-11 | 东京毅力科创株式会社 | Substrate storage device and maintenance method for vacuum transfer unit of substrate transfer device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005012185A (en) | 2005-01-13 |
| JP4023543B2 (en) | 2007-12-19 |
| KR20040103379A (en) | 2004-12-08 |
| CN1326228C (en) | 2007-07-11 |
| KR20060064041A (en) | 2006-06-12 |
| KR100715067B1 (en) | 2007-05-07 |
| TWI265135B (en) | 2006-11-01 |
| TW200508126A (en) | 2005-03-01 |
| KR100705846B1 (en) | 2007-04-09 |
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