CN1222792C - 3-D optical-wave-guide structure and manufacturing method - Google Patents
3-D optical-wave-guide structure and manufacturing method Download PDFInfo
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- CN1222792C CN1222792C CN 200310111234 CN200310111234A CN1222792C CN 1222792 C CN1222792 C CN 1222792C CN 200310111234 CN200310111234 CN 200310111234 CN 200310111234 A CN200310111234 A CN 200310111234A CN 1222792 C CN1222792 C CN 1222792C
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Abstract
The present invention relates to a 3D optical waveguide structure and a manufacturing method thereof. The 3D optical waveguide structure uses the wafer surface of a single crystal silicon spacer as the {100} surface and uses the lateral side cutting direction as the <100> direction. A lateral reflection film which forms an angle of +/-45 DEG with a waveguide plane is manufactured in the perpendicular direction of a waveguide relay, and all reflection surfaces are mutually perpendicular. Lower cladding, a first sandwich layer structure, an isolation layer, a second sandwich layer structure and upper cladding of the waveguide are orderly manufactured on the surface of a silicon chip structure. The structure is manufactured by adopting two kinds of relatively mature technology, silicon micromachining and planar optical waveguide manufacture, and the manufacturing method is simpler. Because an orthogonal high reflection structure is manufactured on a silicon single crystal substrate, light paths of an upper layer of optical waveguide and a lower layer of optical waveguide can transmit light, and the limitation that the ordinary planar optical waveguide can only be in a single layer structure or the intercommunication among layers is difficult is overcome. Therefore, the density of planar optical waveguide devices per unit area is greatly improved, and the structure has an obvious breakthrough in the miniaturization and the integration of optical waveguide devices.
Description
Technical field
The present invention relates to a kind of three-dimensional optical waveguide structure and preparation method thereof, be specifically related to a kind ofly utilize silicon micromachining technique and planar optical waveguide manufacturing technology to combine to make the three-dimensional optical waveguide device, be used for optical communication, light field of interconnects.
Background technology
The plane light wave waveguide technology is realizing that optic communication device is integrated, is showing more and more remarkable advantages aspect miniaturization and the batch process that its performance has arrived even has been better than traditional micro-optical device, is subjected to common attention in the optic communication device industry always.But making, the structure of the characteristics of itself macrobending radius and individual layer waveguide device also far can't reach the lsi level of integrated circuit, undersized degree based on the integrated optics of plane light wave waveguide technology.
In recent years, three-dimensional integrated optics is the focus that people study always, as the research of photonic crystal, but the 'bottleneck' restrictions on its process technology the application of this technological direction reality.Utilize ripe relatively planar optical waveguide manufacturing technology, be devoted to reduce device volume on its basis, increase the device integrated level, be one comparatively speaking and realize more fast way of three-dimensional waveguide device.The report that this respect has been arranged abroad, as at article: OFC ' 2003, MF42. mention the connection of utilization between the waveguide of a rotation angle micro-reflector realization of Waveguide end face installation different layers in, and for example at article: Appl.Phys.Lett.vol.72, pp.2637-8, the method that has proposed vertical direction fusion coupling (Fused vertical coupling) between the ducting layer among the May 1998. is made three-dimensional waveguide device.
The method or the manufacture difficulty of the three-dimensional waveguide device of above-mentioned making are too big, and stability can't ensure simultaneously, in fact be difficult to realize, or the device architecture of going up between the lower waveguide layer are restricted mutually, can't realize bigger integrated level, littler device size.Therefore how realizing the simplification of manufacture craft, reduce the restriction of waveguiding structure between the different waveguide layer simultaneously, improve integrated level, reduce device size, is a major obstacle that realizes the three-dimensional optical waveguide device.
Summary of the invention
The present invention is in order to overcome the deficiency that prior art exists, a kind of three-dimensional optical waveguide structure and preparation method thereof is provided, the present invention makes this two kinds of relative mature technologies in conjunction with the micromachined of silicon with planar optical waveguide, produce a kind of multilayer planar optical waveguide by the vertical reflection interconnected, but make the density of planar optical waveguide unit area accommodation function device obtain significantly improving, unrestricted mutually between the levels waveguiding structure, method for making is fairly simple simultaneously.
Technical scheme of the present invention: a kind of three-dimensional optical waveguide structure, mainly comprise: silicon chip 1, reflectance coating 7 and multilayer planar optical waveguide structure, it is characterized in that: what silicon chip 1 adopted is monocrystalline silicon piece, its wafer surface is { 100} a face, the lateral trimming direction is＜100〉direction, make to become ± 45 ° offside reflection film 7 relaying on the vertical direction with planar waveguide with waveguide) and each reflecting surface orthogonal, on the silicon chip body structure surface, make waveguide under-clad layer 8-1, ground floor core structure 8-2, separation layer 8-3, second layer core structure 8-4, top covering 8-5 successively.
The method for making of described three-dimensional optical waveguide structure may further comprise the steps:
(1) at first utilize photoetching process to produce parallel on monocrystalline silicon piece 1 surface or perpendicular to the optical waveguide deposition region of side cut direction;
(2) it is vertical with silicon chip surface (1) optical waveguide deposition region anisotropic etching to be gone out sidewall, and parallel or perpendicular to the groove of side cut direction;
(3) remove the anti-etching mask 2 of plasma;
(4) method with deposition covers anticorrosive film 3 at bottom portion of groove, upper surface and the back side;
(5) wet etching goes out orthogonal and silicon chip 1 surface and is ± 45 ° plane;
(6) remove anticorrosive film 3;
(7) be with silicon chip 1 surface ± be coated with reflectance coating 7 on 45 ° the plane;
(8) in groove, deposit waveguide under-clad layer 8-1, ground floor core structure 8-2, separation layer 8-3, second layer core structure 8-4, top covering 8-5 successively.
The described concrete grammar that is coated with reflectance coating is:
(1) monocrystalline silicon piece 1 is established, and placed along the certain angle of＜100〉crystal orientation right bank, the silicon chip angle that tilts of cutting edge makes the outer ledge of the V-type groove of upside avoid stopping of ion beam is as the criterion, with reflectance coating be deposited on a side ± 45 ° of planes on;
(2) monocrystalline silicon piece 1 is established again, placed along the certain angle of＜100〉crystal orientation left banks, the silicon chip angle that tilts of cutting edge makes the outer ledge of the V-type groove of downside avoid stopping of ion beam is as the criterion, with reflectance coating be deposited on opposite side ± 45 ° of planes on;
Above-mentioned said groove, the degree of depth of its groove etching is reflectance coating thickness, waveguide under-clad layer thickness, waveguide core layer thickness, 1/2 waveguide separation layer thickness sum two times, two-layer fiber waveguide device structure is by the alignment technological orientation, and the two-layer light wave sliver at V-type groove place by reflection formation loop is in same upright position.
Advantage of the present invention is, make the high reflection configuration of quadrature on of silicon single crystal substrate in the common planar optical waveguide, can realize the logical light of light path of levels optical waveguide, having overcome the common plane optical waveguide can only be the restriction that is difficult to intercommunication between single layer structure or layer and the layer, thereby improved the density of unit area planar optical waveguide device greatly, in the miniaturization of fiber waveguide device, on integrated tangible breakthrough is arranged, realized three-dimensional optical waveguide device truly.
Description of drawings
Fig. 1 is the basic structure of reflection type three-dimensional optical waveguide loop;
Fig. 2 is the silicon chip crystal orientation structure of using in this test;
Fig. 3 is photoresist film figure after the photoetching of silicon chip locating surface direction of silicon chip surface;
Fig. 4 is the sectional view of photoresist film after the photoetching of silicon chip locating surface direction of silicon chip surface;
Fig. 5 is the groove figure that utilizes plasma anisotropic dry etch technology etching certain depth;
Fig. 6 schemes after bottom portion of groove, upper surface and the back side cover anticorrosive film with the method for deposition;
Fig. 7 is the structural section figure after the anisotropic wet corrosion;
Fig. 8 is the structural section figure that makes reflectance coating of the inclination coating technique;
Fig. 9 is the sectional view of the multilayer lightguide structure of making along light wave sliver direction;
Figure 10 is the sectional view of the multilayer lightguide structure of making perpendicular to light wave sliver direction;
Figure 11 is the light path synoptic diagram of logical light in the multilayer lightguide structure;
Figure 12 establishes silicon chip, and places along the certain angle of＜100〉crystal orientation right bank, with reflectance coating be deposited on a side ± synoptic diagram on 45 ° of planes;
Figure 13 establishes silicon chip, and places along the certain angle of＜100〉crystal orientation left banks, with reflectance coating be deposited on opposite side ± synoptic diagram on 45 ° of planes.
Embodiment
Major technique of the present invention is to utilize the anisotropic etch characteristic of monocrystalline silicon to realize being with silicon chip surface ± 45 ° quadrature V-type groove structure, thereby realizes optics intercommunication between the different light waveguide-layers by high reflection mode.The anisotropic etch of monocrystalline silicon is a comparatively ripe technology in semiconductor technology and micro-electromechanical system (MEMS) technology, but silicon chip structure in actual applications mainly be 100} crystal face＜110〉cut edge, and the opening of V-type groove is at silicon chip surface.The silicon chip structure of utilization of the present invention be 100} crystal face＜100〉cut edge, and utilize dry technique, thereby on the position vertical, form the V-type groove of quadrature with silicon chip surface, on this basis, we utilize the inclination coating technique to make reflectance coating, the loop that the optical waveguide structure that makes different layers is realized light by the height reflection of light repeatedly
The concrete manufacturing process in this three-dimensional optical waveguide loop is,
(1) at first utilize the plasma dry lithographic technique, on silicon chip 1, make edge sidewall 5 with the etching plasma 4 that contains halogens, and sidewall 5 perpendicular to silicon chip 1 upper surface and with the parallel groove structure of silicon chip 1 tangential direction, as Fig. 5; The groove etched degree of depth is reflectance coating thickness, waveguide under-clad layer thickness, waveguide core layer thickness, 1/2 waveguide separation layer thickness sum two times;
(2) behind the removal plasma etching mask 2, cover anticorrosive film 3-1,3-2 at bottom portion of groove, silicon chip 1 upper surface and the back side respectively, anticorrosive membrane material is selected SiO for use
2, can also select Si for use
3N
4, as Fig. 6;
(3) in the anisotropic etchant of silicon, recess sidewall 5 will form the V groove of quadrature through excessive erosion, anisotropic etchant is selected the KOH aqueous solution for use, can also select EDP solution for use, EDP solution is the mixed solution of catechol, water, ethylenediamine, the V-type groove that obtains of corrosion as shown in Figure 7, surperficial 6-1,6-2 are { the 110} crystal face of silicon, the angle β on two surfaces is 90 °, and the angle theta on V-type rooved face and silicon chip 1 surface is ± 45 °;
(4) remove anticorrosive film 3-1,3-2, cover reflectance coating 7 at the quadrature V-type rooved face of silicon chip 1 recess sidewall 5 with the inclined deposition method, made behind the reflectance coating 7 silicon structure as shown in Figure 8;
The step of inclined deposition reflectance coating is, the silicon chip of removing etch-resistant film is established placement, at first along＜100〉side cut directions certain angle that is tilted to the right, deposition ion beam 9 directions are downward perpendicular to the base of placing silicon chip, the angle that the silicon chip side cut is tilted is avoided stopping of ion beam is as the criterion with the outer ledge of the V-type groove of upside, reflectance coating will be deposited on the V-type rooved face of downside, as Figure 12; Along＜100〉the side cut directions identical angle that is tilted to the left, reflectance coating will be in other side deposition, as Figure 13 then.
(5) deposit optical waveguide under-clad layer 8-1, deposition ground floor sandwich layer 8-2 successively on the silicon structure surface; Make ground floor fiber waveguide device, layer deposited isolating 8-3, deposition second layer sandwich layer 8-4 on the 8-2, on 8-4, making second layer fiber waveguide device, deposition top covering 8-5, as shown in Figure 9.Two-layer fiber waveguide device structure is by the alignment technological orientation, to guarantee being in same vertical place value at the two-layer light wave sliver in the formation loop at V-type groove place, as shown in figure 10.The thickness of separation layer 8-3 satisfies the boundary condition that the light path of two-layer fiber waveguide device is independent of each other, and 1/2 position of separation layer height and the orthogonal points on two inclined-planes of V-type groove are in same horizontal level simultaneously, as shown in figure 11.
Claims (4)
1, a kind of three-dimensional optical waveguide, mainly comprise: silicon chip (1), reflectance coating (7) and multilayer planar optical waveguide structure, it is characterized in that: what silicon chip (1) adopted is monocrystalline silicon piece, its wafer surface is { 100} a face, the lateral trimming direction is＜100〉direction, with the vertical direction of duct propagation on make to become ± 45 ° offside reflection film (7) with planar waveguide, and each reflecting surface is orthogonal, makes waveguide under-clad layer (8-1) on the silicon chip body structure surface successively, ground floor core structure (8-2), separation layer (8-3), second layer core structure (8-4), top covering (8-5).
2, the method for making of three-dimensional optical waveguide is characterized in that: may further comprise the steps:
(1) at first utilize photoetching process to produce parallel on monocrystalline silicon piece (1) surface or perpendicular to the optical waveguide deposition region of side cut direction;
(2) it is vertical with silicon chip surface (1) optical waveguide deposition region anisotropic etching to be gone out sidewall, and parallel or perpendicular to the groove of side cut direction;
(3) remove the anti-etching mask of plasma (2);
(4) method with deposition covers anticorrosive film (3) at bottom portion of groove, upper surface and the back side;
(5) wet etching goes out orthogonally, and silicon chip (1) surface is ± 45 ° plane;
(6) remove anticorrosive film (3);
(7) and silicon chip (1) surface be ± be coated with reflectance coating (7) on 45 ° the plane;
(8) in groove, deposit waveguide under-clad layer (8-1), ground floor core structure (8-2), separation layer (8-3), second layer core structure (8-4), top covering (8-5) successively.
3, according to the method for making of the described three-dimensional optical waveguide of claim 2, it is characterized in that: the described concrete grammar that is coated with reflectance coating is:
(1) monocrystalline silicon piece (1) is established, and placed along the certain angle of＜100〉crystal orientation right bank, the silicon chip angle that tilts of cutting edge makes the outer ledge of the V-type groove of upside avoid stopping of ion beam is as the criterion, with reflectance coating be deposited on a side ± 45 ° of planes on;
(2) monocrystalline silicon piece (1) is established again, placed along the certain angle of＜100〉crystal orientation left banks, the silicon chip angle that tilts of cutting edge makes the outer ledge of the V-type groove of downside avoid stopping of ion beam is as the criterion, with reflectance coating be deposited on opposite side ± 45 ° of planes on;
4, according to the method for making of the described three-dimensional optical waveguide of claim 2, it is characterized in that: the degree of depth of groove etching is reflectance coating thickness, waveguide under-clad layer thickness, waveguide core layer thickness, 1/2 waveguide separation layer thickness sum two times, two-layer fiber waveguide device structure is by the alignment technological orientation, and the two-layer light wave sliver at V-type groove place by reflection formation loop is in same upright position.
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| CN 200310111234 CN1222792C (en) | 2003-10-14 | 2003-10-14 | 3-D optical-wave-guide structure and manufacturing method |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2010074186A1 (en) * | 2008-12-22 | 2010-07-01 | Panasonic Electric Works Co., Ltd. | Method for forming mirror-reflecting film in optical wiring board, and optical wiring board |
| CN102812591B (en) * | 2010-03-31 | 2015-11-25 | 惠普发展公司，有限责任合伙企业 | Wave guide system and method |
| CN102393549B (en) * | 2011-11-25 | 2014-12-24 | 深圳市中兴新地通信器材有限公司 | Three-dimensional integration glass-based optical waveguide device and manufacturing method thereof |
| US10436991B2 (en) * | 2017-05-19 | 2019-10-08 | Adolite Inc. | Optical interconnect modules based on glass substrate with polymer waveguide |
| CN110687630B (en) * | 2019-09-30 | 2020-07-28 | 华中科技大学 | SOI substrate applied to three-dimensional optical interconnection and preparation method thereof |
| CN110955001B (en) * | 2020-01-02 | 2023-08-04 | 亨通洛克利科技有限公司 | Silicon photon chip optical power measuring device, equipment and measuring method |
| JP6986582B2 (en) * | 2020-02-06 | 2021-12-22 | Ｎｔｔエレクトロニクス株式会社 | Optical device manufacturing method and manufacturing equipment by local etching |
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