CN117921955A - Microfluidic chip preparation mold and preparation method thereof and microfluidic chip preparation method - Google Patents
Microfluidic chip preparation mold and preparation method thereof and microfluidic chip preparation method Download PDFInfo
- Publication number
- CN117921955A CN117921955A CN202410287014.XA CN202410287014A CN117921955A CN 117921955 A CN117921955 A CN 117921955A CN 202410287014 A CN202410287014 A CN 202410287014A CN 117921955 A CN117921955 A CN 117921955A
- Authority
- CN
- China
- Prior art keywords
- microfluidic chip
- bottom plate
- substrate template
- preparation
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 238000001746 injection moulding Methods 0.000 claims abstract description 40
- 238000000465 moulding Methods 0.000 claims abstract description 31
- 238000001816 cooling Methods 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 34
- 238000005530 etching Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 23
- 238000012545 processing Methods 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 15
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 14
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 14
- 229920001187 thermosetting polymer Polymers 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 8
- 239000000243 solution Substances 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 4
- 238000001259 photo etching Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 claims description 2
- 238000002791 soaking Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 32
- 239000004033 plastic Substances 0.000 abstract description 5
- 229920003023 plastic Polymers 0.000 abstract description 5
- 238000011161 development Methods 0.000 abstract description 2
- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 239000012815 thermoplastic material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000003752 polymerase chain reaction Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000010076 replication Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 208000017667 Chronic Disease Diseases 0.000 description 1
- -1 Polydimethylsiloxane Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005842 biochemical reaction Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000003759 clinical diagnosis Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 230000006806 disease prevention Effects 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002262 irrigation Effects 0.000 description 1
- 238000003973 irrigation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention provides a microfluidic chip preparation mold and a preparation method thereof and a microfluidic chip preparation method. The microfluidic chip preparation mold comprises an outer support and a base template. The preparation method of the micro-fluidic chip preparation mold comprises the following steps: after a groove is formed on one substrate, a base template with a molding surface is fixed in the groove, and after the other substrate is covered on the groove, a cavity is formed by surrounding, and then a through hole is formed. The preparation method of the microfluidic chip comprises the following steps: and (3) injecting plastics into a cavity of a microfluidic chip preparation mould, cooling, forming and separating to obtain the microfluidic chip matched with the forming surface of the substrate template. The invention combines the advantages of the industrial injection molding method and the semiconductor manufacturing process, has small injection molding pressure, low requirements on equipment and dies, low roughness of the dies, can form micro-fluidic chips with small-size microstructures, reduces the development cost and the manufacturing period of the dies, is convenient to replace the dies, and is easy to operate and produce.
Description
Technical Field
The invention relates to the field of manufacturing of microfluidic chips, in particular to a microfluidic chip manufacturing die and a manufacturing method thereof and a microfluidic chip manufacturing method.
Background
The microfluidic chip technology integrates basic operation units such as sample pretreatment, reaction, separation, detection and the like in biological, chemical and medical analysis processes on a chip with the size of a few square centimeters, and uses a micro-channel network to penetrate through each operation link to automatically form the whole analysis process. The microfluidic chip has the characteristics of controllable liquid flow, small sample consumption, high reaction speed, easy integration and the like, and is widely applied to the fields of clinical diagnosis and disease screening such as hospital operation, emergency treatment, intensive care, chronic disease prevention and treatment and the like.
The materials which can be processed by the microfluidic chip are glass, silicon, polymers and the like. Among them, many researchers are interested in the advantages of the polymer materials, such as the variety of the polymer materials, the convenience of processing, and the cheapness. Polydimethylsiloxane (PDMS) is a thermosetting material, and is one of the most widely used materials for microfluidic chips because of its good light transmission properties and simple processing and molding processes. The mass ratio of the casting on the surface of the micro-fluidic chip die is 10:1, uniformly stirring the mixed solution of the PDMS prepolymer and the curing agent, pouring the mixed solution onto a die, placing the die into a vacuum drying oven, curing the mixed solution at the temperature of 90 ℃ for 40min, taking the cured and formed PDMS and the die out, and separating the cured and formed PDMS from the die to obtain the microfluidic chip with the surface consistent with the die structure. But the micro-fluidic chip is often formed as a single material due to the property of not resisting high temperature. The surface hydrophobicity of PDMS makes it difficult for liquids such as buffers to enter their structure, and additional surface modification is required for use. In the experiments of polymerase chain reaction (polymerase chain reaction, PCR), the phenomenon of volatilization of liquid drops is shown during temperature circulation, and the application of the liquid drops is greatly limited. In addition, the molding method is not suitable for mass continuous production due to the complicated steps of the reverse molding process and various factors that are used only by post-treatment.
In view of the factors such as processability, material cost, and biochemical reaction with reagents, the material of the medical microfluidic chip is generally a polymer material. The manufacturing of the polymer micro-fluidic chip mainly comprises the methods of micro-mechanical or laser direct processing polymer molding, photoetching electroforming replication (LIGA) molding, mold replication molding and the like. In order to reduce the processing cost and maintain the processing consistency, the mass production of the polymer microfluidic chip is generally formed by copying an injection mold. The key to injection molding is the processing of the injection mold. The microfluidic chip has a plurality of functional areas, and is reflected as a corresponding macrostructure and local microstructure on the injection mold. The processing method of the macrostructure of the injection mold is basically consistent with that of a common mold, and the processing core of the injection mold is the processing of the microstructure. When a micro-fluidic chip injection mold with a micrometer or even nanometer level is processed by CNC numerical control processing or laser processing, the precision often cannot meet the requirement, and the uniformity and roughness of the processed mold are poor, so that the surface roughness of the injection molded chip cannot meet the use requirement.
In view of this, there are certain drawbacks to both PDMS reverse molded microfluidic chips and micromachining die industrial injection molding schemes. To solve this problem, researchers have adopted methods in semiconductor manufacturing processes to make up for the shortfall of industrial injection molding. By using the method of the photoetching technology, firstly, a layer of photoresist is uniformly coated on a substrate, and the thinner and more uniform the photoresist layer on the surface of the substrate, the finer the manufactured pattern is. The photoresist is divided into positive photoresist and negative photoresist according to the difference of photoreactivity, the former is decomposed after being illuminated, leaving a pattern of non-illuminated areas, and the latter is exposed to light after being illuminated. And (3) exposing by light irradiation, spraying a developer to remove the photoresist in the uncovered area, and then etching.
Wet etching is to use chemical reaction between solution and film to eliminate the part to be etched, so as to reach the aim of etching. Photoresist is typically used as the selective removal material for reticles whose patterns can be etched into glass, silicon or quartz substrates. Wet etching of glass typically uses hydrofluoric acid as an etching solution, which is further diluted with water or a buffer solvent to reduce the etching rate of the oxide, so as to facilitate control of the etching rate and uniformity of the substrate. Therefore, the substrate can be etched by the method to obtain a substrate with an exquisite surface structure, precise size and low roughness, and the precision can be in a micrometer or even nanometer level.
In summary, microfluidic chips are currently manufactured by using a thermosetting material molding method and a thermoplastic material injection molding method. However, after the thermosetting material such as PDMS is molded, the thermosetting material can be normally used only through complex post-treatment steps, such as vacuumizing to remove bubbles, surface modification to change hydrophilicity and hydrophobicity, and the like. And the PDMS material has the problems that bubbles are difficult to remove and the surface solution is evaporated seriously in the using process. The mold used for injection molding is difficult to process a micro-sized structure, and shows defects in micro-nano structures of micro-and nano-scale. Although the chinese patent with application No. 201810335107.X discloses a method of combining a photolithography, etching and electroforming process and an industrial injection molding process, a metal layer is additionally required to be covered on the surface of the base template, which is complicated in process and increases manufacturing cost.
Disclosure of Invention
The invention is carried out to solve the problems, and aims to combine the advantages of an industrial injection molding method and a semiconductor manufacturing process, develop a simple method for directly taking an etched substrate template as an injection mold, and provide a microfluidic chip preparation mold, a preparation method thereof and a microfluidic chip preparation method.
The invention provides a preparation method of a microfluidic chip preparation mold, which has the characteristics that the preparation method is used for preparing the microfluidic chip preparation mold, wherein the microfluidic chip preparation mold is used for preparing a microfluidic chip, and the preparation method of the microfluidic chip preparation mold comprises the following steps: s10, taking two substrates, respectively marking the two substrates as a first bottom plate and a second bottom plate, and forming a groove on the surface of one of the two substrates; s20, arranging a substrate template with a molding surface in the groove, wherein the molding surface is opposite to and matched with the pattern convexity of the surface of the microfluidic chip to be prepared; s30, splicing the first bottom plate and the second bottom plate along the grooves to form a structure with an internal cavity, and recording the structure as an outer supporting piece; s40, forming a channel on the outer support piece, and marking the channel as an injection molding channel so as to enable the injection molding channel to be communicated with the cavity and the outer space of the outer support piece.
The preparation method of the microfluidic chip preparation mold provided by the invention can also have the following characteristics: wherein step S20 comprises the sub-steps of: s21, etching one surface of a substrate template by utilizing a semiconductor processing technology to form a structure which is opposite to and matched with the concave-convex property of the pattern on the surface of the micro-fluidic chip to be prepared, and marking the structure as a molded surface; s22, cutting the substrate template according to the size of the groove, so that the substrate template is embedded into the groove, and the molding surface faces upwards; s23, pouring the adhesive in the grooves and not flooding the molding surface on the substrate template, so that the substrate template is adhered in the grooves.
The preparation method of the microfluidic chip preparation mold provided by the invention can also have the following characteristics: wherein step S21 comprises the sub-steps of: s211, plating a corrosion-resistant material on the surface of the substrate template to form a film; s212, photoetching a micro-concave lattice on the plated film; s213, placing the substrate template in etching liquid for soaking, and etching a distance into the substrate template along the micro-concave lattice; and S214, placing the etched substrate template in a cleaning solution so as to remove the plated film, and obtaining the substrate template with the micro-concave lattice, wherein the surface of the substrate template with the micro-concave lattice is opposite to and matched with the concave-convex pattern of the surface of the micro-fluidic chip to be prepared, and is recorded as the surface.
The preparation method of the microfluidic chip preparation mold provided by the invention can also have the following characteristics: in step 23, the adhesive is a thermosetting material, and the thermosetting material includes PDMS, AB glue, or UV glue, and the adhesive adheres the substrate template in the groove.
The invention provides a microfluidic chip preparation mold, which has the characteristics that the preparation mold is prepared by the preparation method of any one of the microfluidic chip preparation molds, and is used for preparing a microfluidic chip, and the microfluidic chip preparation mold comprises: the outer support piece is internally provided with a cavity and an injection molding channel which is communicated with the cavity and the external space of the outer support piece; and the substrate template is arranged in the cavity, one surface of the substrate template is a molding surface, and the molding surface is opposite to and matched with the pattern convexity of the surface of the microfluidic chip to be prepared.
The microfluidic chip preparation mold provided by the invention can also have the following characteristics: the outer support piece comprises a first bottom plate and a second bottom plate, wherein a groove is formed in the surface of one of the first bottom plate and the second bottom plate, the first bottom plate and the second bottom plate are spliced into the outer support piece with a cavity along the groove, the depth of the groove is larger than the thickness of the substrate template, and the difference between the depth of the groove and the thickness of the substrate template is the thickness of the microfluidic chip to be prepared.
The microfluidic chip preparation mold provided by the invention can also have the following characteristics: wherein, wear to be equipped with the passageway of moulding plastics on first bottom plate or the second bottom plate, the passageway of moulding plastics connects cavity and outer support piece's outer space.
The microfluidic chip preparation mold provided by the invention can also have the following characteristics: wherein, first bottom plate and second bottom plate wear to be equipped with the passageway of moulding plastics jointly, the passageway of moulding plastics connects cavity and outer support piece's outer space.
The invention provides a preparation method of a microfluidic chip, which has the characteristics that the preparation mold of the microfluidic chip is used for preparing the microfluidic chip.
The preparation method of the microfluidic chip provided by the invention can also have the following characteristics: the preparation method of the microfluidic chip comprises the following steps: s50, injecting a thermoplastic polymer in a molten state into a cavity inside the outer support through the injection molding channel; and S60, after cooling, opening the first bottom plate and the second bottom plate of the outer support piece, separating the substrate template from the polymer formed by cooling on the substrate template, and obtaining the prepared microfluidic chip by the polymer formed by cooling.
Effects and effects of the invention
According to the microfluidic chip preparation mold, the preparation method and the microfluidic chip preparation method, which are related by the invention, the advantages of the industrial injection molding method and the semiconductor manufacturing process are combined, so that the method can rapidly process the microfluidic chip preparation mold at low cost and prepare the microfluidic chip, has high precision and is easy to demould, and meanwhile, the steps are simple and practical and are easy to carry out in batches.
Drawings
FIG. 1 is an exploded view of the structure of a microfluidic chip fabrication mold according to example 1 of the present invention without a base template;
FIG. 2 is a schematic plan view of a microfluidic chip fabrication mold according to example 1 of the present invention without the second base plate;
FIG. 3 is a block flow diagram of a method for preparing a microfluidic chip preparation mold in example 2 of the present invention;
Fig. 4 is a schematic diagram showing a process of preparing a base template having a molding surface in the preparation method of a microfluidic chip preparation mold according to embodiment 2 of the present invention;
FIG. 5 is a flow chart of a method for fabricating a microfluidic chip in example 3 of the present invention;
FIG. 6 is a flow chart of an injection molding process of the microfluidic chip manufacturing method in example 3 of the present invention;
Fig. 7 is a schematic diagram of an injection molding process of the microfluidic chip manufacturing method in example 3 of the present invention.
Detailed Description
In order to make the technical means, creation characteristics, achievement purposes and effects achieved by the invention easy to understand, the following embodiment describes a microfluidic chip preparation mold, a preparation method thereof and a microfluidic chip preparation method thereof specifically by combining the accompanying drawings.
Example 1 ]
The embodiment provides a micro-fluidic chip preparation mold.
FIG. 1 is an exploded view of the structure of a microfluidic chip fabrication mold according to example 1 of the present invention without a base template; fig. 2 is a schematic plan view of a microfluidic chip manufacturing mold according to example 1 of the present invention without the second base plate.
As shown in fig. 1-2, the present embodiment provides a microfluidic chip preparation mold 100 for preparing a microfluidic chip, the microfluidic chip preparation mold 100 including an outer support 10 and a base template 20.
The outer support 10 includes a first base plate 11 and a second base plate 12, which are made of metal.
The surface of the first bottom plate 11 is provided with a groove 111, and the first bottom plate 11 is also provided with a perfusion channel 112 which is communicated with the groove 111 and the external space of the first bottom plate 11.
In this embodiment, the shape of the recess 111 is rectangular or square to facilitate subsequent embedding of the base form 20, the recess 111 is 10-50mm long, 10-50mm wide, and 20-50mm deep.
In this embodiment, the irrigation channel 112 has an inner diameter of 1-5mm.
The first base plate 11 and the second base plate 12 are spliced into the outer support 10 having an inner cavity (not shown) along one side of the groove 111, and the pouring passage 112 communicates the cavity with the outer space of the outer support 10.
In this embodiment, the first bottom plate 11 and the second bottom plate 12 are further provided with corresponding through holes (not shown) respectively, and the two are fastened by bolts passing through the through holes.
The base template 20 is disposed in the recess 111, and has a quadrilateral, circular or sector shape, a volume of 2000-125000mm 3, and a material of borosilicate glass, silicon or quartz (borosilicate glass in this embodiment, a hardness of 480 HK); one surface of the base template 20 is a molding surface 21, the convexity of the pattern of the molding surface 21 is opposite to and matched with that of the surface of the microfluidic chip to be prepared, and the molding surface 21 faces upwards and faces the same opening as the groove 111; the thickness of the base template 20 is smaller than that of the groove 111, and the difference between the two is the thickness of the microfluidic chip to be prepared; the base form 20 is positioned in the inner cavity of the outer support 10 by the splicing of the first base plate 11 and the second base plate 12.
In this embodiment, the base template 20 is adhered to the groove 111 by an adhesive, which is a thermosetting material such as PDMS, AB glue or UV glue.
Example 2]
The embodiment provides a preparation method of a micro-fluidic chip preparation mold.
FIG. 3 is a block flow diagram of a method for preparing a microfluidic chip preparation mold in example 2 of the present invention; fig. 4 is a schematic diagram showing a process of preparing a base template having a molding surface in the preparation method of a microfluidic chip preparation mold according to example 2 of the present invention.
As shown in fig. 3-4, the present embodiment provides a method for preparing a microfluidic chip preparing mold, for preparing the microfluidic chip preparing mold 100 provided in < embodiment 1>, the method for preparing a microfluidic chip preparing mold of the present embodiment includes the steps of:
s10, taking two substrates, respectively marking the two substrates as a first bottom plate and a second bottom plate, and forming a groove on the surface of the first bottom plate;
S211, taking a substrate template, plating a chromium layer of 100nm on the surface of the substrate template, and then uniformly spin-coating photoresist on the substrate template;
S212, after exposing the surface of the substrate template by using a mask plate, dissolving and washing off photoresist of an unexposed part, thereby describing a micro-concave lattice with the diameter of 1-200 mu m in a chromium layer and the photoresist on the substrate template, cleaning the surface of the substrate template by using deionized water, and then drying by nitrogen, developing, heating and naturally cooling;
S213, placing the substrate template in etching liquid to soak the substrate template, so that the etching liquid etches a distance along the micro-concave lattice into the substrate template, stirring and shaking are required continuously in the etching process, and the etching time is adjusted according to the depth of etching required, wherein the etching rates of different etching liquids and concentrations on glass are different (hydrofluoric acid solution is selected in the embodiment), and the type, concentration and etching time of the etching liquid are selected appropriately according to the required etching size;
S214, placing the etched substrate template in toluene solution to wash away redundant photoresist and chromium layers, and then performing ultrasonic cleaning to obtain the substrate template with a micro-concave lattice, wherein one surface of the substrate template with the micro-concave lattice is opposite to and matched with the concave-convex pattern of the surface of the micro-fluidic chip to be prepared, and marking the surface as a surface;
S22, cutting the substrate template according to the size of the groove, so that the substrate template is embedded into the groove, and the molding surface faces upwards;
S23, pouring an adhesive in the groove and not submerging the molding surface on the substrate template, so that the substrate template is adhered in the groove, wherein the adhesive is a thermosetting material such as PDMS, AB glue or UV glue;
S30, splicing the first bottom plate and the second bottom plate along the grooves to form a structure with an internal cavity, and recording the structure as an outer supporting piece;
And S40, forming a channel on the outer support piece, and marking the channel as an injection molding channel, so that the injection molding channel is communicated with the cavity and the external space of the outer support piece, and obtaining the micro-fluidic chip preparation mold.
In this embodiment, the injection molding channel is completely located in the first bottom plate of the outer support member and penetrates through the first bottom plate, so that the groove is communicated with the space outside the first bottom plate.
In steps S211 to S23 of a modification of the present embodiment, etching operations may be performed on a plurality of substrate templates, and the etched sizes are all different, and then the plurality of substrate templates are all fixed in the grooves of the first base plate, so that the microfluidic chip prepared with the mold has pattern structures of different sizes thereon.
For convenience of expression, the same structures as those of < embodiment 1> are given the same designations in this embodiment, and the same descriptions are omitted.
Example 3 ]
The embodiment provides a preparation method of a microfluidic chip.
Fig. 5 is a flow chart of a method for preparing a microfluidic chip in example 3 of the present invention.
As shown in fig. 5, the present embodiment provides a microfluidic chip manufacturing method using the microfluidic chip manufacturing mold of < embodiment 1> manufactured by the manufacturing method of the microfluidic chip manufacturing mold provided in < embodiment 2>, the microfluidic chip manufacturing method comprising the steps of:
s50, injecting a thermoplastic polymer in a molten state into a cavity inside the outer support through the injection molding channel;
And S60, after cooling, opening the first bottom plate and the second bottom plate of the outer support piece, separating the substrate template from the polymer formed by cooling on the substrate template, and obtaining the prepared microfluidic chip by the polymer formed by cooling.
In this embodiment, the polymer in step S50 is any one of thermoplastic materials such as PS, PE, PP, and PMMA.
FIG. 6 is a flow chart of an injection molding process of the microfluidic chip manufacturing method in example 3 of the present invention; fig. 7 is a schematic diagram of an injection molding process of the microfluidic chip manufacturing method in example 3 of the present invention.
As shown in fig. 6-7, in the present embodiment, the injection molding process of step S50 includes the following sub-steps:
S51, connecting an injection molding machine and an air compressor by using an air line;
s52, filling polymer thermoplastic material particles into a charging barrel of an injection molding machine, wherein each time the filling material preferably does not exceed the charging barrel;
S53, turning on a heating system of the injection molding machine, adjusting the temperature to a temperature range required for processing the high polymer thermoplastic material, and selecting a corresponding melting temperature, for example, selecting a processing temperature of a Polystyrene (PS) material to be 180-200 ℃;
s54, adjusting air pressure according to the condition of the high polymer thermoplastic material, uniformly injecting the high polymer thermoplastic material into a die, displaying the current working pressure by a pressure regulator pressure gauge, wherein the required air pressure is 0.35-0.85MPa, the defect of an injection molding finished product can be caused by the too low air pressure, and the base template can be damaged by the too high air pressure;
S55, the opening of the pouring channel is optimally spaced about 5cm away from the injection nozzle of the injection molding machine, and after the opening of the pouring channel is aligned with the injection nozzle of the injection molding machine, an injection switch of the injection molding machine is pressed until the injection molding process is finished.
For convenience of expression, the same structures as those of < embodiment 1> are given the same designations in this embodiment, and the same descriptions are omitted.
Effects and effects of the examples
In the preparation mold of the microfluidic chip, the preparation method of the microfluidic chip and the preparation method of the microfluidic chip provided by the embodiment of the invention, the formed microfluidic chip not only inherits the advantages of low surface roughness and high precision of a base template, but also has high consistency with the base template, can realize batch production, and has the advantages of simple and convenient forming process, easy operation and high accuracy and precision.
The embodiment of the invention combines the advantages of industrial injection molding and semiconductor manufacturing processes, has low roughness of the processed substrate template, and can form a small-size microstructure.
The embodiment of the invention has the advantages that two or more micro-structure substrate templates etched with different sizes are simultaneously embedded in the groove, so that structures with different sizes can be obtained on one micro-fluidic chip, and different using purposes are achieved. In addition, the method greatly reduces the machining steps, so that the machining cost is greatly reduced. The fine grade of the surface pattern of the base template can be kept at the micron grade for a long time, the processing cost and the manufacturing cost of the base template are reduced, the repeatability is good, and the production period is shortened.
The embodiment of the invention reduces the development cost and the manufacturing period of the base template, is convenient for replacing the base template and is easy for mass production.
The fine grade of the pattern on the substrate template of the embodiment of the invention can be kept at the micron grade and the submicron grade for a long time, the repeatability is good, and the production period is shortened.
According to the embodiment of the invention, a metal layer does not need to be plated on the etched substrate template, so that complicated processing steps are omitted, the manufacturing process flow is simple and convenient, and the economical efficiency and the practicability are improved.
According to the embodiment of the invention, the substrate template is coated by using a thermosetting material such as PDMS, so that the problem of difficult demoulding caused by shrinkage of a product due to temperature change can be reduced during demoulding.
It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The preparation method of the micro-fluidic chip preparation mold is characterized by comprising the following steps of:
S10, taking two substrates, respectively marking the two substrates as a first bottom plate and a second bottom plate, and forming a groove on the surface of one of the two substrates;
s20, arranging a substrate template with a molding surface in the groove, wherein the molding surface is opposite to and matched with the convexity of the pattern of the surface of the microfluidic chip to be prepared;
S30, splicing the first bottom plate and the second bottom plate along the grooves to form a structure with an internal cavity, and recording the structure as an outer supporting piece;
S40, forming a channel on the outer support piece, namely an injection molding channel, so that the injection molding channel is communicated with the cavity and the outer space of the outer support piece.
2. The method for preparing the microfluidic chip preparation mold according to claim 1, wherein:
wherein step S20 comprises the sub-steps of:
S21, etching one surface of a substrate template by utilizing a semiconductor processing technology to form a structure which is opposite to and matched with the concave-convex pattern of the surface of the microfluidic chip to be prepared, and marking the structure as a molded surface;
S22, cutting the substrate template according to the size of the groove, so that the substrate template is embedded into the groove, and the molding surface faces upwards;
S23, pouring adhesive in the grooves and not flooding the molding surface on the substrate template, so that the substrate template is adhered in the grooves.
3. The method for preparing the microfluidic chip preparation mold according to claim 2, wherein:
wherein step S21 comprises the sub-steps of:
s211, plating a corrosion-resistant material on the surface of the substrate template to form a film;
S212, photoetching a micro-concave lattice on the plated film;
S213, placing a substrate template in etching liquid for soaking, and etching a distance into the substrate template along the micro-concave lattice;
s214, placing the etched substrate template in a cleaning solution to remove the plated film to obtain the substrate template with the micro-concave lattice,
The substrate template is characterized in that one surface with the micro-concave lattice is opposite to and matched with the concave-convex pattern of the surface of the micro-fluidic chip to be prepared, and is marked as a molded surface.
4. The method for preparing the microfluidic chip preparation mold according to claim 2, wherein:
wherein, in step 23, the adhesive is a thermosetting material,
The thermosetting material comprises PDMS, AB glue or UV glue,
The adhesive adheres the base form to the recess.
5. A microfluidic chip preparation mold, characterized in that it is prepared by using the preparation method of the microfluidic chip preparation mold according to any one of claims 1 to 4, for preparing a microfluidic chip, the microfluidic chip preparation mold comprising:
The outer support piece is internally provided with a cavity and an injection molding channel communicated with the cavity and the external space of the outer support piece; and
The substrate template is arranged in the cavity, one surface of the substrate template is a molding surface, and the molding surface is opposite to and matched with the pattern convexity of the surface of the microfluidic chip to be prepared.
6. The microfluidic chip preparation mold according to claim 5, wherein:
Wherein the outer supporting piece comprises a first bottom plate and a second bottom plate, a groove is arranged on one surface of the first bottom plate and the second bottom plate, the two bottom plates are spliced into the outer supporting piece with the cavity along the groove,
The depth of the groove is larger than the thickness of the substrate template, and the difference between the depth of the groove and the thickness of the substrate template is the thickness of the microfluidic chip to be prepared.
7. The microfluidic chip preparation mold according to claim 6, wherein:
Wherein the first bottom plate or the second bottom plate is provided with an injection molding passage in a penetrating way,
The injection molding passage connects the cavity with an outer space of the outer support.
8. The microfluidic chip preparation mold according to claim 6, wherein:
wherein the first bottom plate and the second bottom plate are jointly provided with injection molding channels in a penetrating way,
The injection molding passage connects the cavity with an outer space of the outer support.
9. A method for preparing a microfluidic chip, characterized in that the microfluidic chip preparation mold according to any one of claims 5 to 8 is used for preparing a microfluidic chip.
10. The method for preparing a microfluidic chip according to claim 9, comprising the steps of:
s50, injecting a thermoplastic polymer in a molten state into the cavity inside the outer support through an injection molding channel;
And S60, after cooling, opening the first bottom plate and the second bottom plate of the outer support piece, and separating the substrate template from the polymer formed by cooling on the substrate template, wherein the polymer formed by cooling is the prepared microfluidic chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410287014.XA CN117921955A (en) | 2024-03-13 | 2024-03-13 | Microfluidic chip preparation mold and preparation method thereof and microfluidic chip preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410287014.XA CN117921955A (en) | 2024-03-13 | 2024-03-13 | Microfluidic chip preparation mold and preparation method thereof and microfluidic chip preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117921955A true CN117921955A (en) | 2024-04-26 |
Family
ID=90755990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410287014.XA Pending CN117921955A (en) | 2024-03-13 | 2024-03-13 | Microfluidic chip preparation mold and preparation method thereof and microfluidic chip preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117921955A (en) |
-
2024
- 2024-03-13 CN CN202410287014.XA patent/CN117921955A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4489945B2 (en) | Microfluidic product and manufacturing method thereof | |
| Khoury et al. | Ultra rapid prototyping of microfluidic systems using liquid phase photopolymerization | |
| US9498914B2 (en) | 3D microfluidic devices based on open-through thermoplastic elastomer membranes | |
| US20040241049A1 (en) | Elastomeric tools for the fabrication of elastomeric devices and uses thereof | |
| US20050067286A1 (en) | Microfabricated structures and processes for manufacturing same | |
| CN105548315A (en) | Polymer micro-fluidic chip and preparation method thereof | |
| US7682541B2 (en) | Manufacturing method of a microchemical chip made of a resin | |
| CN117921955A (en) | Microfluidic chip preparation mold and preparation method thereof and microfluidic chip preparation method | |
| US20100264567A1 (en) | Apparatus for fixing plastic sheet and method of fabricating nano pattern on plastic sheet using the same | |
| Lee | Microinjection molding of plastic microfluidic chips including circular microchannels | |
| EP1416325A1 (en) | A master and method of manufacturing a master for molds used to produce microstructured devices | |
| KR100911908B1 (en) | Method for producing die and molding obtained by it | |
| KR101066310B1 (en) | A stamper inserted mold for manufacturing a biochip having microscopic pattern and macro pattern in one body and manufacturing method of the biochip using the same | |
| KR100492284B1 (en) | Method of manufacturing microchip | |
| CN113290770A (en) | Injection molding method of plastic microfluidic chip | |
| CN113477281B (en) | Method for manufacturing multi-scale microfluidic chip and multi-scale microfluidic chip | |
| CN109821583B (en) | Processing method of special-shaped cross section micro-channel chip based on FDM three-dimensional printing | |
| CN113211720A (en) | Injection mold for PDMS micro-fluidic chip and manufacturing method | |
| KR100498560B1 (en) | mold of plastic microchip and methode thereof | |
| JP4769544B2 (en) | Manufacturing method of secondary mold | |
| NAGAI et al. | Rapid prototyping of PDMS microchannels for animal and plant cells using cutting plotter and double casting | |
| CN114433260B (en) | Nano-fluidic chip based on nano-cracks and processing method thereof | |
| KR102133679B1 (en) | Biochip quick delivery molding based on mold base standardized by the biochip size | |
| Zhao et al. | Development of rapid manufacturing technology of polymer microfluidic devices by micro moulding using silicon mould inserts | |
| TW202010646A (en) | Manufacturing method of microfluidic chip and finished product thereof forming a microfluidic chip having a first microfluidic unit and a second microfluidic unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination |