CN117711991A - Wafer groove type cleaning equipment - Google Patents
Wafer groove type cleaning equipment Download PDFInfo
- Publication number
- CN117711991A CN117711991A CN202410160296.7A CN202410160296A CN117711991A CN 117711991 A CN117711991 A CN 117711991A CN 202410160296 A CN202410160296 A CN 202410160296A CN 117711991 A CN117711991 A CN 117711991A
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- cavity
- cleaning
- vibrator
- wafer
- conducting
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- 238000004140 cleaning Methods 0.000 title claims abstract description 150
- 239000007788 liquid Substances 0.000 claims abstract description 53
- 238000010438 heat treatment Methods 0.000 claims abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 31
- 238000002955 isolation Methods 0.000 claims abstract description 13
- 238000000926 separation method Methods 0.000 claims abstract description 3
- 238000007599 discharging Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 13
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 54
- 239000002245 particle Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005192 partition Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention belongs to the technical field of wafer wet methods, in particular to wafer groove type cleaning equipment, which comprises a cleaning groove body and a vibrator cavity connected with the bottom of the cleaning groove body, wherein a separation plate is arranged in the cleaning groove body and divides the cleaning groove body into a cleaning cavity for storing cleaning liquid and a conducting cavity for storing pure water; the cleaning cavity is positioned above the isolation plate, and the conducting cavity is positioned below the isolation plate; at least 1 sound wave vibrator group is arranged in the vibrator cavity at intervals, the sound wave vibrator group comprises an ultrasonic vibrator and megasonic vibrators, and each sound wave vibrator group is electrically connected with a sound wave controller. The beneficial effects are that: simultaneously, an ultrasonic vibrator and a megasonic vibrator are arranged, and the cleaning efficiency is improved through the generated complex frequency sound wave. The conduction cavity is used for sound wave and heat propagation simultaneously, so that the volume of the equipment can be reduced, and the heating device is arranged in the conduction cavity, so that the service life of the heating device can be prolonged.
Description
Technical Field
The invention relates to the technical field of wafer cleaning, in particular to wafer groove type cleaning equipment.
Background
Wafer cleaning is the most common process step in semiconductor manufacturing process Cheng Chong, mainly by cleaning the wafer surface with a tank or a single wafer to remove electrostatically adsorbed fine particles and other chemicals remaining in the semiconductor manufacturing process. The tank type wafer cleaning equipment often needs to heat the cleaning liquid to realize good cleaning effect when cleaning the wafer, and the heating mode of the tank type cleaning equipment in the past is to directly stretch into the chemical liquid with heating device to heat, and this kind of mode has following defect:
1. the uneven heating results in different temperatures of cleaning liquid near different wafers, which affects the stability of the cleaning effect.
2. The cleaning liquid can corrode the heating device, seriously affects the service life of the heating device, and causes the increase of production cost.
In addition, tank cleaning devices are often combined with ultrasonic, megasonic generators, the principle of which is the flow of sound waves and cavitation produced by ultrasonic and megasonic generators. The sound wave flow directly resonates with fine particles on the surface of the wafer so as to remove the fine particles; the cavitation principle is that the sound wave generator generates tiny bubbles, the bubbles float upwards, and the bubbles are continuously expanded and closed under the action of a sound field, so that impact and vibration are generated on the surface of a wafer, and pollutants on the surface are removed. The ultrasonic wave generator and the megasonic generator generate different frequencies of sound waves, when the ultrasonic wave generator and the megasonic generator are used for cleaning particles on the surface of the wafer, when the frequency of the sound waves is lower, the size of bubbles is larger and the density is lower, and when the frequency is larger, the size of the bubbles is reduced and the density is increased. The larger the bubble size, the larger the impact force generated during collapse, the stronger the ability to remove particles, but the larger the damage to the wafer surface.
The conventional tank type cleaning machine usually only comprises an ultrasonic generator or a megasonic generator, and the particle diameter adsorbed on the surface of the wafer can be large or small, so that a single generator cannot effectively remove particles with different diameters, and even if the tank type cleaning machine is subjected to ultrasonic cleaning and megasonic cleaning, the particles with all diameters cannot be cleaned, therefore, a method capable of realizing continuous sonic frequency needs to be found.
In view of the foregoing, there is an urgent need to provide a new wafer tank cleaning apparatus to solve the above-mentioned problems.
Disclosure of Invention
Based on the prior art, the invention provides wafer groove type cleaning equipment.
The invention provides wafer groove type cleaning equipment which comprises a cleaning groove body and a vibrator cavity connected with the bottom of the cleaning groove body, wherein a separation plate is arranged in the cleaning groove body and divides the cleaning groove body into a cleaning cavity for storing cleaning liquid and a conducting cavity for storing pure water; the cleaning cavity is positioned above the isolation plate, and the conducting cavity is positioned below the isolation plate; at least 1 sound wave vibrator group is arranged in the vibrator cavity at intervals, the sound wave vibrator group comprises an ultrasonic vibrator and megasonic vibrators, and each sound wave vibrator group is electrically connected with a sound wave controller.
Preferably, the isolation plate is provided with at least 4 positioning columns for positioning the wafer basket.
Preferably, the volume of the cleaning chamber is greater than the volume of the conducting chamber.
Preferably, the wafer tank cleaning apparatus further comprises:
at least 2 first liquid inlet pipes connected with the cleaning cavity and used for introducing different cleaning liquids or pure water into the cleaning cavity;
and the first liquid outlet is connected with the cleaning cavity and is used for discharging the polluted mixed cleaning liquid.
Preferably, the wafer tank cleaning apparatus further comprises:
the second liquid inlet pipe is connected with the conducting cavity and is used for introducing pure water into the conducting cavity, and the pure water is used for conducting heat and sound waves at the same time;
and the second liquid outlet pipe is connected with the conducting cavity and is used for discharging pure water in the conducting cavity.
Preferably, at least 1 heating device is arranged inside the conduction cavity and is used for heating pure water in the conduction cavity and keeping the temperature, and the heating device is configured as a heating rod.
Preferably, a mounting plate is arranged below the vibrator cavity, a through hole is formed in the bottom cavity wall of the vibrator cavity, a notch is formed in the position, corresponding to the through hole, of the mounting plate, and the second liquid outlet pipe passes through the vibrator cavity and extends out of the through hole.
Preferably, the ultrasonic vibrator and the megasonic vibrator penetrate through the bottom cavity wall of the conducting cavity so as to protrude into the conducting cavity, and the ultrasonic vibrator and the megasonic vibrator are arranged in a sealing way with the bottom cavity wall of the conducting cavity;
the vibrator cavity is also provided with at least 1 air port for balancing the air pressure in the vibrator cavity.
Preferably, the acoustic wave controller is configured as a phase adjuster to periodically change the phases of the acoustic wave emitted from the ultrasonic vibrator and the megasonic vibrator.
Preferably, the two sides of the cleaning tank body are provided with mounting frames, and the mounting frames are used for mounting the cleaning tank body on the equipment main body.
The beneficial effects of the invention are as follows:
1. the oscillator cavity is arranged, a plurality of groups of oscillator groups are arranged in the oscillator cavity, the phase of the sound wave is regulated through the sound wave controller, the sound wave complex frequency can be realized, and the better cleaning effect than the conventional groove type cleaning machine with the single-frequency ultrasonic generator or the megasonic generator is realized through the sound wave flow and cavitation generated by the sound wave.
2. The conduction cavity is arranged, the heating device of the groove type cleaning machine and the cavity for transmitting the megasonic waves of the megasonic vibrator are combined into one, and the volume and the production cost of the groove type cleaning machine are greatly saved.
3. The heating device is arranged in the conduction cavity, and heat conduction is carried out through pure water, so that not only can uniformity of heating heat distribution be realized, but also the problem that the heating device is directly contacted with cleaning liquid to cause corrosion of the heating device is avoided.
Drawings
FIG. 1 is a schematic diagram of a wafer tank cleaning apparatus;
FIG. 2 is a front view of a wafer tank cleaning apparatus;
FIG. 3 is a front cross-sectional view of a wafer tank cleaning apparatus;
FIG. 4 is a cross-sectional view of a conductive chamber of a wafer tank cleaning apparatus;
FIG. 5 is a diagram showing the vibrator installation of a wafer tank cleaning apparatus;
FIG. 6 is a bottom view of a wafer tank cleaning apparatus;
in the figure: 1. a cleaning tank body; 2. a vibrator cavity; 3. a mounting frame; 4. a mounting plate; 11. cleaning the cavity; 12. a conductive cavity; 13. a partition plate; 21. a vibrator group; 22. an air port; 23. a via hole; 41. a notch portion; 111. a first liquid inlet pipe; 112. a first liquid outlet; 121. a second liquid inlet pipe; 122. a second liquid outlet pipe; 123. a heating device; 131. and positioning columns.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described in the following description with reference to the drawings in the embodiments of the present invention, but it should be noted that these embodiments are not limiting to the present invention, and functional, method, or structural equivalent changes or substitutions made by those skilled in the art according to these embodiments are included in the scope of the present invention.
It should be understood that the terms "center", "longitudinal", "transverse", "vertical", "horizontal", "axial", "radial", "above", "below", etc. indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, and are merely for convenience of description of the present technical solution and simplification of description. In particular, the term "upper" refers to the direction in which the wafer cleaning tank body is open, and the term "lower" refers to the direction opposite thereto.
Referring to fig. 1 to 6, the present embodiment discloses a specific implementation manner of a wafer tank type cleaning apparatus, which includes a cleaning tank 1 and a vibrator cavity 2 connected to the bottom of the cleaning tank 1, wherein a partition plate 13 is disposed in the cleaning tank 1, and the partition plate 13 divides the cleaning tank 1 into a cleaning cavity 11 for storing cleaning liquid and a conducting cavity 12 for storing pure water; the cleaning cavity 12 is positioned above the isolation plate 13, and the conducting cavity 12 is positioned below the isolation plate 13; at least 1 acoustic wave vibrator group 21 is arranged in the vibrator cavity 2 at intervals, the acoustic wave vibrator group 21 comprises ultrasonic vibrators and megasonic vibrators, and each acoustic wave vibrator group 21 is electrically connected with an acoustic wave controller (not shown in the figure).
The traditional groove type cleaning machine only comprises an ultrasonic vibrator or a megasonic vibrator, and the main reason is that the ultrasonic vibrator is different from the megasonic vibrator in the working environment of the wafer cleaning equipment, and the ultrasonic vibrator is directly arranged at the bottom or the side wall of the cleaning groove body and directly works; in order to achieve better cleaning effect, wafer tank type cleaning equipment using megasonic vibrators is generally provided with a conducting cavity, the conducting cavity is filled with pure water, and the megasonic vibrators work in the conducting cavity. The working frequency of the ultrasonic vibrator is generally 15-200 kHz, tiny bubbles are mainly generated by utilizing the cavitation effect of liquid, the bubbles are exploded near the surface of the wafer after floating upwards, dirt and particles on the surface of the wafer are taken away by energy generated by the explosion, and the particles with the diameter larger than 0.4 mu m on the surface of the wafer can be effectively cleaned. The working frequency of the megasonic vibrator is generally 800-1000kHz, and high-speed micro water flow formed in the cleaning liquid by utilizing high-frequency sonic energy continuously impacts the surface of the wafer, so that particles with the diameter smaller than 0.2 mu m on the surface of the wafer can be effectively cleaned. In the actual production process, the diameter of particles adsorbed on the surface of the wafer may be large or small, and the wafer cleaning equipment provided with the single-frequency sonic vibrator cannot effectively remove the particles with different diameters.
The ultrasonic vibrator and the megasonic vibrator penetrate through the bottom cavity wall of the conducting cavity 2 so as to protrude into the conducting cavity 2, and the ultrasonic vibrator and the megasonic vibrator are arranged in a sealing way with the bottom cavity wall of the conducting cavity 2; in this embodiment, the operating frequency of the selected ultrasonic transducer is 40-200kHz and the operating frequency of the selected megasonic transducer is 800-1000kHz. Further, each of the acoustic wave vibrator groups 21 is electrically connected to an acoustic wave controller, and the acoustic wave controller is configured as a phase regulator, and the phase regulator periodically changes the phases of the acoustic waves emitted by the ultrasonic vibrator and the megasonic vibrator, so as to regulate the distribution of the frequency time domain and the space of the acoustic wave, and better generate cavitation and controllable acoustic wave flow after passing through the conducting cavity 2, so as to better clean particles with various diameters on the surface of the wafer.
Still further, the oscillator chamber 2 is further provided with at least 1 air port 22 for balancing the air pressure in the oscillator chamber, and as the oscillator generates a large amount of heat during operation, the air in the oscillator chamber 2 is continuously heated to increase the air pressure in the oscillator chamber 2, if the air does not circulate, the heat cannot be timely discharged, the continuously generated heat and the increased air pressure can affect the working state of the oscillator, and the service life of the oscillator is seriously possibly reduced or even damaged. After the air port 22 is added, the internal and external air pressure of the vibrator cavity 2 can be kept balanced, and the circulated air can timely take away heat, so that the running stability of the vibrator is ensured, and the service life of the vibrator can be effectively prolonged.
At least 4 positioning columns 131 are arranged on the isolation plate 13, and after the basket filled with wafers is sent into the cleaning tank body 1 by an external carrying device, the basket needs to be positioned. The positioning columns 131 matched with the flower basket are arranged, so that an external carrying device, such as a manipulator, is assisted to position, and is convenient to take and place, and in addition, stability of the wafer can be kept in the cleaning process.
The wafer tank type cleaning apparatus further comprises at least 2 first liquid inlet pipes 111, and the first liquid inlet pipes 111 are connected with the cleaning cavity 11. In semiconductor manufacturing processes, the recipe of the cleaning liquid used by the trench cleaning apparatus may be different for different processes, for example, using the trench cleaning apparatus after the polishing process, the main contaminant is silicon-containing particles; the main pollutants of the tank type cleaning equipment used in the photoresist stripping process are mainly colloid to be removed, other chemical liquid residues and particulate matters. For different processes, different cleaning solutions are needed, and for this purpose, the wafer tank type cleaning device provided by the invention has at least 2 first liquid inlet pipes 111, and different chemical solutions and pure water can be introduced to form cleaning solutions with a predetermined ratio for different cleaning processes. A first liquid outlet 112 is also provided near the bottom wall of the cleaning chamber 11 for discharging the contaminated mixed cleaning liquid.
The wafer tank type cleaning device further comprises a second liquid inlet pipe 121 and a second liquid outlet pipe 122, wherein the second liquid inlet pipe 121 is connected with the conducting cavity 12 and used for introducing pure water into the conducting cavity 12, and the second liquid outlet pipe 122 is connected with the bottom cavity wall of the conducting cavity 12 and used for discharging the pure water in the conducting cavity 12. At least 1 heating device 123 is further disposed inside the conducting chamber 12, and the heating device 123 is configured as a heating rod for heating the pure water in the conducting chamber 12 and maintaining the temperature.
In the wafer tank cleaning device, the cleaning liquid often needs a certain temperature to promote chemical reaction, so that the cleaning efficiency of the wafer is improved. Therefore, in the process of cleaning the wafer, the chemical liquid needs to be heated and insulated, the heating device is directly stretched into the cleaning liquid to be heated and insulated in the traditional method, and the cleaning liquid is generally corrosive, so that the service life of the heating device is always influenced. Furthermore, the heating mode can also cause uneven temperature distribution in the cleaning tank, and obviously, in the heating mode, the heat source is only the heating device, so that the temperature of the part of the cleaning liquid close to the heating device is relatively higher, and the temperature of the part of the cleaning liquid far from the heating device is relatively lower, and therefore, the wafer cleaning effect is inevitably uneven.
In the wafer tank cleaning apparatus of the present invention, pure water in the conducting cavity 12 serves as a heat conducting carrier, the heating device 123 extends into the conducting cavity 12 to heat the pure water, and when the temperature of the pure water exceeds the temperature of the cleaning solution, the heat conducting process starts, which has the following advantages:
1. the heating device 123 does not contact with cleaning liquid, only contacts with pure water, and cannot be corroded, so that the service life of the heating device 123 can be greatly prolonged.
2. The heating process is relatively mild, the uniformity of heat conduction is better, and the effect of cleaning the wafer is better.
It can be seen from the above description that the pure water in the conducting cavity 12 is used for conducting heat and sound waves at the same time, so that the heating component and the sound wave conducting component in the conventional wafer tank type cleaning device are combined into one, the modularity is realized, and the transverse space occupied by the cleaning tank body can be greatly reduced.
Further, the two sides of the cleaning tank body 1 are provided with mounting frames 3, the lower part of the vibrator cavity 2 is provided with mounting plates 4, and the mounting frames 3 and the mounting plates 4 are used for mounting the cleaning tank body 1 and the vibrator cavity 2 on the equipment main body. The bottom wall of the vibrator cavity 2 is provided with a via hole 23, a notch 41 is arranged at a position of the mounting plate 4 corresponding to the via hole 23, and the second liquid outlet pipe 122 passes through the vibrator cavity 2 and extends out of the via hole 33.
The process flow of the wafer groove type cleaning equipment provided by the invention is as follows:
the first liquid inlet pipe is used for injecting different cleaning liquid or pure water into the cleaning cavity according to a preset proportion;
then, injecting pure water into the conducting cavity through the second liquid inlet until the conducting cavity is filled;
after the conduction cavity is filled with pure water, the heating device heats the pure water, and the cleaning liquid in the cleaning cavity is indirectly heated to a preset temperature through heat conduction;
after the cleaning solution is heated to a preset temperature, the external carrying device puts the basket loaded with the groups of wafers to be cleaned into the cleaning solution for guessing and immersing the basket into the cleaning solution;
after the flower basket is positioned, closing the opening of the cleaning tank body 1, starting the operation of the acoustic wave vibrator group, and periodically adjusting the phases of the acoustic wave sent out by the ultrasonic wave vibrator and the megasonic wave vibrator through an acoustic wave controller;
after the cleaning is completed, the external carrying device sends out the cleaned wafer and carries out a drying process.
In summary, the present invention provides a wafer tank type cleaning apparatus, which includes a cleaning tank body and a vibrator cavity connected to the bottom of the cleaning tank body, wherein a partition board is disposed in the cleaning tank body, and the partition board partitions the cleaning tank body into a cleaning cavity for storing cleaning liquid and a conducting cavity for storing pure water; the cleaning cavity is positioned above the isolation plate, and the conducting cavity is positioned below the isolation plate; at least 1 sound wave vibrator group is arranged in the vibrator cavity at intervals, the sound wave vibrator group comprises an ultrasonic vibrator and megasonic vibrators, and each sound wave vibrator group is electrically connected with a sound wave controller. The beneficial effects are that: simultaneously, an ultrasonic vibrator and a megasonic vibrator are arranged, and the cleaning efficiency is improved through the generated complex frequency sound wave. The conduction cavity is used for sound wave and heat propagation simultaneously, so that the volume of the equipment can be reduced, and the heating device is arranged in the conduction cavity, so that the service life of the heating device can be prolonged.
The present invention is not limited to the above-mentioned embodiments, and any person skilled in the art, based on the technical solution of the present invention and the inventive concept thereof, can be replaced or changed within the scope of the present invention.
Claims (8)
1. The wafer groove type cleaning equipment comprises a cleaning groove body and a vibrator cavity connected with the bottom of the cleaning groove body, and is characterized in that a separation plate is arranged in the cleaning groove body and divides the cleaning groove body into a cleaning cavity for storing cleaning liquid and a conducting cavity for storing pure water; the cleaning cavity is positioned above the isolation plate, and the conducting cavity is positioned below the isolation plate; at least 1 sound wave vibrator group is arranged in the vibrator cavity at intervals, the sound wave vibrator group comprises an ultrasonic vibrator and a megasound wave vibrator, and each sound wave vibrator group is electrically connected with a sound wave controller;
further comprises:
at least 2 first liquid inlet pipes connected with the cleaning cavity and used for introducing different cleaning liquids or pure water into the cleaning cavity;
the first liquid outlet is connected with the cleaning cavity and used for discharging the polluted mixed cleaning liquid;
the second liquid inlet pipe is connected with the conducting cavity and is used for introducing pure water into the conducting cavity, and the pure water is used for conducting heat and sound waves at the same time;
and the second liquid outlet pipe is connected with the conducting cavity and is used for discharging pure water in the conducting cavity.
2. A wafer tank cleaning apparatus according to claim 1, characterized in that: and the isolation plate is provided with at least 4 positioning columns for positioning the wafer flower basket.
3. A wafer tank cleaning apparatus according to claim 1, characterized in that: the volume of the cleaning cavity is larger than the volume of the conducting cavity.
4. A wafer tank cleaning apparatus according to claim 1, characterized in that: at least 1 heating device is arranged in the conduction cavity and used for heating pure water in the conduction cavity and keeping the temperature, and the heating device is configured as a heating rod.
5. A wafer tank cleaning apparatus according to claim 1, characterized in that: the oscillator comprises a vibrator cavity, and is characterized in that a mounting plate is arranged below the vibrator cavity, a through hole is formed in the bottom cavity wall of the vibrator cavity, a notch is formed in the position, corresponding to the through hole, of the mounting plate, and a second liquid outlet pipe passes through the vibrator cavity and extends out of the through hole.
6. A wafer tank cleaning apparatus according to claim 1, characterized in that:
the ultrasonic vibrator and the megasonic vibrator penetrate through the bottom cavity wall of the conducting cavity so as to protrude into the conducting cavity, and the ultrasonic vibrator and the megasonic vibrator are arranged in a sealing way with the bottom cavity wall of the conducting cavity;
the vibrator cavity is also provided with at least 1 air port for balancing the air pressure in the vibrator cavity.
7. A wafer tank cleaning apparatus according to claim 1, characterized in that: the acoustic wave controller is configured as a phase adjuster to periodically change the phases of the ultrasonic vibrator and the sound wave emitted from the megasonic vibrator.
8. A wafer tank cleaning apparatus according to claim 1, characterized in that: the washing tank body both sides are equipped with the mounting bracket, the mounting bracket is used for with the washing tank body is installed on the equipment main part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410160296.7A CN117711991A (en) | 2024-02-05 | 2024-02-05 | Wafer groove type cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410160296.7A CN117711991A (en) | 2024-02-05 | 2024-02-05 | Wafer groove type cleaning equipment |
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| CN117711991A true CN117711991A (en) | 2024-03-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202410160296.7A Pending CN117711991A (en) | 2024-02-05 | 2024-02-05 | Wafer groove type cleaning equipment |
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2024
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