CN117606666A - Monocrystalline silicon transmitter and packaging method - Google Patents
Monocrystalline silicon transmitter and packaging method Download PDFInfo
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- CN117606666A CN117606666A CN202311536663.0A CN202311536663A CN117606666A CN 117606666 A CN117606666 A CN 117606666A CN 202311536663 A CN202311536663 A CN 202311536663A CN 117606666 A CN117606666 A CN 117606666A
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 229920002545 silicone oil Polymers 0.000 claims abstract description 40
- 230000005540 biological transmission Effects 0.000 claims abstract description 39
- 239000012530 fluid Substances 0.000 claims abstract description 36
- 230000008054 signal transmission Effects 0.000 claims abstract description 23
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical group OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000002955 isolation Methods 0.000 claims abstract description 15
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- 238000012545 processing Methods 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims description 45
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- 239000003921 oil Substances 0.000 claims description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 230000003750 conditioning effect Effects 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 230000003321 amplification Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 15
- 238000009530 blood pressure measurement Methods 0.000 abstract description 5
- 238000009423 ventilation Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
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- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
- G01L7/18—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements using liquid as the pressure-sensitive medium, e.g. liquid-column gauges
- G01L7/182—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements using liquid as the pressure-sensitive medium, e.g. liquid-column gauges constructional details, e.g. mounting
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention provides a monocrystalline silicon transmitter and a packaging method, wherein a pressure sensing module is arranged in a transmitter base, the pressure sensing module comprises an MEMS pressure sensing chip and a TO pressure sensing seat, the MEMS pressure sensing chip and the TO pressure sensing seat are matched TO define a first cavity and a second cavity which are sealed and isolated in the base, pressure transmission medium silicone oil is arranged in the first cavity, the first end face of the MEMS pressure sensing chip is contacted with the pressure transmission medium silicone oil, the MEMS pressure sensing chip is used for detecting pressure change of the pressure transmission medium silicone oil, and the second end face of the MEMS pressure sensing chip is communicated with the second cavity. An isolation diaphragm is arranged between the fluid channel in the pressure transmitting joint and the first chamber. The PCBA signal transmission plate is in signal connection with the MEMS pressure sensing chip and is used for collecting the electrical signals of the MEMS pressure sensing chip and processing the signals. The invention has the advantages of high flow pressure measurement and accurate and stable measurement data.
Description
Technical Field
The invention belongs to the technical field of transmitters, and particularly relates to a monocrystalline silicon transmitter and a packaging method.
Background
The monocrystalline silicon transducer is a device which uses a monocrystalline silicon pressure sensor as a sensitive element to convert a pressure signal into an electric signal and then converts the electric signal into a standard electric signal to be output through a signal processing circuit, and is commonly used for measuring the pressure of media such as gas, liquid, steam and the like in industries such as petroleum, electric power, chemical industry, metallurgy, pharmacy, light industry and the like. However, in the practical industrial field, there is an application requirement for measuring wide-range fluid pressure, the pressure sensing chip adopted by the traditional monocrystalline silicon transmitter has a complex packaging structure and poor stability, and meanwhile, the situations of zero point thermal hysteresis, zero point drift and the like can occur, the measurement precision is poor, the error precision can reach +/-2% FS, the annual drift amount can reach more than 0.5% FS, and the requirement of wide-range accurate measurement cannot be met.
Disclosure of Invention
The invention aims to solve the technical problems that the existing monocrystalline silicon transmitter cannot realize wide-range fluid pressure measurement and has poor measurement accuracy.
In order to solve the problems, the technical scheme of the invention is as follows:
a monocrystalline silicon transmitter, comprising: the pressure transmission interface, the base and the PCBA signal transmission board; the pressure sensing module comprises an MEMS pressure sensing chip and a TO pressure sensing seat, wherein the MEMS pressure sensing chip and the TO pressure sensing seat are matched TO define a first cavity and a second cavity which are sealed and isolated in the base, pressure transmission medium silicone oil is arranged in the first cavity, a first end face of the MEMS pressure sensing chip is in contact with the pressure transmission medium silicone oil, the MEMS pressure sensing chip is used for detecting pressure change of the pressure transmission medium silicone oil, and a second end face of the MEMS pressure sensing chip is communicated with the second cavity; an isolation diaphragm is arranged between the fluid channel in the pressure transmitting joint and the first chamber; the PCBA signal transmission plate is in signal connection with the MEMS pressure sensing chip and is used for collecting and processing the electrical signals of the MEMS pressure sensing chip; in the fluid pressure detection process, fluid enters the pressure transmission interface, the isolation diaphragm is stressed to deform and extrude to the side of the first cavity, pressure transmission medium silicone oil in the first cavity is stressed to generate acting force on the first end face of the MEMS pressure sensing chip, and the MEMS pressure sensing chip detects pressure change of the pressure transmission medium silicone oil and outputs an electric signal to the PCBA signal transmission board.
Preferably, the second end surface circumferential area of the MEMS pressure sensing chip is fixed on the top opening end surface of the TO pressure sensing seat by welding and sealing.
Preferably, the pressure sensing module further comprises a ceramic seat and a ceramic cap, wherein the bottom of the ceramic seat is fixed on the circumferential end face of the top of the TO pressure sensing seat, the ceramic cap is fixed on the top end of the ceramic seat, and holes are formed in the top of the ceramic cap.
Preferably, the ceramic seat is provided with a gold layer, the ceramic seat and the TO pressure sensing seat are conducted through a conducting circuit, and meanwhile, the MEMS pressure sensing chip is connected with the ceramic seat in a gold wire bonding mode, so that the TO pressure sensing seat is conducted.
Preferably, an oil filling hole is formed in the TO pressure sensing seat, the oil filling hole penetrates through the TO pressure sensing seat body and is communicated with the first cavity, and the oil filling hole is used for filling pressure transfer medium silicone oil into the first cavity.
Preferably, the outer side of the base is provided with a shell, the outer side end face of the pressure transmitting joint is fixedly connected with the contact face of the bottom of the shell through welding seal, the circumferential end face of the pressure transmitting joint fluid channel is fixedly connected with the contact face of the top end of the base through welding seal, and the outer wall face of the TO pressure sensing seat is fixedly connected with the inner wall face of the base through argon arc welding.
Preferably, a vent pipe is arranged in the second chamber, a first port of the vent pipe is fixed on a second end face of the MEMS pressure sensing chip, the shell is provided with a vent hole communicated with the outside, and a second port of the vent pipe is connected with the tail end of the vent hole.
Preferably, the PCBA signal transmission board is internally provided with an MCU, a signal conditioning circuit and a signal output circuit, and the PCBA signal transmission board is communicated with the TO pressure sensing seat TO realize the electric signal transmission with the MEMS pressure sensing chip.
Preferably, the signal conditioning circuit comprises an AD7799BRU chip for realizing signal amplification gain; the signal output circuit comprises an AD5700 chip and is used for realizing signal external output.
A packaging method of a single crystal silicon transmitter pressure sensing module comprises the following steps:
s1: the peripheral area of the non-pressure-sensing side end face of the MEMS pressure-sensing chip is fixed on the top opening end face of the TO pressure-sensing seat through welding and sealing;
s2: the bottom of the ceramic seat is fixed on the circumferential end surface of the top of the TO pressure sensing seat and is communicated with the TO pressure sensing seat through a conducting circuit;
s3: the MEMS pressure sensing chip is connected with the ceramic seat in a gold wire bonding mode;
s4: the ceramic cap is fixed at the top end of the ceramic seat.
By adopting the technical scheme, the invention has the following advantages and positive effects compared with the prior art:
(1) In the monocrystalline silicon transmitter, an isolation diaphragm is arranged between a fluid channel in a pressure transmitting joint and a first chamber where one pressure measuring end of an MEMS pressure sensing chip is located, the first chamber is filled with pressure transmitting medium silicone oil, one pressure measuring end of the MEMS pressure sensing chip is in direct contact with the pressure transmitting medium silicone oil, in the fluid pressure measuring process, fluid generates pressure on the isolation diaphragm, the isolation diaphragm deforms and extrudes to the side of the first chamber, namely the pressure is transmitted to one pressure measuring end of the MEMS pressure sensing chip through the pressure transmitting medium silicone oil as a transmission medium, and then the MEMS pressure sensing chip outputs a corresponding electric signal to the outside according to the measured pressure value. Through the cooperation of isolation diaphragm and pressure medium silicone oil, can make pressure transmission more accurate stable, guaranteed the accuracy and the stability of monocrystalline silicon changer measuring data, avoid appearing the condition that the data beats, control output accuracy error is within 0.03%FS, and annual drift volume can reach within 0.1%FS.
(2) In the monocrystalline silicon transmitter, the packaging of the monocrystalline silicon transmitter pressure sensing module is realized through the matching of the ceramic seat, the TO pressure sensing seat and the ceramic cap, the pressure sensing module after packaging of the monocrystalline silicon transmitter is fixed in the base in an argon arc welding mode, and the base, the outer shell and the pressure transmitting joint are tightly connected finally, so that the structural stability and the integral shock resistance of the monocrystalline silicon transmitter are ensured, the invention can be applied TO a scene of wide-range pressure measurement while ensuring the measurement precision, and the measured fluid pressure value can reach 40-60 MPa.
(3) The monocrystalline silicon transmitter comprises the ventilation pipeline, one end of the ventilation pipeline is communicated and fixed at one end of the MEMS pressure sensing chip, which is not used for measuring fluid pressure, the other end of the ventilation pipeline is communicated with the outer side of the shell, so that the communication between the MEMS pressure sensing chip and an external space is realized, the MEMS pressure sensing chip can compensate and correct a final fluid measurement pressure value in real time according to an external air pressure value through the arrangement of the ventilation pipeline, the influence of the external air pressure environment under different measurement environments on measurement precision is reduced, and meanwhile, the ventilation pipeline has a heat dissipation function, and the condition that zero drift is generated when the temperature of the MEMS pressure sensing chip rises under the state that the monocrystalline silicon transmitter works for a long time is avoided.
Drawings
FIG. 1 is a schematic diagram of a single crystal silicon transmitter according to the present invention
Fig. 2 is a schematic diagram of a signal conditioning circuit according to the present invention.
Fig. 3 is a schematic circuit diagram of a main control chip provided by the invention.
Fig. 4 is a schematic diagram of a signal output circuit according to the present invention.
Reference numerals illustrate: 1: a pressure transmission interface; 2: a base; 3: PCBA signal transmission board; 4: a MEMS pressure sensing chip; 5: a TO pressure sensing seat; 6: pressure medium silicone oil; 7: an isolation diaphragm; 8: a ceramic base; 9: a ceramic cap; 10: an oil filling hole; 11: a ventilation duct; 12: a vent hole; 13: a housing.
Detailed Description
The invention provides a monocrystalline silicon transmitter and a packaging method, which are further described in detail below with reference to the accompanying drawings and specific embodiments. Advantages and features of the invention will become more apparent from the following description and from the claims.
First embodiment
Referring to fig. 1, a monocrystalline silicon transmitter provided in this embodiment includes: the pressure transmission interface 1, the base 2 and the PCBA signal transmission board 3; the base 2 is internally provided with a pressure sensing module, the pressure sensing module comprises an MEMS pressure sensing chip 4 and a TO pressure sensing seat 5, the MEMS pressure sensing chip 4 and the TO pressure sensing seat 5 are matched TO define a first cavity and a second cavity which are sealed and isolated in the base 2, the first cavity is internally provided with pressure transmission medium silicone oil 6, a first end face of the MEMS pressure sensing chip 4 is contacted with the pressure transmission medium silicone oil 6, the MEMS pressure sensing chip 4 is used for detecting pressure change of the pressure transmission medium silicone oil 6, and a second end face of the MEMS pressure sensing chip 4 is communicated with the second cavity; an isolation diaphragm 7 is arranged between the fluid channel in the pressure transmission interface 1 and the first chamber; the PCBA signal transmission plate 3 is in signal connection with the MEMS pressure sensing chip 4 and is used for collecting and processing the electrical signals of the MEMS pressure sensing chip 4.
In the single crystal silicon transmitter provided by the embodiment, the MEMS pressure sensing chip 4 is fixedly arranged at the top opening of the TO pressure sensing seat 5, a first cavity and a second cavity which are sealed and isolated in the base 2 are defined by matching the MEMS pressure sensing chip 4 and the TO pressure sensing seat 5, wherein the first cavity is filled with the pressure-transmitting medium silicone oil 6, and the first end surface of the MEMS pressure sensing chip 4 for measuring the fluid pressure is directly contacted with the pressure-transmitting medium silicone oil 6. An isolation diaphragm 7 for isolating fluid is arranged between the fluid channel in the pressure transmission interface 1 and the first chamber, in the fluid pressure measurement process, the fluid is transmitted to one side of the isolation diaphragm 7, the isolation diaphragm 7 deforms towards the first chamber side due to the fluid pressure, the fluid pressure is transmitted to the first end face of the MEMS pressure sensing chip 4 through the pressure transmission medium silicone oil 6 as a transmission medium, and the MEMS pressure sensing chip 4 detects the pressure change of the pressure transmission medium silicone oil 6 and outputs a corresponding electric signal to the PCBA signal transmission board 3.
The pressure transmission medium silicone oil 6 is an organosilicon compound with stable chemical properties, firstly has higher viscosity and elasticity, the volume of the pressure transmission medium silicone oil cannot be changed obviously within a certain pressure, and secondly, the silicone oil has lower surface tension, in the embodiment, the first chamber is in a sealed state, the silicone oil can be well wetted and permeated into a plurality of fine gaps in the oiling process, no cavity area in the first chamber is ensured, meanwhile, the influence of temperature change within a certain range on the volume change of the silicone oil is small, so that the pressure transmission accuracy and stability of the pressure transmission in the fluid of the monocrystalline silicon transmitter in the embodiment can be ensured by the pressure transmission medium silicone oil.
Preferably, the second end surface circumferential area of the MEMS pressure sensing chip 4 is fixed on the top opening end surface of the TO pressure sensing seat 5 through welding and sealing, and the outer wall surface of the TO pressure sensing seat 5 is fixedly connected with the inner wall surface of the base 2 through argon arc welding, so that the sealing isolation between the first cavity and the second cavity is ensured, leakage of the pressure transfer medium silicone oil 6 and the cavity area in the first cavity are prevented, and meanwhile, the TO pressure sensing seat 5 plays a bearing role on the MEMS pressure sensing chip 4, and stability of the MEMS pressure sensing chip 4 is ensured.
Preferably, the pressure sensing module further comprises a ceramic seat 8 and a ceramic cap 9, the bottom of the ceramic seat 8 is fixed on the circumferential end face of the top of the TO pressure sensing seat 5, namely, the side wall of the ceramic seat 8 surrounds the MEMS pressure sensing chip 4, the ceramic cap 9 is fixed on the top end of the ceramic seat 8, the packaging structure can protect the MEMS pressure sensing chip 4, and meanwhile, the outer side wall of the ceramic seat 8 is tightly attached TO the inner side wall of the base 2, so that the stability of the pressure sensing module is ensured. The top of the ceramic cap 9 is also provided with a plurality of holes, so that the pressure transmission medium silicone oil 6 can be filled in the first cavity and plays a role in transmitting fluid pressure.
Preferably, the ceramic seat 8 is provided with a gold layer, the ceramic seat 8 and the TO pressure sensing seat 5 are conducted through a conducting circuit, meanwhile, the MEMS pressure sensing chip 4 is connected with the ceramic seat 8 in a gold wire bonding mode, and further conduction with the TO pressure sensing seat 5 is achieved, namely when the MEMS pressure sensing chip 4 detects pressure generated by fluid, the MEMS pressure sensing chip 4 can output an electric signal TO the TO pressure sensing seat 5, and the electric signal is led out through a Pin needle of the TO pressure sensing seat 5.
Preferably, a vertical oil filling hole 10 is provided in the TO pressure sensing seat 5, the oil filling hole 10 penetrates through the TO pressure sensing seat 5 body and is communicated TO the top end of the first cavity, in the manufacturing stage of the monocrystalline silicon transmitter provided in this embodiment, the pressure transmission medium silicone oil 6 is injected into the first cavity from the oil filling hole 10 through the high vacuum silicone oil injection technology, and after the pressure transmission medium silicone oil 6 is completely filled in the first cavity, the oil filling hole 10 is closed. The high vacuum silicone oil injection technology can ensure that a cavity area is avoided in the first cavity, so that the pressure transmission of the pressure transmission medium silicone oil 6 is more accurate and stable, namely, the measurement data of the monocrystalline silicon transmitter provided by the embodiment is more accurate and stable.
Preferably, the outside of the base 2 is provided with a shell 13, the contact surface of the outside end surface of the pressure transmitting port 1 and the bottom of the shell 13 is fixedly connected through welding seal, the contact surface of the circumferential end surface of the fluid channel of the pressure transmitting port 1 and the top end of the base 2 are fixedly connected through welding seal, the shell 13 and the pressure transmitting port 1 comprise the mutual fixed connection between the bases 2, the good overall vibration resistance of the monocrystalline silicon transmitter provided by the embodiment is ensured, the structural stability can be ensured in the fluid pressure measurement with larger flow velocity, and the measuring range and the measuring precision of the fluid pressure are further improved.
Preferably, be equipped with vent pipe 11 in the second cavity, vent pipe 11 first port intercommunication is fixed in MEMS sense pressure chip 4 second terminal surface, and casing 13 is equipped with the air vent 12 of outside intercommunication simultaneously, and vent pipe 11 second port and air vent 12 tail end connection realize MEMS sense pressure chip 4 and external space's intercommunication promptly, make MEMS sense pressure chip 4 can compensate and revise final fluid measurement pressure value in real time according to external air pressure value through the setting of vent pipe 11, reduce the influence of external air pressure environment under different measurement environment to measurement accuracy. Meanwhile, the ventilation pipeline 11 has a heat dissipation function, so that the condition that zero drift is generated when the temperature of the MEMS pressure sensing chip 4 rises in a long-term working state of the monocrystalline silicon transmitter provided by the embodiment is reduced, and the measurement accuracy is further improved. While the vent 12 is internally threaded, related fittings may be assembled to extend other functions as required by the measurement site.
Preferably, the monocrystalline silicon transmitter provided in this embodiment includes a PCBA signal transmission board 3, the TO pressure sensing seat 5 is led TO the PCBA signal transmission board 3 through Pin needles, that is, the MEMS pressure sensing chip 4 outputs an electrical signal after measuring fluid pressure, and the electrical signal can be transmitted TO the PCBA signal transmission board 3 through the TO pressure sensing seat 5. The PCBA signal transmission board 3 is provided with modules such as an MCU, a signal conditioning circuit, a signal output circuit and the like for carrying out subsequent processing on the electric signals output by the MEMS pressure sensing chip 4.
Referring to fig. 2, the signal conditioning circuit includes an AD7799BRU chip, which is a 3-channel, low-noise, low-power instrumentation amplifier chip with a 24-bit converter and a programmable gain amplifier built in, and can amplify the signal to a desired amplitude by selecting an appropriate gain setting, so as to perform accurate analog-to-digital conversion. In the working state of the monocrystalline silicon transmitter provided by the embodiment, the PCBA signal transmission board 3 is in signal conduction with the TO pressure sensing seat 5 through the J2 sensor interface, receives an analog signal output by the MEMS pressure sensing chip 4, and performs gain amplification and analog-TO-digital conversion on an electric signal TO realize digital signal conversion and digital signal transmission of the electric signal with a high-precision code value.
Referring to fig. 3, the mcu is MSP43OF5418AIPN, the MSP43OF5418AIPN is conducted with the AD7799BRU, digital signals output by the AD7799BRU are received, and analog processing OF the signals is performed by matching with corresponding electronic components such as capacitors, resistors, inductors, TVS and the like, and corresponding debugging programs, so that the digital signals are converted into corresponding analog signals.
Referring to fig. 4, the signal output circuit includes an AD5700 chip, where the AD5700 chip is a low-power consumption HART modem, the AD5700 chip is connected to the MCU through a HART communication interface, the AD5700 chip receives an analog signal output by the MCU, and after being processed by the AD5700 chip, the AD5700 chip outputs a current signal of 4-20mA through a HART output end or performs signal communication with the master station or the controller based on an RS-485 serial communication protocol.
Second embodiment
The embodiment provides a packaging method of a sensing die set of a monocrystalline silicon transmitter, which comprises the following steps:
s1: the peripheral area of the non-pressure-sensing side end surface of the MEMS pressure sensing chip 4 is fixed on the top opening end surface of the TO pressure sensing seat 5 through welding and sealing;
s2: the bottom of the ceramic seat 8 is fixed on the periphery Xiang Duanmian of the top of the TO pressure sensing seat 5 and is communicated with the TO pressure sensing seat 5 through a conducting circuit;
s3: the MEMS pressure sensing chip 4 is connected with the ceramic seat 8 in a gold wire bonding mode;
s4: a ceramic cap 9 is fixed to the top end of the ceramic base 8.
The embodiment provides the packaging method of the pressure sensing module of the monocrystalline silicon transmitter, which ensures that all parts of the pressure sensing module are assembled and fastened, the pressure sensing module is stable and reliable, the pressure sensing module is stressed uniformly under the action force of fluid, the pressure sensing module is clung TO the inner wall surface of the base 2 in the lateral direction, the bottom of the TO pressure sensing seat 5 is clung TO the shell 13, the integral structure of the monocrystalline silicon transmitter is more stable, the measurement result is more accurate, the method can be applied TO measuring the high pressure value of the fluid in a large range, and the method is suitable for measuring the pressure of the fluid in different measuring environments.
The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, it is within the scope of the appended claims and their equivalents to fall within the scope of the invention.
Claims (10)
1. A monocrystalline silicon transmitter, comprising: the pressure transmission interface, the base and the PCBA signal transmission board;
the pressure sensing module comprises an MEMS pressure sensing chip and a TO pressure sensing seat, wherein the MEMS pressure sensing chip and the TO pressure sensing seat are matched TO define a first cavity and a second cavity which are sealed and isolated in the base, pressure transmission medium silicone oil is arranged in the first cavity, a first end face of the MEMS pressure sensing chip is in contact with the pressure transmission medium silicone oil, the MEMS pressure sensing chip is used for detecting pressure change of the pressure transmission medium silicone oil, and a second end face of the MEMS pressure sensing chip is communicated with the second cavity;
an isolation diaphragm is arranged between the fluid channel in the pressure transmitting joint and the first chamber;
the PCBA signal transmission plate is in signal connection with the MEMS pressure sensing chip and is used for collecting and processing the electrical signals of the MEMS pressure sensing chip;
in the fluid pressure detection process, fluid enters the pressure transmission interface, the isolation diaphragm is stressed to deform and extrude to the side of the first cavity, pressure transmission medium silicone oil in the first cavity is stressed to generate acting force on the first end face of the MEMS pressure sensing chip, and the MEMS pressure sensing chip detects pressure change of the pressure transmission medium silicone oil and outputs an electric signal to the PCBA signal transmission board.
2. The single crystal silicon transmitter of claim 1 wherein the second end circumferential region of the MEMS pressure sensing die is secured TO the top open end of the TO pressure sensing die by a solder seal.
3. The single crystal silicon transmitter of claim 1 wherein the pressure sensing module further comprises a ceramic base and a ceramic cap, wherein the bottom of the ceramic base is fixed on the circumferential end face of the top of the TO pressure sensing base, the ceramic cap is fixed on the top of the ceramic base, and the top of the ceramic cap is provided with a hole.
4. The single crystal silicon transmitter of claim 3 wherein the ceramic base is provided with a gold layer, the ceramic base and the TO pressure sensing base are conducted through a conducting circuit, and the MEMS pressure sensing chip is connected with the ceramic base through gold wire bonding, so that the TO pressure sensing base is conducted.
5. The single crystal silicon transmitter of claim 1 wherein the TO pressure sensing seat is internally provided with an oil filling hole, the oil filling hole penetrates through the TO pressure sensing seat body and is communicated with the first chamber, and the oil filling hole is used for filling pressure transfer medium silicone oil into the first chamber.
6. The single crystal silicon transmitter of claim 1 wherein a housing is arranged on the outer side of the base, the outer side end face of the pressure transmitting joint is fixedly connected with the bottom contact face of the housing through welding seal, the circumferential end face of the pressure transmitting joint fluid channel is fixedly connected with the top contact face of the base through welding seal, and the outer wall face of the TO pressure sensing seat is fixedly connected with the inner wall face of the base through argon arc welding.
7. The single crystal silicon transmitter of claim 1 wherein a vent conduit is disposed in the second chamber, the first port of the vent conduit is fixed to the second end face of the MEMS pressure sensing chip, the housing is provided with an externally communicating vent hole, and the second port of the vent conduit is connected to the tail end of the vent hole.
8. The monocrystalline silicon transmitter of claim 1, wherein the PCBA signal transmission board is provided with an MCU, a signal conditioning circuit and a signal output circuit, and the PCBA signal transmission board is connected TO the TO pressure sensing seat TO realize electrical signal transmission with the MEMS pressure sensing chip.
9. The monocrystalline silicon transmitter of claim 8, wherein the signal conditioning circuit comprises an AD7799BRU chip for implementing signal amplification gain; the signal output circuit comprises an AD5700 chip and is used for realizing signal external output.
10. The packaging method of the single crystal silicon transmitter pressure sensing module is characterized by comprising the following steps of:
s1: the peripheral area of the non-pressure-sensing side end face of the MEMS pressure-sensing chip is fixed on the top opening end face of the TO pressure-sensing seat through welding and sealing;
s2: the bottom of the ceramic seat is fixed on the circumferential end surface of the top of the TO pressure sensing seat and is communicated with the TO pressure sensing seat through a conducting circuit;
s3: the MEMS pressure sensing chip is connected with the ceramic seat in a gold wire bonding mode;
s4: the ceramic cap is fixed at the top end of the ceramic seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202311536663.0A CN117606666A (en) | 2023-11-17 | 2023-11-17 | Monocrystalline silicon transmitter and packaging method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311536663.0A CN117606666A (en) | 2023-11-17 | 2023-11-17 | Monocrystalline silicon transmitter and packaging method |
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| CN117606666A true CN117606666A (en) | 2024-02-27 |
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| CN202311536663.0A Pending CN117606666A (en) | 2023-11-17 | 2023-11-17 | Monocrystalline silicon transmitter and packaging method |
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| Country | Link |
|---|---|
| CN (1) | CN117606666A (en) |
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2023
- 2023-11-17 CN CN202311536663.0A patent/CN117606666A/en active Pending
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